JP2546431B2 - Film carrier tape - Google Patents

Description

TECHNICAL FIELD The present invention relates to a film carrier tape, and more particularly to a film carrier tape used for manufacturing a semiconductor device.

[Conventional technology]

Conventionally, a film carrier tape of this kind is made of polyimide or the like having a sprocket hole 2 for carrying and positioning, a device hole 5 for inserting a semiconductor chip 11 and an outer lead hole 6 under an outer lead 8 as shown in FIG. A metal foil such as copper is adhered onto the insulating film 1, and the metal foil is etched to form the inner lead 3, the outer lead 8 and the electrical selection pad 4 having a desired shape.

As shown in FIGS. 7 (a) and 7 (b), a semiconductor device manufacturing method using this film carrier tape prepares a semiconductor chip 11 in which bumps 12 which are metal projections are provided on electrode terminals in advance. Then, the inner leads 3 on the film carrier tape and the bumps 12 on the semiconductor chip 11 are aligned, and inner leads are bonded by a thermocompression bonding method or a eutectic method, and the electrical selection pad 4 in the state of the film carrier tape. Conduct electrical selection and bias test by contacting the contactor with. Here, the suspender 7, which is the frame of the insulating film 1, functions to prevent deformation of the inner leads 3 and the outer leads 8. It is generally practiced to pot the resin 13 to seal the resin to improve reliability and mechanically protect it. After that, the outer lead 8 is cut into a desired length, and then, as shown in FIG.
The outer lead 8 is outer lead bonded to the bonding pad 17 on the printed circuit board 10. Since semiconductor devices using these film carrier tapes can be bonded at one time regardless of the number of leads, the speed is fast, and they can be transported and positioned using sprocket holes and can be used in reel form. It has the advantage that it is easy to automate the work and that a thin insulating film and a metal foil are used, so that a very thin, small and lightweight semiconductor device can be provided.

[Problems to be Solved by the Invention]

In the conventional film carrier tape described above, when potting with a resin for improving reliability and mechanical protection is performed, the portion where the outer lead hole exists has the end portion of the suspender as shown in FIG. 7 (a). Therefore, the resin does not flow out further due to the surface tension, that is, it does not flow into the outer lead hole, but in the portion where the outer lead hole does not exist, that is, the portion of the tie bar 9, the resin flows out onto the tie bar 9 as shown in FIG. 7 (b). Therefore, the film thickness of the sealing resin 13 potted on the semiconductor chip becomes unstable.
Further, when the tie bar is cut for mounting on a printed circuit board or the like, the sealing resin 13 that has flowed out onto the tie bar 9 increases the substantial film thickness of the insulating film 1 of the tie bar 9. , The cutting die wears quickly because it is hard,
In some cases, it has the drawback of leading to damage. In order to prevent this, as shown in FIG. 8, there is a method in which a solder resist 14 is applied to the outside of the region of the suspender 7 to be sealed with resin by a method such as screen printing in advance, and this is used as a resin stopper. However, in this case, the inner leads 3 made of a mask or the like are used in the screen printing process.
Or, since the outer leads 8 may be deformed, the production yield of the film carrier tape is reduced. Further, there is a drawback that the impurity ions in the solder resist 14 adversely affect the reliability.

The present invention has been made in view of the above problems, and is intended to provide a film carrier tape in which the film thickness of the resin is stable and does not shorten the life of the cutting die of the tie bar without increasing the cost. is there.

[Means for solving the problem]

The film carrier tape of the present invention is an insulating film having at least a sprocket hole for carrying and positioning, a device hole into which a semiconductor chip is inserted, and an outer lead hole provided with an outer lead for electrically connecting to the outside. A lead formed of metal and at least an electric selection pad connected to the lead, and a suspender which is a frame of the insulating film existing between the device hole and the outer lead hole and a support for the suspender. In the film carrier tape having the tie bar, the resin stopper block formed by the metal for avoiding the portion near the device hole is provided only on the suspender near the tie bar.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a film carrier tape showing a first embodiment of the present invention.

