CN105960104B - Improve the method for graphic plating folder film - Google Patents
Improve the method for graphic plating folder film Download PDFInfo
- Publication number
- CN105960104B CN105960104B CN201610352377.2A CN201610352377A CN105960104B CN 105960104 B CN105960104 B CN 105960104B CN 201610352377 A CN201610352377 A CN 201610352377A CN 105960104 B CN105960104 B CN 105960104B
- Authority
- CN
- China
- Prior art keywords
- auxiliary
- plate
- electroplate
- area
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 claims abstract description 51
- 238000009713 electroplating Methods 0.000 claims abstract description 22
- 230000008569 process Effects 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000004064 recycling Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 230000002159 abnormal effect Effects 0.000 abstract description 5
- 230000006872 improvement Effects 0.000 abstract description 4
- 238000009826 distribution Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of methods of improvement graphic plating folder film, the following steps are included: (1) places at least one PCB production plate in the plate placement region that winged Palestine and China are electroplated, winged bar of the plating passes through two electroplating line transmitting electroplating currents to the two sides of the plate in the plate placement region respectively；At least one auxiliary electroplate is placed on the vacancy in the plate placement region to be covered with entire plate rest area；(2) graphic plating process is routinely carried out；(3) PCB being electroplated production plate is subjected to down one of etching work procedure；After the auxiliary electroplate is moved back tin, recycling.One aspect of the present invention can improve electric force lines distribution, reduce electroplating quality exception, and still further aspect can accurately calculate input total current value, be further reduced estimation or empirical value and cause electroplating quality abnormal.
Description
Technical field
The present invention relates to printed circuit board fields, more particularly to a kind of method of improvement graphic plating folder film.
Background technique
It regenerates along with the change of electronics new product and constantly accelerates, corresponding PCB (Printed Circuit Board,
Printed circuit board) type is continuously increased, and product is more towards type, and quantity is small, high density connection, the strong direction hair of electrical reliability
Exhibition, at present especially for express mail pcb board manufacturing enterprise, this requires especially prominent.And the graphic plating as manufacturing process,
It is the important procedure that line layer and hole coating are thickeied after outer light is imaged.
In graphic plating process, main quality abnormal is exactly plating folder film.The main reason for folder film occurs, which is electroplated, is, by
Pcb board material production figure number in graphic plating process is more, and production quantity is few, 3 plates is less than under general condition, and need to make sometimes
Make production initial workpiece, completely entirely winged bar can not be gone up, and pcb board area to be plated is smaller, then electric force lines distribution unevenness is electroplated, causes PCB
It is larger that fine and closely woven route or isolated land undertake actual current, and leading to copper electroplating layer thickness is more than thickness of dry film, and by dry film
Covering causes rear process to move back film failure, can not etch this region layers of copper when etching clean, and short circuit be caused to be scrapped.This is solved to ask
Thickness of dry film can be improved in topic, improves the methods of electroplating device and electroplating liquid medicine photo etching to be promoted and the side such as uniformity itself is electroplated
Method, but its production cost will greatly improve, and be unfavorable for Cost Control；
Also there is the prior art that the increase around the pcb board material on winged bar of plating is taken to scrap rim charge auxiliary plating (such as Fig. 1 institute
Show), to improve coating uniformity.But due to, because depositing using various sizes of rim charge, causing its area accurate in production
It calculates, can only be calculated by skilled worker's personnel's empirical value, can not accurately calculate winged bar of whole plating of current value, so as to cause
The plating folder quality abnormals such as film or copper thickness deficiency occur.
Summary of the invention
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of method of improvement graphic plating folder film.
Specific technical solution is as follows:
A method of improving graphic plating and press from both sides film, comprising the following steps:
(1) at least one PCB production plate is placed in the plate placement region that winged Palestine and China are electroplated, winged bar of the plating is to described
The two sides of plate in plate placement region passes through two electroplating line transmitting electroplating currents respectively；In the plate placement region
In vacancy on place at least one auxiliary electroplate to be covered with entire plate rest area；
(2) graphic plating process is routinely carried out；
(3) PCB being electroplated production plate is subjected to down one of etching work procedure；After the auxiliary electroplate is moved back tin,
Recycling；
The ratio of the area of the area and PCB production plate of the auxiliary electroplate is 1:0.8~1:1.3；
The auxiliary electroplate includes the first auxiliary surface and the second auxiliary surface, first auxiliary surface and second auxiliary
Surface is helped to be provided with insulating regions and nonisulated region；The PCB production plate includes the first production surface and the second production table
Face；First auxiliary surface and first production surface are located on same electroplating line；Second auxiliary surface with
Second production surface is located on another electroplating line；The area in the nonisulated region of first auxiliary surface with it is described
The ratio of the area to be plated on the first production surface is 1:1~1:1.3；The area in the nonisulated region of second auxiliary surface and institute
The ratio for stating the area to be plated on the second production surface is 1:1~1:1.3.
