JPH0210846A - Film for tab - Google Patents
Film for tabInfo
- Publication number
- JPH0210846A JPH0210846A JP63162166A JP16216688A JPH0210846A JP H0210846 A JPH0210846 A JP H0210846A JP 63162166 A JP63162166 A JP 63162166A JP 16216688 A JP16216688 A JP 16216688A JP H0210846 A JPH0210846 A JP H0210846A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- tab
- film
- lead pattern
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 9
- 238000013508 migration Methods 0.000 abstract description 8
- 230000005012 migration Effects 0.000 abstract description 8
- 229920001721 polyimide Polymers 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 238000001259 photo etching Methods 0.000 abstract description 4
- 239000009719 polyimide resin Substances 0.000 abstract description 4
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- 229910000640 Fe alloy Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はＴＡＢ （テープ・オートメイテッド・ボンデ
ィング）方式の半導体装置の組立てプロセスに用いられ
るＴＡＢ用フィルムに関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a TAB (tape automated bonding) film used in a TAB (tape automated bonding) type semiconductor device assembly process.
（従来の技術）
上記ＴＡＢは、テープ状のフィルムキャリアによる自動
ボンディングであるが、ここで使用されるＴＡＢ用フィ
ルムとしては、第５図及びｍ６図に示すものが一般に知
られていた
即ち、テープ状で幅方向の両端縁に長さ方向に延びるパ
ーホレーション穴２を設けたポリイミドフィルム等の基
材１の上面に、所定のリードパターン形状に成形した、
例えば厚さｔｌが３５μ程度（ｔ １Ｊ＝３５μ）の銅
箔等の導体３を接着剤４を介して接着して構成したもの
であり、上記導体３のリードパターン形状の成形は、例
えば基材１の全表面に接着剤４を介して上記銅箔等の導
体３をラミネートした後に上記パーホレーション穴２を
基準にしてホトエツチング等の加工を施して行われてい
た。(Prior Art) The TAB described above is automatic bonding using a tape-shaped film carrier, and the TAB film used here is generally known as shown in Figures 5 and 6. Molded into a predetermined lead pattern shape on the upper surface of a base material 1 such as a polyimide film having perforation holes 2 extending in the length direction on both edges in the width direction.
For example, it is constructed by bonding a conductor 3 such as a copper foil with a thickness tl of about 35μ (t 1J = 35μ) via an adhesive 4, and the lead pattern shape of the conductor 3 is formed, for example, on a base material. A conductor 3 such as the copper foil is laminated on the entire surface of the conductor 1 via an adhesive 4, and then processing such as photoetching is performed using the perforation holes 2 as a reference.
（発明が解決しようとする課題）
しかしながら、上記従来のＴＡＢ用フィルムにおいては
、その構造上、リードパターンとなる導体３の下面に接
着剤４とポリイミド樹脂等の基材１とが存在し、これら
の部材、特に接着剤４は一般に吸湿性があるため、スズ
や接着剤中の不純物等による金属のマイグレーションが
発生し、このマイグレーションによってリード間の短絡
に繋がってしまうことがあるという問題点があった。(Problem to be Solved by the Invention) However, in the conventional TAB film described above, due to its structure, an adhesive 4 and a base material 1 such as polyimide resin are present on the lower surface of the conductor 3 which becomes a lead pattern. Since the members, especially the adhesive 4, are generally hygroscopic, there is a problem in that metal migration occurs due to tin, impurities in the adhesive, etc., and this migration may lead to a short circuit between the leads. Ta.
この現象は、ＴＡＢフィルムを使用して構成した半導体
装置で、特に動作電圧の高いものに顕著に現れる。This phenomenon is particularly noticeable in semiconductor devices constructed using TAB films, especially those with high operating voltages.
なお、上記金属のマイグレーションを防止した信頼性の
高いＴＡＢ用フィルムを得るために、接着剤の純度をア
ップさせることも考えられるが、接着剤への吸湿があれ
ば、本質的な解決とはならない。In addition, in order to obtain a highly reliable TAB film that prevents the above metal migration, it is possible to improve the purity of the adhesive, but if the adhesive absorbs moisture, this is not a fundamental solution. .
本発明は上記に鑑み、ポリイミド樹脂等の基材や接着剤
による金属のマイグレーションの発生をを完全に防止し
た信頼性の高いＴＡＢ用フィルムを提供することを目的
とする。In view of the above, an object of the present invention is to provide a highly reliable TAB film that completely prevents metal migration caused by a base material such as a polyimide resin or an adhesive.
