CN105517363A - Method for electroplating circuit board - Google Patents
Method for electroplating circuit board Download PDFInfo
- Publication number
- CN105517363A CN105517363A CN201511034758.8A CN201511034758A CN105517363A CN 105517363 A CN105517363 A CN 105517363A CN 201511034758 A CN201511034758 A CN 201511034758A CN 105517363 A CN105517363 A CN 105517363A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- conductive tape
- electro
- plating
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a method for electroplating a circuit board. The circuit board is provided with a plurality of isolated circuits, and the method includes the steps of: performing pattern transfer on the circuit board, and displaying a circuit pattern on the circuit board; treating the circuit board before electroplating, and using a conductive tape to paste the periphery of the isolated circuits, one end of the conductive tape stretching out of an edge of the circuit board; performing pattern electroplating on the circuit board; before etching, tearing the conductive tape; and performing pattern etching on the circuit board. The conductive tape is pasted in the periphery of the isolated circuits, thereby expanding an electroplating area of the isolated circuits, during electroplating, electroplating is performed on the isolated circuits and the conductive tape at the same time, and the conductive tape achieves a function of shunting, thereby preventing a circumstance that the thickness of electroplating layers on the isolated circuits is too large and thus causing partial electroplating nonuniformity, diffusion coating or film clamping of the circuit board, and improving electroplating uniformity of the circuit board, secondary pattern transfer and etching are not needed, production efficiency is high, and production cost is reduced.
Description
Technical field
The present invention relates to printed wire electroplating technology field, particularly relate to a kind of electro-plating method of wiring board.
Background technology
Along with variation, the miniaturization of electronic product, require also day by day to improve to becoming more meticulous of printed wiring board, its graphic designs wiring variation, because of component placement design and the characteristic requirements of product, a lot of printing line circuit graphic designs skewness, local line or pad is caused seriously to isolate, and the graphics area of subregion may be excessive, this produces to printed wiring board graphic plating and brings serious challenge, and the situations such as parcel plating is uneven, plating, folder film easily appear in the product produced.The printed wiring board of prior art is for when having an isolated area, at the copper face that isolated area increase is windowed, successively by Graphic transitions, graphic plating, Etching, to increasing, secondary Graphic transitions is carried out in the position of windowing, the method for Etching is processed, but this method needs through twice etching, secondary image shifts, production efficiency is low, and production cost is high.
Summary of the invention
The object of the present invention is to provide a kind of electro-plating method of wiring board, can avoid repeatedly Graphic transitions and etching, improve the electroplating evenness of wiring board, production efficiency is high, reduces production cost.
For realizing object of the present invention, the technical scheme taked is:
An electro-plating method for wiring board, this wiring board is provided with several isolated circuits, and the method comprises the following steps:
Graphic transitions is carried out to wiring board, the line pattern on circuit plate;
Carry out pre-electroplating treatment to wiring board, use conductive tape to paste around the periphery of isolated circuit, the edge of wiring board is stretched out in one end of conductive tape;
Graphic plating is carried out to wiring board;
Before etching, conductive tape is removed;
Etching is carried out to wiring board.
By stickup conductive tape around isolated circuit, expand the plating area of isolated circuit, electroplate on isolated circuit and conductive tape during plating simultaneously, conductive tape plays the effect of shunting, prevent the isolated circuit thickness of coating that powers on too high, parcel plating is uneven, the situation of plating or folder film to cause wiring board to occur, improves the electroplating evenness of wiring board.And after having electroplated, conductive tape is removed, just can obtain the target electrodeposited coating of isolated circuit, without the need to carrying out secondary Graphic transitions and etching, production efficiency is high, reduces production cost.
Below technical scheme is further illustrated:
Further, there is gap between conductive tape and isolated circuit.Prevent when removing conductive tape, the target electrodeposited coating on isolated circuit is caused damage, the target electrodeposited coating on isolated circuit is protected.
