CN102781176A - Splicing method of circuit board and splicing circuit board - Google Patents
Splicing method of circuit board and splicing circuit board Download PDFInfo
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- CN102781176A CN102781176A CN2011101200444A CN201110120044A CN102781176A CN 102781176 A CN102781176 A CN 102781176A CN 2011101200444 A CN2011101200444 A CN 2011101200444A CN 201110120044 A CN201110120044 A CN 201110120044A CN 102781176 A CN102781176 A CN 102781176A
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- protruding tooth
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Abstract
The invention provides a splicing method of a circuit board. The method comprises that snags are formed at the edge of a first circuit board, grooves are formed at the edge of a second circuit board, the snags are embedded in the grooves through an adhesive, groove positions in which the snags are embedded are pressed and dried, and a splicing circuit board is obtained. The invention also discloses the splicing circuit board. The splicing circuit board comprises the first circuit board and the second circuit board, wherein the edge of the first circuit board is provided with the snags, the edge of the second circuit board is provided with the grooves, and the snags are embedded in the grooves through the adhesive. Accordingly, circuits of the splicing circuit board cannot change, the communication signal interference caused by the fact that the splicing circuit board is applied to a base station antenna is avoided, and the emission effect cannot be affected.
Description
[technical field]
The present invention relates to the circuit board technique technical field, relate in particular to a kind of joining method and splicing wiring board of wiring board.
[background technology]
Development along with scientific and technological level; The communication environment of face of mankind becomes increasingly complex; In order to cooperate the signal emission of different regions, the base station needs increasing big plate antenna as emission source, and the splicing process of wiring board provides feasibility for making larger sized antenna.The size-constrained size range that can process in process equipment of the wiring board of traditional fabrication; Large-sized more wiring board processing needs the process equipment of large format more; The input that needs more funds thus; Use the wiring board splicing process then can not receive the restriction of equipment and production technology, make the large scale wiring board.
In the prior art, carry out circuit through methods such as slot, golden fingers between the wiring board and connect.But the inventor finds in to the research of prior art and practice process; Because not doing jigsaw between the wiring board handles; Its working face is difficult to guarantee on a horizontal plane; And the change in the design also taken place in circuit, can cause communication interference if be applied on the antenna for base station, influences launching effect.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of joining method and splicing wiring board of wiring board; The circuit that can avoid splicing wiring board changes; And then avoid splicing wiring board and be applied to and cause communication interference on the antenna for base station, influence launching effect.
For solving the problems of the technologies described above, one embodiment of the invention provides a kind of joining method of wiring board, and this method comprises:
The edge of first wiring board is molded protruding tooth;
The edge of second wiring board is molded groove;
Adopt adhesive that said protruding tooth is embedded in the said groove;
Pressing and dry is carried out at the groove position that is embedded with protruding tooth, obtained the splicing wiring board.
Another embodiment of the present invention also provides a kind of splicing wiring board, and this wiring board comprises:
The edge has first wiring board of protruding tooth; And,
The edge has second wiring board of groove;
Said protruding tooth is embedded in the said groove through adhesive.
Compared with prior art; Technique scheme has the following advantages: because the first wiring board edge has protruding tooth; The second wiring board edge has groove, so after being embedded in protruding tooth in the groove through adhesive, first wiring board and second wiring board are on same horizontal plane; And the circuit of first wiring board and second wiring board does not change in the process of splicing, so the splicing wiring board that provides of the embodiment of the invention is applied on the antenna for base station and can not cause communication interference, can guarantee launching effect.
[description of drawings]
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention; The accompanying drawing of required use is done to introduce simply in will describing embodiment below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the joining method flow chart that the present invention implements a kind of wiring board that provides;
Fig. 2 is the joining method flow chart that the present invention implements two a kind of wiring boards of providing;
Fig. 3 is the joining method flow chart that the present invention implements three a kind of wiring boards of providing;
Fig. 4 is that the present invention implements five a kind of splicing circuit board structure sketch mapes of providing;
Fig. 5 is that the present invention implements six a kind of splicing circuit board structure sketch mapes of providing.
[embodiment]
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making all other embodiment that obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Embodiment one,
Referring to Fig. 1, for the present invention implements the joining method flow chart of a kind of wiring board that provides, this joining method comprises the steps:
S101: the edge of first wiring board is molded protruding tooth.The edge L1 that for example, first wiring board need be spliced molds protruding tooth with engraving machine.
S102: the edge of second wiring board is molded groove.The edge L2 that for example, second wiring board need be spliced molds groove with engraving machine.
S103: the protruding tooth that adopts adhesive that the S101 step is obtained is embedded in the groove of S102 step acquisition.For example, with the protruding tooth on L1 limit and the groove consistency from top to bottom on L2 limit, make protruding tooth be embedded in the groove.
Wherein, adhesive can be glue.
S104: pressing and dry is carried out at the groove position that is embedded with protruding tooth, obtained the splicing wiring board.In concrete implementation process, can adopt hot press that first wiring board and second wiring board are compressed, heat drying keeps certain hour simultaneously.
In this enforcement, because the first wiring board edge has protruding tooth, the second wiring board edge has groove, so after being embedded in protruding tooth in the groove through adhesive, first wiring board and second wiring board are on same horizontal plane; And the circuit of first wiring board and second wiring board does not change in the process of splicing, so the splicing wiring board of the joining method acquisition that provides of present embodiment is applied on the antenna for base station and can not cause communication interference, can guarantee launching effect.
The foregoing description one has been described a kind of joining method of wiring board, enumerates embodiment below respectively first wiring board and second wiring board are respectively the rigidity wiring board, for example pcb board (Printed Circuit Board, printed circuit board (PCB)); And first wiring board and second wiring board be respectively FPC, for example the joining method during FPC plate (Flexible Printed Circuit Board, flexible printed circuit board) is described.
Embodiment two,
Referring to Fig. 2, for the present invention implements the joining method flow chart of two a kind of wiring boards of providing, the joining method when two pairs first wiring boards of this embodiment and second wiring board are the rigidity wiring board is described, and comprises the steps:
S201: the edge that first wiring board need be spliced molds step-like protruding tooth with engraving machine.
Wherein: the width of protruding tooth and the width of breach are H1; The length of protruding tooth is L; Relation between the height h of protruding tooth and the first wiring board height d is following: h=d/2-x/2, the thickness that is used for coating adhesive of x for reserving.
For example, if the thickness of first wiring board is d, the width of the step-like protruding tooth that engraving molds is identical with the width of breach; Be H1; This H1 is generally 1/5 of the first wiring board overall width, if first wiring board is wide or narrow, then looks protruding the tooth quantity of concrete distribution and decides; The length of protruding tooth (being step) is L; The height h of protruding tooth is d/2-0.025mm, and wherein, 0.025mm is half the for the thickness 0.05mm's that is used for cementing that reserves.
S202: the edge that second wiring board need be spliced molds step-like groove with engraving machine.
Wherein: the relation between the width H2 of groove and the width H1 of protruding tooth is following: H2=H1+x; With groove adjacent protrusion partial width H3=H1-x; The length of groove and the equal in length of protruding tooth; The height of groove equates with the height of protruding tooth.
For example, if the thickness of second wiring board is d, the relation between the width H1 of the step-like protruding tooth that engraving molds among the width H2 of engraving moulding appearance scalariform groove and the step S201 is following: H2=H1+0.05mm; With groove adjacent protrusion partial width H3=H1-0.05mm; The equal in length of the step-like protruding tooth that engraving molds among the length of groove and the step S201 is L; The height of the step-like protruding tooth that engraving molds among the height of groove and the step S201 equates, is d/2-0.025mm.
S203: the surrounded surface of the step-like groove that step-like protruding tooth that obtains at step S201 or step S202 obtain is coated with the adhesive that a layer thickness is x.
The surrounded surface of the step-like groove that for example, obtains at step S202 is coated with the glue that a layer thickness is 0.05mm.
S204: with first wiring board and the second wiring board consistency from top to bottom, the step-like protruding tooth that step S201 is obtained is embedded in the step-like groove of step S202 acquisition.
S205: pressing and dry is carried out at the groove position that is embedded with protruding tooth, obtained the splicing wiring board.
In concrete implementation process, can adopt hot press that first wiring board and second wiring board are compressed, heat drying keeps certain hour simultaneously.
In this enforcement, through making two rigidity wiring boards reach the effect of splicing step-like protruding tooth and step-like groove pressing bonding, spliced two rigidity wiring boards are on same horizontal plane; Increased the area that bonds simultaneously, improved locating accuracy, made rigidity splicing wiring board receive side direction torsion and also be not easy fracture; And the circuit of two rigidity wiring boards does not change in the process of splicing, so the rigidity splicing wiring board that obtains of the joining method that provides of present embodiment is applied on the antenna for base station and can not cause communication interference, can guarantee launching effect.
Embodiment three,
Referring to Fig. 3, for the present invention implements the joining method flow chart of three a kind of wiring boards of providing, the joining method when three pairs first wiring boards of this embodiment and second wiring board are FPC is described, and comprises the steps:
S301: the edge that first wiring board need be spliced molds circular-arc protruding tooth with engraving machine.For example, the shape of protruding tooth is identical with the shape of slide fastener double wedge.
Wherein: the height of circular-arc protruding tooth is identical with the height of first wiring board.
S302: the edge that second wiring board need be spliced molds arc-shaped groove with engraving machine.
For example, the shape of groove is identical with the shape of the recessed tooth of slide fastener.
Wherein, the height of arc-shaped groove equates with the height that the height and the step S301 of second wiring board carve the circular-arc protruding tooth that molds; The shape of the shape of arc-shaped groove and the recessed tooth of slide fastener is similar; Radius+the x of the radius of arc-shaped groove=circular-arc protruding tooth, the thickness that is used for coating adhesive of x for reserving, for example, x=0.05mm.
S303: the edge of the arc-shaped groove that circular-arc protruding tooth that obtains at step S301 or step S302 obtain is coated with layer of adhesive.
For example, the edge of the arc-shaped groove that obtains at step S302 is coated with the glue that a layer thickness is 0.05mm, and the edge scribbles the arc-shaped groove size of glue and the circular-arc protruding tooth equal and opposite in direction of cementing not.
S304: with first wiring board and the second wiring board consistency from top to bottom, the circular-arc protruding tooth that step S301 is obtained is embedded in the arc-shaped groove of step S302 acquisition.
S305: pressing and dry is carried out at the groove position that is embedded with protruding tooth, obtained the splicing wiring board.
In concrete implementation process, can adopt hot press that first wiring board and second wiring board are compressed, heat drying keeps certain hour simultaneously.
In this enforcement, through making two FPCs reach the effect of splicing circular-arc protruding tooth and arc-shaped groove pressing bonding, spliced two FPCs are on same horizontal plane; Because the contact-making surface of protruding tooth and groove is an arc-shaped surface, thereby has increased bond area, two FPCs are inlayed mutually and have been improved locating accuracy and bonding stress; And the circuit of two FPCs does not change in the process of splicing, so the flexibility splicing wiring board that obtains of the joining method that provides of present embodiment is applied on the antenna for base station and can not cause communication interference, can guarantee launching effect.
Adopt the wiring board of the foregoing description splicing,, can further carry out consolidation process the junction according to the needs of working strength.
More than the inventive method embodiment is described, describe down in the face of device embodiment of the present invention.
Embodiment four,
For the present invention implements four a kind of splicing wiring boards of providing, this splicing wiring board comprises:
The edge has first wiring board of protruding tooth; And the edge has second wiring board of groove; Protruding tooth is embedded in the groove through adhesive.
In this enforcement, because the protruding tooth of first wiring board is embedded in through adhesive in the groove of second wiring board, therefore first wiring board and second wiring board are on same horizontal plane; And the circuit of first wiring board and second wiring board does not change, so the splicing wiring board that provides of present embodiment is applied on the antenna for base station and can not cause communication interference, can guarantee launching effect.
