JP2001177224A - Microwave circuit substrate and manufacturing method - Google Patents
Microwave circuit substrate and manufacturing methodInfo
- Publication number
- JP2001177224A JP2001177224A JP35971499A JP35971499A JP2001177224A JP 2001177224 A JP2001177224 A JP 2001177224A JP 35971499 A JP35971499 A JP 35971499A JP 35971499 A JP35971499 A JP 35971499A JP 2001177224 A JP2001177224 A JP 2001177224A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- resin
- substrate
- dimensional
- dimensional circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、実装部品が内蔵さ
れ、所定形状に折曲された立体回路基板及びその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional circuit board having a built-in component and bent into a predetermined shape, and a method of manufacturing the same.
【0002】[0002]
【従来の技術】近年、回路配線基板として所望の3次元
形状に形成された立体回路基板が提案されている。従来
の立体回路基板としては例えば次のようなものが知られ
ている。2. Description of the Related Art In recent years, a three-dimensional circuit board formed in a desired three-dimensional shape has been proposed as a circuit wiring board. For example, the following three-dimensional circuit boards are known as conventional three-dimensional circuit boards.
【0003】(i)樹脂による基板成形後に銅の無電解
メッキを施し、これをエッチングして回路パターンを形
成して成る立体回路基板(特開平9−266368号公
報参照)。 (ii)銅箔を予め立体成形し、この予備成形した銅箔と
基板となる必要枚数のプリプレグシートとを、成形金型
で同時に加熱加圧して成形を行って構成した立体回路基
板(特開平9−266368号公報参照)。 (iii) 立体基板の表面に金属導電膜を設け、この金属導
電膜をレーザ光により選択的に除去して回路パターンを
形成するようにして構成した立体回路基板(特開平8−
148803号公報参照)。 これらの立体回路基板では、完成後の立体回路基板上に
実装部品、いわゆる電子部品が実装されるようになされ
る。(I) A three-dimensional circuit board formed by forming a circuit pattern by subjecting copper to electroless plating after forming the board with a resin and etching the electroless plating (see JP-A-9-266368). (Ii) A three-dimensional circuit board formed by three-dimensionally forming a copper foil in advance, and simultaneously forming the preformed copper foil and a required number of prepreg sheets by heating and pressing with a forming die. 9-266368). (iii) A three-dimensional circuit board formed by providing a metal conductive film on the surface of a three-dimensional substrate and selectively removing the metal conductive film with a laser beam to form a circuit pattern (Japanese Unexamined Patent Publication No.
148803). In these three-dimensional circuit boards, mounted components, so-called electronic components, are mounted on the completed three-dimensional circuit board.
【0004】[0004]
【発明が解決しようとする課題】ところで、上述した従
来の立体回路基板においては、(i)〜(iii) のいずれ
の場合も、立体回路基板を形成した後に、電子部品を実
装することになるため、段差等の影響で電子部品の実装
が難しく、実装作業性を悪くしていた。In the above-mentioned conventional three-dimensional circuit board, in any of the cases (i) to (iii), electronic components are mounted after the three-dimensional circuit board is formed. Therefore, it is difficult to mount the electronic components due to the influence of steps or the like, and the mounting workability is deteriorated.
【0005】また、上記(i)の立体回路基板では、回
路パターンの形成が銅メッキ及び選択エッチングを用い
て行われるので、製作工程が多くなると共に、銅メッキ
工程においてメッキ設備、廃液処理が必要であった。上
記(ii)の立体回路基板では、複数枚のプリプレグシー
トを必要としこの複数枚の積層したプリプレグシートと
予め折曲した銅箔を成形金型で加熱、加圧して成形し、
その後、銅箔を選択エッチングして回路パターンを形成
して作られるが、製作工程が煩雑であった。上記(iii)
の立体回路基板では、回路パターンをレーザ光を用いて
形成するので、大掛りな製造設備を必要とするものであ
った。さらに、立体回路基板の製造において、平面基板
を直接立体基板にするのは困難であった。In the three-dimensional circuit board (i), since the circuit pattern is formed by using copper plating and selective etching, the number of manufacturing steps is increased, and plating equipment and waste liquid treatment are required in the copper plating step. Met. In the three-dimensional circuit board of the above (ii), a plurality of prepreg sheets are required, and the plurality of laminated prepreg sheets and the pre-bent copper foil are molded by heating and pressing with a molding die,
Thereafter, the circuit pattern is formed by selectively etching the copper foil to form a circuit pattern, but the manufacturing process is complicated. (Iii) above
In the three-dimensional circuit board, since a circuit pattern is formed by using a laser beam, large-scale manufacturing equipment is required. Further, in manufacturing a three-dimensional circuit board, it has been difficult to directly convert a flat board into a three-dimensional board.
