CN113950204B - Manufacturing method of prefabricated circuit board and prefabricated circuit board - Google Patents
Manufacturing method of prefabricated circuit board and prefabricated circuit board Download PDFInfo
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- CN113950204B CN113950204B CN202010687460.1A CN202010687460A CN113950204B CN 113950204 B CN113950204 B CN 113950204B CN 202010687460 A CN202010687460 A CN 202010687460A CN 113950204 B CN113950204 B CN 113950204B
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The application relates to the technical field of circuit boards, and particularly discloses a manufacturing method of a prefabricated circuit board and the prefabricated circuit board. The manufacturing method of the prefabricated circuit board comprises the following steps: providing a core plate, and forming a circuit layer on at least one side of the core plate to obtain a composite substrate, wherein a plurality of grooves are formed in the circuit layer, and the grooves gradually narrow from the bottom to the top of one side away from the core plate, so that the surface opening area of the grooves is smaller than the bottom surface area of the grooves; and laminating the two outer metal layers, the plurality of composite substrates and the plurality of prepregs according to a preset sequence, and pressing to form a prefabricated circuit board, wherein part of prepregs in the pressed prefabricated circuit board flow into the groove after being melted, and are joggled in the groove after being solidified. Through the mode, the bonding force between the laminated prefabricated circuit board layers can be improved, and layering and board explosion are avoided to a certain extent.
Description
Technical Field
The present disclosure relates to the field of circuit boards, and in particular, to a method for manufacturing a prefabricated circuit board and a prefabricated circuit board.
Background
As electronic products function more and more, the insulation system of printed circuit board (Printed Circuit Board, PCB) substrates is more and more diversified. Currently, common PCBs are typically fabricated using conventional prepreg lamination techniques. The conventional prepreg lamination technology refers to laminating a prepreg directly between two core boards or metal layers to be laminated for lamination.
During the long-term development, the inventor of the application finds that the delamination of different materials is mainly caused by poor interlayer bonding force in the prior art: the bonding force between the conductive layer and the prepreg in the lamination process is poor, the bonding force between the conductive layer and the printing ink in the surface treatment (such as solder resist printing ink) is poor, the bonding force between the hole plugging resin and the prepreg is poor, and the like.
Disclosure of Invention
The application provides a manufacturing method of a prefabricated circuit board and the prefabricated circuit board, so that the bonding force between the layers of the prefabricated circuit board after lamination is improved, and layering and board explosion are avoided to a certain extent.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: provided is a method of manufacturing a prefabricated circuit board, including: providing a core plate, and forming a circuit layer on at least one side of the core plate to obtain a composite substrate, wherein a plurality of grooves are formed in the circuit layer, and the grooves gradually narrow from the bottom to the top of one side away from the core plate, so that the surface opening area of the grooves is smaller than the bottom surface area of the grooves; and laminating the two outer metal layers, the plurality of composite substrates and the plurality of prepregs according to a preset sequence, and pressing to form a prefabricated circuit board, wherein part of prepregs in the pressed prefabricated circuit board flow into the groove after being melted, and are joggled in the groove after being solidified.
In order to solve the technical problems, another technical scheme adopted by the application is as follows: provided is a prefabricated circuit board including: two outer metal layers, a plurality of composite substrates and a plurality of prepregs which are laminated according to a preset sequence; each composite substrate comprises a core plate and a circuit layer formed on at least one side of the core plate, a plurality of grooves are formed in the circuit layer, the grooves are gradually narrowed from the bottom to the top of one side, away from the core plate, of each groove, so that the surface opening area of each groove is smaller than the bottom surface area of each groove, and part of prepregs are joggled in the grooves.
The beneficial effects of this application are: in order to solve the above problems, the present invention provides a circuit board with a plurality of grooves formed on at least one side of a core board, wherein the grooves gradually narrow from the bottom to the top of the side away from the core board, so that the surface opening area of the grooves is smaller than the bottom surface area of the grooves, and part of the prepregs in the prefabricated circuit board after lamination flow into the grooves after melting and are jogged in the grooves after solidification. Meanwhile, the prepreg joggles with the grooves after lamination has higher binding force, and the problems of layering and board explosion after reflow soldering can be avoided to a certain extent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly introduce the drawings needed in the embodiments and the description of the prior art, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for manufacturing a prefabricated circuit board according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the structure corresponding to step 101 in FIG. 1;
FIG. 3 is a schematic diagram illustrating a structure corresponding to step 102 in FIG. 1;
FIG. 4 is a schematic flow chart of step 101 in FIG. 1;
FIG. 5 is a schematic diagram of the structure corresponding to each step in FIG. 4;
FIG. 6 is a schematic view of the structure at B in FIG. 5;
FIG. 7 is a schematic flow chart of step S14 in FIG. 4;
FIG. 8 is another flow chart of step 101 of FIG. 1;
fig. 9 is a schematic structural diagram of a prefabricated circuit board according to an embodiment of the present application.
