JPH09199631A - Structure and fabrication method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve junction reliability by moderating stress applied to a junction between a semiconductor device and a mother board keeping flexibility of a flexible wiring board by bringing an auxiliary plate coincident with the external appearance of the semiconductor device into surface contact with the flexible wiring board. SOLUTION: An auxiliary plate 15 is fixed to an active surface side or a non-active surface side of a semiconductor device 4 with an adhesive 16, and the auxiliary plate 15 and a flexible wiring board 2 are brought into surface contact. Further, the auxiliary plate 15 has a heavier weight of the semiconductor device excluding the weight of the auxiliary plate 15. Hereby, there is eliminated the loss of flexibility of the flexible wiring board 2, and there is moderated stress to a junction after a solder ball 8 melted and fixed to an external connection electrode 7 formed on the flexible wiring board 2 is joined with a connection terminal of a mother board to improve connection reliability. Deformation of the flexible wiring board 2 is corrected with the weight of the auxiliary plate 15, and hence packaging property onto the mother board is stabilized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a structure and a manufacturing method of a package in which a semiconductor element is mounted on a wiring board based on a flexible tape.

[0002]

2. Description of the Related Art In recent years, various consumer and industrial electronic devices have been rapidly reduced in size, weight, thickness, and performance due to remarkable progress in electronics technology. Furthermore, in consumer electronic devices, it is essential to provide cheaper products. In addition to thinning, fine patterning, and miniaturization of electronic components to be used, it is also necessary to provide cheaper electronic components. The situation is unavoidable.

Various types of electronic parts have been developed, and in particular, as a means for easily realizing miniaturization and high performance of the electronic parts as described above, a package such as a ball grid array is used. A form has been proposed, and among them, a package form of a ball grid array using a flexible tape as a base of a wiring board is proposed, which can provide an inexpensive package relatively easily. This uses a long flexible tape,
The TAB mounting technology is used in the reel-to-reel method, and the mounting technology called gang bonding can be used to continuously and collectively bond the semiconductor elements. Therefore, the productivity can be improved, and as a result, an inexpensive package is provided. There is an advantage that you can. On the other hand, wire bonding is a well-known mounting technique using metal wires. However, as the number of electrodes in a semiconductor element increases as metal wires are connected one by one. , Productivity will decrease. Also, single-point bonding without using metal wires is a well-known mounting technique,
Similar to wire bonding, this also reduces the productivity because the joints are connected one by one. On the other hand, since the gang bonding enables collective bonding regardless of the number of electrodes of the semiconductor element, the productivity never decreases. By the way, gang bonding is a mounting technique in which heat and pressure are applied to a bonding tool to collectively bond electrodes of a semiconductor element and leads formed on a wiring board made of a flexible tape. A package completed by a mounting technique such as TAB using a flexible tape is called a tape ball grid array, and is disclosed in JP-A-63-14455 and JP-A-63-307.
762 also proposes a structure related to this.

FIG. 2 shows a typical sectional structure of a semiconductor device called a tape ball grid array. Here, FIG.
Does not show the state of the semiconductor device which is resin-sealed with a molding agent, which is shown in FIGS. 3 and 4. FIG. 3 shows a cross-sectional structure of a semiconductor device called a tape ball grid array, which is resin-sealed by a molding agent supply method proposed in JP-A-63-14455, and FIG. 4 is shown in JP-A-63-307762. 2 is a cross-sectional structure of a semiconductor device called a tape ball grid array, which is resin-sealed by the method of supplying a molding agent proposed in the above.

In FIG. 2, reference numeral 2 denotes a flexible wiring board, which is based on a flexible material such as polyimide or polyester. A wiring pattern 3 is formed on one surface of the flexible wiring board 2. Reference numeral 4 is a semiconductor element, and 5 is an electrode of the semiconductor element 4. Leads 6 electrically connected to the electrodes 5 of the semiconductor element 4 are formed at one end of the wiring pattern 3 by the number of the electrodes 5 of the semiconductor element 4. The leads 6 are formed so as to overhang in a device hole 9 provided in the center of the flexible wiring board 2 and not to short-circuit to the edge of the semiconductor element 4 when the semiconductor element 4 is mounted. The other end of the wiring pattern 3 is connected to an external connection electrode 7 which is formed on one surface of the flexible wiring board 2 and is planarly arranged at a constant interval on the same surface as the wiring pattern 3. The tips of the leads 6 are collectively joined to the electrodes 5 of the semiconductor element 4 by gang bonding. Reference numeral 11 denotes a solder resist, which is protected by the solder resist 11 except at least the electrodes 7 for external connection. Reference numeral 8 is a solder ball mounted on the external connection electrode 7, and has a role of electrically relaying the external connection electrode 7 and the connection terminal of the motherboard. Actually, the solder balls 8 mounted on the external connection electrodes 7 are soldered to the connection terminals of the motherboard by reflow.

