JPH07114216B2 - Method of mounting film carrier type semiconductor device - Google Patents

Description

The present invention relates to a method of mounting a film carrier type semiconductor device for mounting a film carrier type semiconductor device on a printed circuit board.

[Prior Art] A conventional method of manufacturing a film carrier type semiconductor device is, as shown in FIGS. 7 and 8, a sprocket hole 41 for carrying and positioning, and a device hole which is an opening portion into which a semiconductor chip 31 is inserted. A metal foil such as copper is adhered onto an insulating film such as polyimide having 39, and the metal foil is etched to form leads (inner lead 35, outer lead 36) of a desired shape and pads 44 for electrical selection. Then, the film carrier tape 40 is manufactured. Further, bumps 46, which are metal protrusions, are formed on the electrode terminals of the semiconductor chip 31.

Next, the inner leads 35 of the film carrier tape 40 and the bumps 46 of the semiconductor chip 31 are inner lead bonded (hereinafter abbreviated as ILB) by a thermocompression bonding method or a eutectic method.
Then, a contactor is brought into contact with the electrical selection pad 44 in a state of being mounted on the film carrier tape to perform electrical selection and bias test of the semiconductor chip 31. As a result, the film carrier type semiconductor device is completed. Here, a suspender 32, which is a frame of an insulating film, may be provided in advance on the film carrier tape 40 to prevent deformation of the leads 35 and 36. Further, in order to improve reliability and mechanical protection, as shown in FIG. 9, the resin 47 may be potted to perform resin sealing.

When the film carrier type semiconductor device as described above is mounted on a printed circuit board, the outer leads 36 are cut into a desired length, and then, as shown in FIG. After fixing the semiconductor chip 31, the outer lead 36 is bonded to the bonding pad 52 on the printed board 50 by the outer lead bonding (hereinafter referred to as OLB
Abbreviated).

Since these film carrier type semiconductor devices can be bonded once regardless of the number of leads, the manufacturing process is quick, and since the film carrier tape 40 is used, the work can be easily automated. Have the advantages of.

In the conventional manufacturing process of the film carrier type semiconductor device described above, the OLB process is generally performed by pressing and heating the leads with a pressing tool as in the ILB process. Joining is Au-
It is implemented by thermocompression bonding of Au, brazing using Au-Sn eutectic or solder.

On the other hand, with respect to general packages such as plastic packages and ceramic packages, and parts such as resistors and capacitors, solder brazing is often used, and recently, solder reflow method is generally used. Is. That is, solder paste is applied on the bonding pad of the printed circuit board by a printing method or the like, then parts such as a semiconductor package and a resistor are aligned with the printed circuit board with an adhesive to temporarily fix the adhesive, an infrared heating furnace, hot air. A printed circuit board is placed in a heating furnace or a heating steam tank, or the solder paste is melted by laser welding to mount components. Mounting by such a solder reflow method has an advantage that many components can be mounted at the same time and automation is easy.

[Problems to be Solved by the Invention] However, when the film carrier type semiconductor device is applied to the solder reflow method, since the suspender portion of the film carrier type semiconductor device is formed of an insulating film, the suspender portion is easily warped. As a result, the lead height varies.

As a result, the solder paste applied to the bonding pad of the printed circuit board and the lead do not come into contact with each other, which makes it impossible to mount the semiconductor device.

Generally, as the mounting density is promoted, the lead pitch of the semiconductor device is shortened, but with this, mounting by the solder reflow method becomes difficult. Currently 0.65
The pitch is generally 1.0 mm to 1.0 mm, and it is said that 0.4 to 0.5 mm is the limit, for example, as described in Nikkei Electrokunis December 12, 1988, pages 141 to 149. That is,
Insufficient wetting occurs due to insufficient amount of solder paste, and solder bridge occurs due to excessive amount of solder paste.Therefore, it is necessary to control the amount of solder paste applied accurately, and therefore it is necessary to keep the lead height accurate. It As a control amount of the lead height and flatness, about 0.05 to 0.10 mm is required, but in the case of a film carrier type semiconductor device, the amount of warpage increases as the suspender section becomes large due to the large number of leads, A warp of several μm or more often occurs. Therefore, in general, the mounting of the film carrier type semiconductor device is often performed by pressing the leads with the pressure tool to correct the lead height variation due to the warping as described above, and the solder reflow method is not recommended. Almost never. However, most components such as resistors and capacitors, including general packages, can be mounted by the solder reflow method, and it is not possible to mount only film carrier type semiconductor devices individually with a pressure tool in the current automated mounting line. There are drawbacks such as not matching, and the need to install a dedicated device for the film carrier type semiconductor device.

The present invention has been made in view of such problems,
An object of the present invention is to provide a mounting method of a film carrier type semiconductor device which can correct the warp of the suspenders and can be easily mounted by the solder reflow method.

