CN105228372A - The manufacture method of a kind of wiring board local golden finger - Google Patents
The manufacture method of a kind of wiring board local golden finger Download PDFInfo
- Publication number
- CN105228372A CN105228372A CN201510623560.7A CN201510623560A CN105228372A CN 105228372 A CN105228372 A CN 105228372A CN 201510623560 A CN201510623560 A CN 201510623560A CN 105228372 A CN105228372 A CN 105228372A
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- CN
- China
- Prior art keywords
- golden finger
- wiring board
- dry film
- copper
- manufacture method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses the manufacture method of a kind of wiring board local golden finger, relate to wiring board production technical field.Described manufacture method comprises the following steps: S1 makes wiring board outer-layer circuit figure; S2 plates the thin copper of one deck at the whole plate of PCB surface, then directly pastes the first dry film, opens the one-level window of the monolateral large 0.25-0.3mm of copper at the bottom of than golden finger position in the position of the corresponding golden finger of the first dry film; S3 microetch liquid medicine etches away the heavy thin copper of one-level the window's position step S2; S4 pastes the second dry film on the first dry film, opens the secondary windows of the monolateral large 0.08-0.12mm of copper at the bottom of than golden finger position in the position of the corresponding golden finger of the second dry film; S5 is at position electricity nickel, the gold of the corresponding secondary windows of wiring board; S6 fades away the first dry film and the second dry film, etches away the thin copper that PCB surface step S2 is heavy.The manufacture method of wiring board local of the present invention golden finger, at electric nickel, Jin Hou, without the need to the lead-in wire of etch gold finger, can not cause the problem that the circuit of PCB surface causes circuit less than normal because of etching lead-in wire.
Description
Technical field
The present invention relates to wiring board production technical field, particularly relate to the manufacture method of a kind of wiring board local golden finger.
Background technology
Current wiring board makes in golden finger process, need have been gone between conduct effect by design, and lead-in wire conduction could be golden on the electricity of golden finger position, etches away lead-in wire, thus produce the production plate met the demands after electricity gold by skin.And prior art makes in the process of circuit board golden finger, on wiring board, local needs the golden finger of electricity gold to compare dispersion, makes gold finger lead process also more numerous and diverse, needs again outer etching to be etched away by lead-in wire, well cannot meet need of production after electric gold; Meanwhile, in outer etching process, the problem easily causing the circuit on wiring board to cause circuit less than normal because of etching lead-in wire, causes scrapping of wiring board.
Summary of the invention
For the problems referred to above, the invention provides a kind of manufacture method that can be good at solving local electric golden finger on wiring board, concrete scheme is as follows:
A manufacture method for wiring board local golden finger, comprises the following steps:
S1: make wiring board outer-layer circuit figure, described line pattern comprises the end copper of golden finger position;
S2: plate the thin copper of one deck at the whole plate of PCB surface, thin copper thickness is 0.1-2 μm, is preferably 0.3-0.6 μm; Then directly paste the first dry film, open one-level window in the position of the corresponding golden finger of the first dry film, described one-level window is identical with the shape of copper at the bottom of golden finger position, and the area of one-level window is greater than the area of copper at the bottom of golden finger position; Spacing between the edge of described one-level window and the edge of copper at the bottom of corresponding golden finger position is 0.25-0.3mm;
S3: etch away the heavy thin copper of one-level the window's position step S2 with microetch liquid medicine, then the thiourea solution of wiring board with mass fraction 3-5% is cleaned, remove the activation Pb that plate face is residual;
S4: paste the second dry film on the first dry film, opens secondary windows in the position of the corresponding golden finger of the second dry film; Described secondary windows is identical with the shape of copper at the bottom of golden finger position, and the area of secondary windows is greater than the area of copper at the bottom of golden finger position; Spacing between the edge of described secondary windows and the edge of copper at the bottom of corresponding golden finger position is 0.08-0.12mm, is preferably monolateral large 0.1mm.
S5: at position electricity nickel, the gold of the corresponding secondary windows of wiring board;
S6: the first dry film that the PCB surface that fades away covers and the second dry film, wiring board adhesive tape is pasted in the position of electronickelling, gold, prevent rear operation microetch liquid medicine from polluting golden face, then the heavy thin copper of PCB surface step S2 is etched away with microetch liquid medicine, expose PCB surface circuit, tear wiring board adhesive tape after microetch, golden finger is exposed.
