CN206533604U - A kind of nested composite circuit board - Google Patents
A kind of nested composite circuit board Download PDFInfo
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- CN206533604U CN206533604U CN201621439369.3U CN201621439369U CN206533604U CN 206533604 U CN206533604 U CN 206533604U CN 201621439369 U CN201621439369 U CN 201621439369U CN 206533604 U CN206533604 U CN 206533604U
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- flexible layer
- copper
- circuit board
- flexible
- composite circuit
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Abstract
The utility model is related to a kind of nested composite circuit board, and the composite circuit board includes：Flexible board and at least one is copper-based, wherein, offer at least one receiving hole on the flexible board, it is described copper-based to be correspondingly arranged in an interference fit in the receiving hole.The utility model is copper-based in being internally provided with for flexible board, and it is small using copper-based amount, both the bendable folding endurance and pliability of flexible board had been remained, compared with existing welding metal substrate, has also solved that metal material consumption is big, cost is high, packaging density is low, the bulky technical problem of volume.
Description
Technical field
The utility model is related to circuit board making field, more particularly to a kind of nested composite circuit board.
Background technology
With the development of electronics industry, electronic product volume is less and less, and power density is increasing, how to seek radiating
And the best approach of structure design, the huge challenge just designed into current electronics industry.
In traditional printed circuit board (PCB) (PCB, Printed Circuit Board) structure, the radiating side commonly used at present
Method is generally comprised makes circuit board and on circuit boards two kinds of welding metal substrate using metal substrate, refers to Fig. 1, Fig. 1
For the structural representation of the circuit board of the prior art with metal substrate, wherein, 11 it is core plate, 12 be adhesive linkage, 13 is
Metal substrate；But utility model people has found that circuit board that both techniques are made all has metal material and disappeared in practice
Consumption is big, cost is high, the bulky shortcoming of volume, and relatively low occasion is required for some heat radiation powers, higher cost without
Method meets the market demand.
In addition, the material of traditional printed circuit board (PCB) is stiff board material, by epoxy resin, glass-fiber-fabric and copper foil group
Into after cured by heat zone, bonding turns into an entirety, possesses fine rigid nature, can be in welding and installation
Play support and fixation well.But general printed circuit board (PCB) is rigid printed circuit board (PCB), two dimension can only be carried out even
Connect, i.e., complete connection in the plate face of printed circuit board (PCB), such as tie point to be connected is not needed by wire in same plate face, then
Conducting could be completed, thus it is high to the space requirement of electronic product.
Therefore, it is necessary to a kind of printed circuit board arrangement is provided, the metal material consumption to solve prior art presence is big, into
This height, volume are heavy, can not realize the problem of three-dimensional is connected.
The content of the invention
The purpose of this utility model is to provide a kind of nested composite circuit board, and it is arranged at flexible printing electricity by copper-based
In the plate of road, to solve that the consumption of existing metal material is big, cost is high, volume is heavy, can not three-dimensional connection technical problem.
To solve the above problems, the technical scheme that the utility model is provided is as follows：
The utility model embodiment is related to a kind of nested composite circuit board, and it includes：
Flexible board and at least one is copper-based, wherein, offer at least one receiving hole on the flexible board, it is described it is copper-based with
The mode of interference fit is correspondingly arranged in the receiving hole.
The flexible board includes flexible layer I, flexible layer II, is arranged between the flexible layer I and the flexible layer II
Adhesive linkage, the surface circuit I for being arranged at the surface of flexible layer I and the surface circuit for being arranged at the surface of flexible layer II
Ⅱ。
Further, the flexible layer I, the flexible layer II are provided with stress in the mating surface contacted with the adhesive linkage
Raised and/or stress groove.
Further, the flexible layer I, the flexible layer II are provided with stress in the mating surface contacted with the adhesive linkage
Groove, the width of the stress groove is less than or equal to 0.2mm.
Further, the stress groove is the annular groove being arranged in the mating surface of flexible layer I or flexible layer II.
Further, the stress groove is outer narrow interior wealthy rhombus groove.
