JP2626081B2 - Film carrier semiconductor device - Google Patents
Film carrier semiconductor deviceInfo
- Publication number
- JP2626081B2 JP2626081B2 JP1218967A JP21896789A JP2626081B2 JP 2626081 B2 JP2626081 B2 JP 2626081B2 JP 1218967 A JP1218967 A JP 1218967A JP 21896789 A JP21896789 A JP 21896789A JP 2626081 B2 JP2626081 B2 JP 2626081B2
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- semiconductor device
- lead
- semiconductor chip
- suspender
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はフィルムキャリヤ半導体装置に関し、特に多
ピンのフィルムキャリヤ半導体装置に関する。Description: FIELD OF THE INVENTION The present invention relates to a film carrier semiconductor device, and more particularly to a multi-pin film carrier semiconductor device.
従来のフィルムキャリヤ方式による半導体装置は、第
５図（ａ），（ｂ）に示す如く、搬送及び位置決め用の
スプロケットホール1aと、半導体チップ2aが入る開孔部
であるデバイスホール3aを有するポリイミド等の絶縁フ
ィルム上に銅等の金属箔を接着し、金属箔をエッチング
等により、所定の形状のリード4aと電気選別のためのパ
ッド5aとを形成したフィルムキャリヤテープ6aとを、あ
らかじめ電極端子上に金属突起物であるバンプ7aを設け
た半導体チップ2aとを準備し、次にフィルムキャリヤテ
ープのリード4aと半導体チップのバンプ端子7aとを熱圧
着法又は共晶法等によりインナーリードボンディング
（以下ILB）し、フィルムキャリヤテープの状態で電気
選別用パッド5a上に接触子を接触させて電気選別やバイ
アス試験を実施することにより製造される半導体装置で
ある。ここで、リード4aの変形防止用として絶縁フィル
ムの枠であるサスペンダ8aをあらかじめフィルムキャリ
ヤテープに設けることや信頼性向上及び機械的保護のた
め第７図に示すように樹脂9aをポッティングして樹脂封
止を行う場合もある。As shown in FIGS. 5 (a) and 5 (b), a conventional film carrier type semiconductor device has a polyimide film having a sprocket hole 1a for transport and positioning and a device hole 3a which is an opening for a semiconductor chip 2a. A metal foil such as copper is adhered onto an insulating film such as a copper foil, and the metal foil is etched by etching or the like. A semiconductor chip 2a provided with bumps 7a as metal projections thereon is prepared, and then the leads 4a of the film carrier tape and the bump terminals 7a of the semiconductor chip are subjected to inner lead bonding (thermocompression bonding or eutectic method). (Hereinafter referred to as ILB), and a contact is made on the electrical selection pad 5a in the state of a film carrier tape to perform electrical selection and a bias test. A semiconductor device to be manufactured. Here, a suspender 8a, which is a frame of an insulating film, is provided in advance on the film carrier tape to prevent deformation of the lead 4a, and the resin 9a is potted as shown in FIG. 7 for improving reliability and mechanical protection. In some cases, sealing is performed.
上述のようなフィルムキャリヤ半導体装置を実装する
場合は、リード4aを所定の長さに切断し、ついで第８図
に示すように、例えばプリント基板11aに接着材10aによ
り半導体チップ2aを固着後、リード4aをプリント基板上
のボンディングパッド12aにアウターリードボンディン
グ（以下OLB）して実施することができる。When mounting the film carrier semiconductor device as described above, the lead 4a is cut to a predetermined length, and then, as shown in FIG. 8, for example, after fixing the semiconductor chip 2a to the printed board 11a with an adhesive 10a, Outer lead bonding (OLB) can be performed by bonding the leads 4a to the bonding pads 12a on the printed circuit board.
これらのフィルムキャリヤ半導体装置は、ボンディン
グがリード数と無関係に一度で可能であるため作業スピ
ードが速いこと、フィルムキャリヤテープを使用するた
めの作業の自動化が容易である等の利点を有している。These film carrier semiconductor devices have advantages such as a high working speed because bonding can be performed once regardless of the number of leads, and easy automation of work for using a film carrier tape. .
