JP2543867Y2 - SIP type electronic components - Google Patents
SIP type electronic componentsInfo
- Publication number
- JP2543867Y2 JP2543867Y2 JP6668491U JP6668491U JP2543867Y2 JP 2543867 Y2 JP2543867 Y2 JP 2543867Y2 JP 6668491 U JP6668491 U JP 6668491U JP 6668491 U JP6668491 U JP 6668491U JP 2543867 Y2 JP2543867 Y2 JP 2543867Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- type electronic
- sip
- casing
- sip type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案はＳＩＰ型電子部品に係わ
り、リフロー処理に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a SIP type electronic component and relates to a reflow process.
【０００２】[0002]
【従来の技術】従来のＳＩＰ型（シングルインラインパ
ッケージタイプ）電子部品においては、ケーシング前に
電気的検査が行われることが多い。ところが、ケーシン
グ方法としてハーメチックシールを半田封着で行う場
合、予めリード端子を半田付けして電気的検査を行って
からケーシングを実施するが、ケースを半田封着すると
きにリード端子の半田も溶融するため、リード端子が外
れたり、曲がったりすることが多い。そのため、リード
端子の半田付けに高温半田を用いたり、ケーシング前に
リード端子の半田付けをしないでプローブ等を端子部分
に当てて検査が行われていた。2. Description of the Related Art In a conventional SIP type (single in-line package type) electronic component, an electrical inspection is often performed before a casing. However, when the hermetic seal is performed by soldering as a casing method, the lead terminals are soldered in advance and an electrical inspection is performed before the casing is performed.However, when the case is soldered, the solder of the lead terminals is also melted. For this reason, the lead terminals often come off or bend. Therefore, inspection has been performed by using high-temperature solder for soldering the lead terminals or applying a probe or the like to the terminal portions without soldering the lead terminals before the casing.
【０００３】[0003]
【考案が解決しようとする課題】リード端子の半田付け
に高温ハンダを用いると、他の部品と同じ処理工程の利
用が出来なくなる。また、プローブ等での検査では、接
触抵抗の問題などで検査結果に対する信頼性が低くな
る。When high-temperature solder is used for soldering lead terminals, the same processing steps as those for other components cannot be used. In the inspection using a probe or the like, the reliability of the inspection result is reduced due to a problem of contact resistance or the like.
【０００４】[0004]
【課題を解決するための手段】本考案は上述の問題を解
決するために、ＳＩＰ型電子部品の半田付けによるケー
シングにおいて、ケーシングの半田と同じ融点の半田を
用い、リード端子を予めＳＩＰ型電子部品本体に半田付
けしておき、アルミナ若しくは金属板製の部材上にリー
ド端子が浮いた状態でＳＩＰ型電子部品本体を載置し、
リフロー処理によりケースのケーシングを行うようにし
たＳＩＰ型電子部品を提供するものである。According to the present invention, in order to solve the above-mentioned problems, in a casing formed by soldering an SIP type electronic component, a solder having the same melting point as that of the casing is used, and lead terminals are previously set in the SIP type electronic component. Soldering to the component body, placing the SIP type electronic component body with the lead terminals floating on a member made of alumina or metal plate,
An object of the present invention is to provide a SIP electronic component in which a casing of a case is formed by a reflow process.
【０００５】[0005]
【作用】以上のように構成したので、本考案によるＳＩ
Ｐ型電子部品のリフロー処理においては、ケーシング時
にアルミナ若しくは金属製の部材上にリード端子が浮い
た状態になるようにＳＩＰ電子部品本体を載置し、その
ままリフロー処理を行うことにより、リード端子部分の
半田が溶融しても半田端子が外れたり、曲がったするこ
とがない。[Operation] With the above configuration, the SI according to the present invention is provided.
In the reflow processing of the P-type electronic component, the main body of the SIP electronic component is placed so that the lead terminal is floated on an alumina or metal member at the time of the casing, and the reflow processing is performed as it is, so that the lead terminal portion is formed. Even if the solder melts, the solder terminal does not come off or bend.
