CN109429442A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN109429442A CN109429442A CN201710773938.0A CN201710773938A CN109429442A CN 109429442 A CN109429442 A CN 109429442A CN 201710773938 A CN201710773938 A CN 201710773938A CN 109429442 A CN109429442 A CN 109429442A
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive
- pad
- conductive pad
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
Abstract
The present invention relates to a kind of circuit boards.A kind of circuit board includes an insulating layer, a weld pad, a nickel plating layer gold.The weld pad, the nickel plating layer gold are arranged on the insulating layer.The nickel plating layer gold coats the weld pad.The weld pad includes the first conductive pad and the second conductive pad.Second conductive pad is arranged on the insulating layer.First conductive pad is arranged on second conductive pad.The thickness of second conductive pad is less than the thickness of first conductive pad.Relatively described first conductive pad of second conductive pad has protrusion.The protrusion is around first conductive pad.The present invention also provides the production methods of foregoing circuit plate.
Description
Technical field
The present invention relates to circuit board making fields more particularly to a kind of multilayer circuit board and preparation method thereof.
Background technique
Printed circuit board is widely used because having many advantages, such as that packaging density is high.Application about circuit board is asked
Referring to document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High
Density multilayer printed circuit board for HITAC M-880, IEEE Trans.on
Components,Packaging,and Manufacturing Technology,1992,15(4):1418-1425。
In the manufacturing process of circuit board, it will usually be surface-treated to weld pad, successively plate one layer on weld pad surface
Nickel coating and one layer of Gold plated Layer.Weld pad, nickel coating, Gold plated Layer are respectively provided on the insulating layer, and nickel coating coats weld pad, Gold plated Layer packet
Plating nickel layer.In actual conditions, there is small gap in the intersection of Gold plated Layer, nickel coating and insulating layer.Wet air
It is easy to enter from gap and metal erosion occurs with the nickel coating.Nickel coating corrodes to a certain extent, and Gold plated Layer will be from electricity
Removing falls off on the plate of road.
Summary of the invention
Therefore, it is necessary to which providing a kind of circuit board and preparation method thereof solves above-mentioned technical problem.
A kind of production method of circuit board, comprising steps of
One first copper foil layer and an insulating layer are provided, the copper foil layer is fixed on the insulating layer；
It makes to form first conductive layer with line pattern, first conductive layer in the first copper foil layer surface
Including multiple first conductive pads；
It etches first copper foil layer and obtains the second conductive layer, make the line pattern and described first of second conductive layer
The line pattern of conductive layer, which faces, answers, and second conductive layer includes multiple second conductive pads, the thickness of second conductive pad
Degree is less than the thickness of first conductive pad, and first conductive pad and second conductive pad collectively form the circuit board
Weld pad, each first conductive pad are arranged on corresponding second conductive pad, second conductive pad relatively described first
Conductive pad has protrusion, and the protrusion is around first conductive pad；
One layer of nickel plating layer gold is plated in the upper surface of the weld pad and side.
A kind of circuit board includes an insulating layer, a weld pad, a nickel plating layer gold.The weld pad, the nickel plating layer gold are respectively provided with
On the insulating layer.The nickel plating layer gold coats the weld pad.The weld pad includes the first conductive pad and the second conductive pad.Institute
The second conductive pad is stated to be arranged on the insulating layer.First conductive pad is arranged on second conductive pad.Described second
The thickness of conductive pad is less than the thickness of first conductive pad.Relatively described first conductive pad of second conductive pad, which has, to be protruded
Part.The protrusion is around first conductive pad.
Compared with prior art, circuit board provided by the invention and preparation method thereof includes the weld pad, the weld pad packet
Include second conductive pad and first conductive pad.Second conductive pad is arranged on the insulating layer, and described first leads
Electrical pad is arranged on second conductive pad, and the thickness of second conductive pad is less than the thickness of first conductive pad, described
Relatively described first conductive pad of second conductive pad has protrusion, and the protrusion is described around first conductive pad
Protrusion close to the Gold plated Layer be extended, replace the nickel coating preferentially with the Gold plated Layer, nickel coating and it is described absolutely
The air and moisture entered between edge layer reacts, and has delayed the reaction time of the nickel coating and air and moisture, centainly
It prevents the Gold plated Layer that will remove from the circuit board in degree to fall off.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the copper clad laminate that invention preferred embodiment provides and the first dry film.