Further, the width in gap is d, wherein, and 1mm≤d≤3mm.After conductive tape is removed, remain in electrodeposited coating on isolated circuit in the error range of target electrodeposited coating, prevent the isolated circuit of conductive tape and circuit board from linking together.
Further, carrying out in pre-electroplating treatment step to wiring board, using the logicalnot circuit graphics field on plating resist film covering wiring board.When making plating, prevent from electroplating logicalnot circuit graphics field, enhance productivity further.
Further, before etching, plating resist film is carried out moving back membrane operations.When preventing etching, the electrodeposited coating under plating resist film cannot be etched, and affects etch effect.
Further, the width of conductive tape is 5 ~ 10mm.
Further, the thickness of conductive tape is not less than 0.25mm.Facilitate conductive tape to paste, and be beneficial to and manual tear conductive tape.
Further, conductive tape uses Copper Foil as electric conductor, before conductive tape is affixed to wiring board, uses scraper to carry out cutting to conductive tape.There is cull to stay on dry film after preventing conductive tape from tearing, affect and follow-up move back film and etching work procedure.
Further, carrying out in graphic plating step to wiring board, copper facing, zinc-plated or plating nickel gold operation are being carried out successively to the line pattern on wiring board.
Further, carry out in pattern transfer step to wiring board, use the film or laser selective ground exposed portion light resist, and by the line pattern on development liquid medicine circuit plate.
Compared with prior art, the present invention has following beneficial effect:
The present invention is by stickup conductive tape around isolated circuit, expand the plating area of isolated circuit, electroplate on isolated circuit and conductive tape during plating simultaneously, conductive tape plays the effect of shunting, prevent the isolated circuit thickness of coating that powers on too high, parcel plating is uneven, the situation of plating or folder film to cause wiring board to occur, improves the electroplating evenness of wiring board.And after having electroplated, conductive tape is removed, just can obtain the target electrodeposited coating of isolated circuit after moving back film etching, without the need to carrying out secondary Graphic transitions and etching, production efficiency is high, reduces production cost.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the electro-plating method of embodiment of the present invention wiring board.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail:
As shown in Figure 1, a kind of electro-plating method of wiring board, this wiring board is provided with several isolated circuits, and the method comprises the following steps:
Graphic transitions is carried out to wiring board, the line pattern on circuit plate;
Carry out pre-electroplating treatment to wiring board, use conductive tape to paste around the periphery of isolated circuit, the edge of wiring board is stretched out in one end of conductive tape;
Graphic plating is carried out to wiring board;
Before etching, conductive tape is removed;
Etching is carried out to wiring board.
By stickup conductive tape around isolated circuit, expand the plating area of isolated circuit, electroplate on isolated circuit and conductive tape during plating simultaneously, conductive tape plays the effect of shunting, prevent the isolated circuit thickness of coating that powers on too high, parcel plating is uneven, the situation of plating or folder film to cause wiring board to occur, improves the electroplating evenness of wiring board.And after having electroplated, conductive tape is removed, just can obtain the target electrodeposited coating of isolated circuit, without the need to carrying out secondary Graphic transitions and etching, production efficiency is high, reduces production cost.
In the present embodiment, use the film or laser imaging optionally exposed portion light resist, and by the line pattern on development liquid medicine circuit plate.Graphic transitions can also be carried out in other way according to actual needs to wiring board.When Etching is carried out to wiring board, unwanted figure is etched away by liquid medicine, expose the part line pattern of final needs.
Before Graphic transitions is carried out to wiring board, first whole plate electro-coppering is carried out to wiring board, after Graphic transitions, again pre-electroplating treatment is carried out to wiring board, the periphery of conductive tape around isolated circuit is pasted, between conductive tape and isolated circuit, there is gap.Prevent when removing conductive tape, the target electrodeposited coating on isolated circuit is caused damage, the target electrodeposited coating on isolated circuit is protected.
