CN109714902A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN109714902A CN109714902A CN201711015962.4A CN201711015962A CN109714902A CN 109714902 A CN109714902 A CN 109714902A CN 201711015962 A CN201711015962 A CN 201711015962A CN 109714902 A CN109714902 A CN 109714902A
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- conducting wire
- conductive pad
- circuit board
- substrate
- pad
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Abstract
The present invention relates to a kind of circuit boards.The circuit board includes a substrate and a line layer.The line layer includes a conducting wire film and an electroplated layer.The electroplated layer is arranged on the conducting wire film.The conducting wire film setting is on the substrate.The conducting wire film includes multiple first conductive pads.The electroplated layer includes multiple second conductive pads.Each first conductive pad forms a weld pad with corresponding one second conductive pad.The one nickel plating layer gold of weld pad outer cladding.The nickel plating layer gold setting is on the substrate.Second conductive pad is arranged on first conductive pad.Relatively described second conductive pad of first conductive pad has protrusion, and the protrusion is around second conductive pad.The present invention also provides the production methods of foregoing circuit plate.
Description
Technical field
The present invention relates to circuit board making fields more particularly to a kind of multilayer circuit board and preparation method thereof.
Background technique
Printed circuit board is widely used because having many advantages, such as that packaging density is high.Application about circuit board is asked
Referring to document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High
Density multilayer printed circuit board for HITAC M-880, IEEE Trans.on
Components,Packaging,and Manufacturing Technology,1992,15(4):1418-1425。
In the manufacturing process of circuit board, it will usually be surface-treated to weld pad, successively plate one layer on weld pad surface
Nickel coating and one layer of Gold plated Layer.Weld pad, nickel coating, Gold plated Layer are respectively provided on the insulating layer, and nickel coating coats weld pad, Gold plated Layer packet
Plating nickel layer.In actual conditions, there is small gap in the intersection of Gold plated Layer, nickel coating and insulating layer.Wet air
It is easy to enter from gap and metal erosion occurs with the nickel coating.Nickel coating corrodes to a certain extent, and Gold plated Layer will be from electricity
Removing falls off on the plate of road.
Summary of the invention
Therefore, it is necessary to which providing a kind of circuit board and preparation method thereof solves above-mentioned technical problem.
A kind of production method of circuit board, comprising steps of
Presoma is provided, the presoma includes electroconductive polymer monomer and soluble metal salt solution；
Substrate is provided, the presoma is coated on and is formed by curing conducting wire film on the surface of the substrate, the conduction
Line film includes multiple first conductive pads；
Electroplated layer is formed in the conducting wire film surface, the electroplated layer and conducting wire film collectively form route
Layer, the line pattern of the electroplated layer and the line pattern of conducting wire film face and answer, and the electroplated layer includes multiple the
Two conductive pads, first conductive pad and second conductive pad collectively form the weld pad of the circuit board, and each second is conductive
Pad is arranged on corresponding first conductive pad, and relatively described second conductive pad of first conductive pad has protruding portion
Point, the protrusion is around second conductive pad；
One layer of nickel plating layer gold is coated on the weld pad, obtains the circuit board.
A kind of circuit board a comprising substrate and a line layer, the line layer include a conducting wire film and one
Electroplated layer, the electroplated layer are arranged on the conducting wire film, and the conducting wire film is arranged on the substrate, institute
Stating conducting wire film includes multiple first conductive pads, and the electroplated layer includes multiple second conductive pads, each first conductive pad
A weld pad, the one nickel plating layer gold of weld pad outer cladding, the plating nickel gold are formed with corresponding one second conductive pad
On the substrate, second conductive pad is arranged on first conductive pad, and first conductive pad is with respect to institute for layer setting
The second conductive pad is stated with protrusion, the protrusion is around second conductive pad.
