CN1767724A

CN1767724A - Method of coupling PCB substrate

Info

Publication number: CN1767724A
Application number: CNA200510113128XA
Authority: CN
Inventors: 李敏宰
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-10-15
Filing date: 2005-10-14
Publication date: 2006-05-03
Also published as: KR20040097018A; KR100642848B1

Abstract

A method is provided to simplify procedures and achieve improved strength of joint and quality of printed circuit board. A method comprises a step of cutting and removing defective printed circuit board from a printed circuit board sheet constituted by a plurality of printed circuit boards, in such a manner that the cut surfaces of the printed circuit board sheet and defective printed circuit board are formed into a three-dimensional shape; and a step of bonding a non-defective printed circuit board to the cut surface of the printed circuit board sheet by using an adhesive, and hardening the resultant structure. The defective printed circuit board is cut from the printed circuit board sheet in such a manner that the cut surfaces of the printed circuit board sheet and defective printed circuit board have stepped portions.

Description

The method of coupling PCB substrate

Related application

The application requires on October 15th, 2004 to be submitted to the priority of the korean patent application No.10-2004-0082840 of Korea S Department of Intellectual Property, is incorporated herein its disclosed full content as a reference.

Technical field

The present invention relates to connect the method for printed circuit board (pcb) substrate, more particularly, the method that relates to a kind of like this coupling PCB substrate, this method with defective PCB when the PCB substrate with a plurality of PCB cuts away, form the step-like cutting surface of defective PCB, and connect high-quality PCB by adhesive being put on this step-like cutting surface.

Background technology

Printed circuit board (pcb) is the plate that comprises the circuit layer that is used to connect electronic component and system.This PCB comprises dielectric plate and wire pattern, this wire pattern by electric conducting material just copper become and be formed on the described plate.

In order to produce PCB in batches, on single large substrates, form a plurality of PCB.This large substrates is called the PCB substrate.When making the PCB substrate, if one of them PCB defectiveness, the whole PCB substrate that then has this defective PCB has just destroyed, even this PCB substrate has comprised a plurality of high-quality PCB.Therefore reduce the productivity ratio of PCB, and increased its manufacturing cost.

In order to overcome this shortcoming, be entitled as the open No.1999-0072847 of Korean Patent of " method and apparatus (Method anddevice for combine of PCB sheet) that engages the PCB substrate ", the open No.2001-0036619 of Korean Patent that is entitled as " method and apparatus that engages the PCB substrate ", the open No.2001-0036620 of Korean Patent that is entitled as " method and apparatus that engages the PCB substrate ", the open No.2001-0036622 of Korean Patent that is entitled as the open No.2001-0036621 of Korean Patent of the method and apparatus of substrate " engage PCB " and is entitled as " method and apparatus that engages the PCB substrate " has introduced the method for various coupling PCB substrates.

Below with reference to Fig. 1 and 2, the method for the coupling PCB substrate that the open No.2001-0036621 of Korean Patent is disclosed is described.

With reference to Fig. 1 and 2, a plurality of PCB are formed on the PCB substrate 4, and this PCB substrate 4 comprises defective PCB2 '.The connecting portion 20 of cutting defective PCB2 ' removes defective PCB2 ' from PCB substrate 4, and forms cutting room 22 to be connected to PCB isolation channel K around the connecting portion 20 of defective PCB2 '.To have connecting portion 20 ' high-quality PCB21 place that defective PCB2 ' is formed to be removed on the position by removing on the PCB substrate 4.That is to say, the PCB clench nail of PCB fixed head 1 is inserted in the corresponding nail joint batter of high-quality PCB21, allow have connecting portion 20 ' high-quality PCB21 insert in the established cutting room 22.Described PCB substrate 4 and high-quality PCB21 are positioned on the PCB fixed head 1 and form as one.In order to prevent any loosening of PCB substrate 4 and high-quality PCB21, between PCB substrate 4 and high-quality PCB21, form space 13, and the adhesive that epoxy resin is made is injected in this space 13.Temperature with about 120-200 ℃ in drying oven is solidified the adhesive that injects.Here, when cure adhesive, cover on the high-quality PCB21, be heated to avoid high-quality PCB21 with lid.After the curing, remove the PCB clench nail, allow PCB substrate 4 break away from PCB fixed head 1 then.

