CN104349585A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN104349585A CN104349585A CN201310328970.XA CN201310328970A CN104349585A CN 104349585 A CN104349585 A CN 104349585A CN 201310328970 A CN201310328970 A CN 201310328970A CN 104349585 A CN104349585 A CN 104349585A
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- circuit board
- substrate
- electroconductive polymer
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a circuit board which comprises a substrate and a conductive circuit formed on the surface of the substrate, wherein the conductive circuit comprises a conductive circuit film and a plated metal layer; the conductive circuit film is formed between the substrate and the plated metal layer; the conductive circuit film comprises a conductive high molecular material and metal simple substances uniformly dispersed in the conductive high molecular material. The invention also provides a manufacturing method of the circuit board.
Description
Technical field
The present invention relates to circuit board making technology, particularly relate to a kind of circuit board and preparation method thereof.
Background technology
Along with electronic product is toward development that is miniaturized, high speed direction, circuit board is also from single-sided circuit board, double-sided PCB toward multilayer circuit board future development.Multilayer circuit board refers to the circuit board with multilayer conductive circuit, it has more wiring area, higher interconnect density, thus be widely used, see document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
The print circuit plates making with refinement conducting wire is adopted with the following method usually: provide insulated substrate; Conductive layer is formed on the surface of insulated substrate; Photoresist oxidant layer is formed on the surface of conductive layer; Described photoresist oxidant layer is exposed and developed; Described conductive layer is etched, obtains conducting wire; And described photoresist oxidant layer is removed.In above-mentioned manufacture method, need the conductive layer adopting photoresist and full wafer, and, in the processing procedures such as exposure, development and etching, need corresponding chemical reagent and need a large amount of water resourcess to clean.Thus manufacture method of the prior art has more serious pollution to environment, and the production cost of circuit board is higher.
Summary of the invention
Therefore, be necessary to provide a kind of can minimizing to produce to environment the circuit board manufacturing method and obtained circuit board that pollute.
A kind of circuit board, it conducting wire comprising substrate and be formed at substrate surface, described conducting wire comprises conducting wire film and electroplated metal layer, described conducting wire film-shaped is formed between substrate and electroplated metal layer, described conducting wire film comprises conductive polymer material and metal simple-substance, and described metal simple-substance is dispersed in described conductive polymer material.
A manufacture method for circuit board, comprises step: provide electroconductive polymer monomer and soluble metal salt solution; Described electroconductive polymer monomer and soluble metal salt solution Homogeneous phase mixing are obtained presoma; Substrate is provided; Described presoma is coated formation conducting wire, the surface pattern at substrate; Adopt conducting wire pattern described in UV-irradiation to harden to make it, make described electroconductive polymer monomer polymerization obtain electroconductive polymer, the metal ion of described slaine is reduced to metal simple-substance, obtains conducting wire film; And forming electroplated metal layer at described conducting wire film surface, described electroplated metal layer and conducting wire film are by forming conducting wire.
Circuit board that the technical program provides and preparation method thereof, by the monomer of electroconductive polymer and the surface of predecessor coated substrates comprising metal ion, and adopts UV-irradiation after-hardening to become conducting wire film.Described conducting wire film comprises conductive polymer material and metal simple-substance, has good conductivity, directly can form electroplated metal layer on its surface as follow-up.Therefore, the manufacture method of the circuit board that the technical program provides, when making conducting wire, not needing to carry out to expose, develop and the process such as etching, thus avoid a large amount of chemical reagent of use and need a large amount of water resourcess.Thus the circuit board manufacturing method that the technical program provides can reduce the pollution produced environment, and reduces the production cost of circuit board.Further, in the technical program, conducting wire film is formed only needs to adopt UV-irradiation, and does not need high-temperature baking process, thus can avoid the damage causing the insulating barrier in substrate during high-temperature baking.
Accompanying drawing explanation
Fig. 1 is the generalized section of the substrate that the technical program embodiment provides.
Fig. 2 is the generalized section after the substrate surface formation conducting wire pattern of Fig. 1.
Fig. 3 is that the conducting wire pattern of Fig. 2 is obtained the generalized section after the film of conducting wire by UV-irradiation after-hardening.
Fig. 4 is the generalized section after the substrate surface formation plating resist barrier of Fig. 3.
Fig. 5 is the generalized section after the conducting wire film surface formation electroplated metal layer of Fig. 4.
Fig. 6 is the generalized section of the circuit board that the technical program makes.
