JPH091969A - Ic card and manufacture thereof - Google Patents
Ic card and manufacture thereofInfo
- Publication number
- JPH091969A JPH091969A JP7153137A JP15313795A JPH091969A JP H091969 A JPH091969 A JP H091969A JP 7153137 A JP7153137 A JP 7153137A JP 15313795 A JP15313795 A JP 15313795A JP H091969 A JPH091969 A JP H091969A
- Authority
- JP
- Japan
- Prior art keywords
- film
- card
- circuit
- coil
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000004804 winding Methods 0.000 claims abstract description 25
- 229920006267 polyester film Polymers 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 19
- 239000000463 material Substances 0.000 abstract description 12
- 125000006850 spacer group Chemical group 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000003990 capacitor Substances 0.000 abstract description 5
- 239000013039 cover film Substances 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣカードとその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card and its manufacturing method.
【０００２】[0002]
【従来の技術】非接触式ＩＣカードは、通常、信号を送
受信するための渦巻き状のコイルまたはアンテナと、信
号を処理するためのＩＣチップやチップコンデンサ等の
電子部品、回路導体、及びこれらを支持する基板からな
っている。2. Description of the Related Art A non-contact type IC card usually has a spiral coil or antenna for transmitting and receiving signals, electronic parts such as IC chips and chip capacitors for processing signals, circuit conductors, and these. It consists of a supporting substrate.
【０００３】このうち、アンテナコイルは、絶縁基板
（ガラスエポキシ、ポリエステルフィルム等のフレキシ
ブルシート）上に、銅またはアルミの箔を貼り付け、エ
ッチングして形成したシートコイルや、断面が円形また
は長方形（長円形）の銅線等を渦巻き状に巻いた巻線コ
イル、あるいは、ポリエステルフィルム等のフレキシブ
ルシート上に、導体ペーストをシルクスクリーン印刷に
よって形成したものなどがある。前者２つ（エッチング
コイル及び巻線コイル）は、比較的低抵抗（比抵抗数μ
Ω・ｃｍ）の材料が選択できるため、アンテナコイルに
要求される低抵抗、高インダクタンスとすることが可能
であるが、後者の印刷コイルは、導体ペースト中に導電
性を有するための金属粒子以外に、接着のための樹脂が
混入するため、低抵抗化には限界（比抵抗≧数１０μΩ
・ｃｍ）があり、高抵抗、低インダクタンスのものとな
ってしまう。Among them, the antenna coil is a sheet coil formed by adhering copper or aluminum foil on an insulating substrate (flexible sheet such as glass epoxy, polyester film, etc.) and etching, or a circular or rectangular section ( There is a wound coil formed by spirally winding an (oval) copper wire, or a flexible sheet such as a polyester film on which a conductive paste is formed by silk screen printing. The former two (etching coil and winding coil) have a relatively low resistance (specific resistance several μ
(Ω · cm) material can be selected, so it is possible to have low resistance and high inductance required for the antenna coil. However, the latter printing coil is other than metal particles to have conductivity in the conductor paste. In addition, since the resin for adhesion is mixed, there is a limit to lowering the resistance (specific resistance ≧ several 10 μΩ
.Cm), which results in high resistance and low inductance.
【０００４】また、アンテナコイルと電子部品を搭載す
る回路基板には、ＴＡＢのような金属薄板を必要形状に
打ち抜いたもの、あるいは絶縁フィルム上にアンテナコ
イルと同様に金属箔を貼り付け、これをエッチング処理
するもの及び印刷でアンテナコイルと同様に回路形成す
るものがあり、上記アンテナコイルと前記回路配線方法
を組み合わせて用いることができる。このうち、エッチ
ングによるアンテナコイルと回路、エッチング回路と巻
線コイル、印刷によるアンテナコイルと回路、ＴＡＢ法
によるアンテナコイルと回路、ＴＡＢ法による回路と巻
線コイルの５種が、一般的に使用される製造の組み合わ
せである。The circuit board on which the antenna coil and the electronic parts are mounted has a metal thin plate such as TAB punched out in a required shape, or a metal foil is adhered on an insulating film in the same manner as the antenna coil. Some are etched and some are printed to form a circuit similar to an antenna coil, and the antenna coil and the circuit wiring method can be used in combination. Of these, five types are generally used: an antenna coil and circuit by etching, an etching circuit and winding coil, an antenna coil and circuit by printing, an antenna coil and circuit by TAB method, and a circuit and winding coil by TAB method. It is a combination of manufacturing.