Such as the ratio of the area to be plated of the area and first production surface in the nonisulated region of first auxiliary surface
The area in the nonisulated region of range or second auxiliary surface beyond 1:1~1:1.3 and described second produces surface
The ratio of area to be plated exceeds the range of 1:1~1:1.3, it is likely that causes the adverse consequences of the disposable qualification rate decline of hole copper.
In wherein some embodiments, the auxiliary electroplate is divided into five according to the of different sizes of nonisulated region area
Kind, the nonisulated region area on five kinds of auxiliary electroplate accounts for the 30%, 40% of entire auxiliary plating plate suqare respectively,
50%, 60% and 70%.
In wherein some embodiments, the nonisulated region area phase of first auxiliary surface and the second auxiliary surface
Together.
In wherein some embodiments, the auxiliary electroplate be rectangle, a length of 550 ± 10mm, width be 350 ±
10mm.The present invention obtains the auxiliary electricity of above-mentioned size in conjunction with production practices according to the research for a long time in pcb board manufacture
Plating plate can meet the needs of most of PCB size.
In wherein some embodiments, one layer of material of resistance to galvanic insulation is covered on the insulating regions of the auxiliary electroplate
Material.
In wherein some embodiments, the resistance to stop-off material is epoxy resin insulation material.
In wherein some embodiments, the auxiliary electroplate is prepared by 314 or 316 stainless steels.
The present invention compared with the prior art the advantages of and have the beneficial effect that
Inventor in view of the shortcomings of the prior art, is not changing electroplating device, or adjustment is electroplated under conditions of photo etching, Yu Tu
The auxiliary electroplate that can be recycled of same size is placed in shape electroplating work procedure, by pcb board to be plated to be covered with entire plating
The gap of winged bar of plate placement region, and define that nonisulated region and PCB in auxiliary electroplate produce the to be plated of plate
The corresponding relationship of area；Further, according to the research for a long time to pcb board material graphic plating, setting five kinds has not
With the auxiliary electroplate of the specific dimensions in the nonisulated region of area, most production requirement can be met.One aspect of the present invention
Electric force lines distribution can be improved, input current value can accurately be calculated by reducing quality abnormals, the still further aspects such as plating folder film, into
One step reduces estimation or empirical value and causes electroplating quality abnormal.
Detailed description of the invention
Fig. 1 is that the prior art takes the schematic diagram for scrapping rim charge progress graphic plating；
Fig. 2 be the present invention take auxiliary electroplate carry out graphic plating schematic diagram, wherein 100 for PCB produce plate, 200
To assist electroplate, 210 be insulating regions, and 300 be winged bar of plating, and 310 be plating top clip.
Specific embodiment
The present invention is further illustrated by the following examples.
Embodiment 1
A method of improving graphic plating and press from both sides film, comprising the following steps:
(1) the plate placement region in winged bar 300 of plating places at least one PCB production plate 100, is electroplated winged bar 300
Two electroplating line transmitting electroplating currents are passed through respectively to the two sides of the plate in plate placement region；In plate placement region
Vacancy on place at least one auxiliary electroplate 200 to be covered with entire plate rest area；In the present embodiment, PCB produces plate
100 and auxiliary electroplate 200 be all to fly the plating top clip 310 in bars 300 by being electroplated and fixed；
Assisting the ratio of the area of electroplate 200 and the area of PCB production plate 100 is 1:0.8~1:1.3；
Electroplate 200 is assisted to include the first auxiliary surface and the second auxiliary surface, the first auxiliary surface and the second supplementary table
Face is provided with insulating regions and nonisulated region；It includes the first production surface and the second production surface that PCB, which produces plate 100,；The
One auxiliary surface is located on same electroplating line with the first production surface；Second auxiliary surface is located at another with the second production surface
On one electroplating line；The ratio of the area in the nonisulated region of the first auxiliary surface and the area to be plated on the first production surface is 1:
1~1:1.3；The ratio of the area in the nonisulated region of the second auxiliary surface and the area to be plated on the second production surface is 1:1~1:
1.3。
(2) according to the area to be plated etc. on the particular number of auxiliary electroplate, nonisulated region and PCB production plate, divide
Current value is not calculated, carries out graphic plating process；
If the PCB of small lot production model produces plate 100, quantity is 2 plates, having a size of 560mm*370mm, PCB
The area to be plated for producing the first production face surface-CS (component side) and the second production face surface-SS (welding surface) of plate 100 is equal
For 6.21dm2, area to be plated accounts for the 30% of the area of component side and welding surface respectively；Current density is 1.6ASD, and whole
(a length of 550 ± 10mm, width are 350 ± 10mm to the auxiliary electroplate 200 placed on winged bar, are altogether 5 pieces, assist electroplate
The area in the nonisulated region in 200 the first auxiliary surface and the second auxiliary surface is the area in face where nonisulated region
30%；
Thus CS surface current=1.6ASD*6.21dm is calculated2* (2+5)=69.5A；
SS surface current=1.6ASD*6.21dm2* (2+5)=69.5A.