Main element symbol description
| Substrate | 110 |
| Conducting wire pattern | 120 |
| Conducting wire film | 121 |
| Plating resist barrier | 150 |
| Opening | 151 |
| Electroplated metal layer | 130 |
| Conducting wire | 140 |
| Circuit board | 100 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with drawings and Examples, circuit board that the technical program provides and preparation method thereof is described in further detail.
The manufacture method of the circuit board that the technical program embodiment provides comprises the following steps:
The first step, provides electroconductive polymer monomer and soluble metal salt solution.
Described electroconductive polymer monomer is the monomer that the macromolecule formed after polymerization has conductivity.Described electroconductive polymer monomer is specifically as follows aniline, pyrroles or thiophene etc., also can be the derivative of aniline, azole derivatives or thiophene derivant etc., as 3, and 4-ethylene thiophene, 2,5-dimethoxy aniline etc.Electroconductive polymer monomer is generally liquid.
Soluble metal salt solution can be soluble copper salt solution, soluble silver salt solution or soluble palladium salting liquid etc.In the present embodiment, be described for copper-bath.
Second step, obtains presoma by described electroconductive polymer monomer and soluble metal salt solution Homogeneous phase mixing.
In this step, mechanical agitation or other modes can be adopted, make electroconductive polymer monomer and soluble metal salt solution Homogeneous phase mixing.
3rd step, refers to Fig. 1, provides substrate 110.
Described substrate 110 can be insulating substrate, also can for being formed with the circuit substrate of conducting wire, and the side of described circuit substrate is insulating substrate.The material of described insulating substrate can be the material being generally used for making insulating barrier in circuit board making process, as polyimides etc.In the present embodiment, substrate 110 is insulating substrates is that example is described.
4th step, refers to Fig. 2, described presoma is coated formation conducting wire, the surface pattern 120 at substrate 110.
In this step, the mode of screen painting, inkjet printing or rotary coating can be adopted described presoma to be coated formation conducting wire, surface pattern 120 at substrate 110.Distribution and the shape of the shape of described conducting wire pattern 120 and distribution and the conducting wire that wish is formed are identical.
5th step, refers to Fig. 3, adopts conducting wire pattern 120 described in UV-irradiation to harden, obtains conducting wire film 121.
By adopting ultraviolet light to irradiate, making the described electroconductive polymer monomer polymerization reaction take place in the presoma in described conducting wire pattern 120, becoming electroconductive polymer, be combined with the intimate surface of substrate 110.Carry out in the process of being polymerized at described electroconductive polymer monomer, free electron can be produced, the metal ion of the soluble metal salt solution in the presoma in described conducting wire pattern 120 is combined with described free electron, be reduced to metal simple-substance, thus the metal simple-substance atom in the conducting wire film 121 obtained is interconnected, increase the electric conductivity of the conducting wire pattern 120 after sclerosis further.
Further, in the present embodiment, the wave-length coverage of the ultraviolet light of employing is 350 nanometer to 770 nanometers.Be preferably 365 nanometers.When adopting the derivative of aniline, azole derivatives or thiophene derivant as electroconductive polymer monomer, if be connected with in the circulus of monomer and scold electronics base, as methoxyl group etc., more can contribute to monomer provides electronics to the metal ion of slaine, so that reducing metal ions is metal simple-substance when being polymerized.Such as, when electroconductive polymer monomer is 2,5-dimethoxy aniline, 2 and 5 positions of its phenyl ring are connected to methoxyl group, due to methoxyl group have scold electro, thus accelerate monomer be polymerized time provide electronics to the metal ion of slaine, so that reducing metal ions is metal simple-substance.
In addition, because the electroconductive polymer obtained after polymerization has the characteristic of oxidation/reduction condition conversion, in described electroconductive polymer oxidation/reduction condition conversion process, can free electron be discharged, thus metal ion can be accelerated further and be reduced to metal simple-substance.
The electroconductive polymer obtained in conducting wire film 121 can be polyaniline, polypyrrole or polythiophene.Or the polymer of the derivative of aniline, azole derivatives or thiophene derivant.As Polyglycolic acid fibre or poly-2,5-dimethoxy aniline etc.Described metal simple-substance can be copper, silver or palladium etc.
6th step, sees also Fig. 4 to Fig. 6, adopts the mode of plating, forms electroplated metal layer 130 on the surface of conducting wire film 121, and described electroplated metal layer 130 forms conducting wire 140 jointly with conducting wire film 121, obtains circuit board 100.