【０００６】[0006]
【実施例】以下、図面において本考案によるＳＩＰ型電
子部品のリフロー処理の実施例を説明する。図１は本考
案によるＳＩＰ型電子部品のリフロー処理の一実施例の
要部斜視図であり、図２はＳＩＰ型電子部品の一実施例
の要部断面図である。図において、１はＳＩＰ型電子部
品本体で、リード端子２は予めケーシングで使用される
半田にて半田付けされており、アルミナ若しくは金属製
の部材４の上にリード端子２が浮いた状態でＳＩＰ型電
子部品本体１を載置し、さらに、ＳＩＰ型電子部品本体
１の予めクリーム半田が塗布してある所定の位置にケー
ス３の外周部が重なるようにケース３を被せて、リフロ
ー処理することによりケーシングされる。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of a reflow process for a SIP electronic component according to the present invention. FIG. 1 is a perspective view of a main part of an embodiment of a reflow process for a SIP type electronic component according to the present invention, and FIG. 2 is a sectional view of a main part of an embodiment of the SIP type electronic component. In the figure, reference numeral 1 denotes a SIP type electronic component main body, and a lead terminal 2 is soldered with solder used in a casing in advance, and the SIP is carried out in a state where the lead terminal 2 is floated on an alumina or metal member 4. The electronic component main body 1 is placed, and further, the case 3 is covered so that the outer peripheral portion of the case 3 overlaps a predetermined position of the SIP electronic component main body 1 where cream solder is applied in advance, and reflow processing is performed. It is casing by.
【０００７】[0007]
【考案の効果】以上説明したように、本考案によるＳＩ
Ｐ型電子部品のリフロー処理においては、アルミナ若し
くは金属製の部材の上にリード端子が浮いた状態でＳＩ
Ｐ型電子部品本体を載置することにより、リード端子が
直に装置や治具に触れたり、リード端子に何らかの力が
加わったりしないようにしたためため、ケーシングのた
めのリフロー処理を行うとき、リード端子部分の半田が
溶融してもリード端子が外れたり、曲がったりすること
を防ぐことが出来る。また、ケーシング前に電気的検査
を行えるので歩留りがよくなり、他の部品と同じ処理工
程を利用することが出来るため、製造コストが大幅に低
減される。[Effects of the Invention] As described above, the SI according to the present invention is
In the reflow processing of P-type electronic components, the lead terminal is floated on an alumina or metal member.
The P-type electronic component body is placed so that the lead terminals do not directly touch the device or jig, or any force is applied to the lead terminals. Even if the solder at the terminal portion is melted, the lead terminal can be prevented from coming off or bending. In addition, since the electrical inspection can be performed before the casing, the yield can be improved, and the same processing steps as those for other parts can be used, so that the manufacturing cost can be greatly reduced.
【図１】本考案によるＳＩＰ型電子部品のリフロー処理
の一実施例の要部斜視図である。FIG. 1 is a perspective view of a main part of an embodiment of a reflow process for a SIP electronic component according to the present invention.
【図２】ＳＩＰ型電子部品の一実施例の要部断面図であ
る。FIG. 2 is a sectional view of a main part of one embodiment of a SIP electronic component.
１ ＳＩＰ型電子部品本体 ２ リード端子 ３ ケース ４ 部材 DESCRIPTION OF SYMBOLS 1 SIP-type electronic component main body 2 Lead terminal 3 Case 4 Member
Claims (1)
シングにおいて、ケーシングの半田と同じ融点の半田を
用い、リード端子を予めＳＩＰ型電子部品本体に半田付
けしておき、アルミナ若しくは金属板製の部材上にリー
ド端子が浮いた状態でＳＩＰ型電子部品本体を載置し、
リフロー処理によりケースのケーシングを行うようにし
たことを特徴とするＳＩＰ型電子部品。In a casing formed by soldering an SIP type electronic component, a lead terminal is soldered in advance to a body of the SIP type electronic component using solder having the same melting point as that of the casing, and a member made of alumina or a metal plate is used. Place the SIP electronic component body with the lead terminals floating above,
A SIP type electronic component, wherein a casing of a case is formed by a reflow process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6668491U JP2543867Y2 (en) | 1991-08-22 | 1991-08-22 | SIP type electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6668491U JP2543867Y2 (en) | 1991-08-22 | 1991-08-22 | SIP type electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0520333U JPH0520333U (en) | 1993-03-12 |
| JP2543867Y2 true JP2543867Y2 (en) | 1997-08-13 |
Family
ID=13323007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6668491U Expired - Fee Related JP2543867Y2 (en) | 1991-08-22 | 1991-08-22 | SIP type electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2543867Y2 (en) |
-
1991
- 1991-08-22 JP JP6668491U patent/JP2543867Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0520333U (en) | 1993-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |