JP3061767B2 - Tape carrier and manufacturing method thereof - Google Patents
Tape carrier and manufacturing method thereofInfo
- Publication number
- JP3061767B2 JP3061767B2 JP9217977A JP21797797A JP3061767B2 JP 3061767 B2 JP3061767 B2 JP 3061767B2 JP 9217977 A JP9217977 A JP 9217977A JP 21797797 A JP21797797 A JP 21797797A JP 3061767 B2 JP3061767 B2 JP 3061767B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- shaped metal
- metal substrate
- forming
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＩＣなどを実装
し、電子回路機器や電子回路基板や液晶表示装置などに
搭載されるＴＡＢ（Tape Automated Bonding）用テープ
キャリア、特に、表裏の導通にスルホールメッキや半田
ボール等を要しないテープキャリアとその製造方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier for TAB (Tape Automated Bonding) mounted on an electronic circuit device, an electronic circuit board, a liquid crystal display device, or the like, on which an IC or the like is mounted. The present invention relates to a tape carrier that does not require plating or solder balls, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、ＴＡＢ用テープキャリアは、例え
ば次の〜の工程を経て製造していた。 図３に示すように、テープ状絶縁フィルム５１の片
面に接着剤５２をコートする。 パンチングで、テープ状絶縁フィルム５１にデバイ
ス孔５１ａ、アウターリード孔５１ｂ、ガイド孔５１ｃ
などをあける。 接着剤５２を用いて導体（銅箔）５３をラミネート
する。 キュアーしてからフォトレジスト５４ａをコートす
る。 露光・現像してから、バックコート５４ｂを付す
る。 エッチングしてからレジスト剥離して導体パターン
を形成する。 もし、ソルダーレジスト印刷が必要な場合には、そ
の印刷を行ってから、仕上げメッキ５５を施す。 最後に、図４に示すようにデバイス孔５１ａの回り
のインナーリード５７間にＩＣ５８を実装する。2. Description of the Related Art Conventionally, TAB tape carriers have been manufactured through, for example, the following steps (1) to (3). As shown in FIG. 3, one side of a tape-shaped insulating film 51 is coated with an adhesive 52. Device holes 51a, outer lead holes 51b, guide holes 51c are formed in the tape-shaped insulating film 51 by punching.
And so on. A conductor (copper foil) 53 is laminated using an adhesive 52. After curing, the photoresist 54a is coated. After exposure and development, a back coat 54b is applied. After etching, the resist is peeled off to form a conductor pattern. If solder resist printing is required, the printing is performed, and then the finish plating 55 is applied. Finally, an IC 58 is mounted between the inner leads 57 around the device hole 51a as shown in FIG.
【０００３】[0003]
【発明が解決しようとする課題】ところで、近年、電子
機器のダウンサイジングやコストダウンの要請がますま
す強くなっている。これらの要請に応えるために、チッ
プサイズと同等或いはわずかに大きいＣＳＰ（Chip Siz
e Package）などのパッケージが開発された。ところ
が、表裏の導通をとるためにＣＳＰの裏側に半田ボール
を付ける工程が必要で、製造が面倒で高価になってい
た。更に、基板との接合部が温度サイクルテストにもた
ない問題も生じている。In recent years, there has been a growing demand for downsizing and cost reduction of electronic devices. To meet these demands, a CSP (Chip Siz
e Package). However, a step of attaching a solder ball to the back side of the CSP is necessary in order to establish conduction between the front and back sides, which has been troublesome and expensive to manufacture. Further, there is a problem that the junction with the substrate cannot be obtained in the temperature cycle test.
【０００４】そこで、本発明の目的は、表裏の導通がス
ルホールメッキや半田ボール等を設けることなく可能で
あり、またデバイス孔やアウターリード孔をあける特別
な金型も不要で、製造が容易でコストダウンが図れ、し
かもリードの補強が容易で信頼性があり、更にリードを
真っ直ぐではなく曲げることも可能で、ＩＣ設計の自由
度も増すテープキャリアとその製造方法を提供すること
にある。[0004] Therefore, an object of the present invention is to enable conduction between the front and back without providing through-hole plating or solder balls, and it is not necessary to use a special mold for forming device holes and outer lead holes. It is an object of the present invention to provide a tape carrier and a method of manufacturing the tape carrier, which can reduce the cost, can easily reinforce the leads, are reliable, can also bend the leads instead of straightening them, and increase the degree of freedom in IC design.