Compared with prior art, the production method of the circuit board provided by the invention is using on the conducting wire film
The mode that the electroplated layer is electroplated makes the line layer, it is easier to reach the production of thick copper circuit；The circuit board includes institute
Weld pad is stated, the weld pad includes first conductive pad and second conductive pad, and first conductive pad is arranged in the base
On plate, second conductive pad is arranged on first conductive pad, the relatively described second conductive pad tool of first conductive pad
There is protrusion, the protrusion is extended close to the Gold plated Layer, hinders air and moisture enters in the weld pad
Copper wire is corroded in portion；The conducting wire film itself is more preferable compared with the corrosion resistance of layers of copper route, and with the binding force of substrate compared with
It is good, when corrosive gas corrodes the weld pad, prevent the Gold plated Layer to remove from the circuit board to a certain extent de-
It falls, the circuit board is made to be not susceptible to the risk of route removing.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section for the substrate that invention preferred embodiment provides.
Fig. 2 is that the substrate surface of Fig. 1 forms conducting wire pattern and hardened to obtain conducting wire by ultraviolet light thin
Diagrammatic cross-section after film.
The substrate and the diagrammatic cross-section after conducting wire film laminating dry film that Fig. 3 is Fig. 2.
Fig. 4 is the diagrammatic cross-section after the dry film exposure development of Fig. 3.
Fig. 5 is that the diagrammatic cross-section after electroplated layer is formed in the dry film pattern of Fig. 4.
Fig. 6 is that the substrate of Fig. 5 strips the diagrammatic cross-section after dry film.
Fig. 7 is that the cross-sectional view after nickel coating and Gold plated Layer is formed on the weld pad of Fig. 6.
Main element symbol description
Circuit board 100
Substrate 10
Conducting wire film 20
First conductive pad 22
Protrusion 24
Dry film 30
Dry film pattern 32
Opening 320
Electroplated layer 40
Second conductive pad 42
Line layer 50
Weld pad 60
Nickel coating 70
Gold plated Layer 80
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Below for making single layer board, come illustrate the technical program provide circuit board 100 production method, institute
The production method for stating circuit board 100 includes the following steps:
The first step provides electroconductive polymer monomer and soluble metal salt solution.
The electroconductive polymer monomer is the monomer that the macromolecule that is formed is conductive after polymerization.The electric conductivity is high
Molecule monomer is specifically as follows aniline, pyrroles or thiophene etc., or derivative, azole derivatives or the thiophene of aniline spread out
Biology etc., such as 3,4- ethylene thiophene, 2,5- dimethoxy aniline etc..Electroconductive polymer monomer is usually liquid.
Soluble metal salt solution can be soluble copper salt solution, soluble silver salt solution or soluble palladium salting liquid
Deng.In the present embodiment, it is illustrated by taking copper-bath as an example.
The electroconductive polymer monomer and soluble metal salt solution are uniformly mixed to get presoma by second step.
In this step, mechanical stirring or other modes can be used, so that electroconductive polymer monomer and soluble gold
Belong to salting liquid uniformly to mix.
Third step, referring to Fig. 1, providing a substrate 10.
The substrate 10 is insulating substrate.The material of the insulating substrate can be commonly used in the process for circuit board making
Make the material of insulating layer, such as polyimides.
4th step forms conducting wire pattern on the surface of substrate 10 and adopts referring to Fig. 2, being coated on the presoma
The hardening of the conducting wire pattern described in ultraviolet light, obtains conducting wire film 20.The conducting wire film 20 includes more
A first conductive pad 22.
In this step, the presoma can be coated with by the way of screen painting, inkjet printing or rotary coating
In in the surface of substrate 10 formation conducting wire pattern.The shape of the conducting wire pattern and distribution and the conductor wire to be formed
The distribution on road and shape are identical.
