JPH01124273A - Mounting structure of magnetoelectric transducer - Google Patents
Mounting structure of magnetoelectric transducerInfo
- Publication number
- JPH01124273A JPH01124273A JP62282074A JP28207487A JPH01124273A JP H01124273 A JPH01124273 A JP H01124273A JP 62282074 A JP62282074 A JP 62282074A JP 28207487 A JP28207487 A JP 28207487A JP H01124273 A JPH01124273 A JP H01124273A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- magnetoelectric transducer
- hole
- substrate
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 239000010409 thin film Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 abstract description 15
- 238000007650 screen-printing Methods 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 2
- 238000004080 punching Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 11
- 239000002313 adhesive film Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ホール素子、磁気抵抗素子等の磁電変換素子
のプリント配線板への実装構造に関連し、特に、小型薄
型を目指す実装構造に関連する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a mounting structure for a magnetoelectric conversion element such as a Hall element or a magnetoresistive element on a printed wiring board, and is particularly applicable to a mounting structure that aims to be small and thin. Related.
磁電変換素子は、回転機器、ブラシレスモータ等の回転
制御用センサーなどに用いられるものであり、通常、モ
ールド樹脂によりパッケージされ、外部接続用のリード
が引き出されている。これらはプリント配線板に実装さ
れ使用される場合が多いが、特に実装後の全体厚の薄さ
が要求される場合、プリント配線板上に穴または切り欠
きをつくり、そこに配置する事が考えられる。Magnetoelectric transducers are used in rotation control sensors for rotating equipment, brushless motors, etc., and are usually packaged with molded resin and have leads for external connection drawn out. These are often mounted and used on a printed wiring board, but especially when a thin overall thickness is required after mounting, it is a good idea to make a hole or cutout on the printed wiring board and place it there. It will be done.
プリント配線板に穴をあけて、磁電変換素子を実装する
場合の一例を第８図に示す。FIG. 8 shows an example of mounting a magnetoelectric transducer by making a hole in a printed wiring board.
磁電変換素子はアルミナ、フェライト、ガラス、シリコ
ン等で形成された基板１の上に感磁性薄膜２が形成され
ている。感磁性薄膜２は、ホール素子では、ＩｎＳｂ、
、ＧａＡｓ５ＩｎＡｓ等の化合物半導体が、また磁気抵
抗素子ではＮｉ−Ｆｅ５ Ｎ１−Ｃ。The magnetoelectric conversion element has a magnetically sensitive thin film 2 formed on a substrate 1 made of alumina, ferrite, glass, silicon, or the like. In the Hall element, the magnetically sensitive thin film 2 is made of InSb,
, GaAs5InAs, and other compound semiconductors, and magnetoresistive elements such as Ni-Fe5 N1-C.
等の強磁性体がそれぞれ用いられる。また、図示してい
ないが感磁性薄膜２の感磁部の上に保護膜が設けられて
いることもある。基板１は、リン青銅などで形成され更
にその表面に銀めっきが施された外部引き出し用のり−
ド９のアイランド部１０とグイボンド樹脂層１１を介し
て接着されている。Ａｕ、ＡＩ等により形成されている
電極３とリード９は、Ａｕ、 ＡＩ等からなるワイヤ１
２によってボンディングされている。モールド樹脂１３
は熱硬化型のエポキシ樹脂であり、トランスファモール
ド法等によって形成されたものである。プリント配線板
を構成する絶縁層４は、ガラスエポキシ板、ガラスポリ
イミド板、ガラスＰＴＦＥ板、紙フエノール板、或いは
アルミナ板等のセラミックス板、或いはポリイミドフィ
ルム、ＰＥＴフィルム、ポリアミドイミドフィルム、等
のフィルムまたはその他のエポキシ樹脂等、絶縁性を有
する材質であり、図示していないが片面或いは両面に導
体による配線がなされている。プリント配線板とは硬質
のプリント配線板のみならずフレキシブル配線板、プリ
ントコイル、コネクター等も意味する。プリント配線板
には穴６があけられ、磁電変換素子のモールド樹脂部が
大向に配置され、リード９とプリント配線板上の接続用
端子５がはんだ２０により接続されている。この場合一
般的な例として磁電変換素子内の基板１の大きさは、約
１．０龍角、厚さが約０．１５鰭であり、モールド後の
磁電変換素子全体の大きさは、リードの保持強度等を考
慮してモールド樹脂で覆うため最終的に２．０ｕ角、全
体厚はｌ ｎ＋程度となり、プリント配線板からはみ出
す厚さｌ、は０．２５ｍ以上となるのが通常である。These ferromagnetic materials are used. Further, although not shown, a protective film may be provided on the magnetically sensitive portion of the magnetically sensitive thin film 2. The board 1 is made of phosphor bronze or the like, and the surface thereof is further plated with silver for external drawing.