Detailed Description
The embodiment of the application provides a manufacturing method of a prefabricated circuit board and the prefabricated circuit board, so that the bonding force between the layers of the prefabricated circuit board after lamination is improved, and layering and board explosion are avoided to a certain extent.
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
The following will each explain in detail by means of specific examples.
Referring to fig. 1-3, a method for manufacturing a prefabricated circuit board 100 according to an embodiment of the present application includes the following steps:
step S101: providing a core board 10, and forming a circuit layer 20 on at least one side of the core board 10 to obtain a composite substrate 101, wherein a plurality of grooves 30 are formed on the circuit layer 20, and the grooves 30 gradually narrow from the bottom to the top of the side facing away from the core board 10, so that the surface opening area of the grooves 30 is smaller than the bottom surface area of the grooves 30.
Specifically, the core plate 10 described in the specification of the present application may be a common core plate 10 having a copper thickness of less than 10OZ per layer, or may be a thick copper core plate 10 having a copper thickness of greater than or equal to 10OZ per layer. The core board 10 may be a double-sided copper-clad plate, or may be a multilayer board obtained by laminating double-sided copper-clad plates. Here, the metal layer of the inner layer or the surface layer of the core board 10 has been processed into the circuit layer 20, and one or both side surfaces of the core board 10 may have a circuit pattern.
Preferably, the core 10 is a ceramic core or a resin core.
The circuit layer 20 is provided with a plurality of grooves 30, generally, the number of the grooves 30 is a plurality of grooves to increase the interlayer bonding force, the grooves 30 are dovetail grooves, and the grooves 30 gradually narrow from the bottom to the top of the side away from the core plate 10, so that the surface opening area of the grooves 30 is smaller than the bottom surface area of the grooves 30. The grooves 30 may be arranged in parallel or staggered, and in addition, the grooves 30 may also adopt dovetail groove structures of various shapes.
Step S102: the two outer metal layers 60, the plurality of composite substrates 101 and the plurality of prepregs 50 are laminated according to a preset sequence and pressed to form the prefabricated circuit board 100, wherein in the pressed prefabricated circuit board 100, part of the prepregs 50 flow into the groove 30 after being melted and are joggled in the groove 30 after being solidified.
The prepreg 50 is composed of glass fiber cloth and resin, wherein the resin is phenolic resin or epoxy resin or polythioamine resin or polytetrafluoroethylene. Phenolic resins were the earliest successful development by humans and formed into commercial polymers. The method is characterized in that two cheap chemicals, namely liquid phenol and liquid formaldehyde, undergo a continuous bridging reaction under acidic or alkaline conditions, and harden into a solid synthetic material. The epoxy resin is the most widely used substrate in the current printed circuit board industry, has low price and is convenient for purchase. The polysulfide resin has good high temperature resistance, and is favorable for manufacturing high temperature resistant multilayer circuit boards. The polytetrafluoroethylene has high impedance, is suitable for high communication application, and can meet the requirements of aerospace on a multi-circuit board.
In contrast to the situation in the prior art, in the embodiment of the present application, the circuit layer 20 provided with the plurality of grooves 30 is formed on at least one side of the core board 10, wherein the grooves 30 gradually narrow from the bottom to the top of the side away from the core board 10, so that the surface opening area of the grooves 30 is smaller than the bottom surface area of the grooves 30, and in the pressed prefabricated circuit board 100, part of the prepreg 50 flows into the grooves 30 after being melted and is jogged into the grooves 30 after being solidified. Meanwhile, the prepreg 50 after lamination is joggled with the groove 30, has higher binding force, and can avoid the problems of layering and board explosion after reflow soldering to a certain extent.
Referring to fig. 4 to 6, the step S101 includes:
s11: a first sub-line layer (not shown) is printed on the core 10.
Specifically, optionally, the circuit layer coating contains conductive particles, and the conductive particles can be at least one of silver nano-particles, copper nano-particles (copper powder), aluminum nano-particles, gold nano-particles, silver nano-alloys or copper nano-alloys.
Preferably, in this step, the circuit layer coating used for printing the first sub-circuit layer includes the following components in mass ratio: 55 to 75 percent (such as 55 percent, 70 percent, 72 percent and 75 percent) of copper powder, 7 to 17 percent (such as 7 percent, 10 percent and 17 percent) of glass powder as filler, 15 to 35 percent (such as 15 percent, 20 percent and 35 percent) of organic solvent and 3 to 5 percent (such as 3 percent, 4 percent and 5 percent) of oxidant.
Alternatively, for example, the organic solvent may be diethyl butanol, ethyl element, terpineol, etc., and the oxidizing agent may be boron oxide and zinc oxide.