Concrete, first can form plating resist barrier 150 on the surface of substrate 110, be formed with the opening 151 corresponding with conducting wire film 121 in described plating resist barrier 150, conducting wire film 121 is exposed from described opening 151.Described plating resist barrier 150 can adopt the mode of printing photoresist to be formed.Then, adopt the mode of plating, conducting wire film 121 surface after curing forms electroplated metal layer 130.Because the conducting wire film 121 after sclerosis has conductivity, thus the conducting wire film 121 after can hardening carries out plated metal, forms electroplated metal layer 130.Finally, described plating resist barrier 150 is removed.Described electroplated metal layer 130 can be metal copper layer.
After this step, can further include the step forming welding resisting layer on the surface of circuit board 100.
Refer to Fig. 6, the technical program also provides a kind of circuit board 100, and it comprises substrate 110 and is formed at the conducting wire 140 on substrate 110 surface.Described conducting wire 140 comprises conducting wire film 121 and electroplated metal layer 130.Described conducting wire film 121 is formed between substrate 110 and electroplated metal layer 130, and described conducting wire film 121 comprises conductive polymer material and metal simple-substance.Described metal simple-substance is dispersed in described conductive polymer material.Described electroconductive polymer adopts and is used for bearing metal simple substance, and conducting wire film 121 and substrate 110 are combined closely.Described electroconductive polymer can be polyaniline, polypyrrole or polythiophene.Or the polymer of the derivative of aniline, azole derivatives or thiophene derivant.As Polyglycolic acid fibre or poly-2,5-dimethoxy aniline etc.Described metal simple-substance can be copper, silver or palladium etc.
Be understandable that, the circuit board manufacturing method that the technical program provides also can be applied to the making of multilayer circuit board, only needs at conducting wire 140 side pressing insulating barrier, then, according to the method making conducting wire 140, in the making conducting wire, surface of insulating barrier.
Circuit board that the technical program provides and preparation method thereof, by the monomer of electroconductive polymer and the surface of predecessor coated substrates comprising metal ion, and adopts UV-irradiation after-hardening to become conducting wire film.Described conducting wire film comprises conductive polymer material and metal simple-substance, has good conductivity, directly can form electroplated metal layer on its surface as follow-up.Therefore, the manufacture method of the circuit board that the technical program provides, when making conducting wire, not needing to carry out to expose, develop and the process such as etching, thus avoid a large amount of chemical reagent of use and need a large amount of water resourcess.Thus the circuit board manufacturing method that the technical program provides can reduce the pollution produced environment, and reduces the production cost of circuit board.
Further, in the technical program, conducting wire film is formed only needs to adopt UV-irradiation, and does not need high-temperature baking process, thus can avoid the damage causing the insulating barrier in substrate during high-temperature baking.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a circuit board, it conducting wire comprising substrate and be formed at substrate surface, described conducting wire comprises conducting wire film and electroplated metal layer, described conducting wire film-shaped is formed between substrate and electroplated metal layer, described conducting wire film comprises conductive polymer material and metal simple-substance, and described metal simple-substance is dispersed in described conductive polymer material.
2. circuit board as claimed in claim 1, it is characterized in that, described electroconductive polymer is polyaniline, polypyrrole or polythiophene.
3. circuit board as claimed in claim 1, it is characterized in that, described electroconductive polymer is the polymer of the polymer of anil, the polymer of azole derivatives or thiophene derivant.
4. circuit board as claimed in claim 1, is characterized in that, described electroconductive polymer is Polyglycolic acid fibre or poly-2,5-dimethoxy aniline.
5. circuit board as claimed in claim 1, it is characterized in that, the material of described electroplated metal layer is copper.
6. a manufacture method for circuit board, comprises step:
Electroconductive polymer monomer and soluble metal salt solution are provided;
Described electroconductive polymer monomer and soluble metal salt solution Homogeneous phase mixing are obtained presoma;
Substrate is provided;
Described presoma is coated formation conducting wire, the surface pattern at substrate;
Adopt conducting wire pattern described in UV-irradiation to harden to make it, make described electroconductive polymer monomer polymerization obtain electroconductive polymer, the metal ion of described slaine is reduced to metal simple-substance, obtains conducting wire film; And
Form electroplated metal layer at described conducting wire film surface, described electroplated metal layer and conducting wire film are by forming conducting wire.
7. the manufacture method of circuit board as claimed in claim 6, is characterized in that, described electroconductive polymer monomer is aniline, pyrroles, thiophene, the derivative of aniline, azole derivatives or thiophene derivant.
8. the manufacture method of circuit board as claimed in claim 6, it is characterized in that, described electroconductive polymer monomer is 3,4-ethylene thiophene or 2,5-dimethoxy aniline.
9. the manufacture method of circuit board as claimed in claim 6, it is characterized in that, the wave-length coverage of described ultraviolet light is 350 nanometer to 770 nanometers.