【0006】本発明は、上述の点に鑑み、所定の立体形
状に形成できると共に、実装部品の保護を可能にし、且
つ製造の容易化を図った立体回路基板及びその製造方法
を提供するものである。SUMMARY OF THE INVENTION In view of the above, the present invention provides a three-dimensional circuit board which can be formed into a predetermined three-dimensional shape, protects mounted components, and facilitates manufacturing, and a method of manufacturing the same. is there.
【0007】[0007]
【課題を解決するための手段】本発明に係る立体回路基
板は、所定形状に折り曲げられた樹脂基板内に、回路パ
ターンに接続された実装部品が埋め込まれ、回路パター
ンが樹脂基板の一方の面に臨むようにした構成とする。In the three-dimensional circuit board according to the present invention, a mounting component connected to a circuit pattern is embedded in a resin board bent into a predetermined shape, and the circuit pattern is formed on one surface of the resin board. The configuration is such that it faces.
【0008】本発明の立体回路基板においては、実装部
品が回路パターンに実装された状態でモールド樹脂によ
る所定形状に折り曲げられた樹脂基板内に埋め込まれて
いるので、実装部品が樹脂基板により保護されると共
に、立体回路基板として構成された時点で既に実装部品
の実装が完了しており、種々の立体形状が可能となる。In the three-dimensional circuit board of the present invention, since the mounted components are embedded in the resin substrate bent into a predetermined shape by the mold resin while being mounted on the circuit pattern, the mounted components are protected by the resin substrate. In addition, the mounting of the mounted components has already been completed at the time of being configured as a three-dimensional circuit board, and various three-dimensional shapes are possible.
【0009】本発明に係る立体回路基板の製造方法は、
絶縁シート上に形成された回路パターンに実装部品を実
装し、所定形状に折り曲げられた剛性基板上にこの所定
形状に沿って実装部品が実装された絶縁シートを貼着
し、実装部品を埋め込むように剛性基板の形状に沿って
樹脂モールドする。A method for manufacturing a three-dimensional circuit board according to the present invention comprises:
The mounting component is mounted on the circuit pattern formed on the insulating sheet, and the insulating sheet on which the mounting component is mounted along the predetermined shape is stuck on a rigid substrate bent into a predetermined shape, and the mounting component is embedded. Then, resin molding is performed along the shape of the rigid substrate.
【0010】本発明の立体回路基板の製造方法において
は、回路パターンが形成された絶縁シートに対して平面
状態で実装部品を実装するので、実装作業が容易に行え
る。所定形状に折り曲げられた剛性基板上にこの所定形
状に沿って絶縁シートを貼着した後、実装部品を埋め込
むように剛性基板の形状に沿って樹脂モールドするの
で、所定形状に折曲された立体回路基板を容易に製造す
ることができる。実装部品は、樹脂モールドで埋め込ま
れるので、立体回路基板の製造終了と同時に保護され
る。In the method of manufacturing a three-dimensional circuit board according to the present invention, since the mounted components are mounted in a planar state on the insulating sheet on which the circuit pattern is formed, the mounting operation can be easily performed. After the insulating sheet is adhered along the predetermined shape on the rigid substrate bent into the predetermined shape, and then resin molded along the shape of the rigid substrate so as to embed the mounted components, the three-dimensional shape bent into the predetermined shape is used. The circuit board can be easily manufactured. Since the mounted components are embedded in the resin mold, they are protected at the same time when the production of the three-dimensional circuit board is completed.
【0011】[0011]
【発明の実施の形態】本発明に係る立体回路基板は所定
形状に折り曲げられた樹脂基板内に、回路パターンに接
続された実装部品が埋め込まれ、回路パターンが樹脂基
板の一方の面に臨んだ構成とする。DESCRIPTION OF THE PREFERRED EMBODIMENTS In a three-dimensional circuit board according to the present invention, mounted components connected to a circuit pattern are embedded in a resin board bent into a predetermined shape, and the circuit pattern faces one surface of the resin board. Configuration.
【0012】本発明に係る立体回路基板の製造方法は、
絶縁シート上に形成された回路パターンに実装部品を実
装する工程と、所定形状に折り曲げられた剛性基板上に
この所定形状に沿って実装部品が実装された絶縁シート
を貼着する工程と、実装部品を埋め込むように剛性基板
の所定形状に沿って樹脂モールドする工程を有する。本
発明は、さらにこの樹脂モールド後に、樹脂モールドに
よる基板より剛性基板及び絶縁シートを剥離する工程を
有する。[0012] The method for manufacturing a three-dimensional circuit board according to the present invention comprises:
A step of mounting the mounted components on a circuit pattern formed on the insulating sheet, a step of attaching an insulating sheet on which the mounted components are mounted along the predetermined shape to a rigid substrate bent into a predetermined shape, and a step of mounting. A step of resin molding along a predetermined shape of the rigid substrate so as to embed the component. The present invention further includes a step of removing the rigid substrate and the insulating sheet from the resin-molded substrate after the resin molding.
【0013】以下、図1及び図2を参照して本発明によ
る立体回路基板及びその製造方法の一実施の形態を説明
する。Hereinafter, an embodiment of a three-dimensional circuit board and a method of manufacturing the same according to the present invention will be described with reference to FIGS.
【0014】本実施の形態においては、先ず、図1Aに
示すように、柔軟性を有する絶縁シート、例えばポリエ
ステル系等による樹脂シート1を用意し、この樹脂シー
ト1の一方の面上に、例えば印刷によって導電性接着剤
による所定の回路パターン2を被着形成する。導電性接
着剤は、例えば熱硬化性樹脂に導電粒子、例えばCu粒
子、Ag粒子あるいはCu粒子の表面をAg膜で被覆し
た粒子等を分散して構成することができる。In this embodiment, first, as shown in FIG. 1A, a flexible insulating sheet, for example, a resin sheet 1 made of polyester or the like is prepared, and for example, on one surface of the resin sheet 1, for example, A predetermined circuit pattern 2 is formed by applying a conductive adhesive by printing. The conductive adhesive can be formed by, for example, dispersing conductive particles, for example, Cu particles, Ag particles, or particles obtained by coating the surfaces of Cu particles with an Ag film, on a thermosetting resin.
【0015】次に、図1Bに示すように、樹脂シート1
の表面に形成された硬化される前の回路パターン2上に
実装部品、いわゆる電子部品(例えばリードレス部品、
リードを有するIC部品等)3を実装する。この場合、
電子部品3をその端子部分4あるいはリード部分5か回
路パターン2上に接触するように載置する。この電子部
品3の実装は、樹脂シート1が平面の状態で行われる。Next, as shown in FIG.
Components, so-called electronic components (for example, leadless components,
3) are mounted. in this case,
The electronic component 3 is placed so as to be in contact with the terminal portion 4 or the lead portion 5 or the circuit pattern 2. The mounting of the electronic component 3 is performed in a state where the resin sheet 1 is flat.
【0016】次に、図1Cに示すように、回路パターン
2である導電性接着剤を加熱して硬化させる。この加熱
硬化処理によって、回路パターン2が硬化されると共
に、各電子部品3が回路パターン2に電気的且つ機械的
に接続される。Next, as shown in FIG. 1C, the conductive adhesive as the circuit pattern 2 is cured by heating. By this heat curing treatment, the circuit pattern 2 is cured, and each electronic component 3 is electrically and mechanically connected to the circuit pattern 2.
