CN109936926A - Single-sided flexible substrate fine-line and preparation method thereof - Google Patents
Single-sided flexible substrate fine-line and preparation method thereof Download PDFInfo
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- CN109936926A CN109936926A CN201910187058.4A CN201910187058A CN109936926A CN 109936926 A CN109936926 A CN 109936926A CN 201910187058 A CN201910187058 A CN 201910187058A CN 109936926 A CN109936926 A CN 109936926A
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Abstract
The present invention relates to a kind of single-sided flexible substrate fine-lines and preparation method thereof.The preparation method, pass through the deposited metal matrix on insulating substrate, inkjet printing obtains ink layer on metallic matrix, ink layer is set to be formed with patterning opening to expose pattern metal matrix, then redox reaction generation copper occurs with electroplate liquid in the plating process as reaction electrode for pattern metal matrix, obtain the patterned copper layer being attached on pattern metal matrix, and ink layer and the metallic matrix with ink layer corresponding region are removed, the final route line width that obtains is the single-sided flexible substrate fine-line that 3um-5um and thickness are less than 10um.The preparation method step is simple and efficient, and can quickly and subtly be realized the forming of 3um-5um fine-line, be greatly shortened the fabrication cycle of fine-line, reduce the cost of manufacture of fine-line, realize the scale of mass production of product, and improve the yield of route product.
Description
Technical field
The present invention relates to route design fields, more particularly to a kind of single-sided flexible substrate fine-line and its preparation
Method.
Background technique
COF (Chip on film, membrane of flip chip technology), be chip attachment is realized on flexible film substrates chip I/
The output of O is widely used on the panel of the electronic products such as mobile phone, TV, ipad.Currently, in COF flexible base board route essence
Thin production aspect, relatively common method are to carry out line pattern using exposure technique using a kind of semi-additive process
Delicate execution, manufacture craft specifically include that dry film pressing, ultraviolet exposure, development, plating, etching.It can be seen that
This manufacturing process steps are various, complex, and production efficiency is low, and the yield for making fine-line is lower.
Therefore, that there are processing steps is various, complicated for the preparation method of illustrative single side COF flexibility fine-line, production
Low efficiency, the low problem of product yield.
Summary of the invention
Based on this, it is necessary to which processing step can be simplified by providing one kind, and the single side for improving production efficiency and product yield is soft
Property substrate fine-line and preparation method thereof.
In order to achieve the object of the present invention, the present invention adopts the following technical scheme:
A kind of preparation method of single-sided flexible substrate fine-line, comprising:
Insulating substrate, the deposited metal matrix on the insulating substrate are provided；
By inkjet printing, deposited ink layer, the ink layer are formed with patterning opening to reveal on the metallic matrix
Pattern metal matrix out；
Plating forms patterned copper layer on the pattern metal matrix；
Remove the ink layer and the metallic matrix with the ink layer corresponding region.
The width of the patterning opening is 3um-5um in one of the embodiments,.
The ink droplet of inkjet printing is -2 picoliters of 1 picoliters in one of the embodiments,.
In one of the embodiments, it is characterized in that, the resolution ratio of inkjet printing is that -4800 point of 2400 dpi (dots per inch) is every
Inch.
The material of the ink layer includes dielectric ink in one of the embodiments,.
In one of the embodiments, the ink layer with a thickness of 8um-10um.
In one of the embodiments, the patterned copper layer with a thickness of be greater than 0 and be less than 10um.
In one of the embodiments, the metallic matrix with a thickness of 200nm-300nm.
The material of the metallic matrix includes one of nickel, chromium, silver or a variety of in one of the embodiments,.
A kind of single-sided flexible substrate fine-line, the single-sided flexible substrate fine-line is by preparation method as described above
It prepares.
The preparation method of above-mentioned single-sided flexible substrate fine-line, by the deposited metal matrix on insulating substrate, in gold
Belong to inkjet printing on matrix and obtain ink layer, ink layer is made to be formed with patterning opening to expose pattern metal matrix, then
Pattern metal matrix occurs redox reaction with electroplate liquid in the plating process as reaction electrode and generates copper, is adhered to
Patterned copper layer on pattern metal matrix, and ink layer and the metallic matrix with ink layer corresponding region are removed, finally
Obtaining route line width is the single-sided flexible substrate fine-line that 3um-5um and thickness are less than 10um.The preparation method step is simple
Efficiently, the forming that can quickly and subtly realize 3um-5um fine-line greatly shortens the fabrication cycle of fine-line, drop
The cost of manufacture of low fine-line, realizes the scale of mass production of product, and improves the yield of route product.
Above-mentioned single-sided flexible substrate fine-line, the line width with 3um-5um and the thickness less than 10um, and can be real
The scale of mass production of existing product, can be widely used on the panel of the electronic products such as mobile phone, TV, ipad.
Detailed description of the invention
Fig. 1 is the flow chart of the preparation method of single-sided flexible substrate fine-line in an implementation；
Fig. 2 is the structural schematic diagram of 1 step S101 of corresponding diagram；
Fig. 3 is the structural schematic diagram of 1 step S102 of corresponding diagram；
Fig. 4 is the structural schematic diagram of 1 step S103 of corresponding diagram；
Fig. 5 is the structural schematic diagram of 1 step S104 of corresponding diagram.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give optional embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
Body embodiment purpose, it is not intended that in limitation the present invention.
It is the flow chart of the preparation method of the single-sided flexible substrate fine-line in an embodiment referring to Fig. 1, Fig. 1.
In the present embodiment, the preparation method of single-sided flexible substrate fine-line can be used for quickly and subtly preparing single side
COF flexible base board fine-line.Specifically, which includes step S101, step S102, step 103 and step
104.Details are as follows:
Step S101, provides insulating substrate, the deposited metal matrix on insulating substrate.
In the present embodiment, for insulating substrate using the flexible base board to insulate, the selection of specific material is unrestricted.It is real one
It applies in example, the material of insulating substrate is polyimides.
In the present embodiment, it please assist referring to fig. 2, metallic matrix 102 is deposited on insulating substrate 101, is configured to
It is enough to deposit the ink layer with patterning opening in the next steps and be electroplated to form figure in the corresponding region of patterning opening
Case layers of copper.
Wherein, depositional mode of the metallic matrix 102 on insulating substrate 101 is unrestricted.It in one embodiment, can be with
It is deposited on by way of magnetron sputtering on insulating substrate 101.
Wherein, during plating forms patterned copper layer, metallic matrix 102 occurs as reaction electrode and electroplate liquid
Redox reaction generates copper, while copper is attached on part metals matrix, effectively increases insulating substrate 101 and patterned copper layer
Between binding force, prevent patterned copper layer from peeling off.Metallic matrix 102 selects conductive electrode material, optionally, metallic matrix
102 material includes one of nickel, chromium, silver or a variety of, such as nickel or nickel alloy.Optionally, the thickness of metallic matrix 102
It is set as 200nm-300nm, so as to improve electroplating efficiency while reducing electroplating cost: if the thickness of metallic matrix 102
The signal for electrical current of spending too thin when 200nm (thickness be less than) when will make electro-coppering is too weak, and electroplating reaction is slow, electroplating efficiency
It is low；If the thickness of metallic matrix 102 is too thick (when thickness is greater than 300nm), the preparation cost of metallic matrix 102 will be increased, such as
Magnetron sputtering cost.
Step S102, by inkjet printing on metallic matrix deposited ink layer, ink layer be formed with patterning opening with
Expose pattern metal matrix.
In the present embodiment, it please assist referring to Fig. 3, ink layer 103 is deposited on metallic matrix 102 by inkjet printing.
Specifically, ink layer 103 includes spaced ink coverage areas domain 103a and patterning opening 103b, and metallic matrix 102 can
It is divided into metallic matrix area of coverage 102a and pattern metal matrix 102b, ink coverage areas domain 103a is covered on metallic matrix and covers
On cover region 102a, patterning opening 103b exposes pattern metal matrix 102b.