In the present embodiment, the width of conductive tape is 5 ~ 10mm, and the thickness of conductive tape is not less than 0.25mm, facilitates the stickup of conductive tape, is beneficial to again manual tearing.When pasting conductive tape, the gap width d between conductive tape and isolated circuit is between 1mm to 3mm.After conductive tape is removed, remain in electrodeposited coating on isolated circuit in the error range of target electrodeposited coating, link together to prevent conductive tape and isolated circuit.Gap width d between conductive tape and isolated circuit can also be set to other numerical value according to actual needs, and conductive tape width can design different width according to the size of isolated circuit.And the adhesion strength of conductive tape is 1.5 ~ kg/25mm, guarantee that conductive tape is adjacent on dry film, and can easily tear it down after plating.
In the present embodiment, conductive tape uses Copper Foil as electric conductor, before conductive tape is affixed to wiring board, uses scraper to carry out cutting to conductive tape.There is cull to stay on dry film after preventing conductive tape from tearing, affect and follow-up move back film and etching work procedure.
When isolated line pitch is larger, two or more pieces conductive tape can be pasted and be uniformly distributed to meet and distribute without copper zone current.And the spacing of isolated circuit is larger, the thickness of coating of isolated circuit is thicker, when spacing is greater than 3mm, the copper of isolated circuit is thick is 1.5 times of normal large copper face, as the thick control 1mil of electro-coppering, the thickness of isolated circuit is just close with the thickness of plating resist dry film, if spacing strengthens again, will there is the risk of folder film.
In the present embodiment, one of them that can be in isolated circuit, isolated pad, weld-ring of the isolated circuit on circuit board is planted.When carrying out pre-electroplating treatment to wiring board, use the logicalnot circuit graphics field on plating resist film covering wiring board.When making plating, prevent from electroplating logicalnot circuit graphics field, enhance productivity further.And before etching, plating resist film is carried out moving back membrane operations.When preventing etching, the electrodeposited coating under plating resist film cannot be etched, and affects etch effect.
Carrying out in graphic plating step to wiring board, copper facing, zinc-plated or plating nickel gold operation are being carried out successively to the line pattern on wiring board.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. an electro-plating method for wiring board, is characterized in that, this wiring board is provided with several isolated circuits, and the method comprises the following steps:
Graphic transitions is carried out to wiring board, the line pattern on circuit plate;
Carry out pre-electroplating treatment to wiring board, use conductive tape to paste around the periphery of isolated circuit, the edge of wiring board is stretched out in one end of conductive tape;
Graphic plating is carried out to wiring board;
Before etching, conductive tape is removed;
Etching is carried out to wiring board.
2. the electro-plating method of wiring board according to claim 1, is characterized in that, there is gap between conductive tape and isolated circuit.
3. the electro-plating method of wiring board according to claim 2, is characterized in that, the width in described gap is d, wherein, and 1mm≤d≤3mm.
4. the electro-plating method of wiring board according to claim 1, is characterized in that, is carrying out in pre-electroplating treatment step to wiring board, uses the logicalnot circuit graphics field on plating resist film covering wiring board.
5. the electro-plating method of wiring board according to claim 4, is characterized in that, before etching, is carried out moving back membrane operations by plating resist film.
6. the electro-plating method of wiring board according to claim 1, is characterized in that, the width of described conductive tape is 5 ~ 10mm.
7. the electro-plating method of wiring board according to claim 6, is characterized in that, the thickness of described conductive tape is not less than 0.25mm.
8. the electro-plating method of wiring board according to claim 1, is characterized in that, described conductive tape uses Copper Foil as electric conductor, before conductive tape is affixed to wiring board, uses scraper to carry out cutting to conductive tape.
9. the electro-plating method of the wiring board according to any one of claim 1 to 8, is characterized in that, is carrying out in graphic plating step to wiring board, carries out copper facing, zinc-plated or plating nickel gold operation successively to the line pattern on wiring board.
