JPS63117436A - Film carrier - Google Patents
Film carrierInfo
- Publication number
- JPS63117436A JPS63117436A JP61262770A JP26277086A JPS63117436A JP S63117436 A JPS63117436 A JP S63117436A JP 61262770 A JP61262770 A JP 61262770A JP 26277086 A JP26277086 A JP 26277086A JP S63117436 A JPS63117436 A JP S63117436A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- film carrier
- semiconductor chip
- carrier
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 230000002787 reinforcement Effects 0.000 claims abstract description 7
- 239000012779 reinforcing material Substances 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 239000011888 foil Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
この発明は、例えばテープキャリア方式により半導体チ
ップを実装するフィルムキャリアに関する。Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention relates to a film carrier for mounting semiconductor chips using, for example, a tape carrier method.
（従来の技術）
近年、半導体技術の発展により、電子装置を小型で高機
能にする要求から、半導体チップの薄型高密度実装化が
進んでいる。この薄型高密度実装化を実現するための手
段として、例えば半導体チップをフィルムキャリアに取
付けて実装する所謂テープキャリア方式（ＴＡＢ）があ
る。(Prior Art) In recent years, with the development of semiconductor technology, semiconductor chips have become thinner and more densely packaged due to the demand for smaller and more highly functional electronic devices. As a means for realizing this thin and high-density packaging, there is, for example, the so-called tape carrier method (TAB) in which a semiconductor chip is mounted on a film carrier.
このようなテープキャリア方式は、例えば第５図に示す
ようにフィルムキャリアに半導体チップを搭載する。す
なわち、フィルムキャリア１０１には半導体チップ１０
３を搭載するための孔部１０５が形成され、フィルムキ
ャリア１０１の一面には回路パターンから孔部１０５に
突出するリード１０７が設けられている。一方、半導体
チップ１０３はステージ１０９上に載置され、孔部１０
５との位置合せを行った後、ボンディングツール１１１
のツール面１１３によりリード１０７と電極バッド１１
５とが加熱押圧されてフィルムキャリア１０１に接合さ
れる。なお、１１７は接＆！媒体としてのバンブである
。In such a tape carrier method, a semiconductor chip is mounted on a film carrier, as shown in FIG. 5, for example. That is, the semiconductor chip 10 is mounted on the film carrier 101.
A hole 105 is formed for mounting 3, and a lead 107 is provided on one side of the film carrier 101 to protrude from the circuit pattern into the hole 105. On the other hand, the semiconductor chip 103 is placed on the stage 109, and the hole 10
5, the bonding tool 111
Lead 107 and electrode pad 11 are connected by tool surface 113 of
5 are heated and pressed and bonded to the film carrier 101. In addition, 117 is contact &! Bamboo as a medium.
ところで、このような従来のフィルムキャリア１０１は
ポリイミド等の絶縁性樹脂テープからなっており、可撓
性を有している。このため、フィルムキャリア１０１の
作業工程におけるハンドリングや他の外力により、フィ
ルムキャリア１０１ｒニー時的；曲がり等の変形が生じ
る場合がある。By the way, such a conventional film carrier 101 is made of an insulating resin tape such as polyimide and has flexibility. For this reason, the film carrier 101r may be deformed, such as bending, due to handling during the work process of the film carrier 101 or other external forces.
一方、半導体チップ１０３は剛性体であるので、このよ
うな場合、第６図に示すようにフィルムキャリア゛１０
１の変形に伴ない、電極パッド１１５に対するリード１
０７の位置がずれて接合がはずれる虞れがある。On the other hand, since the semiconductor chip 103 is a rigid body, in such a case, as shown in FIG.
Due to the deformation of lead 1, lead 1 to electrode pad 115
There is a risk that the position of 07 may shift and the connection may come off.
（発明が解決しようとする問題点）
上記のように従来のフィルムキャリアは可撓性を有して
いるため、外力により変形した場合は半導体チップの電
極パッドに対するリードの位置がずれて接合がはずれる
虞れがある。(Problems to be Solved by the Invention) As mentioned above, conventional film carriers have flexibility, so if they are deformed by external force, the positions of the leads relative to the electrode pads of the semiconductor chip will shift and the bond will come off. There is a risk.
この発明は上記問題に着目してなされたもので、外力に
より変形しても電極パッドに対するリードの位置がずれ
るのを抑えることができるフィルムキャリアの提供を目
的とする。The present invention has been made in view of the above-mentioned problem, and an object of the present invention is to provide a film carrier that can suppress displacement of the lead relative to the electrode pad even if the film carrier is deformed by external force.
［発明の構成］
（問題点を解決するための手段）
上記目的を達成するためにこの発明は、半導体チップを
搭載するために形成され、前記半導体チップの電極パッ
ドと接続されるリードが突出する孔部を備えたフィルム
キャリアにおいて、前記孔部付近を補強する構成とした
。[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention provides a semiconductor chip formed for mounting a semiconductor chip, with leads protruding to be connected to electrode pads of the semiconductor chip. A film carrier having holes is configured to reinforce the vicinity of the holes.
（作用）
上記構成において、フィルムキャリアが外力により変形
しても、孔部付近は補強されているので、半導体チップ
の電極パッドに対するリードの位置がずれるのを抑える
ことができる。(Function) In the above structure, even if the film carrier is deformed by an external force, the vicinity of the hole is reinforced, so it is possible to prevent the leads from shifting in position with respect to the electrode pads of the semiconductor chip.
（実施例）
以下図面に基づき、この発明の実施例を詳細に説明する
。(Example) Examples of the present invention will be described in detail below based on the drawings.
第１図および第２図は、この発明の一実施例に係わるフ
ィルムキャリアを示している。1 and 2 show a film carrier according to an embodiment of the present invention.
第１図および第２図において、ポリイミド等の絶縁性樹
脂テープからなる可撓性のフィルムキャリア３１には半
導体チップ３を搭載するための孔部５が形成され、半導
体チップ３は孔部５の図中下方からフィルムキャリア１
に搭載される。また、フィルムキャリア１の左右縁部に
は長さ方向に送り孔７が形成され、フィルムキャリア１
は図外の送り装置により孔部５の１コマ毎に移動可能と
なっている。1 and 2, a hole 5 for mounting a semiconductor chip 3 is formed in a flexible film carrier 31 made of an insulating resin tape such as polyimide, and the semiconductor chip 3 is placed in the hole 5. Film carrier 1 from the bottom in the diagram
will be installed on. Further, feed holes 7 are formed in the left and right edges of the film carrier 1 in the length direction, and the film carrier 1
can be moved frame by frame in the hole 5 by a feeding device (not shown).
フィルムキャリア１の一面（図中上面）には銅等の金属
箔からなるリード９が孔部５の各辺に沿い所定のピッチ
を持って複数個設けられている。A plurality of leads 9 made of metal foil such as copper are provided on one surface (upper surface in the figure) of the film carrier 1 along each side of the hole 5 at a predetermined pitch.
リード９の基部はフィルムキャリア１上で回路パターン
を構成し、一方、リード９の先端部は半導体チップ３の
電極パッド１１との接続部として孔部５に突出して臨ん
でいる。The bases of the leads 9 constitute a circuit pattern on the film carrier 1, while the tips of the leads 9 protrude into the holes 5 as connection parts with the electrode pads 11 of the semiconductor chip 3.
フィルムキャリア１の他面（図中下面）には絶縁性の合
成樹脂体からなる補強板１３が接着剤等により固定され
ている。補強板１３は孔部５と略同じ大きさの孔部１５
を持った枠状に形成され、フィルムキャリア１に半導体
チップ３を接合するときに与える影響は小さいものとな
っている。これにより、フィルムキャリア１の孔部５付
近が補強され、曲げや他の外力に対する剛性が高められ
る。なお、補強板１３を接着する変わりに、同位置に絶
縁性の合成樹脂材を塗布する構成としてもよい。A reinforcing plate 13 made of an insulating synthetic resin is fixed to the other surface (lower surface in the figure) of the film carrier 1 with an adhesive or the like. The reinforcing plate 13 has a hole 15 approximately the same size as the hole 5.
The semiconductor chip 3 is formed in a frame shape with a . As a result, the vicinity of the hole 5 of the film carrier 1 is reinforced, and its rigidity against bending and other external forces is increased. Incidentally, instead of adhering the reinforcing plate 13, an insulating synthetic resin material may be applied at the same position.
そして、フィルムキャリア１の孔部５と半導体チップ３
との位置合せを行なった後、ボンディングツール１７を
下降させてリード９と電極パッド１１とを熱圧着接合す
る。なお、１９は接続媒体としてのバンブであり、接合
を容易にすると共に接合時の熱から半導体素子を保護す
る。Then, the hole 5 of the film carrier 1 and the semiconductor chip 3
After alignment with the lead 9 and the electrode pad 11, the bonding tool 17 is lowered to bond the lead 9 and the electrode pad 11 by thermocompression. Note that 19 is a bump as a connecting medium, which facilitates bonding and protects the semiconductor element from heat during bonding.
次に作用を説明する。Next, the action will be explained.
上記構成において、外力が作用すると可撓性のフィルム
キャリア１は、補強板１３が接着されていないすなわち
孔部５付近でない部分が変形し、一方、孔部５付近は補
強板１３が接着されているので変形しずらい。この結果
、リード９が変形しずらく、従って、リード９の位置が
半導体チップ３の電極パッド１１に対してずれるのを抑
えることができる。In the above configuration, when an external force is applied, the flexible film carrier 1 deforms in the portions where the reinforcing plate 13 is not bonded, that is, in the vicinity of the hole 5, and on the other hand, in the vicinity of the hole 5, the portion where the reinforcing plate 13 is bonded is deformed. It is hard to deform because it is. As a result, the leads 9 are not easily deformed, and therefore, the position of the leads 9 can be prevented from shifting with respect to the electrode pads 11 of the semiconductor chip 3.