The semiconductor element 4 thus mounted on the flexible wiring board 2 is resin-sealed with a molding agent in order to protect it from the external environment. Various methods have been proposed as a method of supplying a molding agent.
The cross-sectional structure of the semiconductor device 1 formed by the molding agent supply system proposed by No. 14455 will be described with reference to FIG. In FIG. 3, detailed description of the same reference numerals as those in FIG. 2 is omitted. 10 is a molding agent, and the molding agent 10 is supplied by a transfer molding method using a mold, and not only the semiconductor element 4 but also the entire surface of the flexible wiring board 2 and the wiring pattern 3 except the cross section is molded. It is resin-sealed at 10. Reference numeral 19 denotes a contact terminal, which is used when the wiring pattern 3 is formed.
Is also formed so that the upper portion is exposed when the resin is sealed with the molding agent 10. Here, the contact terminals 19 are not the solder balls but the flexible wiring board 2
Copper, nickel, and gold are sequentially stacked on the copper foil patterned as described above, and are formed higher than the wiring pattern 3. The connection between the contact terminal 19 and the connection terminal 13 of the motherboard 12 is performed by, for example, the contact terminal 19 or the motherboard 12
The solder paste or the like is supplied to the connection terminal 13 of No. 1 and the two are solder-joined.

The cross-sectional structure of the semiconductor device 1 formed by the molding agent supply system proposed in JP-A-63-307762 will be described with reference to FIG. In FIG.
Detailed description of the same reference numerals as those in FIG. 2 is omitted. In FIG. 4, the entire surface of the semiconductor element 4 and a part of the flexible wiring board 2 are resin-sealed with a molding agent 10. Further, like the semiconductor device 1 formed by the method of supplying a molding agent proposed in Japanese Patent Laid-Open No. 63-14455, the entire surface other than the cross section of the flexible wiring board 2 and the wiring pattern 3 is resin-sealed with the molding agent 10. A stopped structure has also been proposed as an example. JP-A-63-307762
The transfer molding method using a mold is adopted as an example of the method of supplying the molding agent 10 proposed in (1). External connection electrodes 7 are integrally formed on the wiring pattern 3, and solder balls 8 are fixed to the external connection electrodes 7. The connection with the connection terminal of the mother board is made by melting the solder balls 8 and fixing them.

In any case, the structure of the semiconductor device 1 is such that the entire surface of the semiconductor element 4 and the entire surface or a part of the flexible wiring board 2 are resin-sealed with the molding agent 10.

[0009]

A problem of a semiconductor device called a tape ball grid array described in the prior art will be described. Broadly speaking, there are problems regarding mountability when the semiconductor device is mounted on the motherboard by reflow and problems regarding connection reliability after the semiconductor device is mounted on the motherboard by reflow. Both are disclosed in JP-A-63-14455 and JP-A-63-307.
This is a problem to be raised when the molding agent supply system proposed in 762 is adopted.

First, regarding a problem regarding mountability when a semiconductor device is mounted on a mother board by reflow, FIG.
Will be described using. In FIG. 5, reference numeral 1 denotes a semiconductor device, which is a structure of the semiconductor device 1 based on a flexible wiring board 2 having flexibility, such as a polyimide tape or a polyester tape, so that a rigid wiring board such as a ceramics wiring board or The wiring board itself is very easily warped as compared with the glass epoxy wiring board. In particular, JP-A-63-307
When resin sealing is performed by the method for supplying a molding agent proposed in 762, one surface of the flexible wiring substrate 2 on which the external connection electrodes 7 are arranged in a plane, particularly the opposite surface on which the external connection electrodes 7 are located. The molding agent 10 does not exist in the upper range. Therefore, when the flexible wiring board 2 is warped, the warp cannot be corrected. Therefore, as shown in FIG. 5, a gap 1 is formed between the connection terminal 13 of the mother board 12 and the solder ball 8 of the semiconductor device 1.
4 becomes possible, and reliable soldering by reflow becomes impossible, which causes a connection failure.