Further, the flexible layer I, the flexible layer II are provided with stress in the mating surface contacted with the adhesive linkage
Projection, the stress projection is to process the rigid projections to be formed by extruding, welding, clamping.
Further, it is affixed with surface circuit I, surface circuit II in the copper-based circumferential direction.
Further, it is additionally provided with contact fin in the copper-based circumferential direction coordinated with surface circuit I, surface circuit II
Piece, the contact fin is overlapped in upper surface, lower surface or section side of surface circuit I or surface circuit II.
The preparation method of above-mentioned nested composite circuit board, comprises the following steps：
A, using adhesive linkage flexible layer I and flexible layer II are bonded together, obtain core plate to be laminated；
B, the perforate at the pre-buried copper-based position of the flexible layer I, the flexible layer II and the adhesive linkage；
C, copper-based, the forming processes of selection, its size for being molded the hole position that size is opened up with core plate to be laminated are adapted；
D, to the flexible layer I, the flexible layer II and it is described it is copper-based progress pressing processing；
E, the heavy copper plating of execution, form surface circuit I in the core plate upper surface of pressing, are formed in the core plate lower surface of pressing
Surface circuit II, is connected by heavy copper and electroplating technology by copper-based with outer layer pad or big copper sheet, by common dual platen system
Make flow, form nested composite circuit board.
Compared to the composite circuit board of prior art, nested composite circuit board of the present utility model is in the inside of flexible board
Be provided with it is copper-based, with it is existing metal substrate is set on circuit boards compared with, solve that metal material consumption is big, cost is high, volume
Bulky technical problem, also, the pliability of flexible PCB is remained, with higher bending resistance, three-dimensional can be realized
Connection, such as tie point to be connected can also complete conducting not by wire not in same plate face, disclosure satisfy that some electronics productions
The special space requirement of product.
Brief description of the drawings
Fig. 1 is a kind of existing structural representation of the printed circuit board (PCB) with metal substrate；
The structural representation for the nested composite circuit board that Fig. 2 provides for the utility model；
Another structural representation for the nested composite circuit board that Fig. 3 provides for the utility model；
Another structural representation for the nested composite circuit board that Fig. 4 provides for the utility model；
Wherein, description of reference numerals is as follows：
200th, flexible board；
201st, receiving hole；
202nd, it is copper-based；
21st, flexible layer I；
22nd, flexible layer II；
23rd, adhesive linkage；
24th, surface circuit I；
25th, surface circuit II.
Embodiment
In order that the purpose of this utility model, technical scheme and beneficial effect are more clearly understood, below in conjunction with accompanying drawing and
Embodiment, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only used to
The utility model is explained, is not used to limit the utility model.
It refer to Fig. 2, the structural representation for the nested composite circuit board that Fig. 2 provides for the utility model, wherein, it is described
Nested composite circuit board includes：
Flexible board 200 and at least one copper-based 202, wherein, offer at least one receiving hole on the flexible board 200
201, described copper-based 202 are correspondingly arranged in the receiving hole 201 in an interference fit, and interference fit can guarantee that both connect
Connect firm, while circuit keeps stable connection.
The printed circuit board (PCB) is additionally provided with heater members (not shown), and the heater members correspondence is mounted on described
On copper-based 202.
It is understood that part printed wiring board is due to electrical performance requirements, local heat dissipation capacity is big, therefore meeting during design
Receiving hole 201 is opened up between assist side and copper-based 202 are embedded to and is radiated；Copper-based 202 stock size of embedment is smaller, embedment
With one entirety of formation of flexible board 200 after copper-based 202, so as to realize electric interconnection.Copper is locally embedded in i.e. described flexible board 200
Base 202, small using copper-based 202 amount, compared with welding copper base, lightweight with small volume, cost is low, and packaging density is high
Advantage.
Further, heater members (such as power tube) are directly against above copper-based 202, so that heat conduction is fast.
