CN104725768A - Electric-conducting heat-conducting new material and application thereof - Google Patents
Electric-conducting heat-conducting new material and application thereof Download PDFInfo
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- CN104725768A CN104725768A CN201510120127.1A CN201510120127A CN104725768A CN 104725768 A CN104725768 A CN 104725768A CN 201510120127 A CN201510120127 A CN 201510120127A CN 104725768 A CN104725768 A CN 104725768A
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Abstract
The invention relates to a novel composite material and application thereof. The composite material is prepared from the following components in parts by weight: 0-400 parts of high-dispersivity electric-conducting silver powder, 0-600 parts of high-electric-conductivity copper metal, 0-200 parts of polysiloxane resin, 0-300 parts of phenol, 0-400 parts of formaldehyde, 0-600 parts of phenol formaldehyde resin, 0-100 parts of NL curing agent and 0-50 parts of methylimidazole. The raw materials are subjected to high-speed mixing and extrusion curing to obtain the composite material. The novel composite material has the advantages of favorable processability, outstanding electric properties and the like. Especially in the PCB (printed circuit board) processing technique, after being compounded and mixed with the tin paste/tin sheet, the novel composite material can greatly reduce the problems of cavity pockets generated in SMT welding, and greatly enhances the ground signal completeness between the chip and PCB and high heat conductivity of the PCB heat-dissipation metal substrate, thereby enhancing the stability and reliability of the circuit system.
Description
Technical field
The present invention relates to electric PC board processing technology, be especially applied to the matrix material in the welding of high frequency chip and printed-wiring board (PWB) (PCB) and heat dissipation metal base.
Meanwhile, this material also can be applied in and comprise LED, micro-wave communication, the fields such as loudspeaker system.
Background technology
Along with the development of electronic technology, the miniaturization of product, intensively become trend.Especially in fields such as communication, microwave, aerospace, smart mobile phones, the operating frequency of system progressively improves, and the processing power of chip progressively promotes, and how to improve the signal sensitivity of electronic system, reliability and heat radiation and becomes focus.
For solving this problem, in PCB industry, the technology generally adopting chip to embed metal matrix welding solves ground connection and heat dissipation problem.Current chip bonding technique, tin sheet is mainly adopted to weld between chip with heat dissipation metal base, cost is high, efficiency is low, complex process, ubiquity accounts for the air filled cavity of bonding area 45 ~ 35%, causes the ground connection of chip and heat radiation function greatly to reduce, and easily cause problems of Signal Integrity in high frequency field, greatly reduce entire system reliability.
RF power amplification chip, and the core of LED chip is DIE, and heat radiation bottom DIE and the ground connection key point that to be whole system design whether reliable with application.In the tin cream adopted at present, tin sheet sintering process, due to the superelevation thermal resistance that bubble produces, imperfect earth effect, especially the erratic behavior of bubble distribution is the problem that industry needs to solve for many years.
Along with the continuous breakthrough of material science and technology, the conductive heat conducting material product of some specialized application and electric PC board arises at the historic moment.Product in the market and solution, can only process the heat-conductivity conducting problem of metal matrix to the non-key point in periphery of scatterer, and not relate to chip side, the especially core technology field of DIE bottom.Therefore, development can at the type material of chip side application, the not breakthrough of still material technology aspect, and solves key point and the novelty of PCB industry at application, facilitate the development of PCB industrial chain, there is very important economic worth and practical value.
Summary of the invention
The object of the invention is, for the deficiency of PCB industry current material technology and application scheme, to provide a kind of advanced composite material and the solution in chip side, on the signal integrity and thermal diffusivity basis of the system of guarantee, be applicable to extensive industrialization.
Object of the present invention can be achieved through the following technical solutions:
A kind of conductive and heat-conductive matrix material, described matrix material comprises the component of following weight part:
Polymolecularity conductive silver powder 0 ~ 400 part;
0 ~ 600 part, high conductivity copper metal;
Polyorganosiloxane resin 0 ~ 200 part;
Phenol 0 ~ 300 part;
0 ~ 400 part, formaldehyde;
0 ~ 600 part, resol;
0 ~ 100 part, NL solidifying agent;
Methylimidazole 0 ~ 50 part.
Described advanced composite material, the material after its solidification has good physical and chemical performance, and it has excellent cohesive strength to the surface of metal and non-metallic material.
Described advanced composite material, after its solidification, dielectric properties are good, and set shrinking percentage is little, and dimensional stability is high, and possesses excellent snappiness.
Described advanced composite material, after its solidification, heat resistance is good, can bear the application within 400 degrees Celsius.
Described advanced composite material, its set time is 15 ~ 30 minutes.
The density of described Methylimidazole is 0.5 ~ 1.06 g/ml.
The application of above-mentioned arbitrary described conductive and heat-conductive matrix material, is used for 4G communication base station, smart mobile phone, high frequency communication system, military project radio communication and LED industry after each component of described conductive and heat-conductive matrix material being mixed.