【０００５】[0005]
【発明が解決しようとする課題】ところで、従来のエッ
チングにより、アンテナコイルも含め回路形成する方法
では、回路形成工程だけで、表面ドライフィルム貼付→
露光→現像→エッチング→ドライフィルム除去→洗浄→
裏面ドライフィルム貼付→露光→現像→エッチング→ド
ライフィルム除去→洗浄→スルーホール用穴明け→めっ
き前処理→無電解めっき→めっき後処理→デスミア処理
→洗浄の工程が必要であり、製造工程が長く複雑であ
り、コストも大きくなってしまうという課題があった。By the way, in the conventional method of forming a circuit including the antenna coil by etching, the surface dry film is applied only by the circuit forming step.
Exposure → Development → Etching → Dry film removal → Washing →
Backside dry film application → exposure → development → etching → dry film removal → cleaning → through hole drilling → plating pretreatment → electroless plating → plating posttreatment → desmear treatment → cleaning process is required and the manufacturing process is long There was a problem that it was complicated and the cost increased.
【０００６】また、印刷で、アンテナコイルと回路を形
成する方法は、導電ペースト材料自体の比抵抗が大き
く、渦巻き状に細く長く回路形成すると回路抵抗が大き
くなり過ぎ、必要なアンテナ特性が得られないという課
題があった。In the method of forming the antenna coil and the circuit by printing, the specific resistance of the conductive paste material itself is large, and the circuit resistance becomes too large when the circuit is formed in the shape of a spiral thin long wire, and the necessary antenna characteristics are obtained. There was a problem that there was not.
【０００７】アンテナコイルに金属細線を使用した巻線
コイルを用いる場合は、アンテナ特性は得られるものの
電子部品回路との接続が半田接続によるため、接続部が
厚みが大きくなり、薄型化が困難であるという課題があ
った。When a wire coil using a thin metal wire is used as the antenna coil, although antenna characteristics can be obtained, the connection with the electronic component circuit is made by soldering, so that the connecting portion becomes thick and it is difficult to make it thin. There was a problem of being there.
【０００８】本発明は、安価でアンテナ特性が容易に得
られるＩＣカードと、そのようなＩＣカードを効率良く
製造する方法を提供することを目的とする。It is an object of the present invention to provide an IC card that is inexpensive and can easily obtain antenna characteristics, and a method for efficiently manufacturing such an IC card.
【０００９】[0009]
【課題を解決するための手段】本発明のＩＣカードは、
絶縁フィルム上に形成した、電磁結合または電波で信号
を送受するための巻線アンテナコイル、及び導体回路
と、電子部品と、ポリエステルフィルム等の被覆樹脂と
から構成されることを特徴とする。The IC card according to the present invention comprises:
It is characterized by comprising a wound antenna coil formed on an insulating film for transmitting and receiving a signal by electromagnetic coupling or radio waves, a conductor circuit, an electronic component, and a coating resin such as a polyester film.
【００１０】このようなＩＣカードは、絶縁フィルムの
片面に、導体回路及びアンテナコイルを、シルクスクリ
ーン印刷法にて導電ペーストを塗布形成することによっ
て製造することができる。Such an IC card can be manufactured by coating a conductive circuit and an antenna coil on one surface of an insulating film with a conductive paste by a silk screen printing method.
【００１１】本発明に用いるアンテナコイルとしては、
高インダクタンスが必要とされることから、比抵抗の小
さな銅線等を巻いた巻線コイルとすることが好ましい。
この導電ペーストには、金属粒子の他に、接着用樹脂と
して基材と同種の樹脂を主とすることで、基材と同様な
特性（熱膨張係数、収縮率等）を有する必要がある。As the antenna coil used in the present invention,
Since high inductance is required, it is preferable to use a wound coil formed by winding a copper wire having a low specific resistance.
In addition to the metal particles, this conductive paste is required to have the same characteristics (coefficient of thermal expansion, shrinkage ratio, etc.) as the base material by mainly using the same resin as the base material as the adhesive resin.
【００１２】ＩＣやコンデンサなる電子部品を搭載する
ためには、回路が平滑である上に厚さが薄く、均一で且
つ細線化が可能な方法として、導電ペーストをシルクス
クリーン印刷法によって塗布することが好ましい。本発
明に用いる基材は、カード全体の厚みを薄くするため
に、基材にポリエステルフィルム等の絶縁フィルムを使
用することが好ましい。In order to mount an electronic component such as an IC or a capacitor, a conductive paste is applied by a silk screen printing method as a method in which the circuit is smooth and has a thin thickness, which can be made uniform and thin. Is preferred. The base material used in the present invention preferably uses an insulating film such as a polyester film as the base material in order to reduce the thickness of the entire card.
【００１３】また、巻線コイルのリードと前記回路の接
続には、回路用導電ペーストと相性が良く、且つ接着面
積が小さいことから、強固に接続する材料を選択すると
共に、接着材で巻線コイルのリード全体を包むように覆
うことが好ましい。In addition, for the connection between the lead of the winding coil and the circuit, since the compatibility with the conductive paste for the circuit is good and the adhesion area is small, a material for strong connection is selected and the winding is made with the adhesion material. It is preferable to cover the entire lead of the coil so as to wrap it.
【００１４】[0014]
【実施例】基材１には、１２５μｍ厚ポリエステルフィ
ルムを使用し、これに印刷した導電ペースト２は、金属
粒子に銀粉末を使用し、これにポリエステル樹脂をベー
スに可塑材、溶剤等を適量配合したＬＳ−４１１（株式
会社アサヒ化学研究所製、商品名）を用いた。ポリエス
テルフィルム１に印刷後、８０℃で仮キュアし、その後
１５０℃で本キュアした。この印刷フィルム１に、２５
０μｍ厚のＩＣ３及び５００μｍ厚のチップコンデンサ
４を、異方導電性接着フィルム５であるアニソルム（日
立化成工業株式会社製、商品名）により、１８０℃で接
着した。巻線コイル６は、外形７０×４２×０．４ｍｍ
の長方形ドーナツ状コイルとし、リード７は半田処理し
たものを使用した。前記の部品搭載フィルム１の上に、
予め巻線コイル６が入る凹み部８、及び電子部品搭載部
を金型等で抜いた接着材９付のスペーサ層１０なるもの
を置き、本巻線コイル６をその凹み部８に入れた。この
際、巻線コイル６のリード７が印刷回路１１と接続する
スペーサ層リード接続凹み部１２は、本導電ペースト１
３で短絡しないように離して配置した。巻線コイル６の
リード７を所定の回路接続部１４に押さえつけながら、
導電ペースト１３を塗布し、１５０℃で乾燥硬化させ、
接着した。この巻線コイル６のリード７と回路１１の接
続に供した導電ペースト１３は、前記ＬＳ−４１１（株
式会社アサヒ化学研究所製、商品名）を用いた。スペー
サ層１０に設けたくり抜き部８に、巻線コイル６等を入
れた際のクリアランスが大きい場合には、樹脂１５を封
入し隙間を埋める。最後に、最上層に接着材９付のカバ
ーフィルム１６を貼り付け、加熱加圧し、フィルム間の
接着剤を硬化し、カードを一体化させ図２に示すＩＣカ
ードとした。EXAMPLE A 125 μm thick polyester film was used as the base material 1, and the conductive paste 2 printed on this used silver powder as the metal particles, and a suitable amount of plasticizer, solvent, etc. based on the polyester resin. The compounded LS-411 (Asahi Chemical Laboratory Co., Ltd., trade name) was used. After printing on the polyester film 1, temporary curing was performed at 80 ° C., and then main curing was performed at 150 ° C. This printed film 1 has 25
The IC 3 having a thickness of 0 μm and the chip capacitor 4 having a thickness of 500 μm were adhered at 180 ° C. by Anisolmu (Hitachi Chemical Co., Ltd., trade name) which is an anisotropic conductive adhesive film 5. The winding coil 6 has an outer shape of 70 × 42 × 0.4 mm
The rectangular donut-shaped coil was used and the lead 7 was soldered. On the above component mounting film 1,
A recess 8 into which the winding coil 6 was inserted and a spacer layer 10 with an adhesive 9 obtained by removing the electronic component mounting portion with a mold or the like were placed in advance, and the main winding coil 6 was inserted into the recess 8. At this time, the spacer layer lead connection recess 12 where the lead 7 of the winding coil 6 is connected to the printed circuit 11 is formed in the conductive paste 1
They were separated from each other so that they would not be short-circuited at 3. While pressing the lead 7 of the winding coil 6 against the predetermined circuit connecting portion 14,
Apply the conductive paste 13 and dry and cure at 150 ° C.