【０００５】[0005]
【課題を解決するための手段】本発明によるテープキャ
リヤは、テープ状金属基材にガイド孔を設けるととも
に、該テープ状金属基材をエッチングし、絶縁材料によ
る補強膜を形成することにより、前記テープ状金属基材
の表裏両面にそれぞれ導体パターンを設けてなるもので
ある。According to the tape carrier of the present invention, a guide hole is provided in a tape-shaped metal base material, and the tape-shaped metal base material is etched by using an insulating material.
The tape-shaped metal substrate is formed by forming a reinforcing film
Are provided with conductor patterns on both sides .
【０００６】このようなテープキャリアを製造する本発
明の製造方法には、テープ状金属基材の表裏両面に導体
パターンを形成する方法と、片面にのみ形成する方法と
がある。前者の方法は、次の工程を経て両面タイプのテ
ープキャリアを製造する。The manufacturing method of the present invention for manufacturing such a tape carrier includes a method of forming a conductive pattern on both front and back surfaces of a tape-shaped metal base material and a method of forming a conductive pattern on only one surface. In the former method, a double-sided tape carrier is manufactured through the following steps.
【０００７】（１）テープ状金属基材１にパンチングで
ガイド孔２をあける第１工程。 （２）そのテープ状金属基材１の全面にフォトレジスト
３を施す第２工程。 （３）露光、現像する第３工程。 （４）テープ状金属基材１の表側をエッチングする第４
工程。 （５）前記フォトレジスト３を剥離して表側の導体パタ
ーン４を形成する第５工程。 （６）その表側の導体パターン４上に絶縁材料による補
強膜５を形成する第６工程。 （７）テープ状金属基材１の裏側にフォトレジスト３ａ
を施す第７工程。 （８）露光、現像する第８工程。 （９）前記補強膜５が形成されたテープ状金属基材１の
表側にエッチングレジスト６を形成する第９工程。 （10）テープ状金属基材１の裏側をエッチングする第１
０工程。 （11）裏側のフォトレジストコート３ａを剥離して裏側
導体パターン７を形成する第１１工程。 （12）前記裏側導体パターン７上に絶縁材料による補強
膜８を形成する第１２工程。 （13）表側の前記エッチングレジスト６を剥離する第１
３工程。(1) A first step of punching a guide hole 2 in a tape-shaped metal substrate 1 by punching. (2) A second step of applying a photoresist 3 on the entire surface of the tape-shaped metal substrate 1. (3) Third step of exposure and development. (4) The fourth step of etching the front side of the tape-shaped metal substrate 1
Process. (5) A fifth step of removing the photoresist 3 to form the front-side conductor pattern 4. (6) A sixth step of forming a reinforcing film 5 of an insulating material on the conductor pattern 4 on the front side. (7) A photoresist 3a on the back side of the tape-shaped metal substrate 1.
7th step of applying. (8) An eighth step of exposing and developing. (9) A ninth step of forming an etching resist 6 on the front side of the tape-shaped metal substrate 1 on which the reinforcing film 5 is formed. (10) First to etch the back side of the tape-shaped metal substrate 1
0 steps. (11) An eleventh step of removing the backside photoresist coat 3a to form the backside conductor pattern 7. (12) A twelfth step of forming a reinforcing film 8 of an insulating material on the back-side conductor pattern 7. (13) First to peel off the etching resist 6 on the front side
3 steps.
【０００８】後者の方法は、次の工程を経て片面タイプ
のテープキャリアを製造する。 （Ａ）テープ状金属基材１にパンチングでガイド孔２を
あける第１工程。 （Ｂ）そのテープ状金属基材１の全面にフォトレジスト
３を施す第２工程。 （Ｃ）露光、現像する第３工程。 （Ｄ）テープ状金属基材の表側をエッチングする第４工
程。 （Ｅ）前記フォトレジスト３を剥離して導体パターン４
を形成する第５工程。 （Ｆ）その導体パターン４上に絶縁材料による補強膜５
を形成する第６工程。 （Ｇ）該補強膜５が形成されたテープ状金属基材１の表
側にエッチングレジスト６を形成する第７工程。 （Ｈ）テープ状金属基材１の裏側をエッチングする第８
工程。 （Ｉ）そのエッチングされた裏側に、絶縁材料による補
強膜８を形成する第９工程。 （Ｊ）表側の前記エッチングレジスト６を剥離する第１
０工程。In the latter method, a single-sided tape carrier is manufactured through the following steps. (A) A first step of punching a guide hole 2 in a tape-shaped metal substrate 1 by punching. (B) a second step of applying a photoresist 3 on the entire surface of the tape-shaped metal substrate 1. (C) Third step of exposure and development. (D) A fourth step of etching the front side of the tape-shaped metal substrate. (E) The photoresist 3 is peeled off and the conductor pattern 4 is removed.