Preferably, the viscosity of the circuit layer coating used to print the first sub-circuit layer is 30 to 100pa.s (e.g., 30pa.s, 50pa.s, 75pa.s, 100 pa.s). The viscosity of the circuit layer coating can be adjusted by adjusting the proportion of the main components and the filler in the circuit layer coating. Wherein the main component is copper powder, and the filler is glass powder.
The circuit layer coating on the core board 10 is cured to obtain a first sub-circuit layer. The curing treatment in this step is a constant temperature standing treatment in a closed environment, and the temperature required for the treatment process is 35 to 65 ℃ (e.g., 35 ℃, 40 ℃, 50 ℃, 65 ℃) for 40 to 80 minutes (e.g., 40 minutes, 50 minutes, 60 minutes, 80 minutes).
S12: the support member 40 is disposed on a first sub-wiring layer (not shown), wherein the support member 40 has at least one arc-shaped surface such that the length of the support member 40 is gradually narrowed from one end close to the first wiring layer 20 to the other end far from the first wiring layer 20.
S13: a second sub-line layer is printed out on the side of the first sub-line layer facing away from the core 10.
Specifically, in this step, the wiring layer paint used for printing the second sub-wiring layer is the same as the wiring layer paint used for printing the first sub-wiring layer.
And curing the circuit layer coating on the first sub-circuit layer to obtain a second sub-circuit layer. The curing process in this step is the same as the curing process in step S11.
S14: the support 40 is removed to obtain the composite substrate 101.
In this manner, the support member 40 is disposed on the first sub-circuit layer in the embodiments of the present application, and the circuit layer coating will avoid the support member 40 during printing, so that the grooves 30 in the embodiments described above are formed on the second sub-circuit layer after the curing process.
Referring to fig. 7, when the material of the supporting member 40 is tin, the step S14 includes:
s141: the composite substrate 101 provided with the support 40 is placed in a tin stripping solution for immersion.
Specifically, the tin stripping liquid comprises the following components: concentrated sulfuric acid, hydrogen peroxide, a tin ion complexing agent and a copper surface corrosion inhibitor, and controllable oxidizing Sn into Sn 2+ And removed. The copper surface corrosion inhibitor is one of imidazole, 2-methylimidazole, benzotriazole and methylbenzotriazole, and has the function of inhibiting the corrosion of the tin stripping liquid to the circuit layer 20 made of copper, thereby protecting the circuit layer 20 and maintaining the surface of the circuit layer 20 to be bright.
If the material of the support 40 is nickel, the chemical solution for removing the support 40 is nickel-removing solution. The nickel stripping solution is capable of rapidly and effectively stripping the nickel-material support 40 without damaging the copper-material circuit layer 20.
Step S142 or S143 is entered.
S142: the composite substrate 101 is taken out and rinsed with water.
S143: the composite substrate 101 is placed in a container containing water and subjected to ultrasonic vibration cleaning to remove the support 40.
The ultrasonic vibration cleaning can further remove the etching liquid residue on the surface of the composite substrate 101, and can also remove the supporting member 40 and the polymer detached from the surface of the composite substrate 101. After the ultrasonic vibration cleaning step, the supporting members 40 on the surface of the composite substrate 101 can be completely detached, so that assembly and the like can be performed.
Preferably, the oscillation time of the ultrasonic oscillation cleaning is 40 seconds or longer. In order to avoid that the oscillation time is too long to affect the structure and electrical properties of the composite substrate 101 itself, the oscillation time may be preferably 1-2 minutes.
Referring to fig. 8, when the material of the support member 40 is water-soluble resin, the step S14 includes:
s144: the composite substrate 101 provided with the support 40 is rinsed with high-pressure water to remove the support 40.
Specifically, the support 40 is formed of at least 1 of a water-soluble cellulose resin, a water-soluble acrylic resin, and a water-soluble polyester resin.
Preferably, the support 40 is formed of a water-soluble cellulose resin. Wherein the water-soluble cellulose resin is at least one selected from the group consisting of hydroxypropyl methylcellulose phthalate, hydroxypropyl methylcellulose acetate succinate and hydroxypropyl methylcellulose acetate phthalate.
As shown in fig. 9, the prefabricated circuit board 100 of the embodiment of the present application includes: two outer metal layers 60, a plurality of composite substrates 101, and a plurality of prepregs 50 are laminated in a predetermined order. For example, by lamination according to design requirements, fig. 9 shows an 8-layer pre-fabricated circuit board 100 having three core boards 10. The prefabricated circuit board 100 may be manufactured by the manufacturing method of the prefabricated circuit board in the above-described embodiment.