[Means for Solving the Problems] A mounting method of a film carrier type semiconductor device according to the present invention is a semiconductor element, leads connected to the semiconductor element,
A step of cutting and separating a suspender supporting the leads, a part of the suspender support frame part and a part including the temporary attachment lead provided in the suspender support frame part from the film carrier tape to form a lead; and the temporary attachment lead. Of the film carrier type semiconductor device and a bonding pad on the printed board by a solder reflow method.

[Operation] In the present invention, after the temporary attachment lead provided on the suspender support frame is joined to a predetermined position of the printed board, the lead of the film carrier type semiconductor device is bonded to the lead on the printed board by the solder reflow method. Join with the pad. Therefore, the warp of the suspender portion at the time of solder reflow can be prevented by the temporary mounting lead, so that the film carrier type semiconductor device can be easily mounted by the solder reflow method.

[Embodiment] Next, an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a film carrier type semiconductor device mounted by the method of the first embodiment of the present invention. Inner leads 5 are connected to the electrodes of the semiconductor chip 1 by bonding.

The outer leads 6 extending from the inner leads 5 are joined to the bonding pads 3 on the printed circuit board by the solder 4. The inner lead 5 and the outer lead 6 are supported by the suspender 2 made of an insulating film. Temporary leads 8 are formed at the corners of the suspender 2.
Are similarly joined to the temporary lead pads 7 on the printed circuit board by the solder 4. The suspender 2 is pressed against the printed circuit board by the temporary attachment lead 8.

Next, a method of manufacturing the film carrier type semiconductor device having the above structure will be described with reference to the plan view of FIG. 2 and the sectional view of FIG.

FIG. 2 shows a film carrier tape 10 used in an embodiment of the present invention. As shown in FIG. 2, like the conventional film carrier tape, a metal such as copper is formed on the insulating film in which the sprocket hole 11, the device hole 9 and the OLB hole 15 and the temporary lead hole 12 are formed. A film carrier tape 10 having an inner lead 5, an outer lead 6, a pad 14 for electrical selection and a lead 8 for temporary attachment, which are leads having a desired shape, is prepared by bonding foils and etching or the like.

Here, the temporary attachment lead hole 12 is provided so as to be opened in the suspender support frame 13 that supports the suspender 2.
The temporary lead 8 is provided so as to straddle the temporary lead hole 12.

Next, the inner leads 5 of the film carrier tape 10 and the bumps 16 provided on the electrodes of the semiconductor chip 1 are bonded (ILB) by thermocompression bonding or a eutectic method to form a resin 17
The resin is sealed with. In this embodiment, as shown in FIGS. 2 and 3, inner lead bonding is performed with the lead pattern surface of the film carrier tape 10 and the element forming surface of the semiconductor chip facing each other.

Next, the electrodes of the tester are brought into contact with the electrical selection pad 14 to perform electrode selection, and the film carrier type semiconductor device is completed.

The film carrier type semiconductor device manufactured in this manner is mounted as follows. That is, as shown in the plan view of FIG. 4 and the sectional view of FIG. 5, the outer leads 6 are formed at the same time when the film carrier type semiconductor device is cut and separated. As shown in FIG. 4, this cutting position is an outer edge position of the temporary attachment lead hole 12 and the OLB hole 15 so that the temporary attachment lead 8 and the outer lead 6 are left, and the cutting is performed at this position. The semiconductor chip portion is separated from the film carrier tape 10.

After cutting the temporary attachment lead 8 and the outer lead 6,
Both perform lead forming. Here, the temporary attachment lead 8
The molding depth of is made shallower than the molding depth of the outer lead 6. In this embodiment, as shown in FIG.
Has a butt lead shape in which the lead is molded only downward, but the shape of this molding is not particularly limited.

Next, as shown in FIG. 1, the semiconductor chip 1 that has been cut and lead-molded is bonded to the bonding pad 3 and the outer lead 6 on the printed board on which the bonding pad portion 3 and the temporary attachment pad 7 have been previously coated with the solder paste. The lead 8 for temporary attachment is joined to the lead pad 7 for temporary attachment with the solder 4 while being aligned and placed.

Here, when the film carrier type semiconductor device is mounted, the resin 1 on the semiconductor chip 1 is affected by the ILB face down.
After temporarily fixing 7 and the printed circuit board with an adhesive or the like, the temporary attaching lead 8 may be joined, or the temporary attaching lead 8 may be joined to the bonding pad 3 by an adhesive or the like instead of the solder 4. . In this way, the suspending lead 8 is bonded to the printed circuit board in advance, so that the suspender 2
The warp is corrected, and the outer lead 6 formed below the temporary attachment lead 8 is reliably bonded to the bonding pad 3.

Next, other parts are temporarily fixed on the printed board with adhesive as in the conventional method, and then loaded into a reflow furnace such as an infrared heating furnace, a hot air heating furnace and a heating steam tank, or solder paste by laser welding or the like. Is melted, the outer leads 6 of the film carrier type semiconductor device and the bonding pads 3 are fixed and joined by the solder 4, and the mounting is completed together with other components. In this way, according to this embodiment, the film carrier type semiconductor device can be mounted on the printed circuit board together with other components by the solder reflow method.