A fifth step of forming (F) Reinforcing film 5 of insulating material on conductive pattern 4
A sixth step of forming (G) A seventh step of forming an etching resist 6 on the front side of the tape-shaped metal substrate 1 on which the reinforcing film 5 has been formed. (H) Eighth etching of the back side of the tape-shaped metal substrate 1
Process. (I) A ninth step of forming a reinforcing film 8 made of an insulating material on the etched back side. (J) First step of removing the etching resist 6 on the front side
0 steps.
【０００９】[0009]
【発明の実施の形態】次に、本発明の実施の形態を図面
を参照して説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１０】図１に、両面タイプのテープキャリアを製
造する本発明の第１実施例を示す。この例では、厚さが
１０〜５００μｍの銅、銅合金、アルミニウム、アルミ
ニウム合金、鉄、鉄合金などによるテープ状金属材（以
下、テープ状金属基材と記す）１を基材とし、次の工程
を経て両面タイプのテープキャリアを製造する。FIG. 1 shows a first embodiment of the present invention for producing a double-sided tape carrier. In this example, a tape-shaped metal material (hereinafter, referred to as a tape-shaped metal substrate) 1 made of copper, a copper alloy, aluminum, an aluminum alloy, iron, an iron alloy, or the like having a thickness of 10 to 500 μm is used as a base material. Through the steps, a double-sided tape carrier is manufactured.
【００１１】（１）テープ状金属基材１にパンチングで
ガイド孔２をあける。 （２）テープ状金属基材１の全面にフォトレジスト３を
施す。 （３）テープ状金属基材１の表側から露光、現像する。 （４）テープ状金属基材１の表側を任意にエッチングす
る。 （５）フォトレジスト３を剥離して表側導体パターン４
を形成する。 （６）表側導体パターン４上に、耐熱性、耐薬品性を有
する絶縁材料による補強膜５を、ソルダーレジスト印刷
等で所要範囲（例えば、ばらけそうなところや補強が必
要なところ）に形成する。補強膜５の材料としては、例
えばエポキシ系やポリイミド系の樹脂を用い、厚さは５
μｍ以上とする。補強膜５の形成は、印刷法のほか、ラ
ミネート法や電着法やコート法、更にそれらを露光、現
像する方法などが考えられる。 （７）テープ状金属基材１の裏側に再びフォトレジスト
３ａを施す。 （８）テープ状金属基材１の裏側から露光、現像する。 （９）表側にエッチングレジスト６を施す。 （10）テープ状金属基材１の裏側を任意にエッチングす
る。 （11）フォトレジストを剥離して裏側導体パターン８を
形成する。 （12）裏側導体パターン８上に、上記と同様に絶縁材料
による補強膜９を形成する。 （13）表側のエッチングレジスト６を剥離する。 （14）錫などの仕上げメッキ１０を施す。(1) A guide hole 2 is formed in a tape-shaped metal substrate 1 by punching. (2) A photoresist 3 is applied to the entire surface of the tape-shaped metal substrate 1. (3) Exposure and development are performed from the front side of the tape-shaped metal substrate 1. (4) The front side of the tape-shaped metal substrate 1 is arbitrarily etched. (5) The photoresist 3 is peeled off and the front-side conductor pattern 4 is removed.
To form (6) A reinforcing film 5 made of an insulating material having heat resistance and chemical resistance is formed on the front-side conductor pattern 4 by solder resist printing or the like in a required range (for example, a place where it is likely to be separated or where reinforcement is required). I do. As a material of the reinforcing film 5, for example, an epoxy-based or polyimide-based resin is used.