Next, a problem relating to the connection reliability after the semiconductor device is mounted on the mother board by reflow will be described with reference to an enlarged cross-sectional view of a main part of FIG. In FIG.
When resin molding is performed by the method of supplying a molding agent proposed in Japanese Patent Laid-Open No. 63-14455, the molding agent 10 is used to mold everything except the cross section of the flexible wiring board 2 and the wiring pattern 3. Therefore, although the flexible wiring board 2 was flexible before the resin sealing, once the resin is sealed with the molding agent 10,
Flexibility is lost. If the contact terminals 19 are joined to the connection terminals 13 of the motherboard 12 without impairing the flexibility of the flexible wiring board 2, even if stress is applied to the joint portion, the flexibility of the flexible wiring board 2 relieves the stress, and The stress is less likely to be directly concentrated on the part, and as a result, the connection reliability is improved. However, as shown in FIG. 6, the contact terminals 19 formed on the flexible wiring board 2 whose flexibility has been once impaired.
When the and the connection terminal 13 of the mother board 12 are joined by using, for example, the solder paste 21, stress is directly applied to the joined portion, and in the worst case, the crack 20 is reached. There are various kinds of stress applied to the joint portion, and there are thermal stress, mechanical stress, and the like.

Therefore, the present invention can correct the warp of the flexible wiring board without deteriorating the flexibility of the flexible wiring board in the semiconductor device called tape ball grid array, and as a result, the mountability on the mother board is improved and An object of the present invention is to provide a semiconductor device capable of improving connection reliability.

[0013]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and its contents will be described below with reference to the embodiments shown in the drawings.

In the semiconductor device according to the first aspect of the present invention, in order to prevent the flexibility of the flexible wiring board used in the semiconductor device from being impaired and to correct the warp of the flexible wiring board, the auxiliary plate is formed on the flexible wiring board. It is a structure characterized by being in surface contact.

According to a second aspect of the present invention, in addition to the characteristic features of the first aspect, the semiconductor device has a structure in which an auxiliary plate is fixed to at least the active surface side or the inactive surface side of the semiconductor element. is there.

According to a third aspect of the present invention, in addition to the features of the first and second aspects described above, the auxiliary plate fixed to at least the active surface side or the inactive surface side of the semiconductor element is the weight of the auxiliary plate. The structure is characterized in that it is heavier than the weight of the semiconductor device excluding.

According to another aspect of the semiconductor device of the present invention, a step of forming a wiring board made of a flexible tape, a step of mounting a semiconductor element on the wiring board made of the flexible tape, an active surface side of the semiconductor element and a semiconductor. The manufacturing method includes a step of resin-sealing the vicinity of the element, and a step of fixing an auxiliary plate to at least the active surface side or the inactive surface side of the semiconductor element.

[0018]

Therefore, according to the semiconductor device of the first aspect, since the auxiliary plate conforming to the outer shape of the semiconductor device is only in surface contact with the flexible wiring board, the flexibility of the flexible wiring board is not impaired. . Therefore, the stress applied to the joint between the semiconductor device and the mother board can be relieved, and the connection reliability is significantly improved.

In addition to this, according to the semiconductor device of the second aspect, since the auxiliary plate is fixed only to at least the active surface side or the inactive surface side of the semiconductor element, the flexibility of the flexible wiring board is impaired. Therefore, the operation according to claim 1 can be realized more easily.

Further, according to the semiconductor device of the third aspect, since the auxiliary plate is heavier than the weight of the semiconductor device excluding the weight of the auxiliary plate, it becomes a weight for mounting the semiconductor device on the mother board and is flexible. The warp of the wiring board can be corrected and the mountability can be further improved.

According to the semiconductor device of the fourth aspect, the manufacturing method is capable of easily and maximally extracting the actions of the first to third aspects.