Fig. 2 is that the first dry film of copper of Fig. 1 exposes the diagrammatic cross-section of light forming pattern.
Fig. 3 is the diagrammatic cross-section after the first dry film development of Fig. 2.
Fig. 4 be Fig. 3 the first dry film pattern in form the diagrammatic cross-section after the first conductive layer.
Fig. 5 is that the copper clad laminate of Fig. 4 strips the diagrammatic cross-section after the first dry film.
Fig. 6 is that the first copper foil layer of Fig. 5 and the pressing of the first conductive layer paste the diagrammatic cross-section after the second dry film.
Fig. 7 is the diagrammatic cross-section after the second dry film exposure of Fig. 6.
Fig. 8 is the diagrammatic cross-section after the second dry film development of Fig. 7.
Fig. 9 is that the first copper foil layer of Fig. 8 etches the diagrammatic cross-section after forming pattern.
Figure 10 be Fig. 9 the second dry film from the first copper foil layer and the first conductive layer strip after diagrammatic cross-section.
Figure 11 is that the cross-sectional view after nickel coating and Gold plated Layer is formed on the weld pad of Figure 10.
Main element symbol description
Circuit board 100
Copper clad laminate 10
Insulating layer 12
First copper foil layer 14
First dry film 20
First dry film pattern 22
First opening 220
First conductive layer 30
First conductive pad 32
Second dry film 40
Second dry film pattern 42
Second opening 420
Second conductive layer 50
Second conductive pad 52
Protrusion 54
Line layer 60
Weld pad 70
Nickel coating 80
Gold plated Layer 90
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Below for making single layer board, come illustrate the technical program provide circuit board 100 production method, institute
The production method for stating circuit board 100 includes the following steps:
The first step a, referring to Fig. 1, copper clad laminate 10 and first dry film 20 are provided, by first dry film
20 paste the copper foil surface for being fixed on the copper clad laminate 10.
The copper clad laminate 10 includes an insulating layer 12 and one first copper foil layer 14.First copper foil layer 14 is covered in
On the insulating layer 12.Copper clad laminate 10 can be soft copper clad laminate, or rigid copper clad laminate.Described first
Dry film 20 is covered on first copper foil layer 14.
Second step, please refer to figs. 2 and 3 together, is exposed to first dry film 20, development treatment, described
The first dry film pattern 22 is formed on one dry film 20.
Referring to Fig. 3, being formed with multiple first openings 220 on the first dry film pattern 22.Part first copper foil
The exposure from the multiple first opening 220 of layer 14.
Third step forms institute on first copper foil layer 14 referring to Fig. 4, the copper clad laminate 10 is electroplated
State the first conductive layer 30.
First conductive layer 30 fills the multiple first opening 220.In present embodiment, first conductive layer 30
Thickness be less than first dry film 20 thickness.
In other embodiments, the thickness of first conductive layer 30 can be greater than or equal to first dry film 20
Thickness.
4th step, referring to Fig. 5, first dry film 20 is removed from first copper foil layer 14.Described first leads
The thickness of electric layer 30 is greater than the thickness of first copper foil layer 14.First conductive layer 30 includes multiple first conductive pads 32.
Second dry film 40 pressing is covered in described first referring to Fig. 6, providing one second dry film 40 by the 5th step
On copper foil layer 14 and first conductive layer 30.Second dry film 40 is photonasty cover film.
6th step is exposed second dry film 40 and development treatment, production is formed referring to Figure 7 together and Fig. 8
Second dry film pattern 42.
In this step, the second dry film pattern 42 coats first conductive layer 30, and the first bronze medal described in covering part
Layers of foil 14.First copper foil layer of part 14 is centered around first conductive layer 30.The second dry film pattern 42 includes multiple
Second opening 420.First copper foil layer 14 exposure from the multiple second opening 420.
7th step, referring to Fig. 9, etching first copper foil layer 14, first copper foil layer 14 is fabricated to line
Second conductive layer 50 of road pattern forms line layer 60 on the insulating layer 12.
The line pattern of second conductive layer 50 is corresponding with the line pattern of first conductive layer 30.