It is irradiated by using ultraviolet light, so that the electric conductivity in the presoma in the conducting wire pattern is high
Polymerization reaction occurs for molecule monomer, becomes electroconductive polymer, combines closely with the surface of substrate 10.In the electric conductivity high score
During sub- monomer is polymerize, free electron, the solubility in presoma in the conducting wire pattern can produce
The metal ion of metal salt solution is reduced to metal simple-substance in conjunction with the free electron, and the conducting wire obtained from is thin
Metal simple-substance atom in film 20 is connected with each other, the electric conductivity of the conducting wire pattern after further increasing hardening.
Further, in this embodiment the wave-length coverage of the ultraviolet light used is 350 nanometer to 400 nanometers.Preferably
365 nanometers.When derivative, azole derivatives or the thiophene derivant using aniline are as electroconductive polymer monomer, such as
It is connected with reprimand electronics base, such as methoxyl group in the cyclic structure of fruit monomer, can more facilitate monomer and provide electricity in polymerization
Son gives the metal ion of metal salt, in order to which metal ion is reduced to metal simple-substance.For example, when electroconductive polymer monomer is 2,
When 5- dimethoxy aniline, it is connected separately with methoxyl group on 2 and 5 positions of phenyl ring, since methoxyl group has reprimand electro, thus
Monomer is accelerated to provide electronics in polymerization to the metal ion of metal salt, in order to which metal ion is reduced to metal simple-substance.
In addition, being led since the electroconductive polymer obtained after polymerization has the characteristic of oxidation/reduction condition conversion described
In electrical oxidation polymer/reducing condition conversion process, free electron can be released, so as to further speed up metal from
Son is reduced to metal simple-substance.
Electroconductive polymer obtained in conducting wire film 20 can be polyaniline, polypyrrole or polythiophene.Or benzene
The polymer of the derivative of amine, azole derivatives or thiophene derivant.Such as Polyglycolic acid fibre or poly- 2,5- dimethoxy
Aniline etc..The metal simple-substance can be copper, silver or palladium etc..
5th step provides a dry film 30 refering to Fig. 3, and the dry film 30 is covered in the substrate 10 and the conductor wire
On road film 20.
6th step forms dry film on the dry film 30 referring to Fig. 4, being exposed to the dry film 30, development treatment
Pattern 32.
Multiple openings 320 are formed on the dry film pattern 32.The conducting wire film 20 from it is the multiple opening 320
Middle exposure.The opening 320 is less than the conducting wire film 20 along vertical along the cross-sectional width perpendicular to 10 direction of substrate
Directly in the cross-sectional width in 10 direction of substrate.
7th step, referring to Fig. 5, the substrate 10 is electroplated, on the conducting wire film 20 described in formation
Electroplated layer 40.
The electroplated layer 40 fills the multiple opening 320.In present embodiment, the thickness of the electroplated layer 40 is less than institute
State the thickness of dry film 30.
In other embodiments, the thickness of the electroplated layer 40 can be equal to the thickness of the dry film 30.
8th step, referring to Fig. 6, the dry film 30 is removed from the substrate 10 and the conducting wire film 20.
The thickness of the electroplated layer 40 is greater than the thickness of the conducting wire film 20.The electroplated layer 40 is along perpendicular to the substrate 10
The cross-sectional width in direction is less than the conducting wire film 20 along the cross-sectional width perpendicular to 10 direction of substrate.
The line pattern of the electroplated layer 40 is corresponding with the line pattern of the conducting wire film 20.The electroplated layer
40 include multiple second conductive pads 42.Line layer 50 is collectively formed with the electroplated layer 40 in the conducting wire film 20.It is described
Line layer 50 includes the electroplated layer 40 and the conducting wire film 20 of stacked on top.The line layer 50 includes multiple welderings
Pad 60.The weld pad 60 is made of first conductive pad 22 and second conductive pad 42.First conductive pad 22 is arranged
On the substrate 10.Second conductive pad 42 is fixed on first conductive pad 22.The thickness of second conductive pad 42
Degree is greater than the thickness of first conductive pad 22.Relatively described second conductive pad 42 of first conductive pad 22 has protrusion
24.The protrusion 24 is around second conductive pad 42.