The manufacture method of wiring board local of the present invention golden finger, by adjusting the making step of golden finger, at electric nickel, Jin Hou, without the need to the lead-in wire adopting outer etching solution etch gold to point, the problem that the circuit of PCB surface causes circuit less than normal because of etching lead-in wire can not be caused, reduce the scrappage of wiring board, improve the quality of local electric nickel gold.
Accompanying drawing explanation
Fig. 1 is the vertical view after embodiment of the present invention wiring board first dry film opens one-level window.
Fig. 2 is the vertical view after embodiment of the present invention wiring board second dry film opens secondary windows.
Fig. 3 is the cutaway view of wiring board along Fig. 2 A-A direction.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment technical scheme of the present invention being introduced further and illustrating.
Embodiment
Make each core material circuit, be then pressed into wiring board, then wiring board is produced wiring board outer-layer circuit figure through heavy copper, plate electricity, outer graphics, graphic plating, outer etching, outer-layer circuit figure comprises the end copper of golden finger position.
At the PCB surface electroless copper plating of outer-layer circuit figure that completes, the thin copper thickness of electroless copper plating is 0.3-0.6 μm.
Wiring board only outer pre-treatment after heavy thin copper, directly pastes the first dry film 2, opens one-level window 21 through exposure technology in the position of the corresponding golden finger of the first dry film 2.As shown in Figure 1, one-level window 21 is identical with the shape of copper at the bottom of golden finger position 1, the area of one-level window 21 is greater than the area of copper 1 at the bottom of golden finger position, and the spacing between the edge of one-level window 21 and the edge of copper 1 at the bottom of corresponding golden finger position is 0.25-0.3mm (namely one-level window 21 is than the monolateral large 0.25-0.3mm of copper at the bottom of golden finger position 1).
Wiring board is crossed microetch line, etch away the thin copper of one-level the window's position PCB surface electroless copper plating with microetch liquid medicine, then the thiourea solution of wiring board with mass fraction 3-5% is cleaned, remove the activation Pb that plate face is residual;
Then on the first dry film 2, paste the second dry film 3, open secondary windows 31 through exposure technology in the position of the corresponding golden finger of the second dry film 3.As shown in Figures 2 and 3, secondary windows 31 is identical with the shape of copper at the bottom of golden finger position 1, the area of secondary windows 31 is greater than the area of copper 1 at the bottom of golden finger position, and the spacing between the edge of secondary windows 31 and the edge of copper 1 at the bottom of corresponding golden finger position is 0.08-0.12mm (namely secondary windows 31 is than the monolateral large 0.1mm of copper 1 at the bottom of golden finger position on base material 4).
At the position electricity nickel of the corresponding secondary windows of wiring board, gold to desired thickness;
The first dry film 2 and the second dry film 3 that the PCB surface that fades away covers, wiring board adhesive tape is pasted in the position of electronickelling, gold, prevent rear operation microetch liquid medicine from polluting golden face, then the heavy thin copper of the non-golden finger position of PCB surface is etched away with microetch liquid medicine, expose PCB surface circuit, tear wiring board adhesive tape after microetch, golden finger is exposed.
On demand, at wiring board surface printing solder mask, form protective layer.Should be noted, only microetch section before printing solder mask, prevents microetch liquid medicine from polluting golden face.
Then enter rear operation, carry out other surface of position process and gong goes out required profile, after carrying out electrical testing and visual examination, pack shipment.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (6)
1. a manufacture method for wiring board local golden finger, is characterized in that, comprise the following steps:
S1: make wiring board outer-layer circuit figure, described line pattern comprises the end copper of golden finger position;
S2: plate the thin copper of one deck at the whole plate of PCB surface, then directly paste the first dry film, opens one-level window in the position of the corresponding golden finger of the first dry film; Described one-level window is identical with the shape of copper at the bottom of golden finger position, and the area of one-level window is greater than the area of copper at the bottom of golden finger position; Spacing between the edge of described one-level window and the edge of copper at the bottom of corresponding golden finger position is 0.25-0.3mm;
S3: etch away the heavy thin copper of one-level the window's position step S2 with microetch liquid medicine;
S4: paste the second dry film on the first dry film, opens secondary windows in the position of the corresponding golden finger of the second dry film; Described secondary windows is identical with the shape of copper at the bottom of golden finger position, and the area of secondary windows is greater than the area of copper at the bottom of golden finger position; Spacing between the edge of described secondary windows and the edge of copper at the bottom of corresponding golden finger position is 0.08-0.12mm;
S5: at position electricity nickel, the gold of the corresponding secondary windows of wiring board;
S6: the first dry film that the PCB surface that fades away covers and the second dry film, then etch away the thin copper that PCB surface step S2 is heavy.