Graphic plating process is carried out according to above-mentioned current value.
(3) PCB being electroplated production plate is subjected to down one of etching work procedure；After the auxiliary electroplate is moved back tin, recycling；
Auxiliary electroplate 200 is prepared by 314 or 316 stainless steels, and surface is smooth, smooth, in the present embodiment, auxiliary
Helping electroplate 200 and PCB to produce plate 100 is rectangle.
Auxiliary 200 surface of electroplate is provided with insulating regions 210, and in the present embodiment, the insulating regions 210 are multiple
At the rectangle of the same size of array arrangement, remaining region is nonisulated region, is covered with one layer of ring on the insulating regions 210
Oxygen resin-insulated material.In other embodiments, insulating regions 210 can be the circle of multiple same sizes at array arrangement
Or other arrangement modes or shape, as long as meeting remaining nonisulated region accounts for entire auxiliary 200 area of electroplate 30%,
40%, 50%, 60% and 70%, it also can choose the insulating materials of other resistance to plating.
Inventor will assist electroplate 200 to account for entire auxiliary 200 area of electroplate according to nonisulated region by summarizing
30%, 40%, 50%, 60% and 70% is preferably five kinds, cooperates a length of 550 ± 10mm, width is the ruler of 350 ± 10mm
It is very little, it can satisfy the production needs of most of common PCB production plate 100 substantially.
In graphic plating work process, according to the area to be plated selection auxiliary electroplate on PCB production plate 100 to be electroplated
200, if the area to be plated on the first production surface on PCB production plate 100 is 31%, the area to be plated on the second production surface is
30%, then the nonisulated region area of optional first auxiliary surface and the second auxiliary surface is 30% auxiliary electroplate
200 carry out auxiliary plating.
In the present embodiment, assist the nonisulated region area on two surfaces on electroplate 200 identical.In other realities
It applies in example, two different auxiliary electroplates 200 of the nonisulated area in surface also can be set.
After completing graphic plating process, PCB production plate 100 will continue the normal process steps such as subsequent etching, and auxiliary
Help electroplate 200 then can be after routinely moving back tin processing, recycling recycles.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (7)
1. a kind of method for improving graphic plating folder film, which comprises the following steps:
(1) at least one PCB production plate is placed in the plate placement region that winged Palestine and China are electroplated, winged bar of the plating is to the plate
The two sides of plate in placement region passes through two electroplating line transmitting electroplating currents respectively；In the plate placement region
At least one auxiliary electroplate is placed on vacancy to be covered with entire plate rest area；
(2) graphic plating process is routinely carried out；
(3) PCB being electroplated production plate is subjected to down one of etching work procedure；After the auxiliary electroplate is moved back tin, recycling；
The ratio of the area of the area and PCB production plate of the auxiliary electroplate is 1:0.8~1:1.3；
The auxiliary electroplate includes the first auxiliary surface and the second auxiliary surface, first auxiliary surface and the second supplementary table
Face is provided with insulating regions and nonisulated region；The PCB production plate includes the first production surface and the second production surface；Institute
It states the first auxiliary surface and first production surface is located on same electroplating line；Second auxiliary surface and described the
Two production surfaces are located on another electroplating line；The area in the nonisulated region of first auxiliary surface and first life
The ratio for producing the area to be plated on surface is 1:1~1:1.3；The area in the nonisulated region of second auxiliary surface and described second
The ratio for producing the area to be plated on surface is 1:1~1:1.3.
2. it is according to claim 1 improve graphic plating folder film method, which is characterized in that the auxiliary electroplate according to
The of different sizes of nonisulated region area is divided into five kinds, and the nonisulated region area on five kinds of auxiliary electroplate accounts for whole respectively
The 30%, 40%, 50%, 60% and 70% of a auxiliary plating plate suqare.
3. it is according to claim 1 improve graphic plating folder film method, which is characterized in that first auxiliary surface and
The nonisulated region area of second auxiliary surface is identical.
4. the method according to claim 1 for improving graphic plating folder film, which is characterized in that the auxiliary electroplate is length
Rectangular, a length of 550 ± 10mm, width is 350 ± 10mm.