（課題を解決するための手段）
上記目的を達成するため、本発明におけるＴＡＢ用フィ
ルムは、導体となる金属箔を連続したテープ状に形成し
、この幅方向の両側縁に長さ方向に延びるパーホレーシ
ョン穴を設けるとともに、内部にリードパターンを一体
に形成したものである。(Means for Solving the Problems) In order to achieve the above object, the TAB film of the present invention is provided by forming a metal foil serving as a conductor into a continuous tape shape, and extending in the length direction on both sides of the width direction. In addition to providing perforation holes, a lead pattern is integrally formed inside.
（作 用）
上記のように構成した本発明によれば、ＴＡＢ用フィル
ムは、ポリイミドフィルム等の基材や接着剤を使用する
ことがなく、導体となる金属箔にパーホレーション穴及
びリードパターンが形成され、この金属箔自体の剛性で
このリードパターンを保持することにより、ＴＡＢ用フ
ィルムとしての機能を損なうことな（、上記基材や接む
剤に基づくマイグレーションの発生を完全の防止するこ
とができる。(Function) According to the present invention configured as described above, the TAB film does not use a base material such as a polyimide film or an adhesive, and has perforation holes and lead patterns on the metal foil that serves as a conductor. is formed, and by holding this lead pattern with the rigidity of the metal foil itself, the function as a TAB film is not impaired (and the occurrence of migration due to the base material and contacting agent is completely prevented). I can do it.
（実施例） 以ｆ１本発明の一実施例を図面を参照して説明する。(Example) Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図及び第２図は、ＴＡＢ用フィルム１０を示すもの
で、このＴＡＢ用フィルム１０は、導体となる、例えば
４２７０イ、銅、銅合金又は鉄合金等の金属箔１１を連
続したテープ状に形成するとともに、この幅方向の両側
縁にパーホレーション穴１２を設け、更に内部にリード
パターン１３を、例えばホトエツチング等により一体に
形成して構成したものである。1 and 2 show a TAB film 10. This TAB film 10 is made of a continuous tape-shaped metal foil 11 made of, for example, 4270I, copper, copper alloy, or iron alloy, which becomes a conductor. In addition, perforation holes 12 are provided on both sides in the width direction, and a lead pattern 13 is integrally formed inside by, for example, photo-etching.
この金属箔１１の厚さｔ２は、この内部に形成した上記
リードパターン１３の形状を該金属箔１１自体の剛性で
保持できるよう、例えば５０μ程度（ｔ ２−＝５０μ
）となして、従来の上記導体３の一般的な厚さｔ１＝−
３５μより厚くしている。The thickness t2 of the metal foil 11 is, for example, about 50μ (t2-=50μ) so that the shape of the lead pattern 13 formed inside can be maintained by the rigidity of the metal foil 11 itself.
), the general thickness t1 of the conventional conductor 3 is -
It is made thicker than 35μ.
なお、上記のように、リードパターン１３の厚さｔ２が
５０μ程度と従来のものよりもがなり厚いため、このイ
ンナーリードボンディングの際のボンディングツールの
追従性を考え、このリードパターン１３の先端部分にハ
ーフエツチングを施して、部分的に従来と同様３５μ程
度の薄さにするようにしていも良い。As mentioned above, the thickness t2 of the lead pattern 13 is about 50μ, which is thicker than the conventional one. Half-etching may be applied to the film to partially reduce the thickness to about 35 μm as in the conventional method.
この使用方法は、例えば第３図及び第４図に示すように
、ＩＣチップ１４のパッド部と上記リードパターン１３
の先端のインナーリード部とをボンディングして、リー
ドパターン１３をその起端部から切り離し、矩形状で表
面を絶縁したアルミニウム製等のアウターリード保持台
１５の周囲に固若したアウターリード１６とこのリード
パターン１３の起端のアウターリード部とをボンディン
グし、必要に応じてＩｃチップ１４の表面にここを保護
するためのエポキシ樹脂１７等をボッチングした後、封
止樹脂１８で樹脂封止して、配線基板１９に取付けて使
用するのである。In this usage method, for example, as shown in FIGS. 3 and 4, the pad portion of the IC chip 14 and the lead pattern 13 are
The lead pattern 13 is separated from its starting end by bonding with the inner lead part at the tip of the outer lead 16, which is fixed around an outer lead holding stand 15 made of rectangular aluminum or the like with an insulated surface. After bonding with the outer lead part at the starting end of the lead pattern 13 and, if necessary, botching the surface of the IC chip 14 with epoxy resin 17 or the like to protect it, the resin is sealed with a sealing resin 18. , and is used by being attached to the wiring board 19.