【0017】次に、図1Dに示すように、折り曲げ加
工、成形等により所定の折曲形状をなす剛性基板6を用
意し、この剛性基板6の一面上に、接着剤7を介して電
子部品3を実装した絶縁シート1をその裏面が剛性基板
6側に向くようにして貼着する。絶縁シート1は、柔軟
性を有するために、剛性基板6の折り曲げ形状に沿って
貼着される。剛性基板6としては、例えばAl基板のよ
うな金属基板、硬度の大きい樹脂基板等を用いることが
でき、少なくとも、後工程の樹脂モールドにおいて形状
が変形せずに耐えられ、且つ樹脂モールド後に剥離可能
な性質を有する剛性基板であればよい。Next, as shown in FIG. 1D, a rigid substrate 6 having a predetermined bent shape is prepared by bending, molding or the like, and an electronic component is placed on one surface of the rigid substrate 6 with an adhesive 7 interposed therebetween. The insulating sheet 1 on which the substrate 3 is mounted is attached so that the back surface faces the rigid substrate 6 side. The insulating sheet 1 is adhered along the bent shape of the rigid substrate 6 to have flexibility. As the rigid substrate 6, for example, a metal substrate such as an Al substrate, a resin substrate having high hardness, or the like can be used. At least, the resin substrate in a later step can withstand without deformation in shape and can be peeled off after the resin molding. Rigid substrates having various properties may be used.
【0018】次に、図2Eに示すように、電子部品3を
実装した絶縁シート1を折り曲げ形状の剛性基板6に貼
着してなる折曲構体8を枠治具(例えば射出成形金型
等)9に配置し、樹脂10を埋め込む。すなわち、樹脂
モールドを行う。Next, as shown in FIG. 2E, a bent structure 8 formed by attaching the insulating sheet 1 on which the electronic components 3 are mounted to a bent rigid substrate 6 is attached to a frame jig (for example, an injection mold or the like). ) 9 and resin 10 is embedded. That is, resin molding is performed.
【0019】次に、樹脂10が硬化した後、図2Fに示
すように、枠治具9から樹脂モールドされた折曲体、い
わゆる樹脂モールド折曲構体11を取り出す。Next, after the resin 10 is cured, as shown in FIG. 2F, a bent body molded with resin, that is, a so-called resin molded bent structure 11 is taken out from the frame jig 9.
【0020】次いで、図2Gに示すように、樹脂モール
ド折曲構体11から樹脂シート1と共に剛性基板6を剥
離する。これによって、剛性基板6の折曲形状に沿って
形成された樹脂モールドによる樹脂基板13内に電子部
品3が埋め込まれ、かつ電子部品3に接続する回路パタ
ーン2が樹脂基板13の一面に露出するように形成され
て成る本実施の形態に係る立体回路基板12が完成され
る。Next, as shown in FIG. 2G, the rigid substrate 6 is peeled off together with the resin sheet 1 from the resin mold bent structure 11. As a result, the electronic component 3 is embedded in the resin substrate 13 formed by the resin mold formed along the bent shape of the rigid substrate 6, and the circuit pattern 2 connected to the electronic component 3 is exposed on one surface of the resin substrate 13. The three-dimensional circuit board 12 according to the present embodiment thus formed is completed.
【0021】本実施の形態によれば、剛性基板6の折曲
形状を選ぶことにより、各種形状の電子機器ケースに合
わせた立体回路基板12を作製することができる。全体
の立体形状が樹脂モールドによる樹脂基板13によって
維持されるので、ねじ、リブ等構成品を必要とすること
なく、所定の立体形状の回路基板が容易に得られる。According to the present embodiment, by selecting the bent shape of the rigid substrate 6, it is possible to manufacture the three-dimensional circuit board 12 adapted to electronic device cases of various shapes. Since the entire three-dimensional shape is maintained by the resin substrate 13 formed of the resin mold, a circuit board having a predetermined three-dimensional shape can be easily obtained without requiring components such as screws and ribs.