Method according to the coupling PCB substrate of the prior art fixes the PCB substrate that is positioned on the PCB fixed head 1 with heatproof zone 5, to prevent any loosening of PCB substrate.

But, Korean Patent discloses No.2001-0036619, the open No.2001-0036620 of Korean Patent and Korean Patent discloses in the disclosed conventional method of No.2001-003622, the result who cuts away defective PCB from the PCB substrate is that formed cutting Surface Vertical is in the surface of PCB substrate.And, in order to allow high-quality PCB link to the cutting surface of PCB substrate, need extra PCB fixed head and band.Owing to use adhesive to link to the cutting surface that forms perpendicular to the PCB substrate, therefore, between PCB substrate and high-quality PCB, be difficult to obtain suitable bonding force by high-quality PCB.

When the PCB substrate all had defective PCB at its two ends, the above-mentioned shortcoming of conventional method was particularly serious.Defective PCB is removed and high-quality PCB is linked to after the two ends of PCB substrate, the weight of the high-quality PCB of connection can make the PCB curved substrate.The weakened connecting portion of high-quality PCB of the bending of PCB substrate.Particularly when PCB is extremely thin, for example be used for the PCB of ball grid array (BGA) encapsulation, more be difficult to suitable bonding force high-quality PCB is linked on the PCB substrate.Described BGA encapsulation requires extremely thin PCB, and is various very light, little and have multi-functional electronic component and a communication device to be used for.

Summary of the invention

Therefore, the method that the purpose of this invention is to provide improved coupling PCB substrate, this method with defective PCB when the PCB substrate with a plurality of PCB cuts away, the step-like cutting that forms defective PCB is surperficial, then adhesive is applied on the described cutting surface with step to connect high-quality PCB.

One aspect of the present invention provides the method for a kind of coupling PCB (printed circuit board) substrate, and this method comprises: defective PCB when the PCB substrate with a plurality of PCB cuts away, is all formed step-like cutting surface on PCB substrate and defective PCB; And the three-dimensional cutting surface by adhesive being put on the PCB substrate and solidify this adhesive, high-quality PCB is linked on the step-like cutting surface of PCB substrate.Here, described step-like cutting surface can be a 3D shape, and for example step and zigzag, rather than two-dimensional shapes are for example formed according to the method for prior art coupling PCB substrate, perpendicular to the cutting surface of PCB substrate surface.

Described high-quality PCB can have the corresponding step-like cutting surface, step-like cutting surface with the PCB substrate.

Can adopt computer numerical control (CNC) router (CNC router) to cut away defective PCB from the PCB substrate.

The connection of high-quality PCB can comprise: insert in the hole that forms on the PCB substrate by following closely, the PCB substrate is fixed on the PCB fixed head with at least one nail; After applying adhesive to the cutting surface of described PCB substrate, make the cutting surface adhesion of high-quality PCB and be pressed on the correspondence cutting surface of this PCB substrate; And the adhesive curing between the cutting surface of the cutting surface that makes described PCB substrate and high-quality PCB.

Description of drawings

Specify exemplary embodiment below in conjunction with accompanying drawing, with further understanding above-mentioned and other feature and advantage of the present invention.In the accompanying drawing:

Fig. 1 is the stereogram with PCB substrate of defective PCB and high-quality PCB, is used to illustrate the method according to the prior art coupling PCB substrate;

Fig. 2 is the zoomed-in view of the connecting portion of high-quality PCB, is used to illustrate the method according to the prior art coupling PCB substrate;

Fig. 3 is the stereogram with PCB substrate of a plurality of PCB, is used to illustrate the method according to the coupling PCB substrate of the embodiment of the invention;

Fig. 4 is the stereogram according to the connecting portion of the PCB substrate of the embodiment of the invention;

Fig. 5 A is the profile according to the connecting portion of prior art between PCB substrate and high-quality PCB; And

Fig. 5 B is the profile according to the connecting portion of the present invention between PCB substrate and high-quality PCB.

Embodiment

With reference to the accompanying drawings, illustrate in greater detail the method for coupling PCB substrate.

Fig. 3 is the stereogram with PCB substrate of a plurality of PCB, is used to illustrate the method according to the coupling PCB substrate of the embodiment of the invention, and Fig. 4 is the stereogram according to the connecting portion of the PCB substrate of the embodiment of the invention.