Wherein, ink layer 103 is plating resist ink layer, and corrosion or other shadows of plating can be resisted in subsequent plating step
It rings, so that it is anti-to be not involved in the redox in electroplating process by the ink coverage areas domain 103a metallic matrix area of coverage 102a covered
It answers.Optionally, the material of ink layer 103 includes dielectric ink, is the dielectric ink of ultraviolet light (UV) type specifically.UV type
Dielectric ink can instantaneously be dried under ultraviolet irradiation, solidification, to improve production efficiency；The dielectric ink of UV type simultaneously
Without volatile organic solvent, pollution is small, does not damage human health.The thickness of ink layer 103 determines the thickness of route, optional
The resistivity of electroplating line can be improved in ground, the thickness for making ink layer 103 reach 8um-10um by inkjet printing, so that electric
The subflow general character is more preferable.
Ink layer 103 is deposited on metallic matrix 102 by inkjet printing, forms patterning opening 103b to expose pattern
Change metallic matrix 102b.Wherein, the figure of patterning opening 103b and pattern metal matrix 102b corresponds to fine-line figure
Shape, (direction x is ink coverage areas domain 103a to width of the patterning opening 103b in the direction x and the patterning opening interval 103b is set
The extending direction set) corresponding fine-line line width, pattern can accurately be controlled by inkjet printing melt the width of mouth and be
3um-5um, so that the fine-line of 3um-5um line width can be obtained in the next steps.Wherein, ink coverage areas domain 103a
Width corresponds to the line-spacing (spacing of two neighboring patterning opening 103b) of fine-line, and line-spacing is not limited herein, specifically may be used
To be set according to the demand of practical line-spacing, optionally, the width of ink coverage areas domain 103a is 3um-5um, so that
The fine-line of subsequent step acquisition 3um-5um line-spacing.
Wherein, by the amount of capacity of ink droplet in control ink jet printing process and the resolution ratio of inkjet printing accurately to control
The width of the thickness of ink layer 103, the width of ink coverage areas domain 103a and patterning opening 103b.Specifically, ink-jet is beaten
The ink droplet of print is -2 picoliters of 1 picoliters, and the resolution ratio of inkjet printing is -4800 dpi (dots per inch) of 2400 dpi (dots per inch), so as to accurate
Ink layer 103 is controlled in the thickness range of 8um-10um, ink coverage areas domain 103a schemes simultaneously in the width range of 3um-5um
Case melts mouthful 103b in the width range of 3um-5um.
Deposited ink layer 103 by way of inkjet printing as a result, can quickly and subtly realize fine-line at
Shape greatly shortens the fabrication cycle of route, reduces the cost of manufacture of route, and improves the yield of route product.
Step S103, plating forms patterned copper layer on pattern metal matrix.
In the present embodiment, it please assist referring to fig. 4, plating forms patterned copper layer on pattern metal matrix 102b
104.Specifically, by carrying out energization plating to metallic matrix 102, in the plating process, pattern metal matrix 102b and electricity
It solves liquid and redox reaction generation copper occurs, so that forming line width directly on pattern metal matrix 102b is 3um-5um's
Patterned copper layer 104, the technique for not only saving an etching copper reduce cost and fabrication cycle, while also improving COF production
Yield realizes more fine-line.
In one embodiment, the part pattern metal matrix 102b passes through control electroplating current value and concentration of electrolyte and will scheme
The thickness control of case layers of copper 104 is being greater than 0 and the range less than 10um, so that the thickness of patterned copper layer 104 is less than ink
The thickness of layer 103, it is ensured that the growth district of patterned copper layer 104 is limited on the corresponding region pattern metal matrix 102b,
Without covering to ink layer 103.The route for forming patterned copper layer 104 is finer, avoids simultaneously
All routes form plane short circuit in 103 upper surface of ink layer；On the other hand, convenient for the removal of subsequent ink layers 103.
Step S104 removes ink layer and the metallic matrix with ink layer corresponding region.
In the present embodiment, it please assist referring to Fig. 5, by ink layer 103 and metallic matrix with 103 corresponding region of ink layer
Area of coverage 102a removal, obtains the single side including insulating substrate 101, pattern metal matrix 102a and patterned copper layer 104
Flexible base board fine-line.
In one embodiment, step S104 includes step S1041 and step S1042.
In step S1041, ink layer is removed by UV remover；In step S1042, pass through etching removal and ink
The metallic matrix 102 of layer corresponding region.Wherein, UV remover can according to the property of the material that ink layer 103 is specifically selected into
Row is chosen.