The foregoing description four has been described a kind of splicing wiring board, and enumerating embodiment below respectively is rigidity splicing wiring board to the splicing wiring board, and the structural representation of splicing wiring board during for flexible splicing wiring board described.
Embodiment five,
Referring to Fig. 4, for the present invention implements five a kind of splicing circuit board structure sketch mapes of providing, this splicing wiring board is implemented the rigidity splicing wiring board that two methods described obtain for adopting, and comprising:
The edge has first wiring board 401 of step-like protruding tooth 41; The edge has second wiring board 402 of step-like groove 42; Step-like protruding tooth 41 is embedded in the step-like groove 42 through adhesive.
Wherein: the width of step-like protruding tooth 41 is H1 with the width that is adjacent breach; The length of step-like protruding tooth 41 is L; Relation between the height h of step-like protruding tooth 41 and first wiring board, the 401 height d is following: h=d/2-x/2, x are the thickness of adhesive, for example x=0.05mm; Relation between the width H2 of step-like groove 42 and the width H1 of step-like protruding tooth 41 is following: H2=H1+x; With step-like groove 42 adjacent protrusion partial width H3=H1-x; The equal in length of the length of step-like groove 42 and step-like protruding tooth 41; The height of step-like groove 42 equates with the height of step-like protruding tooth 41.
In the present embodiment, because step-like protruding tooth 41 makes first wiring board 401 and second wiring board 402 reach the effect of splicing with step-like groove 42 pressings bonding, spliced first wiring board 401 and second wiring board 402 are on same horizontal plane; Increased the area that bonds simultaneously, improved locating accuracy, made rigidity splicing wiring board receive side direction torsion and also be not easy fracture; And the circuit of first wiring board 401 and second wiring board 402 does not change in the process of splicing, so the rigidity that provides of present embodiment splices wiring board and be applied on the antenna for base station and can not cause communication interference, can guarantee launching effect.
Embodiment six,
Referring to Fig. 5, for the present invention implements six a kind of splicing circuit board structure sketch mapes of providing, this splicing wiring board is implemented the flexibility splicing wiring board that three methods described obtain for adopting, and comprising:
The edge has first wiring board 501 of circular-arc protruding tooth 51; The edge has second wiring board 502 of arc-shaped groove 52; Circular-arc protruding tooth 51 is embedded in the arc-shaped groove 52 through adhesive.
Wherein: the height of arc-shaped groove 52 equates with the height of second wiring board 502 and the height of circular-arc protruding tooth 51; The shape of the shape of arc-shaped groove 52 and the recessed tooth of slide fastener is similar; Radius+the x of the radius of arc-shaped groove=circular-arc protruding tooth, x are the thickness of adhesive, for example, and x=0.05mm.
In this enforcement, because circular-arc protruding tooth 51 makes first wiring board 501 and second wiring board 502 reach the effect of splicing with arc-shaped groove 52 pressings bonding, spliced first wiring board 501 and second wiring board 502 are on same horizontal plane; Because circular-arc protruding tooth 51 is a curved surface with the contact-making surface of arc-shaped groove 52, thereby has increased bond area, two FPCs are inlayed mutually and have been improved locating accuracy and bonding stress; And the circuit of first wiring board 501 and second wiring board 502 does not change in the process of splicing, so the flexibility that provides of present embodiment splices wiring board and be applied on the antenna for base station and can not cause communication interference, can guarantee launching effect.
More than the embodiment of the invention has been carried out detailed introduction, used concrete example among this paper principle of the present invention and execution mode set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. the joining method of a wiring board is characterized in that, said method comprises:
The edge of first wiring board is molded protruding tooth;
The edge of second wiring board is molded groove;
Adopt adhesive that said protruding tooth is embedded in the said groove;
Pressing and dry is carried out at the groove position that is embedded with protruding tooth, obtained the splicing wiring board.
2. method according to claim 1 is characterized in that, the said edge that first wiring board need be spliced molds protruding tooth, specifically comprises:
The edge that first wiring board need be spliced molds step-like protruding tooth;
Wherein: the width of protruding tooth and the width of breach are H1; The length of protruding tooth is L; Relation between the height h of protruding tooth and the first wiring board height d is following: h=d/2-x/2, the thickness that is used for coating adhesive of x for reserving.