μm or more. The reinforcing film 5 may be formed by a printing method, a laminating method, an electrodeposition method, a coating method, or a method of exposing or developing them. (7) The photoresist 3a is applied again on the back side of the tape-shaped metal substrate 1. (8) Exposure and development are performed from the back side of the tape-shaped metal substrate 1. (9) An etching resist 6 is applied to the front side. (10) The back side of the tape-shaped metal substrate 1 is arbitrarily etched. (11) The photoresist is peeled off to form the backside conductor pattern 8. (12) A reinforcing film 9 made of an insulating material is formed on the back-side conductor pattern 8 in the same manner as described above. (13) The etching resist 6 on the front side is peeled off. (14) Finish plating 10 such as tin is applied.
【００１２】図２に、片面タイプのテープキャリアを製
造する本発明の第２実施例を示す。この例でも、第１実
施例と同様のテープ状金属基材１を用い、次の工程を経
て片面タイプのテープキャリアを製造する。FIG. 2 shows a second embodiment of the present invention for manufacturing a single-sided tape carrier. Also in this example, a single-sided tape carrier is manufactured through the following steps using the same tape-shaped metal substrate 1 as in the first embodiment.
【００１３】（Ａ）テープ状金属基材１にパンチングで
ガイド孔２をあける。 （Ｂ）テープ状金属基材１の全面にフォトレジスト３を
施す。 （Ｃ）テープ状金属基材１の表側から露光、現像する。 （Ｄ）テープ状金属基材１の表側を任意にエッチングす
る。 （Ｅ）フォトレジスト３を剥離して表側に導体パターン
４を形成する。 （Ｆ）導体パターン４上に、耐熱性、耐薬品性を有する
絶縁材料による補強膜５を、ソルダーレジスト印刷等で
所要範囲に形成する。 （Ｇ）テープ状金属基材１の表側にエッチングレジスト
６を施す。 （Ｈ）テープ状金属基材１の裏側を所要範囲だけエッチ
ングする。 （Ｉ）裏側に上記と同様の絶縁材料による補強膜９を形
成する。 （Ｊ）表側のエッチングレジスト６を剥離する。 （Ｋ）錫などの仕上げメッキ１０を施す。(A) A guide hole 2 is formed in a tape-shaped metal substrate 1 by punching. (B) A photoresist 3 is applied to the entire surface of the tape-shaped metal substrate 1. (C) Exposure and development are performed from the front side of the tape-shaped metal substrate 1. (D) The front side of the tape-shaped metal substrate 1 is arbitrarily etched. (E) The photoresist 3 is peeled off to form a conductor pattern 4 on the front side. (F) On the conductor pattern 4, a reinforcing film 5 made of an insulating material having heat resistance and chemical resistance is formed in a required range by solder resist printing or the like. (G) An etching resist 6 is applied to the front side of the tape-shaped metal substrate 1. (H) The back side of the tape-shaped metal substrate 1 is etched only in a required range. (I) A reinforcing film 9 made of the same insulating material as described above is formed on the back side. (J) The etching resist 6 on the front side is peeled off. (K) Finish plating 10 such as tin is applied.
【００１４】[0014]
【発明の効果】以上説明したように、本発明は、テープ
状金属自体を基材としてこれをエッチングし、絶縁材料
による補強膜を形成することにより、前記テープ状金属
基材の表裏両面にそれぞれ導体パターンを設けるので、
次のような効果がある。As described above, according to the present invention, the tape-shaped metal itself is etched as a base material to form an insulating material.
By forming a reinforcing film by the tape-shaped metal
Runode respectively provided conductor patterns on both surfaces of the substrate,
The following effects are obtained.
【００１５】 表裏の導通がスルホールメッキや半田
ボール等を設けることなく可能であり、またデバイス孔
やアウターリード孔をあける特別な金型も不要で、製造
が容易でコストダウンが図れる。The front and back surfaces can be electrically connected without providing through-hole plating, solder balls, and the like, and a special mold for forming device holes and outer lead holes is not required, so that manufacturing is easy and costs can be reduced.
【００１６】 リードの補強が容易で信頼性があり、
更にリードを真っ直ぐではなく曲げることも可能で、Ｉ
Ｃ設計の自由度も増す。[0016] Reinforcement of the lead is easy and reliable.
Furthermore, it is possible to bend the lead instead of straightening it.
The degree of freedom in C design is also increased.
【図１】本発明の第１実施例を工程順に示す断面図であ
る。FIG. 1 is a sectional view showing a first embodiment of the present invention in the order of steps.