上述した従来のフィルムキャリヤ半導体装置は、フィ
ルムキャリヤテープの厚さが通常125μｍと極めてうす
いためにテープが反ってしまうので、最近の実装方法で
あるOLBパッド上に半田ペースト等をスクリーン印刷等
で塗布し、半導体パッケージを接着材で固定して、リフ
ロー炉の中で半田ペーストを溶かしてリードとOLBパッ
ドを半田付するというリフローの際、リードがテープの
反りにより浮き、リードとOLBパッドの間隔があいてし
まい、うまく半田付されないという欠点がある。また、
多ピンになると半導体装置が大きくなりテープの反りに
よるリードの浮きが顕著になる。これにより、一般的な
フィルムキャリヤ半導体装置の実装方法は、加熱ツール
により、リードを押圧しながら行うことが多いが、作業
性、量産性などの点でリフローに劣る。In the conventional film carrier semiconductor device described above, the thickness of the film carrier tape is extremely thin, usually 125 μm, and the tape warps, so solder paste etc. is applied on the OLB pad, which is a recent mounting method, by screen printing etc. Then, fix the semiconductor package with an adhesive, melt the solder paste in a reflow oven and solder the lead and OLB pad.At the time of reflow, the lead floats due to warpage of the tape, and the distance between the lead and OLB pad is reduced. There is a drawback that it does not solder properly. Also,
As the number of pins increases, the size of the semiconductor device increases, and the floating of the leads due to the warpage of the tape becomes remarkable. Accordingly, a general mounting method of the film carrier semiconductor device is often performed while pressing the lead with a heating tool, but is inferior in reflow in terms of workability, mass productivity, and the like.
本発明のフィルムキャリヤ半導体装置は、半導体チッ
プのバンプ端子に接合されたリードを複数個有し、前記
複数個のリードを支持する枠状のサスペンダを有し、前
記リードが前記サスペンダとの接合部を境にして前記半
導体チップへ近づく方向に伸びたインナーリード部と前
記半導体チップから遠ざかる方向に伸びたアウターリー
ド部とを有するフィルムキャリヤ半導体装置において、
前記枠状のサスペンダの前記リードが接合されていない
方の面に絶縁性補強部材が接着され、前記絶縁性補強部
材が前記サスペンダに合わせた枠上部及び底部を備えそ
れによって半導体チップに対応する凹部が設けられてい
るというものである。The film carrier semiconductor device of the present invention has a plurality of leads joined to bump terminals of a semiconductor chip, has a frame-shaped suspender supporting the plurality of leads, and the lead is connected to the suspender. In a film carrier semiconductor device having an inner lead portion extending in a direction approaching the semiconductor chip and an outer lead portion extending in a direction away from the semiconductor chip,
An insulating reinforcing member is bonded to a surface of the frame-shaped suspender on which the lead is not bonded, and the insulating reinforcing member includes a frame upper portion and a bottom portion matched to the suspender, and thereby a recess corresponding to a semiconductor chip. Is provided.
〔実施例１〕 次に本発明について図面を参照して説明する。Embodiment 1 Next, the present invention will be described with reference to the drawings.
第１図は本発明に関連するフィルムキャリヤ半導体装
置の断面図、第２図は本発明に関連するフィルムキャリ
ヤ半導体装置を示す半製品の平面図である。FIG. 1 is a cross-sectional view of a film carrier semiconductor device according to the present invention, and FIG. 2 is a plan view of a semi-finished product showing the film carrier semiconductor device according to the present invention.
フィルムキャリヤテープ6bにスプロケットホール1b、
デバイスホール3b及びデバイスホール内に一端を突出さ
せ多端に電気選別用パッドを形成したリード4bが設けら
れている。半田チップ2bの電極端子上に設けられたバン
プ端子7bとリード4bとがボンディングされている。ま
た、サスペンダ8bには第２図に示すようにガラスエポキ
シ等からなる枠状の絶縁性補強部材13bが接着されてい
る。このようなフィルムキャリヤ装置は、リード4bを所
定の長さに切断し、リード成形した後第３図に示すよう
なプリント基板11bのボンディングパッド12bに接続され
実装される。上述したように、サスペンダに枠状の絶縁
性補強部材が接着材で固定されていることにより、従来
問題となっていたテープの反りによるOLB側のリード浮
きは完全に防止でき、従ってOLB時リードOLB用パッド上
に完全に接触し、リフローによる実装が容易にできると
いう効果がある。Sprocket hole 1b on film carrier tape 6b,
A device hole 3b and a lead 4b having one end protruding into the device hole and having an electric selection pad formed at multiple ends are provided. The bump terminal 7b provided on the electrode terminal of the solder chip 2b and the lead 4b are bonded. As shown in FIG. 2, a frame-shaped insulating reinforcing member 13b made of glass epoxy or the like is bonded to the suspender 8b. In such a film carrier device, the lead 4b is cut into a predetermined length, and after forming the lead, the lead 4b is connected to a bonding pad 12b of a printed board 11b as shown in FIG. 3 and mounted. As described above, since the frame-shaped insulating reinforcing member is fixed to the suspender with an adhesive, the lead floating on the OLB side due to the warpage of the tape, which has conventionally been a problem, can be completely prevented. There is an effect that the contact is completely made on the OLB pad and mounting by reflow can be easily performed.