10. the manufacture method of circuit board as claimed in claim 6, it is characterized in that, described presoma coats the surface at substrate by the mode of screen painting, inkjet printing or rotary coating.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310328970.XA CN104349585B (en) | 2013-08-01 | 2013-08-01 | Circuit board and preparation method thereof |
| TW102128959A TWI531285B (en) | 2013-08-01 | 2013-08-13 | Circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310328970.XA CN104349585B (en) | 2013-08-01 | 2013-08-01 | Circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104349585A true CN104349585A (en) | 2015-02-11 |
| CN104349585B CN104349585B (en) | 2018-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310328970.XA Active CN104349585B (en) | 2013-08-01 | 2013-08-01 | Circuit board and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104349585B (en) |
| TW (1) | TWI531285B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304661A (en) * | 2016-09-28 | 2017-01-04 | 东莞联桥电子有限公司 | A kind of processing technique of wiring board |
| CN109246925A (en) * | 2018-08-28 | 2019-01-18 | 庆鼎精密电子（淮安）有限公司 | Rigid-flex and preparation method thereof |
| CN109714902A (en) * | 2017-10-25 | 2019-05-03 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN109936926A (en) * | 2019-03-13 | 2019-06-25 | 江西沃格光电股份有限公司 | Single-sided flexible substrate fine-line and preparation method thereof |
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| CN1309881A (en) * | 1998-05-16 | 2001-08-22 | 布拉斯伯格表面技术股份有限公司 | Method for metal coating of substrates |
| CN1717435A (en) * | 2003-05-22 | 2006-01-04 | 松下电器产业株式会社 | Method and apparatus for producing conductive polymer |
| CN1772949A (en) * | 2005-11-17 | 2006-05-17 | 上海交通大学 | Laser induced selective chemical plating process |
| CN101511952A (en) * | 2006-08-07 | 2009-08-19 | 印可得株式会社 | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
| CN101754585A (en) * | 2008-11-27 | 2010-06-23 | 富葵精密组件(深圳)有限公司 | Method for manufacturing conductive circuit |
| CN102870508A (en) * | 2011-04-26 | 2013-01-09 | 日本梅克特隆株式会社 | Method for producing transparent printed wiring board, and method for producing transparent touch panel |
| EP2566311A1 (en) * | 2011-09-02 | 2013-03-06 | Atotech Deutschland GmbH | Direct plating method |
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2013
- 2013-08-01 CN CN201310328970.XA patent/CN104349585B/en active Active
- 2013-08-13 TW TW102128959A patent/TWI531285B/en active
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| CN1309881A (en) * | 1998-05-16 | 2001-08-22 | 布拉斯伯格表面技术股份有限公司 | Method for metal coating of substrates |
| CN1717435A (en) * | 2003-05-22 | 2006-01-04 | 松下电器产业株式会社 | Method and apparatus for producing conductive polymer |
| CN1772949A (en) * | 2005-11-17 | 2006-05-17 | 上海交通大学 | Laser induced selective chemical plating process |
| CN101511952A (en) * | 2006-08-07 | 2009-08-19 | 印可得株式会社 | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
| CN101754585A (en) * | 2008-11-27 | 2010-06-23 | 富葵精密组件(深圳)有限公司 | Method for manufacturing conductive circuit |
| CN102870508A (en) * | 2011-04-26 | 2013-01-09 | 日本梅克特隆株式会社 | Method for producing transparent printed wiring board, and method for producing transparent touch panel |
| EP2566311A1 (en) * | 2011-09-02 | 2013-03-06 | Atotech Deutschland GmbH | Direct plating method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304661A (en) * | 2016-09-28 | 2017-01-04 | 东莞联桥电子有限公司 | A kind of processing technique of wiring board |
| CN109714902A (en) * | 2017-10-25 | 2019-05-03 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN109246925A (en) * | 2018-08-28 | 2019-01-18 | 庆鼎精密电子（淮安）有限公司 | Rigid-flex and preparation method thereof |
| US10897816B2 (en) | 2018-08-28 | 2021-01-19 | Qing Ding Precision Electronics (Huaian) Co., Ltd | Rigid-flex circuit board |
| CN109936926A (en) * | 2019-03-13 | 2019-06-25 | 江西沃格光电股份有限公司 | Single-sided flexible substrate fine-line and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104349585B (en) | 2018-05-15 |
| TWI531285B (en) | 2016-04-21 |
| TW201515535A (en) | 2015-04-16 |
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Effective date of registration: 20170705 Address after: 066000 No. 18 Tengfei Road, Qinhuangdao Economic Development Zone, Hebei, China Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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