Described application method is as follows:
Coating solidification is carried out (under follow-up hot environment with described matrix material at the flange base of chip metal, the chemical bond of material changes, merge in molecule rank with soldering tin material, thus make the conductive earthing function of system, heat sinking function has the lifting of magnitude), this chip metal is embedded in the groove of heat radiating metal base of PCB printed-wiring board (PWB) together with tin cream/tin sheet subsequently, enters SMT technical process subsequently.
Again, described application method is as follows:
Coating solidification is carried out with described matrix material at the input/output port of chip flank, subsequently this chip embed together with tin cream/tin sheet PCB printed-wiring board (PWB) input and output terminal position (avoid soldering tin material without controlling mobility, the insulating reliability of raising system), carry out SMT technical process subsequently.
Further, described application method is as follows:
Coating solidification (lifting system ground connection conduction, heat conductivility is carried out with described matrix material at the heat radiating metal basis pontis of PCB, greatly improve current production efficiency, especially disposable percent of pass, reduce manufacturing cost), then this metal matrix carries out welding process flow with the radiator element of system together with tin cream/tin sheet.
Described coating and curing method is as follows:
Each component is added high-speed mixer mix, mixing temperature is 30 ~ 150 DEG C, and mixing time is 3 ~ 30 minutes; Then, mixture is added twin screw extruder and extrudes, be coated in material need in conjunction with part, be cured.
Compared with prior art, the present invention has the following advantages and beneficial effect:
(1) the present invention adopts forming processing technology conventional at present and equipment, has prepared matrix material.In obtained composite system, what play effect is the phenolic resin blend of multiplexed combination: wherein, phenolic resin system both ensure that electric property, had accomplished optimization process again in cost.Matrix material, in hot environment, carries out compounded combination with tin cream/tin sheet material, optimizes the homogeneity of conductive and heat-conductive further, the cost performance of system is given prominence to, is particularly suitable for producing in enormous quantities.
(2) adopt this matrix material, when not affecting follow-up flow process, air filled cavity is reduced within 10%, significantly improves heat conduction and the ground connection performance of system.Carry out compounded combination with tin cream/tin sheet, cost is low, and efficiency is high, substantially increases electric property and the unfailing performance of high frequency circuit system.Especially the disposable qualification rate of system.
Accompanying drawing explanation
Fig. 1 is existing tin cream/tin sheet welding scheme, X ray test figure after SMT;
Fig. 2 is the welding scheme after interpolation matrix material of the present invention, X ray test figure after SMT.
concrete implementation method
Below in conjunction with accompanying drawing and specific examples, the present invention will be further described:
Comparative example 1
Existing welding scheme: in metal matrix inside grooves steel mesh print solder paste, or after placing tin sheet, by core
Sheet, as above groove, enters SMT(Reflow Soldering after applying certain pressure) operation, standard is IPC DRM-SMT-1999(surface mount solder joint evaluation).Treatment effect: the die bottom surface of 35% is long-pending produces cavity.
Embodiment 1
Polymolecularity conductive silver powder 200 parts;
400 parts, high conductivity copper metal;
Polyorganosiloxane resin 20 parts;
300 parts, resol;
10 parts, NL solidifying agent;
Methylimidazole 20 parts.
Shaping matrix material and chip bottom metal flange surface are carried out coating solidify;
Coating and curing method is as follows: each component is added high-speed mixer and mixes, and mixing temperature is 30 ~ 150 DEG C, and mixing time is 3 ~ 30 minutes; Then, mixture is added twin screw extruder and extrudes, be coated in chip need in conjunction with position.
Subsequently by this chip, together implant in the heat dissipation metal base groove of PCB with tin cream/tin sheet, apply certain pressure at chip top simultaneously;
Carry out SMT operation, standard is IPC DRM-SMT-1999(surface mount solder joint evaluation).As shown in Figure 2, the ratio of cyst areas and chip area is within 8% for effect.Contrast known with comparative example 1, embodiment 1 chips bottom metal flange side bubble obviously reduces, by cavity cause can not the abundant problems of Signal Integrity that causes of ground connection, the heat transfer efficiency that caused of cavity the problem such as greatly to reduce and is all resolved.
Embodiment 2
Polymolecularity conductive silver powder 100 parts;
50 parts, high conductivity copper metal;
Polyorganosiloxane resin 40 parts;
300 parts, resol;
10 parts, NL solidifying agent;
Methylimidazole 10 parts.
Shaping matrix material and chip flank input and output terminal surface are carried out coating solidify, coating and curing method is as embodiment 1;
Subsequently by this chip, together implant on the chip input and output metal terminal of PCB with tin cream/tin sheet, apply certain pressure at chip top simultaneously;
Carry out SMT operation, standard is IPC DRM-SMT-1999(surface mount solder joint evaluation).
Embodiment 3
Polymolecularity conductive silver powder 20 parts;
40 parts, high conductivity copper metal;
Polyorganosiloxane resin 15 parts;
Phenol 20 parts;
40 parts, formaldehyde;
300 parts, resol;
20 parts, NL solidifying agent;
Methylimidazole 5 parts.