第３図および第４図は他の実施例を示している。3 and 4 show other embodiments.
この実施例では、孔部５付近のリード９の厚さｄが従来
のものく例えば３０μ）より厚く構成されていると共に
、巾Ｗが従来のものく例えば８０μ）より広く構成され
ている。従って、リード９自体の剛性が高まると周鍔に
、リード９が形成されているフィルムキャリア１の剛性
も高まる。上記構成にあっては、フィルムキャリア１に
外力が加わっても、孔部５付近の剛性が高まっているの
で前述の実施例と同様の効果を得ることができる。なお
、リード９は、厚さ又は巾のいずれか一方を厚くするか
又は広くするような構成としても剛性が高まることはい
うまでもない。In this embodiment, the thickness d of the lead 9 in the vicinity of the hole 5 is thicker than the conventional one (for example, 30 .mu.), and the width W is wider than the conventional one (for example, 80 .mu.). Therefore, when the rigidity of the lead 9 itself increases, the rigidity of the film carrier 1 on which the lead 9 is formed on the periphery also increases. With the above configuration, even if an external force is applied to the film carrier 1, the rigidity near the hole 5 is increased, so that the same effect as in the above embodiment can be obtained. It goes without saying that the rigidity of the lead 9 can also be increased by making either the thickness or the width thicker or wider.
［発明の効果］
以上説明したようにこの発明によれば、半導体チップを
搭載するための孔部付近を補強したため、フィルムキャ
リア３が外力により変形しても、半導体チップの電極パ
ッドに対するリードの位置がずれるのを抑えることがで
き、フィルムキャリアへの半導体チップの接合の信頼性
を高めることができる。[Effects of the Invention] As explained above, according to the present invention, since the vicinity of the hole for mounting the semiconductor chip is reinforced, even if the film carrier 3 is deformed by external force, the position of the leads relative to the electrode pads of the semiconductor chip is maintained. It is possible to suppress the displacement of the semiconductor chip and improve the reliability of bonding the semiconductor chip to the film carrier.
第１図はこの発明の一実施例に係わるノイルムキャリア
の断面図、第２図は同上面図、第３図は他の実施例の断
面図、第４図は同底面図、第５図は従来例の断面図、第
６図は同作用説明図１・・・フィルムキャリア
３・・・半導体チップ
５・・・孔部
９・・・リード
１３・・・補強板FIG. 1 is a sectional view of a Neulum carrier according to one embodiment of the present invention, FIG. 2 is a top view of the same, FIG. 3 is a sectional view of another embodiment, FIG. 4 is a bottom view of the same, and FIG. 6 is a cross-sectional view of the conventional example, and FIG. 6 is an explanatory diagram of the same function. 1... Film carrier 3... Semiconductor chip 5... Hole 9... Lead 13... Reinforcement plate
Claims (3)
導体チップの電極パッドと接続されるリードが突出する
孔部を備えたフィルムキャリアにおいて、前記孔部付近
を補強してなることを特徴とするフィルムキャリア。(1) A film carrier that is formed to mount a semiconductor chip and has a hole from which a lead protrudes to be connected to an electrode pad of the semiconductor chip, the film carrier being reinforced near the hole. film carrier.
は塗布することにより行うことを特徴とする特許請求の
範囲第１項記載のフィルムキャリア。(2) The film carrier according to claim 1, wherein the reinforcement near the hole is performed by adhering or applying an insulating reinforcing material.
広くして行うことを特徴とする特許請求の範囲第１項記
載のフィルムキャリア。(3) The film carrier according to claim 1, wherein the reinforcement near the hole is performed by making the lead thicker or wider.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262770A JPS63117436A (en) | 1986-11-06 | 1986-11-06 | Film carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262770A JPS63117436A (en) | 1986-11-06 | 1986-11-06 | Film carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63117436A true JPS63117436A (en) | 1988-05-21 |
Family
ID=17380346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61262770A Pending JPS63117436A (en) | 1986-11-06 | 1986-11-06 | Film carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63117436A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0382047A (en) * | 1989-08-24 | 1991-04-08 | Nec Corp | Film carrier semicodcutor device |
| JPH03125440A (en) * | 1989-10-09 | 1991-05-28 | Rohm Co Ltd | Electronic parts |
-
1986
- 1986-11-06 JP JP61262770A patent/JPS63117436A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0382047A (en) * | 1989-08-24 | 1991-04-08 | Nec Corp | Film carrier semicodcutor device |
| JPH03125440A (en) * | 1989-10-09 | 1991-05-28 | Rohm Co Ltd | Electronic parts |
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