CN207099424U - A kind of fast radiating circuit board of the embedded copper billet of mobile communication - Google Patents
A kind of fast radiating circuit board of the embedded copper billet of mobile communication Download PDFInfo
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- CN207099424U CN207099424U CN201621424763.XU CN201621424763U CN207099424U CN 207099424 U CN207099424 U CN 207099424U CN 201621424763 U CN201621424763 U CN 201621424763U CN 207099424 U CN207099424 U CN 207099424U
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- fixing groove
- prepreg
- polyimide plate
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Abstract
A kind of fast radiating circuit board the utility model discloses mobile communication with embedded copper billet, including wiring board body, wiring board includes core layer, upper layer of prepreg and lower layer of prepreg, upper layer of prepreg and lower layer of prepreg are separately positioned on the upper epidermis and layer of core layer, polyimide plate is provided with upper layer of prepreg, lower layer of prepreg is provided with lower polyimide plate, copper foil layer is provided with upper polyimide plate and lower polyimide plate, fixing groove and lower fixing groove are provided with assist side body, copper billet is pressed into upper fixing groove and lower fixing groove, through hole is respectively arranged with upper polyimide plate and lower polyimide plate between upper fixing groove and lower fixing groove, silver bullion has been embedded in through hole.The utility model is simple in construction, reasonable in design, and quickly wiring board can not only be radiated, while also enhances the heat dispersion to the upper and lower surface of wiring board.
Description
Technical field
It the utility model is related to wiring board art, the quick heat radiating line of the embedded copper billet of specifically a kind of mobile communication
Road plate.
Background technology
With the development of electronics technology, the requirement more and more higher to wiring board, the line especially used in communications industry
Road plate does not require nothing more than wiring board and meets high frequency requirements, while must also reach certain cooling requirements, communication of the prior art
Need further to improve with the radiating rate of wiring board.
The content of the invention
In order to which the utility model that solves the above problems provides a kind of mobile communication insertion copper billet of good heat dissipation effect
Fast radiating circuit board.
The utility model is achieved through the following technical solutions in order to achieve the above object：
The utility model is a kind of fast radiating circuit board of the embedded copper billet of mobile communication, including wiring board body, line
Road plate includes core layer, upper layer of prepreg and lower layer of prepreg, and upper layer of prepreg and lower layer of prepreg are set respectively
In the upper epidermis and layer of core layer, polyimide plate is provided with upper layer of prepreg, is set in lower layer of prepreg
Lower polyimide plate is equipped with, copper foil layer is provided with upper polyimide plate and lower polyimide plate, is set on assist side body
Be equipped with fixing groove and lower fixing groove, copper billet be pressed into upper fixing groove and lower fixing groove, upper fixing groove and lower fixing groove it
Between upper polyimide plate and lower polyimide plate on be respectively arranged with through hole, be embedded in silver bullion in through hole.
Further improvement of the utility model is：Core layer is epoxy resin flaggy.
Further improvement of the utility model is：The opening of upper fixing groove is arranged on polyimide plate, upper fixation
The bottom of groove is arranged on the middle part of lower polyimide plate, and the opening of lower fixing groove is arranged on lower polyimide plate, lower fixing groove
Bottom be arranged on the middle part of polyimide plate, upper fixing groove is identical with the size of lower fixing groove.
Further improvement of the utility model is：Through hole is disposed in an evenly spaced relation between fixing groove and lower fixing groove
On upper polyimide plate and lower polyimide plate.
The beneficial effects of the utility model are：Wiring board body includes core layer, upper polyimide plate, upper polyimides
Plate, upper layer of prepreg, lower layer of prepreg and copper foil layer, upper fixing groove through upper polyimide plate, upper layer of prepreg, under
Layer of prepreg, the bottom of upper fixing groove are arranged on the middle part of lower polyimide plate, are pressed into fixing groove and lower fixing groove
Copper billet contacted with upper polyimide plate, upper layer of prepreg, core layer, lower half cured layer, lower polyimide plate, can
Each layer of wiring board body is radiated, the silver bullion set on upper polyimide plate and lower polyimide plate will can add
Soon to the radiating of upper polyimide plate and lower polyimide plate.
The utility model is simple in construction, reasonable in design, quickly wiring board can not only be radiated, also enhanced simultaneously
To the heat dispersion of the upper and lower surface of wiring board.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Wherein：1- core layers, the upper layer of prepreg of 2-, layer of prepreg under 3-, the upper polyimide plates of 4-, polyamides is sub- under 5-
Amine plate, 6- copper billets, 7- silver bullions.
Embodiment
In order to strengthen to understanding of the present utility model, the utility model is made below in conjunction with drawings and examples further
Detailed description, the embodiment be only used for explain the utility model, to the scope of protection of the utility model form limit.