8th step, referring to Fig. 10, stripping second conductive layer 50 and the second dry film on first conductive layer 30
40, second conductive layer 50 is exposed with first conductive layer 30.
Second conductive layer 50 includes multiple second conductive pads 52.Second conductive layer 50 and first conductive layer
30 are collectively formed line layer 60.The line layer 60 includes first conductive layer 30 and second conductive layer of stacked on top
50.The line layer 60 includes multiple weld pads 70.The weld pad 70 includes the first conductive pad 32 and second conductive pad 52.Institute
The second conductive pad 52 is stated to be arranged on the insulating layer 12.First conductive pad 32 is fixed on second conductive pad 52.
The thickness of second conductive pad 52 is less than the thickness of first conductive pad 32.Second conductive pad 52 relatively described first
Conductive pad 32 has protrusion 54.The protrusion 54 is around first conductive pad 32.
9th step, please refers to Figure 11, plates one layer of nickel coating 80 on the surface of the weld pad 70, and in the nickel coating 80
Surface plate one layer of Gold plated Layer 90, to complete the production of the circuit board 100.
The nickel coating 80 is arranged on the insulating layer 12, and coats the weld pad 70.The setting of Gold plated Layer 90 exists
On the insulating layer 12, and coat the nickel coating 80.
Figure 11 is please referred to, the circuit board 100 includes the insulating layer 12, the weld pad 70, the nickel coating 80 and institute
State Gold plated Layer 90.The weld pad 70, the nickel coating 80 and the Gold plated Layer 90 are arranged on the insulating layer 12.The plating
Nickel layer 80 coats the upper surface and side of the weld pad 70.The Gold plated Layer 90 coats the nickel coating 80.The weld pad 70 wraps
Include second conductive pad 52 and first conductive pad 32.Second conductive pad 52 is arranged on the insulating layer 12.Institute
The first conductive pad 32 is stated to be arranged on second conductive pad 52.It is conductive that the thickness of second conductive pad 52 is less than described first
The thickness of pad 32.Relatively described first conductive pad 32 of second conductive pad 52 has protrusion 54.The protrusion 54
Around first conductive pad 32.
The top of first conductive pad 32 extends towards the direction close to the Gold plated Layer 90.The protrusion 54 is along vertical
Directly the cross sectional shape in 12 direction of insulating layer is triangle, rectangle or one of trapezoidal.The protrusion 54
Cross sectional shape is not limited to this.
Wherein, the vertical height of 12 upper surface of insulating layer described in 54 apogee distance of protrusion is h；Described second
The overall thickness of conductive pad 52 and first conductive pad 32 is T；The overall thickness of the nickel coating 80 and the Gold plated Layer 90 is H；
Wherein:
h+H≦T。
The width that the protrusion 54 protrudes from first conductive pad 32 is d, in which:
d≦T/3。
Circuit board provided by the invention and preparation method thereof includes the weld pad 70, and the weld pad 70 is led including described second
Electrical pad 52 and first conductive pad 32.Second conductive pad 52 is arranged on the insulating layer 12, first conductive pad
32 are arranged on second conductive pad 52, and the thickness of second conductive pad 52 is less than the thickness of first conductive pad 32,
Relatively described first conductive pad 32 of second conductive pad 52 has protrusion 54, and the protrusion 54 is around described first
Conductive pad 32, the protrusion 54 close to the Gold plated Layer 90 be extended, replace the nickel coating 80 preferentially with the plating
The air and moisture entered between layer gold 90, nickel coating 80 and the insulating layer 12 reacts, and has delayed the nickel coating 80
With the reaction time of air and moisture, prevent the Gold plated Layer 90 that will remove from the circuit board 100 to a certain extent de-
It falls.
It is understood that for those of ordinary skill in the art, can do in accordance with the technical idea of the present invention
Various other changes and modifications out, and all these changes and deformation all should belong to the protection model of the claims in the present invention
It encloses.