It is bonded to the island portion 10 of the board 9 via a Guibond resin layer 11. The electrodes 3 and leads 9 are made of Au, AI, etc., and the wires 1 are made of Au, AI, etc.
It is bonded by 2. Mold resin 13
is a thermosetting epoxy resin, and is formed by a transfer molding method or the like. The insulating layer 4 constituting the printed wiring board is a ceramic board such as a glass epoxy board, a glass polyimide board, a glass PTFE board, a paper phenol board, or an alumina board, or a film such as a polyimide film, a PET film, a polyamideimide film, or the like. It is made of an insulating material such as another epoxy resin, and conductor wiring is provided on one or both sides (not shown). Printed wiring board refers not only to rigid printed wiring boards, but also to flexible wiring boards, printed coils, connectors, etc. A hole 6 is made in the printed wiring board, a molded resin part of the magnetoelectric transducer is placed in the opposite direction, and a lead 9 and a connecting terminal 5 on the printed wiring board are connected by solder 20. In this case, as a general example, the size of the substrate 1 in the magnetoelectric transducer is about 1.0 dragon angle and the thickness is about 0.15 fin, and the overall size of the magnetoelectric transducer after molding is lead Considering the holding strength of the board, etc., it is covered with mold resin, so the final size is 2.0u square and the overall thickness is about ln+, and the thickness l, which protrudes from the printed wiring board, is usually 0.25m or more. .
以上、従来例の一例を示した。基板１とＩＪ−ドの接続
形態やモールド形態は、他にも種々あり得るが、磁電変
換素子とプリント基板との接続にリードを用いる場合、
その後の取り扱いの際、特にプリント配線板に設けられ
た穴へ磁電変換素子を設置する際のリードの保続強度を
確保する為にもモールド樹脂等による補強が必要であり
、この為、六６の面積、及び磁電変換素子がプリント配
線板面からはみ出す厚さｌ、を小さくすることが難しい
。An example of the conventional example has been shown above. There may be various other connection forms and mold forms between the board 1 and the IJ-board, but when using leads to connect the magnetoelectric transducer and the printed circuit board,
During subsequent handling, especially when installing the magnetoelectric transducer into the hole provided in the printed wiring board, reinforcing with molding resin etc. is necessary to ensure the sustaining strength of the lead. It is difficult to reduce the area of the magnetoelectric transducer and the thickness l that the magnetoelectric transducer protrudes from the surface of the printed wiring board.
また、モールドを行った場合に、感磁部がモールド樹脂
に覆われて外からは見えな（なるため、モールドが感磁
部に対してずれて形成された場合でも、それが確認でき
ないままモールドの外形として穴に適切な位置に埋設さ
れ、その結果感磁部中心が最適な実装位置からずれてし
まう場合がある。更に、従来法では、基板上の電極３と
リード９間の電気的接続及び、リード９と端子５間の電
気的接続という２つの電気的接続が必要な為、構造が複
雑であり、コスト的にも高いものとなっている。In addition, when molding is performed, the magnetically sensitive part is covered with the molding resin and cannot be seen from the outside (so even if the mold is formed misaligned with the magnetically sensitive part, it cannot be confirmed and the mold is removed. As a result, the center of the magnetically sensitive part may shift from the optimal mounting position.Furthermore, in the conventional method, the electrical connection between the electrode 3 and the lead 9 on the board Furthermore, since two electrical connections, ie, electrical connections between the leads 9 and the terminals 5, are required, the structure is complicated and the cost is high.
本発明は、磁電変換素子をプリント配線板に実装するに
際し、磁電変換素子の占有する面積及びプリント配線板
面よりの厚さを最小限に抑え、また磁電変換素子の配置
を正確なものとし、かつ簡素な構造でコスト的にも便利
な磁電変換素子のプリント配線板への実装構造を提供す
ることを目的とする。The present invention minimizes the area occupied by the magnetoelectric conversion element and the thickness from the surface of the printed wiring board when mounting the magnetoelectric conversion element on a printed wiring board, and also ensures accurate placement of the magnetoelectric conversion element. It is an object of the present invention to provide a structure for mounting a magnetoelectric transducer on a printed wiring board, which has a simple structure and is convenient in terms of cost.
本発明はリードを用いずに、磁電変換素子を構成する基
板上に形成された端子とプリント配線板上に形成された
端子、とを接続する構造である。即ち、感磁性薄膜と感
磁性薄膜上の所定部分に形成された電極とを表面上に有
する基板が、プリント配線板内に形成された穴または切
り欠き内に配置され、該プリント配線板上に形成された
端子と前記電極とが導電性樹脂またははんだによって接
続されていることを特徴とする磁電変換素子の実装構造
である。The present invention is a structure in which terminals formed on a substrate constituting a magnetoelectric transducer and terminals formed on a printed wiring board are connected without using leads. That is, a substrate having a magnetically sensitive thin film and an electrode formed on a predetermined portion of the magnetically sensitive thin film on its surface is placed in a hole or notch formed in a printed wiring board, and a substrate is placed on the printed wiring board. This is a mounting structure for a magnetoelectric transducer, characterized in that the formed terminal and the electrode are connected by conductive resin or solder.
本発明の構造は、磁電変換素子のプリント配線板への実
装面積及びプリント配線板面からのはみ出しが最小限に
抑えられており、また磁電変換素子の基板は感磁部が正
確な位置にくるようにプリント配線板に配置されている
。しかも全体の構造も簡素なものとなっている。In the structure of the present invention, the mounting area of the magnetoelectric transducer on the printed wiring board and the protrusion from the printed wiring board surface are minimized, and the magnetic sensing part of the magnetoelectric transducer's substrate is placed in an accurate position. It is arranged on the printed wiring board like this. Furthermore, the overall structure is simple.
以下、本発明を図面を用いて説明する。 Hereinafter, the present invention will be explained using the drawings.
第１図及び第２図において、基板１、感磁性薄膜２、電
極３、絶縁層４、端子５はそれぞれ前述した従来のもの
と同様材質からなっている。In FIGS. 1 and 2, a substrate 1, a magnetically sensitive thin film 2, an electrode 3, an insulating layer 4, and a terminal 5 are made of the same materials as those of the prior art described above.
６はプリント配線板に形成された磁電変換素子を埋設す
るための穴であり、パンチング等により形成され、上部
に感磁性薄膜２及び電極３が形成された基板１が嵌め込
まれている。電極３と端子５とは導電性樹脂７により接
続されている。導電性樹脂７は、銀ペースト、銀−パラ
ジウムペースト、銅ペースト、ニッケルペースト等が硬
化したものであり、スクリーン印刷法等により塗布して
設けられる。この際、基板１上の電極３面とプリント配
線板の端子５面の高さを同一とすることにより塗布を容
易に行うことができる。導電性樹脂７の厚さ１２は通常
のメツシュスクリーンを用いる場合５０μｍ以下とする
ことが容易である。Reference numeral 6 denotes a hole for embedding a magnetoelectric conversion element formed on a printed wiring board, which is formed by punching or the like, and into which the substrate 1 having the magnetically sensitive thin film 2 and the electrode 3 formed thereon is fitted. The electrode 3 and the terminal 5 are connected by a conductive resin 7. The conductive resin 7 is made of hardened silver paste, silver-palladium paste, copper paste, nickel paste, etc., and is applied by screen printing or the like. At this time, the application can be easily performed by making the heights of the electrodes 3 on the substrate 1 and the terminals 5 of the printed wiring board the same height. The thickness 12 of the conductive resin 7 can easily be set to 50 μm or less when a normal mesh screen is used.
また第３図に示すように、基板に穴ではなく切り欠き６
′を形成し、基板１を配線することも可能である。Also, as shown in Figure 3, the board has notches 6 instead of holes.
It is also possible to form the substrate 1 and wire the substrate 1.
