CN206380184U - A kind of splicing construction of wiring board - Google Patents

A kind of splicing construction of wiring board Download PDF

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Publication number
CN206380184U
CN206380184U CN201720038915.0U CN201720038915U CN206380184U CN 206380184 U CN206380184 U CN 206380184U CN 201720038915 U CN201720038915 U CN 201720038915U CN 206380184 U CN206380184 U CN 206380184U
Authority
CN
China
Prior art keywords
groove
projection
wiring board
splicing construction
wavy surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720038915.0U
Other languages
Chinese (zh)
Inventor
黄本顺
李大鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Yuhua Tangxia Circuit Board Co Ltd
Original Assignee
Dongguan Yuhua Tangxia Circuit Board Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Yuhua Tangxia Circuit Board Co Ltd filed Critical Dongguan Yuhua Tangxia Circuit Board Co Ltd
Priority to CN201720038915.0U priority Critical patent/CN206380184U/en
Application granted granted Critical
Publication of CN206380184U publication Critical patent/CN206380184U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

A kind of splicing construction of wiring board, including thickness identical first line plate and the second wiring board, first line plate side is provided with projection, second wiring board side is provided with the groove being mutually matched with projection shape, the thickness of the projection is the half of first line plate thickness, the depth of groove is the half of the second circuit plate thickness, the be involutory surface of installation of groove and projection is equipped with blind hole, the end face of projection is provided with wavy surfaces, corresponding side wall is set to wavy surfaces on groove, the wavy surfaces of projection and the wavy surfaces of groove contact with each other clamp and with 0.1 0.2mm gap.The utility model is easy to operate, and splicing construction is stable, and increases cooling mechanism in stitching portion, improves heat dispersion.

Description

A kind of splicing construction of wiring board
Technical field
The utility model is related to the technical field of wiring board, specifically a kind of splicing construction of wiring board.
Background technology
With the development of scientific and technological level, the communication environment of facing mankind becomes increasingly complex, in order to coordinate different regions Signal transmitting, base station needs increasing big plate antenna as emission source, and the splicing process of wiring board for manufacture more Large-sized antenna provides feasibility.The size-constrained size model that can be processed in process equipment of wiring board of traditional fabrication Enclose, more large-sized wiring board processing needs the process equipment of more large format, thus needs the input of more funds, and uses line Road plate splicing process can not then be limited by equipment and production technology, make large scale wiring board.
In the prior art, connection is carried out by methods such as slot, golden fingers between wiring board.But it is due to wiring board Between do not do jigsaw processing, its working face is it is difficult to ensure that on a horizontal plane, and circuit also there occurs the change in design, If applied to communication interference can be caused on antenna for base station, launching effect is influenceed.
The content of the invention
The technical problems to be solved in the utility model is to provide
In order to solve the above-mentioned technical problem, the utility model takes following technical scheme:
A kind of splicing construction of wiring board, including thickness identical first line plate and the second wiring board, first line plate Side is provided with projection, and the second wiring board side is provided with the groove being mutually matched with projection shape, and the thickness of the projection is first The half of circuit plate thickness, the depth of groove is the half of the second circuit plate thickness, and groove and projection are involutory the surface of installation Blind hole is equipped with, the end face of projection is provided with corresponding side wall on wavy surfaces, groove and is set to wavy surfaces, the wave of projection The wavy surfaces of shape surface and groove contact with each other clamp and with 0.1-0.2mm gap.
The groove is provided with the lower radiating groove for extending to the second wiring board side.
The projection is provided with the upper radiating groove for facing lower radiating groove.
The projection is provided with the upper radiating groove with lower radiating groove intervening portion.
Heat-conducting piece is embedded with the first line plate, the heat-conducting piece one end is extended in lower radiating groove.
The blind hole of the projection of the groove is just to setting.
The projection, which is mounted in blind hole when on groove in groove, is filled with bonding agent.
The utility model splicing is convenient, and stable connection, stitching portion has stronger heat dispersion, and is connect using waveform Contacting surface, increases the deformability of stitching portion, Improving The Quality of Products.
Brief description of the drawings
Accompanying drawing 1 is the utility model decomposing state structural representation.
Embodiment
For the ease of the understanding of those skilled in the art, the utility model will be further described below in conjunction with the accompanying drawings.
As shown in Figure 1, the utility model discloses a kind of splicing construction of wiring board, including thickness identical First Line The wiring board 1 of road plate 7 and second, the side of first line plate 7 is provided with projection 6, and the side of the second wiring board 1 is provided with and the shape phase of projection 6 The groove 2 mutually matched, the thickness of the projection 6 is the half of first line plate thickness 7, and the depth of groove 2 is the second wiring board 1 The be involutory surface of installation of the half of thickness, groove 2 and projection 6 is equipped with blind hole 8, and the end face of projection 6 is provided with wavy surfaces 5, corresponding side wall is set to wavy surfaces 4 on groove 2, and the wavy surfaces of projection and the wavy surfaces of groove contact with each other Clamp and the gap with 0.1-0.2mm.
The groove 2 is provided with the lower radiating groove 3 for extending to the second wiring board side.Projection 6 is lower scattered provided with facing The upper radiating groove 9 of heat channel 3.Or projection is provided with the upper radiating groove with lower radiating groove intervening portion, that is, go up radiating groove and lower scattered Heat channel is shifted to install.
Heat-conducting piece is embedded with first line plate, the heat-conducting piece one end is extended in lower radiating groove, is easy to guide heat Into lower radiating groove, lower radiating groove and the more preferable contact heat-exchanging of outside air.Equally, it can also be embedded in and lead in the second wiring board Warmware, and the heat-conducting piece is extended in upper radiating groove, improve heat dispersion.
The blind hole of the projection of groove is just to setting, and projection is mounted in blind hole when on groove in groove filled with bonding Agent so that first line plate and the second wiring board viscosity when pressing are stronger, are difficult to loosen.
In the utility model, after the projection pressing of first line plate is mounted on the groove of the second wiring board, upper radiating groove It is relative with lower radiating groove to form larger heat-dissipating space.Pass through default filling bonding agent in respective blind hole, it is ensured that adhesive property. Because upper radiating groove and lower radiating groove extend to the side of wiring board, directly exchanged heat with air contact, so as to improve two pieces of lines The heat dispersion of road plate stitching portion.Moreover, the end face of projection and groove flat contact is equipped with into wavy surfaces, reserve simultaneously Gap, it is to avoid spliced wiring board is when bending, and stress is understood in stitching portion first, can now by the reserved gap To play certain deformation buffering, it is to avoid the direct rigid doubling of two pieces of wiring boards.
It should be noted that described above is not the restriction to technical solutions of the utility model, this practicality is not being departed from On the premise of new creation design, any obvious replacement is within protection domain of the present utility model.

Claims (7)

1. a kind of splicing construction of wiring board, including thickness identical first line plate and the second wiring board, first line plate one Side is provided with projection, and the second wiring board side is provided with the groove being mutually matched with projection shape, it is characterised in that the thickness of the projection Spend for the half of first line plate thickness, the depth of groove is the half of the second circuit plate thickness, groove and projection are involutory peace The surface of dress is equipped with blind hole, and the end face of projection is provided with corresponding side wall on wavy surfaces, groove and is set to wavy surfaces, convex The wavy surfaces of block and the wavy surfaces of groove contact with each other clamp and with 0.1-0.2mm gap.
2. the splicing construction of wiring board according to claim 1, it is characterised in that the groove is provided with and extends to second The lower radiating groove of wiring board side.
3. the splicing construction of wiring board according to claim 2, it is characterised in that the projection is lower scattered provided with facing The upper radiating groove of heat channel.
4. the splicing construction of wiring board according to claim 2, it is characterised in that the projection is provided with and lower radiating groove The upper radiating groove of intervening portion.
5. the splicing construction of wiring board according to claim 4, it is characterised in that be embedded with and lead in the first line plate Warmware, the heat-conducting piece one end is extended in lower radiating groove.
6. the splicing construction of wiring board according to claim 5, it is characterised in that the blind hole of the projection of the groove is just right Set.
7. the splicing construction of wiring board according to claim 6, it is characterised in that the projection is recessed when being mounted on groove Bonding agent is filled with blind hole in groove.
CN201720038915.0U 2017-01-13 2017-01-13 A kind of splicing construction of wiring board Expired - Fee Related CN206380184U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720038915.0U CN206380184U (en) 2017-01-13 2017-01-13 A kind of splicing construction of wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720038915.0U CN206380184U (en) 2017-01-13 2017-01-13 A kind of splicing construction of wiring board

Publications (1)

Publication Number Publication Date
CN206380184U true CN206380184U (en) 2017-08-04

Family

ID=59403582

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720038915.0U Expired - Fee Related CN206380184U (en) 2017-01-13 2017-01-13 A kind of splicing construction of wiring board

Country Status (1)

Country Link
CN (1) CN206380184U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113577549A (en) * 2020-04-30 2021-11-02 道鑛有限公司 Health care device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113577549A (en) * 2020-04-30 2021-11-02 道鑛有限公司 Health care device

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170804

Termination date: 20210113

CF01 Termination of patent right due to non-payment of annual fee