In this embodiment, the insulating film 1 having the device hole 5 of the sprocket hole 2 and the outer lead hole 6
Inner lead 3 and outer lead 8 similar to the conventional example
In addition to the electrical selection pad 4, rectangular resin stopper blocks 10 (metal pieces having the same width as the outer leads 8) are provided at four locations near the tie bar 9 at each corner of the suspender 7. When the film carrier tape provided with the resin stopper block 10 and the semiconductor chip 11 provided with the bump 12 are inner lead bonded and then potted with resin, the sealing resin 13 is sealed with the resin stopper block 10 as shown in FIG. As a result, the film cannot flow to the tie bar and the film thickness on the semiconductor chip can be maintained at a desired value. For example, suspender width 0.5mm, tie bar width 0.75mm,
An experiment was conducted using a film carrier tape with a tie bar length of 1.7 mm.
% Of the resin leaked to the entire tie bar, but when the resin stop block 10 was provided, there was almost no resin that flowed out to the tie bar, and when the suspender width was narrow, there was a slight outflow. The film thickness of the sealing resin 13 was more stable than that without the resin stopper block because it was much smaller than that without the resin block. Then tie bar 9
Also, the outer leads 8 are cut (Fig. 3) and mounted as shown in Fig. 9 as in the conventional example, but the sealing resin 13 is much less outflow than before when the tie bar 9 before mounting is cut. Therefore, the mold is not significantly deteriorated. In addition, the resin stop block has inner leads 3 and outer leads 8
Since it can be formed at the same time as the pattern such as, the cost does not increase.

FIGS. 4 and 5 are plan views showing the second and third embodiments of the present invention, respectively. The figure shows only the vicinity of the tie bar.

In the first embodiment, a plurality of resin stopper blocks, which are one rectangular piece, are used in order to enhance the effect.
The third embodiment shown in FIG. 5 has an arc shape. Since the resin stop block cannot be provided in contact with the adjacent lead or the end of the suspender 7, there is a gap between the resin stop block and the end of the lead and the suspender. In the case where it is difficult, the resin can be surely stopped by providing the blocks in double or triple as in these examples. It goes without saying that the shape and number of the resin stopping blocks are not limited to those in the embodiment.

〔The invention's effect〕

INDUSTRIAL APPLICABILITY As described above, according to the present invention, when the inner lead, the outer lead and the electric selection pad are formed by etching the metal foil on the insulating film, the resin stopper block is provided on the suspender near the tie bar at the same time. There is an effect that the life of the die used for cutting is not shortened, and the manufacturing of a semiconductor device using a film carrier tape in which the film thickness of the sealing resin is stable can be provided without increasing the cost.

[Brief description of drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention, FIG. 2 is a sectional view used for explaining a manufacturing process of a semiconductor device according to the first embodiment, and FIG. 3 is a first embodiment. A plan view of the semiconductor device used, FIGS. 4 and 5 are plan views showing second and third embodiments of the present invention, respectively. FIG. 6 is a plan view showing a conventional example, and FIGS. FIGS. 7A and 7B are sectional views for explaining a method of manufacturing a semiconductor device using a conventional example, and FIGS. 7A and 7B are views corresponding to line AA and line B-A in FIG. 6, respectively.
It is sectional drawing of a B line equivalent part. 1 ... Insulating film, 2 ... Sprocket hole, 3 ... Inner lead, 4 ... Electrical selection pad, 5 ... Device hole, 6 ... Outer lid hole, 7 ... Suspender, 8 ...
Outer leads, 9 ... Tie bar, 10 ... Resin stop block, 11 ... Semiconductor chip, 12 ... Bump, 13 ... Sealing resin, 14
… Solder resist, 15… Printed circuit board, 16… Adhesive,
17 ... Bonding pad.

Claims (1)

(57) [Claims] 1. A metal on an insulating film having at least a sprocket hole for carrying and positioning, a device hole into which a semiconductor chip is inserted, and an outer lead hole provided with an outer lead for electrically connecting to the outside by metal. A suspender that is a frame of the insulating film and has a tie bar that is a support for the suspender and that has at least the formed lead and an electric selection pad connected to the lead and that is present between the device hole and the outer lead hole. A film carrier tape having: a film carrier tape provided with a resin stopper block at the time of potting formed of the metal, avoiding a portion near the device hole only on the suspender near the tie bar. .