【図２】本発明の第２実施例を工程順に示す断面図であ
る。FIG. 2 is a sectional view showing a second embodiment of the present invention in the order of steps.
【図３】従来例における仕上げメッキ処理までの工程を
示す断面図である。FIG. 3 is a cross-sectional view showing a process up to a finish plating process in a conventional example.
【図４】同上のＩＣ実装工程を示す断面図である。FIG. 4 is a cross-sectional view showing an IC mounting step of the above.
【符号の説明】 １ テープ状金属基材 ２ ガイド孔 ３・３ａ フォトレジスト ４ 表側導体パターン ５ 補強膜 ６ エッチングレジスト ７ フォトレジスト ８ 裏側導体パターン ９ 補強膜 １０ 仕上げメッキ[Description of Signs] 1 Tape-shaped metal substrate 2 Guide hole 3.3a Photoresist 4 Front conductor pattern 5 Reinforcement film 6 Etching resist 7 Photoresist 8 Back conductor pattern 9 Reinforcement film 10 Finish plating
Claims (3)
ともに、該テープ状金属基材をエッチングし、絶縁材料
による補強膜を形成することにより、前記テープ状金属
基材の表裏両面にそれぞれ導体パターンを設けてなるこ
とを特徴とする、テープキャリア。A tape-shaped metal base is provided with a guide hole, and the tape-shaped metal base is etched to form an insulating material.
By forming a reinforcing film by the tape-shaped metal
A tape carrier, characterized in that a conductor pattern is provided on each of the front and back surfaces of a base material .
るテープキャリアの製造方法。 （１）テープ状金属基材にパンチングでガイド孔をあけ
る第１工程。 （２）そのテープ状金属基材の全面にフォトレジストを
施す第２工程。 （３）露光、現像する第３工程。 （４）テープ状金属基材の表側をエッチングする第４工
程。 （５）前記フォトレジストを剥離して表側導体パターン
を形成する第５工程。 （６）その表側導体パターン上に絶縁材料による補強膜
を形成する第６工程。 （７）テープ状金属基材の裏側にフォトレジストを施す
る第７工程。 （８）露光、現像する第８工程。 （９）前記補強膜が形成されたテープ状金属基材の表側
にエッチングレジストを形成する第９工程。 （10）テープ状金属基材の裏側をエッチングする第１０
工程。 （11）裏側のフォトレジストを剥離して裏側の導体パタ
ーンを形成する第１１工程。 （12）その裏側導体パターン上に絶縁材料による補強膜
を形成する第１２工程。 （13）表側の前記エッチングレジストを剥離する第１３
工程。2. A tape carrier manufacturing method for manufacturing a tape carrier through the following steps. (1) A first step of punching a guide hole in a tape-shaped metal substrate by punching. (2) A second step of applying a photoresist to the entire surface of the tape-shaped metal base material. (3) Third step of exposure and development. (4) A fourth step of etching the front side of the tape-shaped metal substrate. (5) A fifth step of removing the photoresist to form a front-side conductor pattern. (6) A sixth step of forming a reinforcing film made of an insulating material on the front conductor pattern. (7) A seventh step of applying a photoresist on the back side of the tape-shaped metal substrate. (8) An eighth step of exposing and developing. (9) A ninth step of forming an etching resist on the front side of the tape-shaped metal substrate on which the reinforcing film has been formed. (10) Tenth etching of the back side of the tape-shaped metal substrate
Process. (11) An eleventh step of removing the backside photoresist to form a backside conductive pattern. (12) A twelfth step of forming a reinforcing film of an insulating material on the back side conductor pattern. (13) A thirteenth step of removing the etching resist on the front side
Process.