【0022】本実施の形態の立体回路基板12において
は、各電子部品3が樹脂基板13内に埋め込まれて保護
されているので、電子部品3が壊れにくいものである。
電子部品3の実装を絶縁シート1が平面な状態で行うこ
とができるので、実装作業が容易になる。本実施の形態
では、簡易な製造設備で容易に立体回路基板12を製造
することができる。In the three-dimensional circuit board 12 of the present embodiment, since each electronic component 3 is embedded in the resin substrate 13 and protected, the electronic component 3 is hardly broken.
Since the mounting of the electronic component 3 can be performed with the insulating sheet 1 being flat, the mounting operation is facilitated. In the present embodiment, the three-dimensional circuit board 12 can be easily manufactured with simple manufacturing equipment.
【0023】本実施の形態の立体回路基板12は、機械
部品、他の基板との組み合せで省スペースの回路基板を
構成することができる。The three-dimensional circuit board 12 of this embodiment can form a space-saving circuit board in combination with mechanical parts and other boards.
【0024】なお、上述の図2Gの工程で立体回路基板
12を作製した後、必要に応じて、外部に露出する回路
パターン2を端子部分を除いて、保護するような絶縁フ
ィルム、絶縁コート膜等を立体回路基板12の表面に形
成するようにしてもよい。After the three-dimensional circuit board 12 is manufactured in the process shown in FIG. 2G, if necessary, an insulating film and an insulating coat film for protecting the circuit pattern 2 exposed to the outside except for the terminal portions. May be formed on the surface of the three-dimensional circuit board 12.
【0025】本発明の他の実施の形態としては、図2F
の工程で得られる剛性基板6が貼着された状態の折曲構
成体11をそのまま立体回路基板に用いるようにするこ
とも可能である。この場合は、適当な手段によって、回
路パターン2の端子部分を外部に露出させるようにす
る。このような立体回路基板によれば、剛性基板6を補
強部材として機能をさせることができる。また剛性基板
6を金属基板で形成してここを接地電位とすれば、電子
部品3及びこれを含む回路に対するシールド機能をもた
せることができる。FIG. 2F shows another embodiment of the present invention.
It is also possible to use the bent structure 11 to which the rigid substrate 6 obtained in the step is attached as it is for a three-dimensional circuit board. In this case, the terminal portion of the circuit pattern 2 is exposed to the outside by appropriate means. According to such a three-dimensional circuit board, the rigid board 6 can function as a reinforcing member. If the rigid substrate 6 is formed of a metal substrate and is set at the ground potential, the electronic component 3 and a circuit including the same can be provided with a shielding function.
【0026】[0026]
【発明の効果】本発明に係る立体回路基板によれば、ね
じ、リブ等の構成部品を有さない自由な形状の立体回路
基板を構成できる。各種形状の電子機器ケースに合せた
立体回路基板を構成することができる。According to the three-dimensional circuit board of the present invention, it is possible to form a three-dimensional circuit board of a free shape having no components such as screws and ribs. A three-dimensional circuit board adapted to electronic device cases of various shapes can be configured.
【0027】実装部品が既に実装されて埋め込まれた状
態で立体回路基板が構成されているので、機械部品、他
基板との組み合せで省スペースの立体回路基板が得られ
る。実装部品は樹脂基板内に埋め込まれて保護されてい
るので、破損しにくく、信頼性の高い立体回路基板が得
られる。Since the three-dimensional circuit board is configured with the mounted components already mounted and embedded, a space-saving three-dimensional circuit board can be obtained in combination with mechanical parts and other substrates. Since the mounted components are protected by being embedded in the resin substrate, a three-dimensional circuit board having high reliability and being hardly damaged can be obtained.
【0028】本実施の形態に係る立体回路基板の製造方
法によれば、ねじ、リブ等の構成部品を用いることな
く、一体構造の立体回路基板を容易に製造することがで
きる。回路パターンの形成に際してレーザ光、エッチン
グ等によるパターニング工程が不要であり、製造工程を
簡単化できる。製造設備も大掛かりとならず、廃液処理
の必要もない。According to the method for manufacturing a three-dimensional circuit board according to the present embodiment, a three-dimensional circuit board having an integral structure can be easily manufactured without using components such as screws and ribs. In forming the circuit pattern, a patterning step by laser light, etching, or the like is not required, and the manufacturing process can be simplified. The manufacturing equipment is not large and there is no need for waste liquid treatment.