このように使用することにより、ＴＡＢアセンブリに高
い信頼性と実装の自動化の便を図るようにすることがで
きる。Used in this manner, the TAB assembly can be made to have high reliability and ease of assembly automation.
なお、上記アウターリード保持台を使用することなく、
配線基板上に設けたはんだ層等に直接リードパターンの
アウターリード部をボンディングしても良いことは勿論
である。In addition, without using the above outer lead holding stand,
Of course, the outer lead portion of the lead pattern may be directly bonded to a solder layer or the like provided on the wiring board.
本発明は上記のように、耐湿性を阻害する接着剤やポリ
イミド樹脂等の基材を使用せずにＴＡＢ用フィルムを構
成したので、この接着剤や基材による金属のマイブレー
ションの発生を完全に防止して、リード間での上記マイ
ブレーションに基づく短絡の発生を抑えることができる
。As described above, in the present invention, the TAB film is constructed without using adhesives or base materials such as polyimide resins that inhibit moisture resistance, so metal migration caused by adhesives or base materials can be completely prevented. This can suppress the occurrence of short circuits due to migration between the leads.
しかも、このＴＡＢ用フィルムは、ホトエチングにより
一括してパターン加工ができるため、価格の低減を図る
とともに、このフィルムの幅については加工上の制約が
なく、最も効率的な寸法を採用することができるといっ
た効果がある。Moreover, this TAB film can be patterned all at once by photo-etching, which reduces the price, and there are no processing restrictions on the width of this film, making it possible to adopt the most efficient dimensions. There is an effect like this.
第１図は本発明の一実施例のＴＡＢ用フィルムを示す平
面図、第２図は第１図の■−■線断面図、第３図は本発
明を使用した半導体装置を示す平面図、第４図は第３図
のＩＶ−ＩＶ線断面図、第５図は従来のＴＡＢ用フィル
ムを示す平面図、第６図は第５図のＶｌ−Ｖｌ線断面図
である。
１０・・・ＴＡＢ用フィルム、１１・・・金属箔、１２
・・・パーホレーション穴、１３・・・リードパターン
、１４・・・ＩＣチップ。
出願人代理人 佐 藤 −雄
第１図
第２図
第３図FIG. 1 is a plan view showing a TAB film according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIG. 3 is a plan view showing a semiconductor device using the present invention. 4 is a sectional view taken along the line IV--IV in FIG. 3, FIG. 5 is a plan view showing a conventional TAB film, and FIG. 6 is a sectional view taken along the line Vl--Vl in FIG. 10... TAB film, 11... Metal foil, 12
...Perforation hole, 13...Lead pattern, 14...IC chip. Applicant's agent Mr. Sato Figure 1 Figure 2 Figure 3
Claims (1)
方向の両側縁に長さ方向に延びるパーホレーション穴を
設けるとともに、内部にリードパターンを一体に形成し
たことを特徴とするＴＡＢ用フィルム。For TAB, a metal foil serving as a conductor is formed into a continuous tape shape, and perforation holes extending in the length direction are provided on both sides of the tape in the width direction, and a lead pattern is integrally formed inside. film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63162166A JPH0210846A (en) | 1988-06-29 | 1988-06-29 | Film for tab |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63162166A JPH0210846A (en) | 1988-06-29 | 1988-06-29 | Film for tab |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0210846A true JPH0210846A (en) | 1990-01-16 |
Family
ID=15749278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63162166A Pending JPH0210846A (en) | 1988-06-29 | 1988-06-29 | Film for tab |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0210846A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5269198A (en) * | 1990-11-27 | 1993-12-14 | Kabushiki Kaisha Daikin Seisakusho | Liquid viscous damper |
-
1988
- 1988-06-29 JP JP63162166A patent/JPH0210846A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5269198A (en) * | 1990-11-27 | 1993-12-14 | Kabushiki Kaisha Daikin Seisakusho | Liquid viscous damper |
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