[0022]

1 is a sectional view schematically showing an embodiment of the present invention. In FIG. 1, 1 is a semiconductor device and 2 is a flexible wiring board. The flexible wiring board 2 is made of a flexible material such as polyimide or polyester. A wiring pattern 3 is formed on one surface of the flexible wiring board 2. A lead 6 electrically connected to the electrode 5 of the semiconductor element 4 is formed at one end of the wiring pattern 3, and the lead 6 overhangs in a device hole 9 provided in the center of the flexible wiring board 2. doing. The bumps 1 connected to the electrodes 5 of the semiconductor element 4 are attached to the tips of the leads 6.
8 are provided. Reference numeral 7 is an external connection electrode, which is arranged on the same surface as the wiring pattern 3 formed on the flexible wiring substrate 2 in a plan view at regular intervals. The external connection electrode 7 may have any shape, and a typical shape is a round shape or a square shape. In this embodiment, the round shape is adopted. Reference numeral 8 is a solder ball mounted on the external connection electrode 7, and is soldered to the connection terminal of the mother board by reflow. Therefore, the solder balls 8 play a role of establishing electrical connection between the semiconductor device 1 and the mother board. 10 is a molding agent, which is resin-sealed around the active surface of the semiconductor element 4 and the vicinity of the joint between the electrode 5 of the semiconductor element 4 and the bump 18 by a coating method using a dispenser or a coating method using a printing machine. I do. Reference numeral 11 is a solder resist, at least the external connection electrode 7 is exposed, and the other parts are protected by the solder resist 11. The external connection electrode 7 needs to be exposed in order to mount the solder ball 8. Reference numeral 15 denotes an auxiliary plate, which is fixed to at least the non-active surface side of the semiconductor element 4 with an adhesive 16. The material of the auxiliary plate 15 is, for example, metal or plastic resin, and the recess 17 wider than the outer shape of the semiconductor element 4 is provided. An adhesive 16 is supplied to the recess 17 to fix the auxiliary plate 15 to the non-active surface side of the semiconductor element 4 in the figure. The auxiliary plate 15 may be fixed to the active surface side of the semiconductor element 4. The auxiliary plate 15 must be heavier than the weight of the semiconductor device 1 excluding the weight of the auxiliary plate 15. By doing so, even if the flexible wiring board 2 is slightly warped, the weight of the auxiliary plate 15 can correct the warpage of the flexible wiring board 2. The thickness of the auxiliary plate 15 is not particularly specified.

By the way, the above-mentioned semiconductor device 1 is completed through the manufacturing steps and manufacturing methods described below.
First, a hole called a device hole 9 is formed in a flexible tape such as polyimide or polyester using a press. The size of the device hole 9 is determined by the size of the semiconductor element 4.

Next, a copper foil is laminated on the flexible tape having the device hole 9 with an adhesive.
The thickness of the flexible tape is, for example, from 25 μm to 250
μm wide, the thickness is set at 25μm intervals,
Select according to purpose and application. The width of the flexible tape is, for example, 35 mm, 48 mm, or 70 mm, which is also selected depending on the purpose and application. The thickness of the copper foil is, for example, 18 μm, 25 μm, or 35 μm, and is selected depending on the purpose and application. The width of the copper foil is determined by the width of the flexible tape and the like.

Next, the copper foil is patterned by etching to form the wiring pattern 3 and the external connection electrode 7. Needless to say, before etching, the copper foil is subjected to a treatment such as exposure and development at a predetermined position so that the wiring pattern 3 and the external connection electrode 7 are formed. A lead 6 electrically connected to the electrode 5 of the semiconductor element 4 is formed at one end of the wiring pattern 3 thus formed by etching. The lead 6 overhangs in the device hole 9. Further, it is formed so as not to short-circuit with the edge of the semiconductor element 4. Next, bumps 18 for connecting to the electrodes 5 of the semiconductor element 4 are formed at the tips of the leads 6. The bump 18 is configured to be connected to the electrode 5 of the semiconductor element 4 by providing a protrusion at the tip of the lead 6, and is short-circuited outside the range to be connected to the electrode 5 of the semiconductor element 4 and to the edge of the semiconductor element 4. It is formed by half-etching the lead 6 in the range.
Here, it goes without saying that all the copper foil surfaces other than the half-etched leads 6 are covered so as not to be etched.