10. the electro-plating method of the wiring board according to any one of claim 1 to 8, it is characterized in that, carry out in pattern transfer step to wiring board, use the film or laser selective ground exposed portion light resist, and by the line pattern on development liquid medicine circuit plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511034758.8A CN105517363A (en) | 2015-12-31 | 2015-12-31 | Method for electroplating circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511034758.8A CN105517363A (en) | 2015-12-31 | 2015-12-31 | Method for electroplating circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105517363A true CN105517363A (en) | 2016-04-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511034758.8A Pending CN105517363A (en) | 2015-12-31 | 2015-12-31 | Method for electroplating circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN105517363A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455353A (en) * | 2016-10-28 | 2017-02-22 | 深圳市兴禾自动化有限公司 | Automatic PCB (Printed Circuit Board) high-temperature adhesive tearing device and adhesive tearing process thereof |
| CN107835575A (en) * | 2017-10-18 | 2018-03-23 | 通元科技(惠州)有限公司 | A kind of PCB electro-plating methods for being directed to separate lines and pad |
| CN109496080A (en) * | 2018-10-08 | 2019-03-19 | 江苏长电科技股份有限公司 | A kind of circuit board plating process method |
| CN110234202A (en) * | 2018-03-06 | 2019-09-13 | 易华电子股份有限公司 | The system for promoting dry film and substrate linking steady character |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349196A (en) * | 1999-06-08 | 2000-12-15 | Sumitomo Metal Electronics Devices Inc | Electroplating method of electronic part and manufacture of the same |
| CN101697666A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Circuit board plating device and method |
| CN201797651U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | PCB (printed circuit board) board with shunt copper sheet |
| CN202841678U (en) * | 2012-07-25 | 2013-03-27 | 广东达进电子科技有限公司 | Outer-layer structure of circuit board |
| CN103619125A (en) * | 2013-11-28 | 2014-03-05 | 深圳市景旺电子股份有限公司 | PCB electroplating method for improving electroplating uniformity |
-
2015
- 2015-12-31 CN CN201511034758.8A patent/CN105517363A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349196A (en) * | 1999-06-08 | 2000-12-15 | Sumitomo Metal Electronics Devices Inc | Electroplating method of electronic part and manufacture of the same |
| CN101697666A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Circuit board plating device and method |
| CN201797651U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | PCB (printed circuit board) board with shunt copper sheet |
| CN202841678U (en) * | 2012-07-25 | 2013-03-27 | 广东达进电子科技有限公司 | Outer-layer structure of circuit board |
| CN103619125A (en) * | 2013-11-28 | 2014-03-05 | 深圳市景旺电子股份有限公司 | PCB electroplating method for improving electroplating uniformity |
Non-Patent Citations (2)
| Title |
|---|
| 张林生: "《机械工业废水处理技术及典型工程》", 30 April 2008 * |
| 邓舜扬: "《新型化工配方和工艺精选》", 31 October 2002 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455353A (en) * | 2016-10-28 | 2017-02-22 | 深圳市兴禾自动化有限公司 | Automatic PCB (Printed Circuit Board) high-temperature adhesive tearing device and adhesive tearing process thereof |
| CN106455353B (en) * | 2016-10-28 | 2023-06-02 | 深圳市兴禾自动化股份有限公司 | Automatic PCB high-temperature adhesive tearing device and adhesive tearing process thereof |
| CN107835575A (en) * | 2017-10-18 | 2018-03-23 | 通元科技(惠州)有限公司 | A kind of PCB electro-plating methods for being directed to separate lines and pad |
| CN110234202A (en) * | 2018-03-06 | 2019-09-13 | 易华电子股份有限公司 | The system for promoting dry film and substrate linking steady character |
| CN109496080A (en) * | 2018-10-08 | 2019-03-19 | 江苏长电科技股份有限公司 | A kind of circuit board plating process method |
| CN109496080B (en) * | 2018-10-08 | 2021-04-09 | 江苏长电科技股份有限公司 | Circuit board electroplating process method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160420 |