基板の固定を確実なものとし、穴または切り欠きと基板
の隙間を埋め、導電性樹脂塗布時のにじみ込みを防ぐた
めに接着剤により基板をプリント配線板の穴または切り
欠きに固定することも好ましい。この場合、基板を穴ま
たは切り欠きに固定する前に、基板の側面または穴また
は切り欠きの側壁に予め接着剤を塗布しておく方法、或
いは、穴または切り欠きへ基板１を配置した後、基板１
の裏側（電極のない面）より接着剤を塗布することが行
われる。更に別法として穴の内部に基板を配置し、接着
剤で固定し、また隙間を埋めて、本発明の実装構造を得
る方法の一例を第４図に示す。プリント配線板に穴６を
あけた後、粘着フィルム１５をプリント配線板の接続端
子５側の面に貼りつける（第４図（Ａ））。基板１を、
電極３側の面を粘着フィルム１５側にして穴６内に配置
し電極３は粘着フィルム１５に貼り合わせる形状とする
（第４図（Ｂ））。It is also preferable to fix the board to the hole or cutout of the printed wiring board with adhesive to ensure the fixation of the board, fill the gap between the hole or cutout and the board, and prevent bleeding when applying the conductive resin. . In this case, before fixing the substrate in the hole or notch, adhesive may be applied in advance to the side surface of the substrate or the side wall of the hole or notch, or after the substrate 1 is placed in the hole or notch, Board 1
The adhesive is applied from the back side (the side without electrodes). Furthermore, as another method, an example of a method for obtaining the mounting structure of the present invention by placing a board inside the hole, fixing it with an adhesive, and filling the gap is shown in FIG. After making holes 6 in the printed wiring board, adhesive film 15 is pasted on the surface of the printed wiring board on the connection terminal 5 side (FIG. 4(A)). Substrate 1,
The electrode 3 is placed in the hole 6 with the surface facing the electrode 3 facing the adhesive film 15, and the electrode 3 is bonded to the adhesive film 15 (FIG. 4(B)).
接着剤８をデイスペンサー等により充填し硬化させる（
第４図（Ｃ））。粘着フィルム１５を剥離する（第４図
（Ｄ））。導電性樹脂７をスクリーン印刷により印刷し
、電極３と端子５を接続し硬化させる（第４図（Ｅ）
）、粘着フィルムはポリエチレンフィルム、塩化ビニル
フィルム、ＰＥＴフィルム等に粘着剤を塗布したもので
あり、剥離時に粘着剤がプリント基板表面に残らない剥
離性の良いものが好ましい。以上の方法により基板１を
固定し、また穴壁面と基板側面間の隙間を埋めることが
きる。また以上の方法は端子、電極面への接着剤の付着
を防止できるので好ましい。Fill the adhesive 8 with a dispenser or the like and harden it (
Figure 4(C)). The adhesive film 15 is peeled off (FIG. 4(D)). The conductive resin 7 is printed by screen printing, and the electrode 3 and the terminal 5 are connected and cured (Fig. 4 (E)).
), the adhesive film is a polyethylene film, vinyl chloride film, PET film, etc. coated with an adhesive, and preferably has good removability so that no adhesive remains on the surface of the printed circuit board when peeled off. By the above method, the substrate 1 can be fixed and the gap between the hole wall surface and the side surface of the substrate can be filled. Further, the above method is preferable because it can prevent the adhesive from adhering to the terminal and electrode surfaces.
以上、プリント配線板の電極と磁電変換素子の電極との
接続に導電性樹脂を用いる実施態様について説明したが
、はんだにより接続を行う事も可能である。第５図及び
第６図にはんだにより接続を行った例を示す。はんだに
よる接続は、ペースト状のものを、スクリーン印刷法、
デイスペンサ法等により塗布しリフローさせるか、或い
はディッピング法により行う。第５図及び第６図に示す
ようにはんだによる接続は、電極３と端子５が隣接して
いる場合に適用される。また、ディッピング法による場
合は、プリント配線板表面に、ソルダーレジスト等の絶
縁層１８を形成しておき、不要の部分にはんだが付着し
ないようにすることも好ましい。はんだの厚み１３は１
００μｍ程度のものとなる。Although the embodiment in which conductive resin is used to connect the electrodes of the printed wiring board and the electrodes of the magnetoelectric conversion element has been described above, it is also possible to make the connection by soldering. FIGS. 5 and 6 show examples in which connections are made by soldering. For connections using solder, use paste, screen printing,
It is applied by a dispenser method and reflowed, or by a dipping method. The solder connection as shown in FIGS. 5 and 6 is applied when the electrode 3 and the terminal 5 are adjacent to each other. Further, when using the dipping method, it is also preferable to form an insulating layer 18 such as a solder resist on the surface of the printed wiring board to prevent solder from adhering to unnecessary parts. Solder thickness 13 is 1
The thickness is about 00 μm.
また、最終的に、素子の保護の目的で素子表面に更に絶
縁被覆を行うことも可能であり好ましい。絶縁被覆は、
絶縁性樹脂をスプレー、ディッピング、スクリーン印刷
等の方法により薄く形成することにより行える。Furthermore, it is also possible and preferable to finally provide an insulating coating on the surface of the element for the purpose of protecting the element. The insulation coating is
This can be done by forming a thin layer of insulating resin using methods such as spraying, dipping, and screen printing.
本発明は実装構造として磁電変換素子とプリント配線板
を組み合わせものであるが、この複合体を磁電変換素子
として使用することも可能である。また導電性樹脂塗布
の際に、他の配線回路をプリント配線板上に同時形成す
ることも可能である。Although the present invention combines a magnetoelectric conversion element and a printed wiring board as a mounting structure, it is also possible to use this composite body as a magnetoelectric conversion element. It is also possible to simultaneously form other wiring circuits on the printed wiring board when applying the conductive resin.
以下、実施例を挙げるが、本発明はこれに限定されるも
のではない。Examples will be given below, but the present invention is not limited thereto.
実施例１
導体（銅）厚３５μｍ、絶縁層（ガラスエポキシ）厚０
．２鶴の片面銅張り積層板を、エツチング法により回路
形成を行った後、１．５ ａｍ角の穴をパンチングにて
あけた。その後、表面にＩｎ−５ｂ感磁性薄膜および、
金電極が形成された大きさ１．５ｕ角、厚さ０．１５ｍ
のアルミナ基板を、積層板に１２０℃の温度をかけた状
態で嵌め込んだ。次いで、エポキシテクノロジー社製銀
ベースト、「エボテックＨ−３１ＤＪをスクリーン印刷
により塗布し電極と端子を接続し、１５０℃、３０分間
の硬化を行った。導電性樹脂の厚み１２は２０μｍであ
った。以上により第１図及び第２図に示す磁電変換素子
の実装構造を得た。Example 1 Conductor (copper) thickness: 35 μm, insulation layer (glass epoxy) thickness: 0
．． After a circuit was formed on a single-sided copper-clad laminate of Nitsuru by an etching method, a 1.5 am square hole was punched. After that, an In-5b magnetically sensitive thin film was applied to the surface,
Size 1.5u square with gold electrode formed, thickness 0.15m
An alumina substrate was fitted into the laminate at a temperature of 120°C. Next, Evotech H-31DJ, a silver base manufactured by Epoxy Technology Co., Ltd., was applied by screen printing, electrodes and terminals were connected, and curing was performed at 150° C. for 30 minutes. The thickness 12 of the conductive resin was 20 μm. Through the above steps, the mounting structure of the magnetoelectric transducer shown in FIGS. 1 and 2 was obtained.
実施例２
第７図にプリントコイルの一例に対して本発明を実施し
た例を示す。プリントコイル１９はフォトリングラフ法
及びメツキ法を用いて製造されたものである。導体パタ
ーン１４はエポキシ樹脂からなる絶縁基板１６に銅によ
り渦巻き状に形成され、表面保護用絶縁層１８としてソ
ルダーレジストが所定部分に塗布し硬化させることによ
り形成されている。導体パターン１４はスルーホール部
１７によって表裏接続されており、磁電変換素子接続用
の端子は５はコイル外周部に形成されている。プリント
コイルの厚みは０．４５ ａｍであった。以上の如きプ
リントコイルの所定の位置に１．２ｎ角の穴をパンチン
グによりあけ、次いで第４図に示す方法にしたがって、
プリントコイルの端子が形成されている面倒全面に、日
東電工■型粘着フィルムｒＳＰＶ−２２４Ｊを貼りつけ
た後、Ｉｎ−５ｂ感磁性薄膜および金電極が表面に形成
された大きさ１． Ｏｎ＋角、厚さ０．２ ＋ｕのアル
ミナ基板を電極を、粘着フィルム側にして貼りつけた。Embodiment 2 FIG. 7 shows an example in which the present invention is applied to an example of a printed coil. The printed coil 19 is manufactured using the photorin graph method and the plating method. The conductor pattern 14 is formed in a spiral shape using copper on an insulating substrate 16 made of epoxy resin, and is formed by applying a solder resist as a surface protection insulating layer 18 to a predetermined portion and hardening it. The conductor pattern 14 is connected on the front and back sides by a through-hole portion 17, and a terminal 5 for connecting a magnetoelectric conversion element is formed on the outer periphery of the coil. The thickness of the printed coil was 0.45 am. A 1.2n square hole is punched in a predetermined position of the printed coil as described above, and then, according to the method shown in Fig. 4,
After pasting Nitto Denko ■ type adhesive film rSPV-224J on the entire surface where the terminals of the printed coil are formed, an In-5b magnetically sensitive thin film and a gold electrode are formed on the surface. An alumina substrate with an On+ angle and a thickness of 0.2 +u was attached with the electrode facing the adhesive film side.
次いで日本ロックタイト株式会社製紫外線硬化型嫌気性
接着剤ｒＬＩ−５０４Ｊをデイスペンサにより大向に塗
布し、紫外線を照射し硬化させた後、粘着フィルムを剥
がした。その後、エポキシテクノロジー社製銀ペースト
「エポテックＨ−３１Ｄ」をスクリーン印刷にて塗布し
、電極３と端子５を接続し、１５０℃、３０分間の加熱
を行ない第７図に示す磁電変換素子を得た。更に表面保
護の為、穴６の範囲にタムラ製作所ソルダーレジストｒ
ＵｓＲ−１１ＧＪをスクリーン印刷により塗布し紫外線
を照射し硬化させた。電極上の導電性樹脂の厚みは２０
μｍ１ソルダーレジストｒＵｓＲ−１１ＧＪの厚みは１
０μｍであった。Next, an ultraviolet curable anaerobic adhesive rLI-504J manufactured by Nippon Loctite Co., Ltd. was applied to Omukai using a dispenser, and after curing by irradiating ultraviolet rays, the adhesive film was peeled off. Thereafter, a silver paste "Epotec H-31D" manufactured by Epoxy Technology Co., Ltd. was applied by screen printing, electrode 3 and terminal 5 were connected, and heating was performed at 150°C for 30 minutes to obtain the magnetoelectric transducer shown in Fig. 7. Ta. Furthermore, in order to protect the surface, Tamura Seisakusho solder resist r is applied to the area of hole 6.
UsR-11GJ was applied by screen printing and cured by irradiation with ultraviolet rays. The thickness of the conductive resin on the electrode is 20
The thickness of μm1 solder resist rUsR-11GJ is 1
It was 0 μm.
実施例３
導体（銅）厚３５μｍ、絶縁層（ガラスエポキシ）厚０
．２ｆｌの片面銅張り積層板をエツチング法にて回路形
成を行った後、１．５Ｎ角の穴をパンチングしてあけ、
端子が穴外縁に接する形状とした。次いで、穴の周辺を
除く所定部分に田村製作所製ソルダーレジストｒＵＳＲ
−１１ＧＪをスクリーン印刷により塗布し、紫外線を照
射し硬化させた。その後、表面にＩｎ−３ｂ感磁性薄膜
および金電極が形成された大きさ１．５ ｔａｒ角、厚
さ０．１５鰭のアルミナ基板を基板側面に日本ロックタ
イト株式会社製嫌気性接着剤ｒＬＩ−３２５」を塗布後
、穴に嵌め込み硬化させた。Example 3 Conductor (copper) thickness: 35 μm, insulation layer (glass epoxy) thickness: 0
．． After forming a circuit on a 2fl single-sided copper-clad laminate using the etching method, punch a 1.5N square hole.
The terminal was shaped so that it touched the outer edge of the hole. Next, solder resist rUSR manufactured by Tamura Seisakusho is applied to the designated areas except around the holes.
-11GJ was applied by screen printing and cured by irradiation with ultraviolet rays. After that, an alumina substrate with a size of 1.5 tar angle and a thickness of 0.15 fins with an In-3b magnetically sensitive thin film and a gold electrode formed on the surface was attached to the side of the substrate using anaerobic adhesive rLI-325 manufactured by Nippon Loctite Co., Ltd. After coating, it was inserted into the hole and allowed to harden.
次いで、２２０℃の共晶はんだ槽にデイツプｌ電極と端
子を接続した。はんだの厚みは９０μｍであった。Next, the dip l electrode and the terminal were connected to a eutectic solder bath at 220°C. The thickness of the solder was 90 μm.
以上により第５図及び第６図に示す磁電変換素子の実装
構造を得た。Through the above steps, the mounting structure of the magnetoelectric transducer shown in FIGS. 5 and 6 was obtained.
本発明の磁電変換素子の実装構造は、配置用穴の面積を
小さくし、またプリント配線板面よりの厚さを小さくす
ることができる。本発明により、例えばプリントコイル
磁電変換素子を実装した場合、コイル導体の占有面積を
大きくし、またモータに組み込んだ際コイルとマグネッ
ト間の距離或いはマグネットとヨーク間の距離を小さく
でき、その結果、高トルクモーターの実現が可能となっ
た。また、本発明の実装構造は磁電変換素子をモールド
しない基板の状態で穴または切り欠き内に配置して得ら
れるので、惑磁部中心が正確な位置に配置されている。The magnetoelectric transducer mounting structure of the present invention can reduce the area of the mounting hole and the thickness from the printed wiring board surface. According to the present invention, for example, when a printed coil magnetoelectric conversion element is mounted, the area occupied by the coil conductor can be increased, and when incorporated into a motor, the distance between the coil and the magnet or the distance between the magnet and the yoke can be reduced, and as a result, This made it possible to create a high-torque motor. Moreover, since the mounting structure of the present invention is obtained by arranging the magnetoelectric transducer in the hole or notch in the state of the substrate without being molded, the center of the magnetism part is arranged at an accurate position.
更に構造が面素でありコスト的にも優れている。Furthermore, it has a planar structure and is superior in terms of cost.
第１図は本発明の磁電変換素子の実装構造を示す一実施
例を示す平面図、第２図は第１図をＡ−Ａ ’平面で切
断した際の断面図、第３図は本発明の他の実施例を示す
平面図、第４図は本発明の実装構造を得るための製造法
の一例を示す工程断面図、第５図は本発明の別の実装構
造を示す平面図、第６図は第５図をＢ−Ｂ’平面で切断
した際の断面図、第７図（Ａ）は本発明をプリントコイ
ルに適用した例を示す平面図、第７図（Ｂ）は第７図（
Ａ）をｃ−ｃ ’平面で切断した際の断面図、第８図は
従来の磁電変換素子のプリント配線板への実装構造を示
す断面図である。
１・・・基板、２・・・感磁性薄膜、３・・・電極、４
・・・絶縁層、５・・・接続用端子、６・・・スルーホ
ール用穴、６′・・・スルーホール用切り欠き、７・・
・導電性樹脂、７′・・・はんだ、８・・・接着剤、９
・・・リード、１０・・・アイランド部、１１・・・ダ
イボンド樹脂層、１２・・・ワイヤ、１３・・・モール
ド樹脂、１４・・・導体パターン、１５・・・粘着フィ
ルム、１６・・・絶縁基板、１７・・・スルーホール、
１８・・・絶縁層、１９・・・プリントコイル、２０・
・・はんだ
特許出願人 旭化成工業株式会社
第１図
第２図
第３簡
第４図
第５図
す
第６図FIG. 1 is a plan view showing an embodiment of the mounting structure of the magnetoelectric transducer of the present invention, FIG. 2 is a cross-sectional view of FIG. 1 taken along the plane A-A', and FIG. FIG. 4 is a plan view showing another embodiment of the present invention; FIG. 4 is a process sectional view showing an example of the manufacturing method for obtaining the mounting structure of the present invention; 6 is a sectional view taken along the plane BB' of FIG. 5, FIG. 7(A) is a plan view showing an example in which the present invention is applied to a printed coil, and FIG. figure(
FIG. 8 is a sectional view showing a mounting structure of a conventional magnetoelectric transducer on a printed wiring board. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Magnetically sensitive thin film, 3... Electrode, 4
... Insulating layer, 5... Connection terminal, 6... Hole for through hole, 6'... Notch for through hole, 7...