【0029】剛性基板の形状を選ぶことにより、各種形
状の電子機器ケースに合せた立体回路基板を製造するこ
とができる。By selecting the shape of the rigid board, it is possible to manufacture a three-dimensional circuit board suitable for electronic device cases of various shapes.
【0030】樹脂モールドで実装部品が埋め込まれるの
で、実装部品の保護ができ、実装部品が破損しにくい高
信頼性のある立体回路基板を製造できる。実装部品の実
装は、絶縁シートが平面の状態で行われるので、部品実
装を容易且つ確実に行うことができる。Since the mounted components are embedded in the resin mold, the mounted components can be protected, and a three-dimensional circuit board with high reliability in which the mounted components are hardly damaged can be manufactured. Since mounting of the mounted components is performed in a state where the insulating sheet is flat, component mounting can be performed easily and reliably.
【図1】A〜D 本発明に係る立体回路基板の製造方法
の一実施の形態を示す製造工程図(その1)である。1A to 1D are manufacturing process diagrams (part 1) illustrating one embodiment of a method for manufacturing a three-dimensional circuit board according to the present invention.
【図2】E〜G 本発明に係る立体回路基板の製造方法
の一実施の形態を示す製造工程図(その2)である。2A to 2G are manufacturing process diagrams (part 2) illustrating one embodiment of a method of manufacturing a three-dimensional circuit board according to the present invention.
1‥‥絶縁シート、2‥‥導電接着剤による回路パター
ン、3‥‥電子部品、4‥‥端子部分、5‥‥リード部
分、6‥‥剛性基板、7‥‥接着剤、8‥‥折曲構体、
9‥‥枠治具、10‥‥樹脂、11‥‥樹脂モールド構
体、12‥‥立体回路基板、13‥‥樹脂基板1} Insulation sheet, 2} Circuit pattern with conductive adhesive, 3} Electronic components, 4} Terminal part, 5} Lead part, 6} Rigid board, 7} Adhesive, 8% folding Song structure,
9 mm frame jig, 10 mm resin, 11 mm resin mold structure, 12 mm three-dimensional circuit board, 13 mm resin board
Claims (3)
に、回路パターンに接続された実装部品が埋め込まれ、 前記回路パターンが前記樹脂基板の一方の面に臨んで成
ることを特徴とする立体回路基板。1. A three-dimensional circuit, wherein a mounting component connected to a circuit pattern is embedded in a resin substrate bent into a predetermined shape, and the circuit pattern faces one surface of the resin substrate. substrate.
に実装部品を実装する工程と、 所定形状に折り曲げられた剛性基板上に該形状に沿って
前記実装部品が実装された絶縁シートを貼着する工程
と、 前記実装部品を埋め込むように前記剛性基板の形状に沿
って樹脂モールドする工程とを有することを特徴とする
立体回路基板の製造方法。2. A step of mounting a mounted component on a circuit pattern formed on an insulating sheet, and attaching an insulating sheet on which the mounted component is mounted along a rigid substrate bent in a predetermined shape. Performing a resin molding along the shape of the rigid substrate so as to embed the mounted component.
前記絶縁シートを剥離する工程を有することを特徴とす
る請求項2に記載の立体回路基板の製造方法。3. The method for manufacturing a three-dimensional circuit board according to claim 2, further comprising a step of separating the rigid substrate and the insulating sheet after the resin molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35971499A JP2001177224A (en) | 1999-12-17 | 1999-12-17 | Microwave circuit substrate and manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35971499A JP2001177224A (en) | 1999-12-17 | 1999-12-17 | Microwave circuit substrate and manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001177224A true JP2001177224A (en) | 2001-06-29 |
Family
ID=18465934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP35971499A Pending JP2001177224A (en) | 1999-12-17 | 1999-12-17 | Microwave circuit substrate and manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001177224A (en) |
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