5. the method according to any one of claims 1 to 4 for improving graphic plating folder film, which is characterized in that the auxiliary
One layer of resistance to stop-off material is covered on the insulating regions of electroplate.
6. the method according to claim 5 for improving graphic plating folder film, which is characterized in that the resistance to stop-off material
For epoxy resin insulation material.
7. the method according to any one of claims 1 to 4 for improving graphic plating folder film, which is characterized in that the auxiliary
Electroplate is prepared by 314 or 316 stainless steels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352377.2A CN105960104B (en) | 2016-05-24 | 2016-05-24 | Improve the method for graphic plating folder film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352377.2A CN105960104B (en) | 2016-05-24 | 2016-05-24 | Improve the method for graphic plating folder film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105960104A CN105960104A (en) | 2016-09-21 |
| CN105960104B true CN105960104B (en) | 2018-12-07 |
Family
ID=56910635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610352377.2A Expired - Fee Related CN105960104B (en) | 2016-05-24 | 2016-05-24 | Improve the method for graphic plating folder film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105960104B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107623999B (en) * | 2017-10-31 | 2020-05-08 | 中山市佳信电路板有限公司 | PCB electroplating method capable of preventing film clamping |
| CN109729649A (en) * | 2019-01-17 | 2019-05-07 | 江门崇达电路技术有限公司 | A kind of restorative procedure of PCB plating folder film |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383169A (en) * | 2011-10-31 | 2012-03-21 | 东莞生益电子有限公司 | Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate |
| CN203021663U (en) * | 2012-12-20 | 2013-06-26 | 景旺电子科技(龙川)有限公司 | Electroplating edge strip for PCB (Printed Circuit Board) electroplating |
| CN203613296U (en) * | 2013-11-26 | 2014-05-28 | 广州兴森快捷电路科技有限公司 | Electroplating device and auxiliary strake thereof for PCB (printed circuit board) |
-
2016
- 2016-05-24 CN CN201610352377.2A patent/CN105960104B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383169A (en) * | 2011-10-31 | 2012-03-21 | 东莞生益电子有限公司 | Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate |
| CN203021663U (en) * | 2012-12-20 | 2013-06-26 | 景旺电子科技(龙川)有限公司 | Electroplating edge strip for PCB (Printed Circuit Board) electroplating |
| CN203613296U (en) * | 2013-11-26 | 2014-05-28 | 广州兴森快捷电路科技有限公司 | Electroplating device and auxiliary strake thereof for PCB (printed circuit board) |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105960104A (en) | 2016-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4257203B2 (en) | Segmented counter electrode for electrolytic treatment systems | |
| US20130081939A1 (en) | Serial plating system | |
| CN105960104B (en) | Improve the method for graphic plating folder film | |
| KR101789299B1 (en) | Manufacturing method and manufacturing apparatus of metal foil | |
| CN102361539A (en) | Method for manufacturing groove-type printed wiring board | |
| CN206100615U (en) | Makeup structure of multilayer pressfitting circuit board | |
| CN105517363A (en) | Method for electroplating circuit board | |
| CN110402033B (en) | Circuit processing method of 10oz thick copper circuit board | |
| JP2019183249A (en) | Anode shielding plate, electrolytic plating device, and method for manufacturing metal-clad laminate | |
| CN106968008A (en) | It is a kind of to accompany plating plate and preparation method thereof applied to graphic plating VCP techniques | |
| JP5751530B2 (en) | Method for electrolytic plating long conductive substrate and method for producing copper clad laminate | |
| CN212357443U (en) | Electroplating device and anode assembly thereof | |
| JP2011246754A (en) | Method for manufacturing metallized resin film substrate | |
| JP6367664B2 (en) | Partial plating method and apparatus | |
| JPH0722473A (en) | Continuous plating method | |
| CN112779578A (en) | Ultrathin film electroplating device | |
| CN202643877U (en) | Printed-circuit board electroplating hanging-board structure | |
| CN208479960U (en) | A kind of thick film series circuit of low-power error | |
| CN207166875U (en) | A kind of circuit board VCP's accompanies plating plate | |
| KR102410794B1 (en) | High-quality plating apparatus | |
| KR20020082860A (en) | A continuous electroforming process to form a strip for battery electrodes and a mandrel to be used in said electroforming process | |
| CN203487255U (en) | Material strap shielding fixture | |
| JP2004176102A (en) | Electroplating apparatus and method for forming electroplated film | |
| JP3891593B2 (en) | Method and apparatus for precise electrolytic deposition or etching of metal layers on conductor plates and foils in feeding equipment | |
| TWI531687B (en) | Shunt Electroplating Machine and Shunt Electroplating Method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181207 |