Analytic explanation is carried out to the concrete structure of the flexible board 200 below：
It refer to Fig. 3, the structural representation for the nested composite circuit board that Fig. 3 provides for the utility model, wherein, it is described
Flexible board 200 includes flexible layer I 21, flexible layer II 22, is arranged at gluing between the flexible layer I 21 and the flexible layer II 22
Layer 23 is connect, the surface circuit I 24 on the surface of flexible layer I 21 is arranged at and is arranged at the surface on the surface of flexible layer II 22
Circuit II 25.
It is preferred that, the adhesive linkage 23 is prepreg.Wherein prepreg is mainly made up of resin and reinforcing material, this
In embodiment, prepreg used in the printed circuit board (PCB) is preferably to do reinforcing material using glass-fiber-fabric.
Further, in order to improve cohesive force, the structure of composite circuit board is made more to consolidate, it is the flexible layer I 21, described soft
Property layer II 22 be provided with mating surface contact with the adhesive linkage 23 stress projection and/or stress groove.Further preferably
, the flexible layer I 21, the flexible layer II 22 are provided with stress groove in the mating surface contacted with the adhesive linkage 23,
The width of the stress groove is less than or equal to 0.2mm, so that prepreg can preferably provide cohesive force, improves flexible layer
Between adhesion.
In order to improve the bonding force of composite circuit board in all directions, its structural strength is improved, the stress groove is
It is arranged in the annular groove in the mating surface of flexible layer I 21 or flexible layer II 22.It is preferred that, in order to improve adhesion, while favorably
In processing, the stress groove is outer narrow interior wealthy rhombus groove.
Optionally, the flexible layer I 21, the flexible layer II 22 are set in the mating surface contacted with the adhesive linkage 23
There is stress raised, the stress projection is to process the rigid projections to be formed by extruding, welding, clamping.Agreement can increase by half
Bonded area between cured sheets and flexible layer, so as to improve adhesion, it is ensured that stable connection, while being more beneficial for processing, giving birth to
Production.
As shown in Figure 3, it is preferred that the receiving hole 201 be arranged at the flexible layer I 21, the flexible layer II 22 and
In 23 3 layers of the adhesive linkage.The thickness of the receiving hole 201 is equal to the flexible layer I 21, the adhesive linkage 23 and described
The gross thickness of flexible layer II 22.
That is, the receiving hole 201 is since the upper surface of flexible layer I 21, through flexible layer I 21, described viscous
Layer 23 and the flexible layer II 22 are connect, the lower surface of flexible layer II 22 is extended to.
The size that the receiving hole 201 is opened up is relevant with copper-based 202 size that need to be embedded to, the width of the receiving hole 201
Degree is equal with copper-based 202 width, in some more accurate occasions of requirement, the thickness of the receiving hole 201 and institute
The thickness for stating copper-based 202 is equal, it is to be understood that may there are error, the thickness of the receiving hole 201 in some occasions
Degree can differ +/- 0.05mm with copper-based 202 thickness.
It is contemplated that Fig. 3 is only illustrated by taking embedment one copper-based 202 on printed circuit board (PCB) as an example, described copper-based 202
The quantity of setting can be determined according to the quantity of high power device, and illustrating not constitute herein limits of the present utility model.
From the foregoing, the printed circuit board (PCB) with copper-based 202 that the utility model is provided, sets in the interior part of flexible board
Copper-based 202 are equipped with, and it is small using copper-based 202 amount, compared with welding copper base, solve metal material and consume big, cost
High, packaging density is low, the bulky technical problem of volume.More specifically, copper-based 202 and surrounding in embedment flexible board 200 are situated between
Matter bonding is good, and without lamination problem, and copper-based 202 surface of embedment and printed wiring board outer layer realize electric interconnection, so that
Realization intactly links together.
Further, it is electrically connected firm in order to ensure, with surface circuit I 24, surface in copper-based 202 circumferential direction
Circuit II 25 is affixed, in order to improve connection reliability, described copper-based 202 weeks coordinated with surface circuit I 24, surface circuit II 25
Contact fin is also provided with by modes such as extruding, welding on to direction, the contact fin is overlapped in surface circuit I 24 or table
Upper surface, lower surface or section side of face circuit II 25, the contact fin can be evenly arranged, in disorder can also arrange, pass through
Fin is contacted, either rotates or bends, contact fin can be connected with corresponding circuit, formed path, improved compound
The job stability of circuit board, extends its service life, cuts after the as composite circuit board punching of side, is internally formed in hole
Medial surface.As optional embodiment, the contact fin is to be evenly arranged in copper-based 202 circumferential strip bulges, described
The bearing of trend of strip bulge with copper-based 202 length direction, receiving hole 201 bearing of trend it is consistent so that copper-based 202
There is more preferable connectivity with surface circuit.