第４図は本発明の実施例１の断面図である。 FIG. 4 is a sectional view of Embodiment 1 of the present invention.
本発明に関連するフィルムキャリヤ半導体装置と同様
にフィルムテープキャリヤテープには、スプロケットホ
ール（図示せず）、デバイスホール3c及び一端がデバイ
スホール内に突出し、多端が電気選別用パッドに形成さ
れたリード4cが設けられている。さらに、サスペンダの
裏面に半導体チップの逃げ用の大きいザグリを入れた平
面状の絶縁性補強部材13cが接着材で固定されている。
また、半導体チップ2cの電極端子上に設けられたバンプ
端子7cとリード4cとがボンディングされ、さらに液状の
樹脂（9c）によりボンディングがなされている。このよ
うなフィルムキャリヤ半導体装置は本発明に関連するフ
ィルムキャリヤ半導体装置と同様にプリント基板上のボ
ンディングパッドに接続され、実装される。Similar to the film carrier semiconductor device related to the present invention, the film tape carrier tape has a sprocket hole (not shown), a device hole 3c and one end protruding into the device hole, and multiple ends formed on the electric selection pad. 4c is provided. Further, a flat insulating reinforcing member 13c containing a large counterbore for escape of the semiconductor chip is fixed to the back surface of the suspender with an adhesive.
Further, the bump terminals 7c provided on the electrode terminals of the semiconductor chip 2c are bonded to the leads 4c, and furthermore, the bonding is performed with a liquid resin (9c). Such a film carrier semiconductor device is connected to a bonding pad on a printed circuit board and mounted similarly to the film carrier semiconductor device related to the present invention.
この実施例では、平面状の絶縁性補強部材をサスペン
ダに固着することにより、本発明に関連するフィルムキ
ャリヤ半導体装置と同様にリード浮きを防止でき、ま
た、仮固定を絶縁性補強部材を接着することにより容易
に実施できる。さらに絶縁性補強部材が半導体チップを
覆う形となっているため、チップ保護の役目もしてい
る。In this embodiment, by fixing the planar insulating reinforcing member to the suspender, it is possible to prevent lead floating as in the film carrier semiconductor device related to the present invention, and to temporarily fix the insulating reinforcing member to the adhesive. This can be easily implemented. Furthermore, since the insulating reinforcing member covers the semiconductor chip, it also plays a role of protecting the chip.
以上説明したように本発明は、サスペンダに枠状又は
平面状の絶縁性補強部材を固着する事により、テープの
反りによるリード浮きを防止でき、実装の際にリードが
OLB用パッド上に完全に接触することから、リフローに
よる半田付が容易に行えるという効果がある。As described above, according to the present invention, by fixing the frame-shaped or planar insulating reinforcing member to the suspender, it is possible to prevent the floating of the lead due to the warpage of the tape, and the lead is mounted at the time of mounting.
Since the contact is completely made on the OLB pad, there is an effect that soldering by reflow can be easily performed.
第１図は本発明のフィルムキャリヤ半導体装置の本発明
に関連するフィルムキャリヤ半導体装置の断面図、第２
図は本発明に関連するフィルムキャリヤ半導体装置を示
す半製品の平面図、第３図は本発明に関連するフィルム
キャリヤ半導体装置の実装状態を示す断面図、第４図は
それぞれ実施例１の断面図、第５図（ａ）及び（ｂ）は
従来のフィルムキャリヤ半導体装置を示す半製品の平面
図及び断面図、第６図は他の従来例を示す断面図、第７
図は他の従来例の実装状態を表した断面図である。 2a,2b,2c,2d……半導体チップ、3a3b……デバイスホー
ル、4a,4b,4c,4d……リード、5a,5b……パッド、6a,6b
……フィルムキャリヤテープ、7a,7b……バンプ端子、8
a,8b,8c,8d……サスペンダ、9a,9c,9d……樹脂、10a,10
b……接着材、11a,11b……プリント基板、12a……配線
導体、13b,13c,13d……絶縁性補強部材。FIG. 1 is a cross-sectional view of a film carrier semiconductor device according to the present invention.
FIG. 1 is a plan view of a semi-finished product showing a film carrier semiconductor device related to the present invention, FIG. 3 is a cross-sectional view showing a mounted state of the film carrier semiconductor device related to the present invention, and FIG. 5 (a) and 5 (b) are a plan view and a sectional view of a semi-finished product showing a conventional film carrier semiconductor device, FIG. 6 is a sectional view showing another conventional example, and FIG.
The figure is a cross-sectional view showing a mounting state of another conventional example. 2a, 2b, 2c, 2d ... semiconductor chip, 3a3b ... device hole, 4a, 4b, 4c, 4d ... lead, 5a, 5b ... pad, 6a, 6b
…… Film carrier tape, 7a, 7b …… Bump terminal, 8
a, 8b, 8c, 8d …… Suspender, 9a, 9c, 9d …… Resin, 10a, 10
b: adhesive material, 11a, 11b: printed circuit board, 12a: wiring conductor, 13b, 13c, 13d: insulating reinforcing member.
Claims (1)
ードを複数個有し、前記複数個のリードを支持する枠状
のサスペンダを有し、前記リードが前記サスペンダとの
接合部を境にして前記半導体チップへ近づく方向に伸び
たインナーリード部と前記半導体チップから遠ざかる方
向に伸びたアウターリード部とを有するフィルムキャリ
ヤ半導体装置において、前記枠状のサスペンダの前記リ
ードが接合されていない方の面に絶縁性補強部材が接着
され、前記絶縁性補強部材が前記サスペンダに合わせた
枠上部及び底部を備えそれによって半導体チップに対応
する凹部が設けられていることを特徴とするフィルムキ
ャリヤ半導体装置。1. A semiconductor device comprising: a plurality of leads joined to bump terminals of a semiconductor chip; and a frame-shaped suspender for supporting the plurality of leads. In a film carrier semiconductor device having an inner lead portion extending in a direction approaching the semiconductor chip and an outer lead portion extending in a direction away from the semiconductor chip, a surface of the frame-shaped suspender on which the leads are not bonded. A film carrier semiconductor device, wherein an insulating reinforcing member is adhered to the insulating carrier, and the insulating reinforcing member has a top portion and a bottom portion corresponding to the suspender, thereby providing a concave portion corresponding to the semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1218967A JP2626081B2 (en) | 1989-08-24 | 1989-08-24 | Film carrier semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1218967A JP2626081B2 (en) | 1989-08-24 | 1989-08-24 | Film carrier semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0382047A JPH0382047A (en) | 1991-04-08 |
| JP2626081B2 true JP2626081B2 (en) | 1997-07-02 |
Family
ID=16728162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1218967A Expired - Lifetime JP2626081B2 (en) | 1989-08-24 | 1989-08-24 | Film carrier semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2626081B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0624212B2 (en) * | 1989-10-09 | 1994-03-30 | ローム株式会社 | Electronic parts |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5746614Y2 (en) * | 1978-06-15 | 1982-10-14 | ||
| JPS568863A (en) * | 1979-07-02 | 1981-01-29 | Mitsubishi Electric Corp | Substrate for semiconductor device |
| JPS63117436A (en) * | 1986-11-06 | 1988-05-21 | Toshiba Corp | Film carrier |
| JPS645895A (en) * | 1987-06-29 | 1989-01-10 | Dainippon Printing Co Ltd | Tape carrier |
| JPH0442922Y2 (en) * | 1987-07-10 | 1992-10-12 | ||
| JPH01157542A (en) * | 1987-12-14 | 1989-06-20 | Mitsubishi Electric Corp | Tape carrier |
| JPH02121344A (en) * | 1988-10-28 | 1990-05-09 | Ibiden Co Ltd | Film carrier |
-
1989
- 1989-08-24 JP JP1218967A patent/JP2626081B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0382047A (en) | 1991-04-08 |
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