9th step, referring to Fig. 7, plating one layer of nickel coating 70 on the surface of the weld pad 60, and in the nickel coating 70
Surface plate one layer of Gold plated Layer 80, to complete the production of the circuit board 100.
The nickel coating 70 is arranged on the substrate 10, and coats the weld pad 60, and specifically, the nickel coating 70 covers
Cover the upper surface of second conductive pad 42, side and covering first conductive pad 22 side and be exposed to described second
The upper surface of conductive pad 42.On the substrate 10, and the nickel coating 70 is completely covered in the setting of Gold plated Layer 80.
Referring to Fig. 7, the circuit board 100 includes the substrate 10, the line layer 50.The line layer 50 includes more
A weld pad 60.The nickel coating 70 and the Gold plated Layer 80 are coated on the multiple weld pad 60.The weld pad 60, the nickel coating
70 and the Gold plated Layer 80 be arranged on the substrate 10.The nickel coating 70 coats the upper surface and side of the weld pad 60
Face.The Gold plated Layer 80 coats the nickel coating 70.The weld pad 60 includes first conductive pad 22 and second conduction
Pad 42.First conductive pad 22 is arranged on the substrate 10.Second conductive pad 42 is arranged in first conductive pad
On 22.The thickness of second conductive pad 42 is greater than the thickness of first conductive pad 22.The opposite institute of first conductive pad 22
The second conductive pad 42 is stated with protrusion 24.The protrusion 24 is around second conductive pad 42.
The protrusion 24 along perpendicular to 10 direction of substrate cross sectional shape be triangle, rectangle or it is trapezoidal in
One kind.The cross sectional shape of the protrusion 24 is not limited to this.
The production method of the circuit board 100 provided by the invention uses and the electricity is electroplated on the conducting wire film 20
The mode of coating 40 makes the line layer 50, it is easier to reach the production of thick copper circuit；The circuit board 100 includes the weldering
Pad 60, the weld pad 60 include first conductive pad 22 and second conductive pad 42.The setting of first conductive pad 22 exists
On the substrate 10, second conductive pad 42 is arranged on first conductive pad 22, the opposite institute of first conductive pad 22
The second conductive pad 42 is stated with protrusion 24, the protrusion 24 is extended close to the Gold plated Layer 80, hinders sky
Gas and moisture enter inside the weld pad 60, corrode copper wire；The conducting wire film 20 itself is anti-corrosion compared with layers of copper route
Property more preferable, and the good bonding strength with substrate 10 prevent institute to a certain extent when corrosive gas corrodes the weld pad 60
It states Gold plated Layer 80 and is removed from the circuit board 100 and fallen off, the circuit board 100 is made to be not susceptible to the risk of route removing.
It is understood that for those of ordinary skill in the art, can do in accordance with the technical idea of the present invention
Various other changes and modifications out, and all these changes and deformation all should belong to the protection model of the claims in the present invention
It encloses.
Claims (10)
1. a kind of production method of circuit board, comprising steps of
Presoma is provided, the presoma includes electroconductive polymer monomer and soluble metal salt solution；
Substrate is provided, the presoma is coated on and is formed by curing conducting wire film on the surface of the substrate, the conducting wire
Film includes multiple first conductive pads；
Electroplated layer is formed in the conducting wire film surface, the electroplated layer and conducting wire film collectively form line layer,
The line pattern of the line pattern of the electroplated layer and conducting wire film, which faces, answers, and the electroplated layer includes multiple second leading
Electrical pad, first conductive pad and second conductive pad collectively form the weld pad of the circuit board, and each second conductive pad is set
It sets on corresponding first conductive pad, relatively described second conductive pad of first conductive pad has protrusion, institute
Protrusion is stated around second conductive pad；
One layer of nickel plating layer gold is coated on the weld pad, obtains the circuit board.
2. the production method of circuit board as described in claim 1, which is characterized in that the protrusion is along perpendicular to the base
The cross sectional shape in plate direction is triangle, rectangle or one of trapezoidal.