2. the manufacture method of wiring board local according to claim 1 golden finger, it is characterized in that, in described step S2, thin copper thickness is 0.1-2 μm.
3. the manufacture method of wiring board local according to claim 2 golden finger, it is characterized in that, described thin copper thickness is 0.3-0.6 μm.
4. the manufacture method of wiring board local according to claim 1 golden finger, is characterized in that, after described step S3, before step S4, also comprise and being cleaned by the thiourea solution of wiring board mass fraction 3-5%.
5. the manufacture method of wiring board local according to claim 1 golden finger, it is characterized in that, in described step S6, the method etching away the thin copper that PCB surface step S2 sinks is: paste cover layer in the position of electronickelling, gold, windowing in other positions, then etches away the heavy thin copper of PCB surface step S2 with microetch liquid medicine.
6. the manufacture method of wiring board local according to claim 5 golden finger, it is characterized in that, described cover layer is wiring board adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510623560.7A CN105228372A (en) | 2015-09-25 | 2015-09-25 | The manufacture method of a kind of wiring board local golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510623560.7A CN105228372A (en) | 2015-09-25 | 2015-09-25 | The manufacture method of a kind of wiring board local golden finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105228372A true CN105228372A (en) | 2016-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510623560.7A Pending CN105228372A (en) | 2015-09-25 | 2015-09-25 | The manufacture method of a kind of wiring board local golden finger |
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| Country | Link |
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| CN (1) | CN105228372A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
| CN106231816A (en) * | 2016-09-06 | 2016-12-14 | 深圳崇达多层线路板有限公司 | A kind of manufacture method of golden fingerboard without lead wire |
| CN110290644A (en) * | 2019-08-02 | 2019-09-27 | 无锡职业技术学院 | A kind of production method of staged golden finger wiring board |
| CN112188750A (en) * | 2020-10-09 | 2021-01-05 | 广州添利电子科技有限公司 | Selective electro-nickel gold process without gold surface overhang |
| CN112867273A (en) * | 2019-11-28 | 2021-05-28 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN103590058A (en) * | 2013-12-03 | 2014-02-19 | 奥士康科技（益阳）有限公司 | Cleaning liquid for removing palladium-removal liquid on PCB plate and cleaning method using the same |
| CN103702526A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Method for treating leadless electroplated golden finger |
| CN104582287A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Film removing method for leadless gilt plate |
-
2015
- 2015-09-25 CN CN201510623560.7A patent/CN105228372A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN103590058A (en) * | 2013-12-03 | 2014-02-19 | 奥士康科技（益阳）有限公司 | Cleaning liquid for removing palladium-removal liquid on PCB plate and cleaning method using the same |
| CN103702526A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Method for treating leadless electroplated golden finger |
| CN104582287A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Film removing method for leadless gilt plate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
| CN106231816A (en) * | 2016-09-06 | 2016-12-14 | 深圳崇达多层线路板有限公司 | A kind of manufacture method of golden fingerboard without lead wire |
| CN110290644A (en) * | 2019-08-02 | 2019-09-27 | 无锡职业技术学院 | A kind of production method of staged golden finger wiring board |
| CN112867273A (en) * | 2019-11-28 | 2021-05-28 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
| CN112867273B (en) * | 2019-11-28 | 2022-06-28 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
| CN112188750A (en) * | 2020-10-09 | 2021-01-05 | 广州添利电子科技有限公司 | Selective electro-nickel gold process without gold surface overhang |
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Application publication date: 20160106 |