FIG. 6 is a plan view showing a second embodiment method of the present invention. The same components as those in the method of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In the present embodiment, the first suspender support frame 13 is not provided, and only the temporary attachment lead 8 is provided. By using this, the film carrier type semiconductor device can be mounted in the same manner as in the first embodiment. It can be carried out. Thus, in order to form the suspender 2 without providing the suspender support frame, a two-layer tape is used to form a film carrier tape.
Manufacture 20. The two-layer tape is not necessary because the Cu layer is thinly formed on the polyimide film by electroless plating without using an adhesive, and Cu is selectively formed by electrolytic plating to a thickness of about 35 μm by the photoresist method. The thin part is formed thinly. Then, Cu of the unnecessary portion is removed by the entire etching to form a lead or the like in a pattern.

Next, the polyimide film is selectively etched by a photoresist method to etch the device hole 9 and the OLB hole 21.
Etc. are formed, and desired plating such as Au or Sn is applied to complete. As a result, the suspenders 8 can be formed without the suspender support frame. Even in the conventional three-layer film carrier tape, first, as in the conventional method, the insulating film such as polyimide is opened by punching the sprocket hole, the device hole, the hole for the OLB, etc. Glue the film.

Next, only the suspender support frame is cut and removed by punching, and then the Cu foil is bonded to the opposite surface via an adhesive, and then the previous film is peeled off. Then, as before, Cu
The film carrier tape 20 provided with the suspenders 2 having no suspender support frame can be manufactured through the foil selective etching step and the desired plating forming step.

In the case of the film carrier tape 20 having no suspender support frame as described above, the size of the suspender support frame generally requires a width of about 0.5 to 1.0 mm in manufacturing, so that the film carrier tape having a large number of leads is particularly preferable. In the above, while the suspender frame limits the OLB hole size, the present invention has an advantage of not affecting the OLB hole size because the temporary mounting lead 8 of the present invention also serves as the suspender support frame. .

Although the suspending lead 8 is provided and the suspender 2 is fixed in the above-described embodiment, the suspender support frame in the conventional film carrier tape can be used instead of the suspending lead. In this case, the suspender support frame 42 of the conventional film carrier tape shown in FIG.
Leave the same as the temporary lead, and bond it to the temporary lead pad on the printed circuit board with an adhesive, or leave a pattern such as Cu plated on the suspender support frame like other leads, It can be mounted by joining with solder or the like. That is, there are no particular restrictions on the method of joining the suspender support frame or the temporary attachment lead which replaces the suspender support frame.

In addition, an OLB that contains outer leads as the number of leads increases
If the temporary hole cannot be sufficiently corrected by temporarily fixing only the suspender support frame in the square corners as in the above example, the temporary lead or temporary hole may be placed in the middle of the OLB hole. It is also possible to add a suspender support frame for attachment. Therefore, there is no restriction on the position and number of the temporary attachment leads.

As described above, according to the present invention, the suspender support frame of the film carrier type semiconductor device or the temporary attachment lead provided on the suspender support frame is temporarily attached to the printed circuit board to correct the warp of the suspender. Therefore, like other parts,
Further, the film carrier type semiconductor device can be mounted on the printed circuit board by the solder reflow method at the same time as other components.

[Brief description of drawings]

FIG. 1 is a perspective view showing a mounted state of a film carrier type semiconductor device manufactured according to the first embodiment of the present invention.
FIG. 5 to FIG. 5 are views showing a mounting method of the film carrier type semiconductor device according to the first embodiment of the present invention. FIG. 2 and FIG. 4 are plan views, and FIG. 3 and FIG. FIG. 6 is a plan view showing a film carrier type semiconductor device mounted according to a second embodiment of the present invention, and FIGS. 7 to 10 are views showing a mounting process of a conventional film carrier type semiconductor device, FIG. 7 is a plan view, and FIGS. 8 to 10 are sectional views. 1,31; Semiconductor chip, 2,32; Suspender, 3,52; Bonding pad, 4; Solder, 5,35; Inner lead, 6,36; Outer lead, 8; Temporary lead, 9,39; Device Hole, 10,20,40; film carrier tape, 11,41; sprocket hole, 12; lead hole for temporary attachment, 13,42; suspender support frame

Claims (1)

[Claims] 1. A film carrier comprising a semiconductor element, a lead connected to the semiconductor element, a suspender for supporting the lead, a part of a suspender support frame part and a part including a temporary attachment lead provided in the suspender support frame part. A step of cutting and separating from the tape to form a lead; a step of joining the temporary attachment lead to a predetermined position of a printed board; a lead of a film carrier type semiconductor device and a bonding pad on the printed board by a solder reflow method. A method for mounting a film carrier type semiconductor device, comprising: a step of bonding.