In order to be better understood from the nested composite circuit board of the utility model offer, below to nesting as shown in Figure 3
The preparation method of type composite circuit board carries out analytic explanation：
The first step, in the mating surface of the flexible layer I 21 and the flexible layer II 22 extruding, fluting by way of add
Work goes out stress projection and/or stress groove, and the flexible layer I 21 and the flexible layer II 22 are bonded in into one using prepreg
Rise, obtain core plate to be laminated.
Second step, pre-buried copper-based 202 in the flexible layer I 21, the flexible layer II 22 and the prepreg
Perforate at position.
The position for needing to set according to high performance components, receiving hole is opened up in the correspondence position of the core plate to be laminated
201, copper-based 202 size that the size of the receiving hole 201 opened up is embedded to as needed is determined.
3rd step, copper-based 202 forming processes；
Selection is differed with core plate same thickness to be laminated or thickness at copper-based the 202 of +/- 0.05mm or so, shaping
Reason, it is molded, and size is equal with the width for the hole position that core plate to be laminated is opened up or slightly larger than hole position, in mismachining tolerance and hole
Under stress contraction, it can realize that both are interference fitted.
In copper-based 202 circumferential processing contact fin, the contact fin can be added by techniques such as welding, punching press, flutings
Work.
4th step, to the flexible layer I 21, the flexible layer II 22 and it is described it is copper-based 202 carry out pressing processing.
It is understood that pressing before processing is being carried out, can be respectively to the flexible layer I 21, the flexible layer II 22
Brown processing is carried out with described copper-based 202.Thereafter, core plate to be laminated and copper-based 202 two parts are carried out using prepreg
Pressing is handled, wherein it is possible to put firm plate in core plate upper and lower faces to be laminated, it is ensured that plate face is smooth.Because in prepreg
Resin has mobility at high temperature, the gap between copper-based 202 and core plate can be preferably filled, by copper-based 202 after solidification
Combined with core plate, as shown in Figure 4.Wherein, prepreg can select it is high containing glue 1080.
5th step, the heavy copper plating of execution, form surface circuit I 24, under the core plate of pressing in the core plate upper surface of pressing
Surface forms surface circuit II 25.
Copper-based 202 are connected with outer layer pad or big copper sheet by heavy copper and electroplating technology, by common dual platen system
Make flow, the final printed circuit board (PCB) with copper-based 202 as shown in Figure 3.Formed after surface lines, you can complete with copper-based
The making of 202 printed circuit board (PCB).
Through practice, the printed circuit board (PCB) with copper-based 202 that the utility model is provided can apply to high-power, height
Among the electronic product of heating, just like inferior field：
Firstth, audio frequency apparatus：Input, output amplifier, balance amplifier, audio-frequency amplifier, power amplifier etc.；
Secondth, power-supply device：Switching regulaor, DC/DC converters, SW adjusters, high power transistor, voltage-stablizer etc.；
3rd, high-frequency communication equipment：High-frequency amplifier, filter circuit, circuit of transmitting messages etc.；
4th, automobile：Electronic controller, igniter, power-supply controller of electric etc.；
5th, computer：CPU board, soft board starter, supply unit etc.；
6th, power model：Transverter, solid-state relay, rectifier, pulse motor driver etc.；
Other can also be applied to simultaneously, such as semiconducting insulation heat-conducting plate, resistor array, hot receiver and solar battery
The fields such as substrate, are not especially limited herein.