Glued. As the conductive paste 13 used for connecting the lead 7 of the winding coil 6 and the circuit 11, the LS-411 (manufactured by Asahi Chemical Laboratory Co., Ltd., trade name) was used. If the clearance when the winding coil 6 and the like is put into the hollow portion 8 provided in the spacer layer 10 is large, the resin 15 is sealed to fill the gap. Finally, the cover film 16 with the adhesive 9 was attached to the uppermost layer, heated and pressed, the adhesive between the films was cured, and the card was integrated to obtain the IC card shown in FIG.
【００１５】[0015]
【発明の効果】アンテナコイルに要求される高インダク
タンス、低抵抗化を巻線コイルの使用で満たすと共に、
回路の量産性、安価製造を可能にする印刷回路配線と、
本回路と巻線コイルを導電ペーストにより接着すること
で、カードに要求される機械的及び電気的特性、作業
性、コストの全ての特性を満たすことができる。The high inductance and low resistance required for the antenna coil are satisfied by using the winding coil, and
Printed circuit wiring that enables mass production of circuits and inexpensive manufacturing,
By bonding the circuit and the winding coil with a conductive paste, it is possible to satisfy all the mechanical and electrical characteristics, workability, and cost required for the card.
【図１】本発明の一実施例を示す非接触式ＩＣカードの
分解断面図である。FIG. 1 is an exploded sectional view of a non-contact type IC card showing an embodiment of the present invention.
【図２】本発明の一実施例を示す非接触式ＩＣカードの
上面図である。FIG. 2 is a top view of a non-contact type IC card showing an embodiment of the present invention.
１ 印刷フィルム（シート） ２ 導電ペースト ３ ＩＣチップ ４ チップコンデンサ ５ 異方導電性フィルム ６ 巻線コイル ７ 巻線コイルのリード端 ８ 巻線コイル挿入凹み ９ シート接着剤 １０ スペーサ層フィルム １１ 印刷回路 １２ スペーサ層巻線リード接続用凹み １３ 巻線リード接続用導電ペースト １４ 回路接続部（巻線リードとの接点） １５ 封入樹脂 １６ カバーフィルム 1 Printing Film (Sheet) 2 Conductive Paste 3 IC Chip 4 Chip Capacitor 5 Anisotropic Conductive Film 6 Winding Coil 7 Lead End of Winding Coil 8 Winding Coil Insertion Ditch 9 Sheet Adhesive 10 Spacer Layer Film 11 Printed Circuit 12 Spacer layer Recess for winding wire connection 13 Conductive paste for winding wire connection 14 Circuit connection part (contact with winding lead) 15 Encapsulating resin 16 Cover film
Claims (3)
は電波で信号を送受するための巻線アンテナコイル、及
び導体回路と、電子部品と、ポリエステルフィルム等の
被覆樹脂とから構成されることを特徴とするＩＣカー
ド。1. A winding antenna coil for transmitting and receiving a signal by electromagnetic coupling or radio waves formed on an insulating film, a conductor circuit, an electronic component, and a coating resin such as a polyester film. The characteristic IC card.
クスクリーン印刷法にて導電ペーストを塗布形成するこ
とを特徴とするＩＣカードの製造方法。2. A method of manufacturing an IC card, comprising forming a conductive circuit on one surface of an insulating film by applying a conductive paste by silk screen printing.
ルムで接続することを特徴とする請求項２に記載のＩＣ
カードの製造方法。3. The IC according to claim 2, wherein the circuit conductor and the electronic component are connected by an anisotropic conductive film.
Card manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7153137A JPH091969A (en) | 1995-06-20 | 1995-06-20 | Ic card and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7153137A JPH091969A (en) | 1995-06-20 | 1995-06-20 | Ic card and manufacture thereof |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002140717A Division JP2002373325A (en) | 2002-05-15 | 2002-05-15 | Ic card |
| JP2005113894A Division JP2005222565A (en) | 2005-04-11 | 2005-04-11 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH091969A true JPH091969A (en) | 1997-01-07 |
Family
ID=15555822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7153137A Pending JPH091969A (en) | 1995-06-20 | 1995-06-20 | Ic card and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH091969A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2803439A1 (en) * | 2000-01-03 | 2001-07-06 | A S K | COUPLING ANTENNA WITH VARIABLE CAPACITY |
| JP2002312750A (en) * | 2001-04-17 | 2002-10-25 | Matsushita Electric Works Ltd | Molding with built-in electronic component-mounted substrate and manufacturing method therefor |
| JP2003037348A (en) * | 2001-07-24 | 2003-02-07 | Dainippon Printing Co Ltd | Method for forming circuit |
-
1995
- 1995-06-20 JP JP7153137A patent/JPH091969A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2803439A1 (en) * | 2000-01-03 | 2001-07-06 | A S K | COUPLING ANTENNA WITH VARIABLE CAPACITY |
| WO2001050547A1 (en) * | 2000-01-03 | 2001-07-12 | Ask S.A. | Variable capacitance coupling antenna |
| JP2003519948A (en) * | 2000-01-03 | 2003-06-24 | アエスカ エス．ア． | Variable capacitive coupling antenna |
| AU767701B2 (en) * | 2000-01-03 | 2003-11-20 | Ask S.A. | Variable capacitance coupling antenna |
| JP2002312750A (en) * | 2001-04-17 | 2002-10-25 | Matsushita Electric Works Ltd | Molding with built-in electronic component-mounted substrate and manufacturing method therefor |
| JP2003037348A (en) * | 2001-07-24 | 2003-02-07 | Dainippon Printing Co Ltd | Method for forming circuit |
| JP4693295B2 (en) * | 2001-07-24 | 2011-06-01 | 大日本印刷株式会社 | Circuit formation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3094481B2 (en) | Electronic circuit device and manufacturing method thereof | |
| US9661759B2 (en) | Printed circuit board and method of manufacturing the same | |
| CN114126239A (en) | Circuit board with embedded thin film resistor and manufacturing method thereof | |
| WO2008133369A1 (en) | The manufacturing method of the thin film ceramic multi layer substrate | |
| JPH091969A (en) | Ic card and manufacture thereof | |
| JP2007115723A (en) | Metal foil laminated body and electronic component | |
| JPH1027952A (en) | Printed wiring board and manufacture thereof | |
| JP2754124B2 (en) | Manufacturing method of metal foil fuse | |
| JPH0143473B2 (en) | ||
| JP2001313448A (en) | Both-side flexible wiring board, ic card, and manufacturing method of the both-side flexible wiring board | |
| JP2002373325A (en) | Ic card | |
| JP2711664B2 (en) | IC card manufacturing method | |
| JP2770485B2 (en) | Circuit board | |
| JPH1074859A (en) | Qfn semiconductor package | |
| JP2571960B2 (en) | Double-sided flexible circuit board and manufacturing method thereof | |
| JPH0224395B2 (en) | ||
| JP2005222565A (en) | Ic card | |
| TWI295113B (en) | ||
| JPH01124273A (en) | Mounting structure of magnetoelectric transducer | |
| JPS62222604A (en) | Formation of circuit board | |
| JPS60165790A (en) | Method of producing electronic circuit board | |
| JP2001036201A (en) | Circuit board for large current and manufacture thereof | |
| TW201513750A (en) | Component-embedded substrate and manufacturing method for same | |
| JP2000294905A (en) | Manufacture of package wiring board | |
| JPS58115886A (en) | Method of producing printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040712 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040720 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050208 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050411 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20050620 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20051209 |