Shaping conductive and heat-conductive matrix material and heat dissipation metal basis pontis are carried out coating solidify, coating and curing method is as embodiment 1;
Subsequently by this heat radiation base, together carry out contraposition with the radiator element of system with tin cream/tin sheet, apply certain pressure at chip top simultaneously;
Carry out SMT operation, standard is IPC DRM-SMT-1999(surface mount solder joint evaluation).
The matrix material of the application can be applicable to 4G communication base station equipment, microwave broadcasting communication system, smart mobile phone, aerospace, and in the electronic technology field such as LED, can meet the signal sensitivity of system, reliability, cooling requirements to the requirement of material.
The aforementioned description to embodiment can understand and apply the invention for ease of those skilled in the art.Person skilled in the art obviously easily can make various amendment to these embodiments, and General Principle described herein is applied in other embodiments and need not through performing creative labour.Therefore, the invention is not restricted to embodiment here, those skilled in the art, according to announcement of the present invention, do not depart from improvement that scope makes and amendment all should within protection scope of the present invention.
Claims (10)
1. a conductive and heat-conductive matrix material, described matrix material comprises the component of following weight part: polymolecularity conductive silver powder 0 ~ 400 part; 0 ~ 600 part, high conductivity copper metal; Polyorganosiloxane resin 0 ~ 200 part; Phenol 0 ~ 300 part; 0 ~ 400 part, formaldehyde; 0 ~ 600 part, resol; 0 ~ 100 part, NL solidifying agent; Methylimidazole 0 ~ 50 part.
2. matrix material according to claim 1, is characterized in that, the material after its solidification has good physical and chemical performance, and it has excellent cohesive strength to the surface of metal and non-metallic material.
3. matrix material according to claim 1, is characterized in that, after its solidification, dielectric properties are good, and set shrinking percentage is little, and dimensional stability is high, and possesses excellent snappiness.
4. matrix material according to claim 1, is characterized in that, after its solidification, heat resistance is good, can bear the application within 400 degrees Celsius.
5. matrix material according to claim 1, is characterized in that, its set time is 15 ~ 30 minutes.
6. matrix material according to claim 1, is characterized in that, the density of described Methylimidazole is 0.5 ~ 1.06 g/ml.
7. the application of arbitrary described conductive and heat-conductive matrix material in a claim 1 ~ 6, it is characterized in that, after each component of described conductive and heat-conductive matrix material being mixed, be used for 4G communication base station, smart mobile phone, high frequency communication system, military project radio communication and LED industry.
8. application according to claim 7, it is characterized in that, described application method is as follows: carry out coating solidification at the flange base of chip metal (under follow-up hot environment with described matrix material, the chemical bond of material changes, merge in molecule rank with soldering tin material, thus make the conductive earthing function of system, heat sinking function has the lifting of magnitude), this chip metal is embedded in the groove of heat radiating metal base of PCB printed-wiring board (PWB) together with tin cream/tin sheet subsequently, enters SMT technical process subsequently.
9. application according to claim 7, it is characterized in that, described application method is as follows: carry out coating solidification at the input/output port of chip flank with described matrix material, subsequently this chip embed together with tin cream/tin sheet PCB printed-wiring board (PWB) input and output terminal position (avoid soldering tin material without controlling mobility, the insulating reliability of raising system), carry out SMT technical process subsequently.
10. application according to claim 7, it is characterized in that, described application method is as follows: carry out coating solidification (lifting system ground connection conduction, heat conductivility at the heat radiating metal basis pontis of PCB with described matrix material, greatly improve current production efficiency, especially disposable percent of pass, reduce manufacturing cost), then this metal matrix carries out welding process flow with the radiator element of system together with tin cream/tin sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510120127.1A CN104725768A (en) | 2015-03-18 | 2015-03-18 | Electric-conducting heat-conducting new material and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510120127.1A CN104725768A (en) | 2015-03-18 | 2015-03-18 | Electric-conducting heat-conducting new material and application thereof |
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| CN104725768A true CN104725768A (en) | 2015-06-24 |
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| CN201510120127.1A Pending CN104725768A (en) | 2015-03-18 | 2015-03-18 | Electric-conducting heat-conducting new material and application thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105349111A (en) * | 2015-11-24 | 2016-02-24 | 苏州市相城区明达复合材料厂 | Novel thermal conductive material |
| CN108587048A (en) * | 2018-04-03 | 2018-09-28 | 商洛学院 | A kind of LED lamp bead pedestal |
-
2015
- 2015-03-18 CN CN201510120127.1A patent/CN104725768A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105349111A (en) * | 2015-11-24 | 2016-02-24 | 苏州市相城区明达复合材料厂 | Novel thermal conductive material |
| CN108587048A (en) * | 2018-04-03 | 2018-09-28 | 商洛学院 | A kind of LED lamp bead pedestal |
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