・Conductive resin, 7'...Solder, 8...Adhesive, 9
...Lead, 10...Island part, 11...Die bond resin layer, 12...Wire, 13...Mold resin, 14...Conductor pattern, 15...Adhesive film, 16...・Insulating board, 17... through hole,
18... Insulating layer, 19... Printed coil, 20...
...Solder patent applicant Asahi Kasei Kogyo Co., Ltd. Figure 1 Figure 2 Figure 3 Simple Figure 4 Figure 5 Figure 6
Claims (1)
電極とを表面上に有する磁電変換素子用の基板が、プリ
ント配線板内に形成された穴または切り欠き内に配置さ
れ、該プリント配線板上に形成された端子と前記電極と
が導電性樹脂またははんだによって接続されていること
を特徴とする磁電変換素子の実装構造。A substrate for a magnetoelectric transducer having a magnetically sensitive thin film and an electrode formed on a predetermined portion of the magnetically sensitive thin film on its surface is placed in a hole or notch formed in a printed wiring board, 1. A mounting structure for a magnetoelectric transducer, characterized in that a terminal formed on a wiring board and the electrode are connected by conductive resin or solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62282074A JPH01124273A (en) | 1987-11-10 | 1987-11-10 | Mounting structure of magnetoelectric transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62282074A JPH01124273A (en) | 1987-11-10 | 1987-11-10 | Mounting structure of magnetoelectric transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01124273A true JPH01124273A (en) | 1989-05-17 |
Family
ID=17647792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62282074A Pending JPH01124273A (en) | 1987-11-10 | 1987-11-10 | Mounting structure of magnetoelectric transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01124273A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5327013A (en) * | 1992-04-30 | 1994-07-05 | Motorola, Inc. | Solder bumping of integrated circuit die |
| WO2014091714A1 (en) * | 2012-12-14 | 2014-06-19 | 旭化成エレクトロニクス株式会社 | Magnetic sensor and magnetic sensor device, and magnetic sensor manufacturing method |
| JP2018137470A (en) * | 2014-06-17 | 2018-08-30 | 旭化成エレクトロニクス株式会社 | Hall sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122177A (en) * | 1980-02-29 | 1981-09-25 | Asahi Chem Ind Co Ltd | Microminiature hall element |
| JPS58171683A (en) * | 1981-12-08 | 1983-10-08 | Denki Onkyo Co Ltd | Magnetic sensor device |
-
1987
- 1987-11-10 JP JP62282074A patent/JPH01124273A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122177A (en) * | 1980-02-29 | 1981-09-25 | Asahi Chem Ind Co Ltd | Microminiature hall element |
| JPS58171683A (en) * | 1981-12-08 | 1983-10-08 | Denki Onkyo Co Ltd | Magnetic sensor device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5327013A (en) * | 1992-04-30 | 1994-07-05 | Motorola, Inc. | Solder bumping of integrated circuit die |
| WO2014091714A1 (en) * | 2012-12-14 | 2014-06-19 | 旭化成エレクトロニクス株式会社 | Magnetic sensor and magnetic sensor device, and magnetic sensor manufacturing method |
| CN104170109A (en) * | 2012-12-14 | 2014-11-26 | 旭化成微电子株式会社 | Magnetic sensor, magnetic sensor device, and magnetic senor manufacturing method |
| JP5676826B2 (en) * | 2012-12-14 | 2015-02-25 | 旭化成エレクトロニクス株式会社 | Manufacturing method of magnetic sensor |
| JPWO2014091714A1 (en) * | 2012-12-14 | 2017-01-05 | 旭化成エレクトロニクス株式会社 | Manufacturing method of magnetic sensor |
| CN106848055A (en) * | 2012-12-14 | 2017-06-13 | 旭化成微电子株式会社 | The manufacture method of Magnetic Sensor and magnet sensor arrangement and Magnetic Sensor |
| JP2018137470A (en) * | 2014-06-17 | 2018-08-30 | 旭化成エレクトロニクス株式会社 | Hall sensor |
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