Claims (8)
1. a kind of production method of circuit board, comprising steps of
One first copper foil layer and an insulating layer are provided, the copper foil layer is fixed on the insulating layer；
It makes to form first conductive layer with line pattern in the first copper foil layer surface, first conductive layer includes
Multiple first conductive pads；
It etches first copper foil layer and obtains the second conductive layer, keep the line pattern of second conductive layer conductive with described first
The line pattern of layer, which faces, answers, and second conductive layer includes multiple second conductive pads, and the thickness of second conductive pad is small
In the thickness of first conductive pad, first conductive pad collectively forms the weldering of the circuit board with second conductive pad
Pad, each first conductive pad are arranged on corresponding second conductive pad, and second conductive pad relatively described first is led
Electrical pad has protrusion, and the protrusion is around first conductive pad；
One layer of nickel plating layer gold is plated in the upper surface of the weld pad and side.
2. the production method of circuit board as described in claim 1, which is characterized in that the protrusion is along perpendicular to described exhausted
The cross sectional shape in edge layer direction is triangle, rectangle or one of trapezoidal.
3. the production method of circuit board as described in claim 1, which is characterized in that form tool figuratum described the in production
It after one conductive layer, etches further comprising the steps of before first copper foil layer obtains the second conductive layer, provides one the
Second dry film is covered on first copper foil layer and first conductive layer by two dry films, and second dry film passes through
Exposure, development form the second dry film pattern, and the second dry film pattern coats first conductive layer, and covering part is around institute
First copper foil layer of the first conductive layer is stated, is not etched by first copper foil layer that the second dry film pattern coats
It removes.
4. the production method of circuit board as described in claim 1, which is characterized in that make shape in the first copper foil layer surface
Having at one includes: to provide one first dry film in the step of figuratum first conductive layer, first dry film is covered in described
On first copper foil layer, and first dry film is exposed, is developed, copper facing and stripping handle to obtain first conductive layer.
5. a kind of circuit board comprising an insulating layer, a weld pad, a nickel plating layer gold, the weld pad, the nickel plating layer gold are respectively provided with
On the insulating layer, the nickel plating layer gold coats the weld pad, and the weld pad includes the first conductive pad and the second conductive pad, institute
The second conductive pad to be stated to be arranged on the insulating layer, first conductive pad is arranged on second conductive pad, and described second
The thickness of conductive pad is less than the thickness of first conductive pad, and relatively described first conductive pad of second conductive pad, which has, to be protruded
Part, the protrusion is around first conductive pad.
6. circuit board as claimed in claim 5, which is characterized in that the end of second conductive pad is along perpendicular to the insulation
Layer direction cross sectional shape is triangle, rectangle or one of trapezoidal.
7. circuit board as claimed in claim 5, which is characterized in that on insulating layer described in the second conductive pad apogee distance
The vertical height on surface is h；The overall thickness of second conductive pad and first conductive pad is T；The nickel coating with it is described
The overall thickness of Gold plated Layer is H；Wherein: h+H≤T.
8. circuit board as claimed in claim 7, which is characterized in that it is conductive that second conductive pad end protrudes from described first
The width of pad is d, in which: d≤T/3.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710773938.0A CN109429442B (en) | 2017-08-31 | 2017-08-31 | Circuit board and manufacturing method thereof |
| TW106140405A TWI661751B (en) | 2017-08-31 | 2017-11-21 | Printed circuit board and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710773938.0A CN109429442B (en) | 2017-08-31 | 2017-08-31 | Circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109429442A true CN109429442A (en) | 2019-03-05 |
| CN109429442B CN109429442B (en) | 2020-09-22 |
Family
ID=65505473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710773938.0A Active CN109429442B (en) | 2017-08-31 | 2017-08-31 | Circuit board and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109429442B (en) |
| TW (1) | TWI661751B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714902A (en) * | 2017-10-25 | 2019-05-03 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN110809364A (en) * | 2019-11-15 | 2020-02-18 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method and PCB |
| CN114554729A (en) * | 2020-11-27 | 2022-05-27 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board and circuit board |
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| CN103582304A (en) * | 2012-07-30 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Transparent printed circuit board and manufacturing method thereof |
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| CN202857129U (en) * | 2012-09-11 | 2013-04-03 | 岳长来 | Structure of metal palladium layer in conducting layer of printed circuit board |
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| CN114554729A (en) * | 2020-11-27 | 2022-05-27 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109429442B (en) | 2020-09-22 |
| TW201914382A (en) | 2019-04-01 |
| TWI661751B (en) | 2019-06-01 |
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