CN204335153U - Pad structure and circuit board - Google Patents
Pad structure and circuit board Download PDFInfo
- Publication number
- CN204335153U CN204335153U CN201420788211.1U CN201420788211U CN204335153U CN 204335153 U CN204335153 U CN 204335153U CN 201420788211 U CN201420788211 U CN 201420788211U CN 204335153 U CN204335153 U CN 204335153U
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- CN
- China
- Prior art keywords
- fluting
- pad structure
- conductive layer
- circuit board
- width
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- Expired - Fee Related
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Abstract
A kind of pad structure and circuit board, pad structure comprises and is opened on substrate and runs through the fluting on the upper and lower surface of this substrate and be coated on the conductive layer at described fluting edge.It is restricted that pad structure is arranged on trace width, and need super-high-current local time, can fill scolding tin on this pad structure, such that the effective cross section of the same electric current of cabling is long-pending to increase, realize caloric value with low cost low, quality is high, the circuit board that overcurrent is large.
Description
Technical field
The utility model relates to circuit board technology, particularly relates to a kind of pad structure and circuit board.
Background technology
In PCB design process, can run into and need limited cabling space to flow through larger electric current, as the big current pin wiring of IPM (Intelligent Power Module, i.e. Intelligent Power Module), the pin wiring etc. of power switch pipe.In the past in order to solve problems, addressed these problems by increasing the methods such as the copper thickness of printed circuit board (PCB), but limited efficiency, easily by causing printed circuit board (PCB) Copper Foil to generate heat, quality declines, and cost increases.
Utility model content
Based on this, be necessary to provide a kind of can the pad structure of the electric current that conducting is larger on the cabling of less width.
A kind of pad structure, comprises and is opened on substrate and runs through the fluting on the upper and lower surface of this substrate and be coated on the conductive layer at described fluting edge.
Further, described fluting comprises coaxial the first fluting and two second flutings arranged, and two described second flutings are positioned at the two ends of described first fluting, and the width of described second fluting is larger than the width of described first fluting.
Further, described conductive layer is covered in the sidewall of described second fluting bottom surface and described first fluting.
Further, the thickness being covered in the described conductive layer of described second fluting is less than or equal to the degree of depth of described second fluting.
Further, the width of described first fluting is a, wherein, and 0.8mm≤a≤1.2mm; The width of described second fluting is b, wherein, and b – a >=0.2mm.
Further, described fluting is rectangle, round rectangle or circle.
Further, described conductive layer is copper foil layer.
Further, when carrying out scolding tin, tin cream is covered on described conductive layer.
In addition, additionally provide a kind of circuit board, comprise substrate, and above-mentioned pad structure.
It is restricted that above-mentioned pad structure is arranged on trace width, and need super-high-current local time, scolding tin can be filled on this pad structure, make the long-pending increase in the effective cross section of the same electric current of cabling, realize caloric value with low cost low, quality is high, the circuit board that overcurrent is large.
Accompanying drawing explanation
Fig. 1 is the plan structure schematic diagram of pad structure in the utility model preferred embodiment;
Fig. 2 is the cross section structure schematic diagram of pad structure in the utility model preferred embodiment;
Fig. 3 is the cross section structure schematic diagram of the filling of pad structure shown in Fig. 2 scolding tin;
Fig. 4 is applied to the structural representation of the circuit board being provided with Intelligent Power Module for pad structure shown in Fig. 2;
Fig. 5 is applied to the structural representation of the circuit board being provided with high-current device for pad structure shown in Fig. 2;
Embodiment
In order to make the technical problems to be solved in the utility model, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1 and Fig. 2, in the utility model preferred embodiment, pad structure 100 comprises fluting 110 and conductive layer 120.Fluting 110 to be opened on substrate 200 and to run through this upper and lower surface of substrate 200, and conductive layer 120 is coated on fluting 110 edge.Particularly, conductive layer 120 is copper foil layer or aluminium foil layer, covers the sidewall of fluting 110 and upper and lower two ends.
Fluting 110 is rectangle, round rectangle or circle.In the present embodiment, fluting 110 comprises the two ends that coaxial the first fluting 111 of arranging and two second flutings, 112, two second flutings 112 are positioned at the first fluting 111, the width of the second many flutings 112 slot than first 111 width large.
If the width of the first fluting 111 is a, then, 0.8mm≤a≤1.2mm; If the width of the second fluting 112 is b, then, b – a >=0.2mm.Usually, the 110 length d that slot look actual track lengths, and length then can combinationally use by multiple pad structure 100 comparatively greatly, preferably, and 3mm≤d≤10mm.
Particularly, conductive layer 120 be covered in the second fluting 112 bottom surface, sidewall and first fluting 111 sidewall.In addition, the thickness being covered in the conductive layer 120 of the second fluting 112 is less than or equal to the degree of depth h of the second fluting 112.Two ends and the solder mask 300 of conductive layer 120 abut against.
With reference to figure 3, when carrying out scolding tin, tin cream 400 is filled on the conductive layer 120 that pad structure 100 li is covered in solder mask 300 scope.
In addition, additionally provide a kind of circuit board, comprise substrate 200 and above-mentioned pad structure 100, as printed circuit board (PCB) (PCB), flexible PCB.
Pad structure 100 is further illustrated below with the example of two methods.
With reference to figure 4, during intelligent power module work, the electric current of its P, U, V, W pin reaches tens peaces even tens peaces, but the distance between P, U, V, W pin is less, because the cabling connected with P, U, V, W pin will meet safe distance requirement each other, make trace width narrower, therefore the current capacity that carries of the cabling of P, U, V, W pin is difficult to meet design requirement.The live stream scarce capacity of cabling also can cause the heating of printed circuit board (PCB) Copper Foil to exceed standard, and reduces product quality.Add above-mentioned pad structure 100 at the cabling of P, U, V, W pin, what significantly promote cabling carries current capacity, solves above-mentioned problem, improving product quality.
With reference to being all big current cabling with 4 of shade cablings 10 ~ 40 in figure 5, figure, due to the layout restrictions of cabling 10, cabling 40, bridge heap BR1, electrochemical capacitor E1, the link width that cabling 20, cabling 30 pile BR1 with bridge is L.Such as: the copper thickness of PCB is 0.5 ounce, the live width L of cabling 20 is 4mm, now the live stream of top layer Copper Foil and bottom Copper Foil can be 8A, when cabling 20 actual needs maximum current is greater than 8A will measure to strengthen cabling 20 carry current capacity, adding above-mentioned pad structure 100 can head it off.And cabling longer time, can multiple pad structure 100 with the use of; In order to prevent cabling conductive capability uneven, can join in cabling multiple pad structure 100 arranged side by side interlocking.
Pad structure 100 described in the present embodiment, realizes flowing through larger electric current at limited cabling space, avoids increasing auxiliary first device such as route thus reduces manufacturing cost, enhances productivity, falling end printed circuit board (PCB) heating, improve product quality.
The above embodiment only have expressed several execution mode of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (9)
1. a pad structure, is characterized in that, comprises and is opened on substrate and runs through the fluting on the upper and lower surface of this substrate and be coated on the conductive layer at described fluting edge.
2. pad structure according to claim 1, it is characterized in that, described fluting comprises coaxial the first fluting and two second flutings arranged, and two described second flutings are positioned at the two ends of described first fluting, and the width of described second fluting is larger than the width of described first fluting.
3. pad structure according to claim 2, is characterized in that, described conductive layer is covered in the sidewall of described second fluting bottom surface and described first fluting.
4. pad structure according to claim 2, is characterized in that, the thickness being covered in the described conductive layer of described second fluting is less than or equal to the degree of depth of described second fluting.
5. the pad structure according to claim 2,3 or 4, is characterized in that, the width of described first fluting is a, wherein, and 0.8mm≤a≤1.2mm; The width of described second fluting is b, wherein, and b – a >=0.2mm.
6. pad structure according to claim 1 and 2, is characterized in that, described fluting is rectangle, round rectangle or circle.
7. pad structure according to claim 1 and 2, is characterized in that, described conductive layer is copper foil layer.
8. pad structure according to claim 1, is characterized in that, when carrying out scolding tin, tin cream is covered on described conductive layer.
9. a circuit board, comprises substrate, it is characterized in that, also comprises the pad structure described in any one of claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420788211.1U CN204335153U (en) | 2014-12-11 | 2014-12-11 | Pad structure and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420788211.1U CN204335153U (en) | 2014-12-11 | 2014-12-11 | Pad structure and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204335153U true CN204335153U (en) | 2015-05-13 |
Family
ID=53171457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420788211.1U Expired - Fee Related CN204335153U (en) | 2014-12-11 | 2014-12-11 | Pad structure and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204335153U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074102A (en) * | 2020-09-15 | 2020-12-11 | 杭州炬华科技股份有限公司 | PCB structure and circuit slotting and flow increasing process for PCB |
| CN113692126A (en) * | 2021-08-16 | 2021-11-23 | 北京梦之墨科技有限公司 | Circuit board, manufacturing method thereof and printing equipment |
-
2014
- 2014-12-11 CN CN201420788211.1U patent/CN204335153U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074102A (en) * | 2020-09-15 | 2020-12-11 | 杭州炬华科技股份有限公司 | PCB structure and circuit slotting and flow increasing process for PCB |
| CN113692126A (en) * | 2021-08-16 | 2021-11-23 | 北京梦之墨科技有限公司 | Circuit board, manufacturing method thereof and printing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150513 Termination date: 20191211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |