JPS58171683A - Magnetic sensor device - Google Patents
Magnetic sensor deviceInfo
- Publication number
- JPS58171683A JPS58171683A JP56197555A JP19755581A JPS58171683A JP S58171683 A JPS58171683 A JP S58171683A JP 56197555 A JP56197555 A JP 56197555A JP 19755581 A JP19755581 A JP 19755581A JP S58171683 A JPS58171683 A JP S58171683A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- plate
- hole
- magnetic sensor
- sensor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000149 penetrating effect Effects 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract 4
- 239000007767 bonding agent Substances 0.000 abstract 2
- 150000002118 epoxides Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は半導体材料を用いたホール素子や磁気抵抗素子
等から成る磁気センサ装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a magnetic sensor device comprising a Hall element, a magnetoresistive element, etc. using a semiconductor material.
最近、向流モータの(ロ)転制御にホール素子を用いる
傾向が大きくなっている。この種の1)l)モータでは
、基板上に2〜6個のホール素子を所定の位置関係に取
付けて使用される。Recently, there has been a growing trend to use Hall elements for (b) rotation control of countercurrent motors. This type of 1)l) motor uses 2 to 6 Hall elements mounted on a substrate in a predetermined positional relationship.
従来はプリント配線を有する基板上にホール素子を1個
1個取付け、ホール素子のリード線をプリン)4線にハ
ンダ付けする等の方法がとられている。しかしながら、
この様な方法では、リード線に制約されてプリント配線
の引回された狭い場所にホール素子を設置出来ない欠点
があると共に、2〜3個のホール素子を用I/コたとき
の相互の位置決めに相当の工夫が必要になる。Conventionally, a method has been used in which Hall elements are mounted one by one on a board having printed wiring, and the lead wires of the Hall elements are soldered to four wires. however,
This method has the drawback that it is not possible to install the Hall element in a narrow space where printed wiring is routed due to the restrictions of lead wires, and there is also the problem of mutual interaction when two or three Hall elements are used. Considerable effort is required for positioning.
最近の傾向としてDDモータの高性能化が計られている
が、懐数個のホール素子間の取付誤差が、磁石回転子の
磁極位置を検出する際の誤差となるので、DDモータの
精能に大きく影響する。それ故、従来の様な方法では濤
足し得る精能は得られない。The recent trend is to improve the performance of DD motors, but the installation error between several Hall elements becomes an error when detecting the magnetic pole position of the magnet rotor, so the precision of DD motors has to be improved. greatly affects. Therefore, it is not possible to obtain sufficient precision using conventional methods.
本発明は上述の点に鑑みなされたもので、以下に図面を
用いて本発明の実施例を詳細に説明する。The present invention has been made in view of the above points, and embodiments of the present invention will be described in detail below with reference to the drawings.
第1図は磁気センサ装置の平面図で、2個のホール素子
を使用する例を示す。図に於て、絶縁基板、例えばエポ
キシ系樹脂やフェノール系樹脂等の厚さ05〜6助程度
の基板1の所定の位置にホール素子を挿入する透孔2.
3を打抜く。この場合、基板1をモータ(図示せず)に
固定するための貫通孔4,5も同様に打抜きで形成され
、この貫通孔4.5を基準にして透孔2,3の位置が精
密に位置づけされる。透孔2,6及び貫通孔4.5を設
けた基板1に、35〜100μm程度の厚さを有する銅
箔を接着剤、例えばエポキシ系接着剤で接着し、公知の
ホトエツチング技術で配線部6゜7、 8. 9. 1
0. 11. 12と端子部6a、7a、8a、9a、
10a、11a、12a及び透孔2,6ノ中に突出した
先端m6b、7b、8b。FIG. 1 is a plan view of a magnetic sensor device, showing an example in which two Hall elements are used. In the figure, a through hole 2 into which a Hall element is inserted is inserted into a predetermined position of an insulating substrate 1 made of, for example, epoxy resin or phenolic resin and having a thickness of about 0.5 to 6 mm.
Punch out 3. In this case, the through holes 4 and 5 for fixing the substrate 1 to the motor (not shown) are also formed by punching, and the positions of the through holes 2 and 3 are precisely positioned with respect to the through holes 4.5. be positioned. A copper foil having a thickness of approximately 35 to 100 μm is adhered to the substrate 1 provided with the through holes 2 and 6 and the through hole 4.5 using an adhesive, for example, an epoxy adhesive, and the wiring portion 6 is formed using a known photoetching technique.゜7, 8. 9. 1
0. 11. 12 and terminal portions 6a, 7a, 8a, 9a,
10a, 11a, 12a and tips m6b, 7b, 8b protruding into the through holes 2, 6.
9b、10b、11b、12bを形成する。9b, 10b, 11b, and 12b are formed.