Next, parts other than the external connection electrode 7 are protected by a solder resist 11. Since the solder balls 8 are mounted on the external connection electrodes 7, it is necessary to expose them. Thereafter, the copper foil on which the bumps 18 are formed is plated with nickel, and the nickel plating is plated with gold. At this time, the conductor surfaces other than the bumps 18 are also similarly processed.
Nickel plating and gold plating are applied. In this way, the flexible wiring board 2 is formed.

Next, the bump 18 formed at the tip of the lead 6 and the electrode 5 of the semiconductor element 4 are connected. The connection method is called gang bonding, and heat and pressure are applied to the bonding tool to crush the bumps 18 and the semiconductor element 4
The electrode 5 is joined. The heat and pressure applied to the bonding tool differ depending on the thickness of the bumps 18 formed at the tips of the leads 6, the number of electrodes 5 of the semiconductor element 4, and the like, so that appropriate bonding conditions are set while performing the condition setting. Further, since the flexible wiring board 2 is formed on the long tape, the semiconductor element 4 can be mounted by the reel-to-reel method. Therefore, the semiconductor element 4 is continuously mounted on the flexible wiring board 2,
Since the so-called TAB mounting method is possible, the productivity is improved, and as a result, the inexpensive semiconductor device 1 can be easily provided. In this embodiment, the bump 18 connected to the electrode 5 of the semiconductor element 4 is provided at the tip of the lead 6 formed at one end of the wiring pattern 3 formed on the flexible wiring board 2. A bump may be provided on the electrode 5.

Next, in order to protect the active surface of the semiconductor element 4 mounted on the flexible wiring board 2 and the vicinity of the joint between the electrode 5 of the semiconductor element 4 and the bump 18 from the external environment, a resin is applied with a molding agent 10. Seal it. The vicinity of the joint portion here means not only the joint portion between the electrode 5 of the semiconductor element 4 and the bump 18, but also at least the cross section of the semiconductor element 4 and the range in which the leads 6 overhang in the device hole 9. Say. A liquid resin is adopted as the mold resin 10, and the mold resin 10 is supplied by a coating method using a dispenser or a coating method using a printing machine.

Next, the auxiliary plate 15 is attached to at least the semiconductor element 4.
The adhesive 16 is used to fix the non-active surface side of the. Auxiliary plate 1
A recess 17 slightly larger than the outer shape of the semiconductor element 4 is formed in the center of the semiconductor chip 5.
Is supplied to fix the auxiliary plate 15 to the non-active surface side of the semiconductor element 4. The outer shape and the depth of the recess 17 are determined by the outer shape and the thickness of the semiconductor element 4 to be mounted. At least when the semiconductor device 1 is mounted on the mother board, the auxiliary plate 15 is in surface contact with the flexible wiring board 2. It becomes important to do. The auxiliary plate 15 may be fixed to the active surface side of the semiconductor element 4. Further, the adhesive 16 is a thermosetting resin, and is required to have heat resistance sufficient to withstand a reflow temperature when the semiconductor device 1 is mounted on a mother board. By the way, the peak value of the reflow temperature is around 240 degrees, and the time is about 10 seconds. Therefore, the adhesive 16 that can withstand this environment is used, and in addition, the material of the non-active surface side of the semiconductor element 4 and the material of the auxiliary plate 15 and the adhesive 16 having good adhesion under any environment are adopted. The same material as the molding agent 10 may be adopted. In this way, the auxiliary plate 15 fixed to the non-active surface side of the semiconductor element 4 is not fixed to the flexible wiring board 2 but is in surface contact therewith. By doing so, the flexibility of the flexible wiring board 2 is not impaired. Further, since the auxiliary plate 15 is heavier than the weight of the semiconductor device 1 excluding the weight of the auxiliary plate 15, even if the flexible wiring board 2 is warped, the auxiliary plate 15 functions as a weight and corrects the warp. It is also possible to do.

Finally, the solder balls 8 are melted and fixed onto the external connection electrodes 7. Even when the solder balls 8 are melted and fixed, as in the case of mounting the semiconductor device 1 on the motherboard,
Joined by reflow. The reflow temperature at this time is as described above. As described above, according to the embodiments of the present invention, the warp of the flexible wiring board can be easily corrected without impairing the flexibility of the flexible wiring board in the semiconductor device called a tape ball grid array, and as a result, the semiconductor It is possible to provide a semiconductor device that can improve mountability when mounting the device on a motherboard and at the same time can improve connection reliability after mounting the semiconductor device on the motherboard.