Preparation method provided in this embodiment, the deposited metal matrix on insulating substrate, by inkjet printing in Metal Substrate
Deposited ink layer on body makes ink layer be formed with patterning and is open to expose pattern metal matrix, then pattern metal base
Body occurs redox reaction as reaction electrode with electroplate liquid in the plating process and generates copper, and acquisition is attached to pattern metal
Patterned copper layer on matrix, and ink layer and the metallic matrix with ink layer corresponding region are removed, it is final to obtain route line width
For 3um-5um and thickness is less than the single-sided flexible substrate fine-line of 10um.The preparation method step is simple and efficient, can be quick
And subtly realize the forming of 3um-5um fine-line, the fabrication cycle of fine-line is greatly shortened, the system of fine-line is reduced
Make cost, realize the scale of mass production of product, and improves the yield of route product.
It should be noted that preparation method provided in this embodiment can also exist in conjunction with boring technique according to actual needs
Through-hole is set, such as the radium-shine through-hole for running through entire substrate out on insulating substrate on insulating substrate, then is utilized respectively this implementation
The preparation method that example provides prepares fine-line in the upper and lower surface of insulating substrate, to realize double-faced flexible substrate fine-line
Preparation, obtaining route line width is the double-faced flexible substrate fine-line that 3um-5um and thickness are less than 10um.
The present embodiment additionally provides a kind of single-sided flexible substrate fine-line, and the single-sided flexible substrate fine-line is by as above
Preparation method described in embodiment prepares.The single-sided flexible substrate fine-line includes insulating substrate, setting in insulation base
Pattern metal matrix on material and the patterned copper layer being arranged on pattern metal matrix.The single-sided flexible substrate is fine
Line width of the route with 3um-5um and the thickness less than 10um, and can be realized the scale of mass production of product, it can be wide
It is applied on the panels of electronic products such as mobile phone, TV, ipad generally.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of preparation method of single-sided flexible substrate fine-line characterized by comprising
Insulating substrate, the deposited metal matrix on the insulating substrate are provided；
By inkjet printing, deposited ink layer, the ink layer are formed with patterning opening to expose figure on the metallic matrix
Case metallic matrix；
Plating forms patterned copper layer on the pattern metal matrix；
Remove the ink layer and the metallic matrix with the ink layer corresponding region.
2. preparation method according to claim 1, which is characterized in that the width of the patterning opening is 3um-5um.
3. preparation method according to claim 1, which is characterized in that the ink droplet of inkjet printing is -2 picoliters of 1 picoliters.
4. preparation method according to claim 1, which is characterized in that the resolution ratio of inkjet printing is 2400 dpi (dots per inch)s-
4800 dpi (dots per inch)s.
5. preparation method according to claim 1, which is characterized in that the material of the ink layer includes dielectric ink.
6. preparation method according to claim 1, which is characterized in that the ink layer with a thickness of 8um-10um.
7. preparation method according to claim 1, which is characterized in that the patterned copper layer with a thickness of being greater than 0 and small
In 10um.
8. preparation method according to claim 1-7, which is characterized in that the metallic matrix with a thickness of
200nm-300nm。
9. preparation method according to claim 1-7, which is characterized in that the material of the metallic matrix includes
One of nickel, chromium, silver are a variety of.
10. a kind of single-sided flexible substrate fine-line, which is characterized in that the single-sided flexible substrate fine-line is wanted by such as right
The described in any item preparation methods of 1-9 are asked to prepare.
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| CN201910187058.4A CN109936926A (en) | 2019-03-13 | 2019-03-13 | Single-sided flexible substrate fine-line and preparation method thereof |
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| CN104349585A (en) * | 2013-08-01 | 2015-02-11 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5721007A (en) * | 1994-09-08 | 1998-02-24 | The Whitaker Corporation | Process for low density additive flexible circuits and harnesses |
| JP2004266078A (en) * | 2003-02-28 | 2004-09-24 | Sony Corp | Method of forming conductor pattern |
| CN101547567A (en) * | 2008-03-28 | 2009-09-30 | 富葵精密组件(深圳)有限公司 | Method for producing conductive circuit |
| CN101594744A (en) * | 2008-05-30 | 2009-12-02 | 财团法人工业技术研究院 | On bendable substrate, make the method and the protection printing ink thereof of conductive pattern |
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Application publication date: 20190625 |
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