Each composite substrate 101 includes a core 10 and a circuit layer 20 formed on at least one side of the core 10, a plurality of grooves 30 are formed on the circuit layer 20, the grooves 30 gradually narrow from the bottom to the top of the side facing away from the core 10, so that the surface opening area of the grooves 30 is smaller than the bottom surface area of the grooves 30, and a part of the prepreg 50 is joggled in the grooves 30.
The circuit layer 20 is provided with a plurality of grooves 30, generally, the number of the grooves 30 is a plurality of grooves to increase the interlayer bonding force, the grooves 30 are dovetail grooves, and the grooves 30 gradually narrow from the bottom to the top of the side away from the core plate 10, so that the surface opening area of the grooves 30 is smaller than the bottom surface area of the grooves 30. The grooves 30 may be arranged in parallel or staggered, and various shapes of dovetail groove structures may be adopted.
The cross section of the groove 30 in the above embodiment is trapezoidal. The inner wall of the groove 30 in the above embodiment is an arc-shaped inner wall.
In contrast to the situation of the prior art, in the prefabricated circuit board 100 of the embodiment of the present application, each composite substrate 101 includes a core board 10 and a circuit layer 20 formed on at least one side of the core board 10, where the groove 30 is gradually narrowed from the bottom to the top of the side facing away from the core board 10, so that the surface opening area of the groove 30 is smaller than the bottom surface area of the groove 30, and in the prefabricated circuit board after lamination, part of the prepreg 50 flows into the groove 30 after being melted and jogged in the groove 30 after being cured, in the embodiment of the present application, no roughening treatment is required to be performed on the prepreg 50, no roughening treatment is performed to the surface of the circuit layer 20, so as to avoid damaging the circuit pattern of the circuit layer 20, and the process procedure can be reduced. Meanwhile, the prepreg 50 after lamination is joggled with the groove 30, has higher binding force, and can avoid the problems of layering and board explosion after reflow soldering to a certain extent.
The foregoing description is only exemplary embodiments of the present application and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the present application.
Claims (9)
1. A method of manufacturing a prefabricated circuit board, comprising:
providing a core plate, and forming a circuit layer on at least one side of the core plate to obtain a composite substrate, wherein a plurality of grooves are formed in the circuit layer, and the grooves gradually narrow from the bottom to the top of one side away from the core plate, so that the surface opening area of the grooves is smaller than the bottom surface area of the grooves;
laminating two outer metal layers, a plurality of composite substrates and a plurality of prepregs according to a preset sequence, and pressing to form a prefabricated circuit board, wherein part of prepregs in the pressed prefabricated circuit board flow into the grooves after melting, and are joggled in the grooves after solidification;
the step of forming a circuit layer on at least one side of the core board to obtain a composite substrate includes:
printing a first sub-circuit layer on the core board;
disposing a support on the first sub-wiring layer, wherein the support has at least one arc-shaped surface such that a length of the support gradually narrows from one end close to the first sub-wiring layer to the other end far from the first sub-wiring layer;
printing a second sub-circuit layer on one side of the first sub-circuit layer away from the core plate;
and removing the supporting piece to obtain the composite substrate.
2. The method according to claim 1, wherein,
when the material of the support is tin, the step of removing the support includes:
placing the composite substrate provided with the supporting piece in tin stripping liquid for soaking;
and taking out the composite substrate and washing with water, or placing the composite substrate in a container containing water for ultrasonic vibration cleaning to remove the supporting piece.
3. The method according to claim 1, wherein,
when the material of the support is a water-soluble resin, the step of removing the support includes:
and flushing the composite substrate provided with the support member with high-pressure water to remove the support member.
4. The method according to claim 1, wherein,
the cross section of the groove is trapezoid.
5. The method according to claim 1, wherein,
the inner wall of the groove is an arc-shaped inner wall.
6. The method according to claim 1, wherein,
the core board is a ceramic core board or a resin core board.
7. A prefabricated circuit board, characterized in that it is manufactured by the manufacturing method according to any one of claims 1 to 6, comprising: two outer metal layers, a plurality of composite substrates and a plurality of prepregs which are laminated according to a preset sequence;
each composite substrate comprises a core plate and a circuit layer formed on at least one side of the core plate, wherein a plurality of grooves are formed in the circuit layer, the grooves are gradually narrowed from the bottom to the top of one side, deviating from the core plate, of each groove, so that the surface opening area of each groove is smaller than the bottom surface area of each groove, and part of prepregs are joggled in the grooves.
8. The prefabricated circuit board according to claim 7, wherein,
the cross section of the groove is trapezoid.
9. The preformed circuit board of claim 7, wherein the inner walls of the recess are arcuate inner walls.
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| CN202010687460.1A CN113950204B (en) | 2020-07-16 | 2020-07-16 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
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| CN202010687460.1A CN113950204B (en) | 2020-07-16 | 2020-07-16 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
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| CN113950204B true CN113950204B (en) | 2024-04-12 |
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