3. method according to claim 2 is characterized in that, the said edge that second wiring board need be spliced molds groove, specifically comprises:
The edge that second wiring board need be spliced molds step-like groove;
Wherein: the relation between the width H2 of groove and the width H1 of protruding tooth is following: H2=H1+x; With groove adjacent protrusion partial width H3=H1-x; The length of groove and the equal in length of protruding tooth; The height of groove equates with the height of protruding tooth.
4. method according to claim 3 is characterized in that, said employing adhesive is embedded in said protruding tooth in the said groove, specifically comprises:
Surrounded surface at said step-like protruding tooth or said step-like groove is coated with the adhesive that a layer thickness is x;
With first wiring board and the second wiring board consistency from top to bottom, said step-like protruding tooth is embedded in the said step-like groove.
5. method according to claim 1 is characterized in that, the said edge that first wiring board need be spliced molds protruding tooth, specifically comprises:
The edge that first wiring board need be spliced molds circular-arc protruding tooth.
6. method according to claim 5 is characterized in that, the said edge that second wiring board need be spliced molds groove, specifically comprises:
The edge that second wiring board need be spliced molds arc-shaped groove;
Wherein: the radius+x of the radius of arc-shaped groove=circular-arc protruding tooth, the thickness that is used for coating adhesive of x for reserving.
7. method according to claim 6 is characterized in that, said employing adhesive is embedded in said protruding tooth in the said groove, specifically comprises:
Be coated with the adhesive that a layer thickness is x at the edge of said protruding tooth or groove;
With first wiring board and the second wiring board consistency from top to bottom, said circular-arc protruding tooth is embedded in the said arc-shaped groove.
8. one kind splices wiring board, it is characterized in that said wiring board comprises:
The edge has first wiring board of protruding tooth; And,
The edge has second wiring board of groove;
Said protruding tooth is embedded in the said groove through adhesive.
9. wiring board according to claim 8 is characterized in that, being shaped as of said protruding tooth and groove is step-like;
Wherein: the width of protruding tooth is H1 with the width that is adjacent breach; The length of protruding tooth is L; Relation between the height h of protruding tooth and the first wiring board height d is following: h=d/2-x/2, x are the thickness of adhesive; Relation between the width H2 of groove and the width H1 of protruding tooth is following: H2=H1+x; With groove adjacent protrusion partial width H3=H1-x; The length of groove and the equal in length of protruding tooth; The height of groove equates with the height of protruding tooth.
10. circuit board according to claim 8 is characterized in that, being shaped as of said protruding tooth and groove is circular-arc;
Wherein: the thickness of the radius+adhesive of the radius of groove=protruding tooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110120044.4A CN102781176B (en) | 2011-05-10 | 2011-05-10 | The joining method of wiring board and splicing wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110120044.4A CN102781176B (en) | 2011-05-10 | 2011-05-10 | The joining method of wiring board and splicing wiring board |
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| Publication Number | Publication Date |
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| CN102781176A true CN102781176A (en) | 2012-11-14 |
| CN102781176B CN102781176B (en) | 2015-08-19 |
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| CN201110120044.4A Active CN102781176B (en) | 2011-05-10 | 2011-05-10 | The joining method of wiring board and splicing wiring board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687330A (en) * | 2013-12-03 | 2014-03-26 | 广州杰赛科技股份有限公司 | Large butt-jointed flexible printed circuit board manufacturing method |
| WO2014079220A1 (en) * | 2012-11-22 | 2014-05-30 | Huang Kuo-Hao | Circuit board and wide-angle illumination led lamp |
| WO2015131458A1 (en) * | 2014-03-03 | 2015-09-11 | 深圳市百能信息技术有限公司 | Pcb splicing method and device |
| CN104981100A (en) * | 2015-06-18 | 2015-10-14 | 镇江华印电路板有限公司 | Flexible and rigid combined circuit board |
| WO2015154241A1 (en) * | 2014-04-09 | 2015-10-15 | 魏晓敏 | Printed circuit board |
| CN110561046A (en) * | 2019-09-10 | 2019-12-13 | 常州市瑞昱通信设备制造有限公司 | Substrate of panel antenna and processing method thereof |
| CN112572004A (en) * | 2019-09-30 | 2021-03-30 | 昆山市蓝天印务有限公司 | Production process of decal without membrane label |
| CN113141706A (en) * | 2020-01-17 | 2021-07-20 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN113316871A (en) * | 2018-11-20 | 2021-08-27 | 安费诺商用电子产品(成都)有限公司 | Circuit board for high power applications |
| CN113950204A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102743A (en) * | 1999-09-29 | 2001-04-13 | Oki Electric Ind Co Ltd | Single-piece board surface |
| JP2005243970A (en) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | Complex circuit board |
| CN1767724A (en) * | 2004-10-15 | 2006-05-03 | 李敏宰 | Method of coupling PCB substrate |
| JP2007043213A (en) * | 2006-11-17 | 2007-02-15 | Denso Corp | Connection structure for circuit board |
| CN2914578Y (en) * | 2006-03-02 | 2007-06-20 | 李学霖 | Pinboard assembling and disassembling structure |
| US20090044969A1 (en) * | 2007-07-20 | 2009-02-19 | Nitto Denko Corporation | Wired circuit board and connection structure between wired circuit boards |
-
2011
- 2011-05-10 CN CN201110120044.4A patent/CN102781176B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102743A (en) * | 1999-09-29 | 2001-04-13 | Oki Electric Ind Co Ltd | Single-piece board surface |
| JP2005243970A (en) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | Complex circuit board |
| CN1767724A (en) * | 2004-10-15 | 2006-05-03 | 李敏宰 | Method of coupling PCB substrate |
| CN2914578Y (en) * | 2006-03-02 | 2007-06-20 | 李学霖 | Pinboard assembling and disassembling structure |
| JP2007043213A (en) * | 2006-11-17 | 2007-02-15 | Denso Corp | Connection structure for circuit board |
| US20090044969A1 (en) * | 2007-07-20 | 2009-02-19 | Nitto Denko Corporation | Wired circuit board and connection structure between wired circuit boards |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014079220A1 (en) * | 2012-11-22 | 2014-05-30 | Huang Kuo-Hao | Circuit board and wide-angle illumination led lamp |
| CN103687330A (en) * | 2013-12-03 | 2014-03-26 | 广州杰赛科技股份有限公司 | Large butt-jointed flexible printed circuit board manufacturing method |
| CN103687330B (en) * | 2013-12-03 | 2016-09-28 | 广州杰赛科技股份有限公司 | A kind of manufacture method of large scale butt-joint process flexible printed-circuit board |
| WO2015131458A1 (en) * | 2014-03-03 | 2015-09-11 | 深圳市百能信息技术有限公司 | Pcb splicing method and device |
| WO2015154241A1 (en) * | 2014-04-09 | 2015-10-15 | 魏晓敏 | Printed circuit board |
| CN104981100A (en) * | 2015-06-18 | 2015-10-14 | 镇江华印电路板有限公司 | Flexible and rigid combined circuit board |
| CN113316871A (en) * | 2018-11-20 | 2021-08-27 | 安费诺商用电子产品(成都)有限公司 | Circuit board for high power applications |
| CN113316871B (en) * | 2018-11-20 | 2024-04-02 | 安费诺商用电子产品(成都)有限公司 | Circuit board for high power applications |
| CN110561046A (en) * | 2019-09-10 | 2019-12-13 | 常州市瑞昱通信设备制造有限公司 | Substrate of panel antenna and processing method thereof |
| CN112572004A (en) * | 2019-09-30 | 2021-03-30 | 昆山市蓝天印务有限公司 | Production process of decal without membrane label |
| CN113141706A (en) * | 2020-01-17 | 2021-07-20 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN113950204A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
| CN113950204B (en) * | 2020-07-16 | 2024-04-12 | 深南电路股份有限公司 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
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| CN102781176B (en) | 2015-08-19 |
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