As shown in figure 1, the utility model is a kind of fast radiating circuit board of the embedded copper billet of mobile communication, including circuit
Plate body, wiring board include core layer 1, upper layer of prepreg 2 and lower layer of prepreg 3, upper layer of prepreg 2 and lower semi-solid preparation
Lamella 3 is separately positioned on the upper epidermis and layer of core layer 1, and polyimide plate 4 is provided with upper layer of prepreg 2,
Lower layer of prepreg 3 is provided with lower polyimide plate 5, copper foil is provided with upper polyimide plate 4 and lower polyimide plate 5
Layer, fixing groove and lower fixing groove are provided with assist side body, copper billet 6 is pressed into upper fixing groove and lower fixing groove,
Through hole is respectively arranged with upper polyimide plate 4 and lower polyimide plate 5 between upper fixing groove and lower fixing groove, in through hole
Silver bullion 7 is embedded with, the opening of upper fixing groove is arranged on polyimide plate, and the bottom of upper fixing groove is arranged on lower polyimides
The middle part of plate 5, the opening of lower fixing groove are arranged on lower polyimide plate, and the bottom of lower fixing groove is arranged on polyimide plate
4 middle part, upper fixing groove is identical with the size of lower fixing groove, and polyethers ether is scribbled in the upper fixing groove on upper polyimide plate 4
Ketone layer adhesion agent, polyether-ether-ketone layer adhesion agent, polyether-ether-ketone layer are also coated with the lower fixing groove under through hole on polyimide plate 5
Adhesion agent have after high temperature resistant, setting rate block, hardening intensity it is high, can be effectively by copper billet and silver bullion adhesion assist side sheet
On body, the silver bullion that is set on upper polyimide plate 4 and lower polyimide plate 5 can be by the heat of wiring board this surface layer as early as possible
Disperse, avoid the top layer heat of the intensive wiring board main body of circuit is excessive from causing temperature too high, core layer is using asphalt mixtures modified by epoxy resin
Fat flaggy is capable of the thickness and intensity of enhancement line plate, core layer, upper half fix lamella 2, upper polyimide plate 4, under it is semifixed
Lamella 3 and lower polyimide plate 5 are integral by the pressing of existing pressing technology, are slotted after pressing, can incited somebody to action after groove
Copper billet and silver bullion mixed pressure enter in wiring board body, then copper foil is laminated into the upper and lower surface of wiring board and forms entirety.
The utility model is simple in construction, reasonable in design, quickly wiring board can not only be radiated, also enhanced simultaneously
To the heat dispersion of the upper and lower surface of wiring board.
Claims (4)
1. a kind of mobile communication fast radiating circuit board of embedded copper billet, including wiring board body, it is characterised in that：The line
Road plate includes core layer（1）, upper layer of prepreg（2）With lower layer of prepreg（3）, the upper layer of prepreg（2）With it is described
Lower layer of prepreg（3）It is separately positioned on the core layer（1）Upper epidermis and layer, the layer of prepreg on described（2）
On be provided with polyimide plate（4）, in the lower layer of prepreg（3）It is provided with lower polyimide plate（5）, gather on described
Acid imide plate（4）With the lower polyimide plate（5）On be provided with copper foil layer, be provided with the wiring board body fixed
Groove and lower fixing groove, copper billet is pressed into fixed groove and the lower fixing groove（6）, fixed groove and it is described under
The upper polyimide plate between fixing groove（4）With the lower polyimide plate（5）On be respectively arranged with through hole, described logical
Hole has been embedded in silver bullion（7）.
A kind of 2. fast radiating circuit board of the embedded copper billet of mobile communication according to claim 1, it is characterised in that：It is described
Core layer（1）For epoxy resin flaggy.
A kind of 3. fast radiating circuit board of the embedded copper billet of mobile communication according to claim 1, it is characterised in that：It is described
The opening of upper fixing groove is arranged on the upper polyimide plate, and the bottom of fixed groove is arranged on the lower polyimides
Plate（5）Middle part, the opening of the lower fixing groove is arranged on the lower polyimide plate, and the bottom of the lower fixing groove is set
The polyimide plate on described（4）Middle part, fixed groove is identical with the size of the lower fixing groove.
A kind of 4. fast radiating circuit board of the embedded copper billet of mobile communication according to claim 1, it is characterised in that：It is described
Through hole is disposed in an evenly spaced relation in the upper polyimide plate between fixed groove and the lower fixing groove（4）Under described
Polyimide plate（5）On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621424763.XU CN207099424U (en) | 2016-12-23 | 2016-12-23 | A kind of fast radiating circuit board of the embedded copper billet of mobile communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621424763.XU CN207099424U (en) | 2016-12-23 | 2016-12-23 | A kind of fast radiating circuit board of the embedded copper billet of mobile communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207099424U true CN207099424U (en) | 2018-03-13 |
Family
ID=61546852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621424763.XU Active CN207099424U (en) | 2016-12-23 | 2016-12-23 | A kind of fast radiating circuit board of the embedded copper billet of mobile communication |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207099424U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966487A (en) * | 2018-09-19 | 2018-12-07 | 广东成德电子科技股份有限公司 | A kind of new-energy automobile high efficiency and heat radiation backboard and preparation method thereof |
| CN113194600A (en) * | 2021-04-27 | 2021-07-30 | 四川普瑞森电子有限公司 | Copper block embedding tool and method for circuit board |
| CN113950204A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
-
2016
- 2016-12-23 CN CN201621424763.XU patent/CN207099424U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966487A (en) * | 2018-09-19 | 2018-12-07 | 广东成德电子科技股份有限公司 | A kind of new-energy automobile high efficiency and heat radiation backboard and preparation method thereof |
| CN113950204A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
| CN113950204B (en) * | 2020-07-16 | 2024-04-12 | 深南电路股份有限公司 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
| CN113194600A (en) * | 2021-04-27 | 2021-07-30 | 四川普瑞森电子有限公司 | Copper block embedding tool and method for circuit board |
| CN113194600B (en) * | 2021-04-27 | 2022-12-20 | 四川普瑞森电子有限公司 | Copper block embedding tool and method for circuit board |
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