3. the production method of circuit board as described in claim 1, which is characterized in that form conducting wire films Step in production
Later, further comprising the steps of before the conducting wire film surface forms electroplated layer, a dry film is provided, by the dry film
It is covered on the substrate and the conducting wire film, the dry film forms dry film pattern by exposure, development.
4. the production method of circuit board as claimed in claim 3, which is characterized in that in the step of forming the dry film pattern
In, the dry film pattern includes multiple openings, and conducting wire film exposure from the multiple opening, the opening is along vertical
Directly the width in the section of the orientation substrate is greater than the conducting wire film along the section perpendicular to the orientation substrate
Width.
5. the production method of circuit board as described in claim 1, which is characterized in that the presoma is using ultraviolet light
Mode solidifies, and the wave-length coverage of the ultraviolet light is 350 nanometers to 400 nanometers.
6. a kind of circuit board comprising a substrate and a line layer, the line layer include a conducting wire film and an electricity
Coating, the electroplated layer are arranged on the conducting wire film, and the conducting wire film setting is on the substrate, described
Conducting wire film includes multiple first conductive pads, and the electroplated layer includes multiple second conductive pads, each first conductive pad with
Corresponding second conductive pad forms a weld pad, the one nickel plating layer gold of weld pad outer cladding, the nickel plating layer gold
On the substrate, second conductive pad is arranged on first conductive pad for setting, and first conductive pad is relatively described
Second conductive pad has protrusion, and the protrusion is around second conductive pad.
7. circuit board as claimed in claim 6, which is characterized in that the protrusion is along perpendicular to the orientation substrate section
Shape is triangle, rectangle or one of trapezoidal.
8. circuit board as claimed in claim 6, which is characterized in that the conducting wire film includes conductive polymer material
And metal simple-substance, the metal simple-substance are dispersed in the conductive polymer material.
9. circuit board as claimed in claim 6, which is characterized in that the electroconductive polymer monomer is aniline, pyrroles, thiophene
At least one of pheno, the derivative of aniline, azole derivatives and thiophene derivant.
10. circuit board as claimed in claim 6, which is characterized in that the electroconductive polymer monomer is 3,4- ethylene thiophene
At least one of with 2,5- dimethoxy aniline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711015962.4A CN109714902A (en) | 2017-10-25 | 2017-10-25 | Circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711015962.4A CN109714902A (en) | 2017-10-25 | 2017-10-25 | Circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109714902A true CN109714902A (en) | 2019-05-03 |
Family
ID=66252246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711015962.4A Pending CN109714902A (en) | 2017-10-25 | 2017-10-25 | Circuit board and preparation method thereof |
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| Country | Link |
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| CN (1) | CN109714902A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110809364A (en) * | 2019-11-15 | 2020-02-18 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method and PCB |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1899002A (en) * | 2003-12-26 | 2007-01-17 | 三井金属矿业株式会社 | Printed-circuit board, its manufacturing method and circuit device |
| US20090308644A1 (en) * | 2006-07-04 | 2009-12-17 | Kyung-Ai Son | Method for Manufacturing PCB and PCB Manufactured using the Same |
| CN104349585A (en) * | 2013-08-01 | 2015-02-11 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN109429442A (en) * | 2017-08-31 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
-
2017
- 2017-10-25 CN CN201711015962.4A patent/CN109714902A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1899002A (en) * | 2003-12-26 | 2007-01-17 | 三井金属矿业株式会社 | Printed-circuit board, its manufacturing method and circuit device |
| US20090308644A1 (en) * | 2006-07-04 | 2009-12-17 | Kyung-Ai Son | Method for Manufacturing PCB and PCB Manufactured using the Same |
| CN104349585A (en) * | 2013-08-01 | 2015-02-11 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN109429442A (en) * | 2017-08-31 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110809364A (en) * | 2019-11-15 | 2020-02-18 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method and PCB |
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