With reference to Fig. 3 and 4, comprise cutting operation and connection operation according to the method for the coupling PCB substrate of present embodiment.

In cutting operation, defective printed circuit board (pcb) is cut away from printed circuit board (pcb) substrate 100.Here, described PCB substrate 100 refers to the substrate of arranging on it and having connect a plurality of PCB.

Before the step that electronic component is installed, can in a unit of PCB substrate 100, carry out clamping and fixing (jig and fixture) step to detect described defective PCB.

The following describes the method according to the coupling PCB substrate of present embodiment, wherein, PCB substrate 100 comprises defective PCB110 at its right-hand member.

Defective PCB110 is cut away and removes from PCB substrate 100.In the present embodiment, cutting defective PCB110 forms step with the cutting surface at PCB substrate 100.That is, the result who cuts away defective PCB110 from PCB substrate 100 has formed step-like cutting surface.

In the conventional method of coupling PCB substrate, formed cutting Surface Vertical does not have difference in the PCB substrate surface between the top and bottom on this cutting surface.

But according to the method for present embodiment, formed cutting surface has step on PCB substrate 100 and defective PCB110.Therefore, described cutting surface is divided into cutting surface, top and cutting surface, bottom, and the surperficial broadening of described cutting is the same with the surface of described step wide.

In the present embodiment, the cutting surface of PCB substrate 100 is cutting surfaces, top 102 and 104, and the cutting surface of defective PCB110 or high-quality PCB120 is cutting surface, bottom 122 and 124.

Can adopt the cutting machine (not shown) to cut defective PCB.Particularly, preferably adopt computer numerical control (CNC) (CNC) router to carry out cutting operation, described computer numerical control (CNC) router drives cutting machine by computer based automatically in numeral that is provided and information.

PCB substrate 100 can comprise a plurality of holes 106, to determine the position of PCB substrate.When carrying out clamping test and use high-quality PCB120 to replace defective PCB110, described a plurality of holes 106 are used for determining the position of PCB substrate, stably to carry out test operation and connection operation.

In connection operation, remove after the defective PCB110, adhesive 130 is applied on the cutting surface of PCB substrate, and high-quality PCB120 is linked on the cutting surface of PCB substrate.Described connection operation can comprise fixing operation, adhere to operation and curing operation.

High-quality PCB120 is that to be confirmed to be in aforementioned clamping and fixation procedure be the PCB of normal operation.This high-quality PCB120 comprises the cutting surface that has with the corresponding step in the cutting of PCB substrate 100 surface.

Therefore, described high-quality PCB120 also has broadening must the same wide cutting surface with described ledge surface, and the broadening cutting surface adhesion of described high-quality PCB120 is on the corresponding step-like cutting surface of PCB substrate 100.Consequently, compared with prior art, described high-quality PCB120 is the same wide with described step-like cutting surface with adhesive surface broadening between the PCB substrate 100.

In fixing operation, after PCB substrate 100 removes defective PCB110, high-quality PCB120 and PCB substrate 100 are located and be fixed on the PCB fixed head 200.

At coupling PCB substrate 100 during with high-quality PCB120, PCB fixed head 200 is fixedly high-quality PCB120 and PCB substrate 100 firmly.Described PCB fixed head can comprise a plurality of nails 202, and these nails are inserted in the hole 106 of PCB substrate 100.

Compared with prior art, because high-quality PCB120 has and the corresponding step-like cutting in the step-like cutting of PCB substrate 100 surface is surperficial, can allow high-quality PCB120 locate at an easy rate and be linked on the PCB substrate 100.

In adhering to operation, adhesive is coated on the step-like cutting surface of high-quality PCB120 and PCB substrate 100, compress then and connect high-quality PCB120 and PCB substrate 100.

The epoxy resin that preferred employing does not contain volatile substances and has a less deformation behaviour is as adhesive.That is to say that described adhesive should be not easy to along with heat treatment process expands or contraction.And, can add curing agent so that high-quality PCB120 and PCB substrate 100 connect securely thermal deformation does not take place.

In the conventional method of coupling PCB substrate, space 13 shown in Figure 2 forms between PCB substrate and high-quality PCB, has predetermined spacing with the injection adhesive, and, need to use band, leak with the adhesive that prevents to inject.These spaces 13 and band are unwanted in the present embodiment, and this is because adhesive 130 directly is coated on the step-like cutting surface of high-quality PCB120 and PCB substrate 100.Therefore, simplified connection operation and reduced manufacturing cost.

In curing operation, the lip-deep adhesive of the step-like cutting that is coated in PCB substrate 100 and high-quality PCB120 is solidified, connection operation is all finished then.

The curing of adhesive 130 can continue to realize in 1 to 4 hour under about 130-190 ℃ temperature.Here, can use cap covers high-quality PCB120 and PCB substrate 100, be subjected to the influence of curing operation to avoid them.

As mentioned above, compare with conventional method, the method for coupling PCB substrate of the present invention has been simplified the connection process, and has strengthened the connecting forces between high-quality PCB and the PCB substrate.

Explanation is compared with conventional method in more detail below, according to the connecting forces enhancing of present embodiment.

Fig. 5 A is the profile according to the connecting portion of prior art between PCB substrate and high-quality PCB, and Fig. 5 B is the profile according to the connecting portion of the present invention between PCB substrate and high-quality PCB.

With reference to Fig. 5 A, the cutting surface that cutting operation makes the PCB substrate and the cutting Surface Vertical of high-quality PCB form in the surface of PCB substrate.And, adopt adhesive to come coupling PCB substrate and high-quality PCB.

Therefore, be difficult to obtain suitable bonding force and keep the connection state between PCB substrate and the high-quality PCB.Particularly include under the situation of a plurality of defective PCB at the two ends of PCB substrate, more be difficult to obtain suitable bonding force and keep the connection state, this be because, have PCB substrate bending owing to the own wt of the high-quality PCB that is connect of high-quality PCB, the connection state between PCB substrate and the high-quality PCB can wreck.

With reference to Fig. 5 B, by the step-like cutting surface of adhesive coupling PCB substrate and the corresponding step-like cutting surface of high-quality PCB.Shown in Fig. 5 B, the PCB substrate is the same wide with described step-like cutting surface with the surperficial broadening of the connection between the high-quality PCB.

Therefore,,, for example be not only and be used for BGA encapsulation but also can be the PCB that is used for FPC, also can obtain and keep bonding force fully even the PCB substrate is extremely thin according to present embodiment.Further, even when the two ends of PCB substrate include a plurality of defective PCB, also can obtain and keep suitable bonding force effectively.

As mentioned above,, cut away defective PCB from the PCB substrate according to the method for coupling PCB substrate of the present invention, surperficial with the step-like cutting that forms the PCB substrate, and the employing adhesive connects the high-quality PCB with corresponding step-like cutting surface.Therefore, simplified manufacturing process and strengthened the bonding force at connecting portion place.

Although specifically illustrate and illustrated the present invention with reference to exemplary embodiment, be understandable that, those of ordinary skill in the art can to the present invention do on the various forms and details on modification, and spirit and scope that do not deviate from claim of the present invention and limited.

Claims

1. the method for a coupling PCB substrate, this method comprises:

When with defective PCB when the PCB substrate with a plurality of PCB cuts away, on described PCB substrate and defective PCB, all form three-dimensional cutting surface; And

Cut the surface and, high-quality PCB is linked on the three-dimensional cutting surface of this PCB substrate by the three-dimensional that adhesive is put on described PCB substrate its curing.

2. the method for claim 1, wherein in the process that forms three-dimensional cutting surface, when with defective PCB when the PCB substrate cuts away, it is surperficial to form step-like cutting on described defective PCB and PCB substrate.

3. method as claimed in claim 2, wherein, described high-quality PCB has the corresponding step-like cutting surface, step-like cutting surface with the PCB substrate.

4. the method for claim 1, wherein described PCB substrate comprises at least one hole, to determine the position of PCB substrate.

5. the method for claim 1, wherein in the process of cutting away defective PCB, adopted the computer numerical control (CNC) router.

6. method as claimed in claim 4, wherein, the connection of described high-quality PCB comprises:

By nail is inserted in the hole of PCB substrate, the PCB substrate is fixed on the PCB fixed head with at least one nail;

Adhesive is coated on the cutting surface of this PCB substrate, makes the cutting surface adhesion of high-quality PCB and be pressed on the correspondence cutting surface of described PCB substrate; And

Adhesive curing between the cutting surface that makes described PCB substrate and the cutting surface of described high-quality PCB.