なお、図面では、透孔2,6から端子WIl)6a〜1
2Lまでの配線のみを示したが、抵抗やコンデンサ、ト
ランジスタやIC等を基板1゛に取付けるべく配線を設
けることが出来る。In addition, in the drawing, the terminals WIl) 6a to 1 are connected from the through holes 2 and 6.
Although only wiring up to 2L is shown, wiring can be provided to attach resistors, capacitors, transistors, ICs, etc. to the board 1.
第2図は第1図の透孔2,3部分の拡大図を示すもので
、透孔2,6の中には、フェライトやガラスから成るサ
ブストレートの上に1n8b、 InAs等の半導体で
形成したホール素子を有するホールチップ13を挿入す
る。即ち、基板1のプリント配線6〜12を有しない側
からホールチップ16の半導体部分を透孔2,3の中に
向けて挿入し、電極、即ちIn等の金線を蒸着した電流
電極14゜15とホール電極16.17をプリント配線
6〜12の先端g7b〜9bの各々に接触させ、先端部
の上から順次ボンデングして先端部7b〜9bを電81
1!14〜17に直接接続する。このボンデングによっ
てホールチップ16は基&1に固定されるが、信頼性の
向上の見地からエポキシ系の樹脂等で透孔2,3の部分
がモールドされる。FIG. 2 shows an enlarged view of the through holes 2 and 3 in FIG. A Hall chip 13 having a Hall element is inserted. That is, the semiconductor portion of the hole chip 16 is inserted into the through holes 2 and 3 from the side of the substrate 1 that does not have the printed wirings 6 to 12, and the electrode, that is, the current electrode 14° on which a gold wire such as In is vapor-deposited. 15 and hole electrodes 16 and 17 are brought into contact with each of the tips g7b to 9b of the printed wirings 6 to 12, and bonding is performed sequentially from above the tips to connect the tips 7b to 9b to the electrodes 81.
1! Connect directly to 14-17. The hole chip 16 is fixed to the base &1 by this bonding, but the through holes 2 and 3 are molded with epoxy resin or the like in order to improve reliability.
なお、上述ではホール素子2個の例で示したが、1個の
場合でも又3〜4個の場合でも同様である。Although the above example uses two Hall elements, the same applies to the case of one Hall element or the case of three to four Hall elements.
又、低磁場の場合には、出力感度を増大させるため先端
部の上からホール素子の感磁部18の上へ磁性片を貼着
する。In addition, in the case of a low magnetic field, a magnetic piece is pasted from above the tip to the magnetic sensing part 18 of the Hall element in order to increase the output sensitivity.
上記実施例では、単一基板の場合について述べたが、第
6図に示す様に、1つのフレームに蝮数個の基板を構成
し、上述の様な磁気センサ装置を作った後一点破線の部
分から切断して個々の分離した装置とすることが出来る
。この方法は治工具を有効に使用出来、又蓋産効果が向
上する。In the above embodiment, the case of a single substrate was described, but as shown in FIG. The parts can be cut into individual separate devices. This method allows effective use of jigs and tools, and improves the lid production effect.
本発明は、叙上の様に構成−したので、磁電変換素子の
位置決め精度が極めて正確に得られ、モータの回転を高
精度に制御することが出来る。Since the present invention is configured as described above, the positioning accuracy of the magnetoelectric transducer can be extremely accurately obtained, and the rotation of the motor can be controlled with high precision.
又、本発明に於ては、ホール素子にリード線やリードフ
レームが全く不必要であり直接プリント配線に接続する
ので、基板に対する磁電変換簀子の取付は作業が著しく
軽減されるばかりでなく、ハンダ材は作業による不良の
発生がなくなり歩留りの向上と共に、リード線及びハン
ダの不要により安価な装置が得られ、又生産性が向上す
る。In addition, in the present invention, there is no need for lead wires or lead frames for the Hall element, and it is directly connected to the printed wiring, so not only is the work required for attaching the magnetoelectric conversion screen to the board significantly reduced, but it also requires less soldering. The material does not have defects due to work, which improves the yield, and since lead wires and solder are not required, an inexpensive device can be obtained, and productivity is improved.
なお、上記実施例ではホール素子について述べたが、磁
気抵抗素子を用いて同様に構成することが出来る。この
場合、配M及び端子部は素子に合わせて形成される。In addition, although the Hall element was described in the above embodiment, a similar configuration can be made using a magnetoresistive element. In this case, the wiring M and the terminal portion are formed to match the element.
又、上記実施例に於て、基板1に銅箔を接着するとき基
板1上に接着剤が貼されるので、先端部6b〜12bの
部分には接着剤が付着せず、ホールチップ16のボンデ
ングが円滑に行える。更ニ又、各々の先端部には透孔6
c’、 7c、 8c、 9G、10c、11c
、12cを形成しであるので、ボンデングのとき熱がプ
リント配線の方へ逃げ麺<熱ハランスカ良好になると共
に、ボンデングによる余剰の熔融金属、例えばハンダ材
を収容するので、ハンダ材が感磁部18にあつわて素子
の性能を低下させることがない利点を有する。Further, in the above embodiment, since adhesive is applied on the substrate 1 when bonding the copper foil to the substrate 1, the adhesive does not adhere to the tip portions 6b to 12b, and the hole chips 16 are Bonding can be done smoothly. Furthermore, there is a through hole 6 at the tip of each
c', 7c, 8c, 9G, 10c, 11c
, 12c are formed, so that during bonding, heat escapes toward the printed wiring, resulting in good heat dissipation, and it accommodates surplus molten metal, such as solder material, from bonding, so that the solder material is absorbed by the magnetically sensitive part. It has the advantage that the performance of the element is not deteriorated in the case of 18.
第1図は本発明磁気センサ装置の平面図、第2図は第1
図の透孔部分の拡大図、第3図は本発明の他の実施例を
示す平面図である。
図中の1は基板、6〜12はプリント配線、6b〜12
bは先端部、16はホールチップ、2゜6は透孔である
。
特許出願人 電気音響株式会社
第1図
5
第2図
手 続 補 正 書(方式)
%式%
1事件の表示 特願昭 56 −197555号2発
明の名称 磁気センサ装置
3補正をする者
事件との関係 特 許 出願人
性 所 東京都大田区西六郷3丁目26番11号5、
補正の対象
明細書全文
6、補正の内容FIG. 1 is a plan view of the magnetic sensor device of the present invention, and FIG.
FIG. 3 is an enlarged view of the through-hole portion in the figure and a plan view showing another embodiment of the present invention. In the figure, 1 is the board, 6-12 are printed wiring, 6b-12
b is a tip, 16 is a hole tip, and 2°6 is a through hole. Patent Applicant Denki Acoustics Co., Ltd. Figure 1 Figure 5 Figure 2 Procedures Amendment (method) % formula % 1 Indication of case Japanese Patent Application No. 56-197555 2 Title of invention Magnetic sensor device 3 Case of person who makes corrections Relationship Patent Applicant Location: 3-26-11-5 Nishirokugo, Ota-ku, Tokyo;
Full text of the specification subject to amendment 6, Contents of amendment
Claims (1)
前記基板上には前記透孔の中に先端部を突出したプリン
ト配線を形成し、前記透孔内にはサブストレート上に形
成した磁電変換素子を挿入して、該素子の電極を前記先
端部に直接接続して構成したことを特徴とする磁気セン
サ装量。1. Forming a through hole penetrating the insulating substrate, and
A printed wiring whose tip protrudes into the through hole is formed on the substrate, a magnetoelectric transducer formed on the substrate is inserted into the through hole, and the electrode of the element is inserted into the tip of the through hole. A magnetic sensor component characterized in that it is configured by being directly connected to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56197555A JPS58171683A (en) | 1981-12-08 | 1981-12-08 | Magnetic sensor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56197555A JPS58171683A (en) | 1981-12-08 | 1981-12-08 | Magnetic sensor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2061815A Division JPH0382358A (en) | 1990-03-13 | 1990-03-13 | Magnetoelectric converter |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58171683A true JPS58171683A (en) | 1983-10-08 |
JPH0366626B2 JPH0366626B2 (en) | 1991-10-18 |
Family
ID=16376435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56197555A Granted JPS58171683A (en) | 1981-12-08 | 1981-12-08 | Magnetic sensor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58171683A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01124273A (en) * | 1987-11-10 | 1989-05-17 | Asahi Chem Ind Co Ltd | Mounting structure of magnetoelectric transducer |
JPH0499568U (en) * | 1991-01-22 | 1992-08-27 | ||
JP2007093468A (en) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Electronics Co Ltd | Electronic component |
JP2009047444A (en) * | 2007-08-14 | 2009-03-05 | Shinka Jitsugyo Kk | Magnetic sensor and manufacturing method therefor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111771U (en) * | 1974-07-15 | 1976-01-28 |
-
1981
- 1981-12-08 JP JP56197555A patent/JPS58171683A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111771U (en) * | 1974-07-15 | 1976-01-28 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01124273A (en) * | 1987-11-10 | 1989-05-17 | Asahi Chem Ind Co Ltd | Mounting structure of magnetoelectric transducer |
JPH0499568U (en) * | 1991-01-22 | 1992-08-27 | ||
JP2007093468A (en) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Electronics Co Ltd | Electronic component |
JP2009047444A (en) * | 2007-08-14 | 2009-03-05 | Shinka Jitsugyo Kk | Magnetic sensor and manufacturing method therefor |
Also Published As
Publication number | Publication date |
---|---|
JPH0366626B2 (en) | 1991-10-18 |
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