From the foregoing, the printed circuit board (PCB) with copper-based 202 that the utility model is provided, sets in the interior part of flexible board
Copper-based 202 are equipped with, and it is small using copper-based 202 amount, compared with welding copper base, solve metal material and consume big, cost
It is high, packaging density is low, volume is heavy, can not three-dimensional connection technical problem.Further, copper-based 202 by way of pressing
It is embedded in plate, with the perfect seamless combination of printed circuit board (PCB).Compared with welding copper billet, it is to avoid welding it is copper-based 202 when high temperature to print
The injury of printed circuit board, reduces the heat resistant requirements of printed circuit board (PCB), while avoiding the difficulty for welding copper-based 202 technique.Embedment
Copper-based 202 can be used for multiple sliding cover, it is to avoid metal substrate design can not meet making multilayer high-frequency microwave circuit signal
The requirement of integrality.
Furthermore, it is necessary to explanation, unless otherwise indicated, term " first " otherwise in specification, " second ", " the 3rd "
It is used only for distinguishing each component, element in specification etc. Deng description, without being intended to indicate that between each component, element
Logical relation or ordinal relation etc..
In summary, although the utility model is disclosed above with preferred embodiment, but above preferred embodiment is not used
To limit the utility model, one of ordinary skill in the art is not departing from spirit and scope of the present utility model, can made
Various changes are defined with retouching, therefore protection domain of the present utility model by the scope that claim is defined.
Claims (7)
1. a kind of nested composite circuit board, it is characterised in that including：
Flexible board is copper-based with least one, wherein, at least one receiving hole is offered on the flexible board, it is described copper-based with interference
The mode of cooperation is correspondingly arranged in the receiving hole；
The flexible board includes flexible layer I, flexible layer II, the bonding being arranged between the flexible layer I and the flexible layer II
Layer, be arranged at the surface circuit I on the surface of flexible layer I and be arranged at the surface circuit II on the surface of flexible layer II；
The flexible layer I, the flexible layer II be provided with the mating surface contacted with the adhesive linkage stress it is raised and/or by
Power groove.
2. nested composite circuit board according to claim 1, it is characterised in that the flexible layer I, the flexible layer II
Stress groove is provided with the mating surface contacted with the adhesive linkage, the width of the stress groove is less than or equal to 0.2mm.
3. nested composite circuit board according to claim 2, it is characterised in that the stress groove is to be arranged in flexibility
Annular groove in the mating surface of layer I or flexible layer II.
4. nested composite circuit board according to claim 2, it is characterised in that the stress groove is outer narrow interior wealthy
Rhombus groove.
5. nested composite circuit board according to claim 1, it is characterised in that the flexible layer I, the flexible layer II
Stress is provided with the mating surface contacted with the adhesive linkage raised, the stress projection is to add by extruding, welding, clamping
The rigid projections of work formation.
6. nested composite circuit board according to claim 1, it is characterised in that with table in the copper-based circumferential direction
Face circuit I, surface circuit II are affixed.
7. nested composite circuit board according to claim 6, it is characterised in that described copper-based and surface circuit I, surface
Contact fin is additionally provided with the circumferential direction that circuit II coordinates, the contact fin is overlapped in surface circuit I or surface circuit
II upper surface, lower surface or section side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621439369.3U CN206533604U (en) | 2016-12-26 | 2016-12-26 | A kind of nested composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621439369.3U CN206533604U (en) | 2016-12-26 | 2016-12-26 | A kind of nested composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206533604U true CN206533604U (en) | 2017-09-29 |
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ID=59922395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621439369.3U Active CN206533604U (en) | 2016-12-26 | 2016-12-26 | A kind of nested composite circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050461A (en) * | 2018-10-12 | 2020-04-21 | 昆山工研院新型平板显示技术中心有限公司 | Electronic device and manufacturing method thereof |
-
2016
- 2016-12-26 CN CN201621439369.3U patent/CN206533604U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050461A (en) * | 2018-10-12 | 2020-04-21 | 昆山工研院新型平板显示技术中心有限公司 | Electronic device and manufacturing method thereof |
| CN111050461B (en) * | 2018-10-12 | 2021-01-22 | 昆山工研院新型平板显示技术中心有限公司 | Electronic device and manufacturing method thereof |
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