[0031]

As is apparent from the above description, the present invention is a semiconductor device called a tape ball grid array, in which at least the active surface side or the non-side surface of a semiconductor element mounted on a flexible wiring board using a flexible tape as a wiring board. Since the auxiliary plate is fixed to the active surface side with an adhesive, the auxiliary plate and the flexible wiring board are in surface contact with each other, and the auxiliary plate has a structure heavier than the weight of the semiconductor device excluding the weight of the auxiliary plate. It is possible to obtain the effect like.

(1) Since the flexibility of the flexible wiring board is not impaired at all, after the solder balls fused and fixed to the external connection electrodes formed on the flexible wiring board are joined to the connection terminals of the motherboard, The stress on the joint can be relieved and the connection reliability is greatly improved.

(2) Since the auxiliary plate is heavier than the weight of the semiconductor device excluding the weight of the auxiliary plate, even if the flexible wiring board is warped, the warp can be corrected by the weight of the auxiliary plate, and the auxiliary wiring to the motherboard. The mountability is extremely stable.

(3) From the above, it is possible to easily provide a semiconductor device capable of significantly improving the connection reliability and mountability between the semiconductor device and the motherboard. Further, since the auxiliary plate is fixed to at least the non-active surface side of the semiconductor element, it is said that a sufficient heat dissipation effect can be obtained by using a metal auxiliary plate and further fixing the auxiliary plate with a conductive adhesive. There is no end.

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing an embodiment of the present invention.

FIG. 2 is a typical cross-sectional structural diagram of a semiconductor device called a tape ball grid array.

FIG. 3 is a cross-sectional structural view of a semiconductor device called a tape ball grid array, which is resin-sealed by a molding agent supply method proposed in Japanese Patent Laid-Open No. 63-14455.

FIG. 4 is a sectional structural view of a semiconductor device called a tape ball grid array, which is resin-sealed by a method of supplying a molding agent proposed in Japanese Patent Laid-Open No. 63-307762.

FIG. 5 is a cross-sectional view illustrating a problem regarding mountability when a semiconductor device is mounted on a mother board by reflow.

FIG. 6 is an enlarged cross-sectional view of a main part of a problem regarding connection reliability after a semiconductor device is mounted on a motherboard by reflow.

[Explanation of symbols]

 1 Semiconductor Device 2 Flexible Wiring Board 3 Wiring Pattern 4 Semiconductor Element 5 Electrode 6 Lead 7 External Connection Electrode 8 Solder Ball 9 Device Hole 10 Molding Agent 11 Solder Resist 12 Motherboard 13 Connection Terminal 14 Gap 15 Auxiliary Plate 16 Adhesive 17 Recess 18 Bump 19 Contact terminal 20 Crack 21 Solder paste

Claims (4)

[Claims] 1. A wiring board made of a flexible tape is used as a base, a wiring pattern is formed on one surface of the wiring board made of the flexible tape, and electrodes for external connection are planarly arranged on the same surface as the wiring pattern. One end of the wiring pattern is connected to the electrode of the semiconductor element, the other end is connected to the electrode for external connection,
In a semiconductor device in which at least the active surface side of the semiconductor element and the vicinity of the semiconductor element are resin-sealed, the wiring board made of the flexible tape and an auxiliary plate are in surface contact with each other. Construction. 2. The semiconductor device according to claim 1, wherein
The structure of a semiconductor device, wherein the auxiliary plate is fixed to at least an active surface or an inactive surface of the semiconductor element. 3. The semiconductor device according to claim 1, wherein
The structure of the semiconductor device, wherein the auxiliary plate is heavier than the weight of the semiconductor device excluding the weight of the auxiliary plate. 4. A step of bonding one end of a wiring pattern formed on the wiring board of a wiring board made of a flexible tape to an electrode of a semiconductor element, and at least the active surface side of the semiconductor element and the vicinity of the semiconductor element. A method of manufacturing a semiconductor device, comprising: a step of sealing with a molding resin; and a step of fixing an auxiliary plate to at least the active surface side or the inactive surface side of the semiconductor element.