るテープキャリアの製造方法。 （Ａ）テープ状金属基材にパンチングでガイド孔をあけ
る第１工程。 （Ｂ）そのテープ状金属基材の全面にフォトレジストを
施す第２工程。 （Ｃ）露光、現像する第３工程。 （Ｄ）テープ状金属基材の表側をエッチングする第４工
程。 （Ｅ）前記フォトレジストを剥離して導体パターンを形
成する第５工程。 （Ｆ）前記導体パターン上に絶縁材料による補強膜を形
成する第６工程。 （Ｇ）該補強膜が形成されたテープ状金属基材の表側に
エッチングレジストを形成する第７工程。 （Ｈ）テープ状金属基材の裏側をエッチングする第８工
程。 （Ｉ）そのエッチングされた裏側に絶縁材料による補強
膜を形成する第９工程。 （Ｊ）表側の前記エッチングレジストを剥離する第１０
工程。3. A tape carrier manufacturing method for manufacturing a tape carrier through the following steps. (A) First step of punching a guide hole in a tape-shaped metal substrate by punching. (B) a second step of applying a photoresist to the entire surface of the tape-shaped metal substrate. (C) Third step of exposure and development. (D) A fourth step of etching the front side of the tape-shaped metal substrate. (E) a fifth step of forming a conductive pattern by removing the photoresist. (F) a sixth step of forming a reinforcing film of an insulating material on the conductor pattern. (G) a seventh step of forming an etching resist on the front side of the tape-shaped metal substrate on which the reinforcing film has been formed. (H) An eighth step of etching the back side of the tape-shaped metal substrate. (I) A ninth step of forming a reinforcing film of an insulating material on the etched back side. (J) Tenth step of removing the etching resist on the front side
Process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9217977A JP3061767B2 (en) | 1997-07-29 | 1997-07-29 | Tape carrier and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9217977A JP3061767B2 (en) | 1997-07-29 | 1997-07-29 | Tape carrier and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1154568A JPH1154568A (en) | 1999-02-26 |
| JP3061767B2 true JP3061767B2 (en) | 2000-07-10 |
Family
ID=16712705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9217977A Expired - Fee Related JP3061767B2 (en) | 1997-07-29 | 1997-07-29 | Tape carrier and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3061767B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3760731B2 (en) | 2000-07-11 | 2006-03-29 | ソニーケミカル株式会社 | Bumped wiring circuit board and manufacturing method thereof |
| JP2002111185A (en) * | 2000-10-03 | 2002-04-12 | Sony Chem Corp | Wiring circuit board with bumps and method of manufacturing the same |
| KR100447495B1 (en) * | 2001-12-28 | 2004-09-07 | 이규한 | circuit pattern of tape carrier type semiconductor package and the method of manufacturing the same |
-
1997
- 1997-07-29 JP JP9217977A patent/JP3061767B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1154568A (en) | 1999-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6569712B2 (en) | Structure of a ball-grid array package substrate and processes for producing thereof | |
| JPH11163022A (en) | Semiconductor and manufacture of the same and electronic equipment | |
| JP2014160857A (en) | Flexible circuit substrate for flip-chip-on-flex applications | |
| US6271057B1 (en) | Method of making semiconductor chip package | |
| US6562250B1 (en) | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | |
| JPH10125818A (en) | Substrate for semiconductor device, semiconductor device and manufacture thereof | |
| JP3061767B2 (en) | Tape carrier and manufacturing method thereof | |
| JP3424523B2 (en) | TAB tape carrier and method of manufacturing the same | |
| JP2000340617A (en) | Tab tape carrier and its manufacture | |
| JPS60216573A (en) | Manufacture of flexible printed circuit board | |
| JP3225163B2 (en) | Tape carrier manufacturing method | |
| JP2711664B2 (en) | IC card manufacturing method | |
| JP4386827B2 (en) | Method for manufacturing printed circuit board | |
| JP2000332064A (en) | Manufacture of fine wiring tape carrier | |
| JP2727870B2 (en) | Film carrier tape and method of manufacturing the same | |
| JP3050253B2 (en) | Method of manufacturing multilayer electronic component mounting substrate | |
| JP2000138264A (en) | Film carrier tape for tab with reinforcing sheet | |
| KR100763961B1 (en) | TBGA semiconductor package and the fabrication method of the same | |
| JP4137295B2 (en) | CSP tape carrier manufacturing method | |
| JP2000332062A (en) | Manufacture of tab thin-film tape carrier | |
| KR100763963B1 (en) | TBGA Semiconductor Package and the fabrication method thereof | |
| CN117750650A (en) | Preparation method of packaging structure and packaging structure | |
| JPH0992678A (en) | Ic package and its manufacturing method | |
| JPH08191123A (en) | Manufacture of lead frame | |
| JP2833315B2 (en) | TAB tape carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20000411 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080428 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090428 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100428 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110428 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120428 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120428 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130428 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140428 Year of fee payment: 14 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |