KR20040097018A - Method for connecting PCB sheet - Google Patents

Abstract

PURPOSE: A method is provided to simplify procedures and achieve improved strength of joint and quality of printed circuit board. CONSTITUTION: A method comprises a step of cutting and removing defective printed circuit board from a printed circuit board sheet(100) constituted by a plurality of printed circuit boards, in such a manner that the cut surfaces of the printed circuit board sheet and defective printed circuit board are formed into a three-dimensional shape; and a step of bonding a non-defective printed circuit board(120) to the cut surface of the printed circuit board sheet by using an adhesive(130), and hardening the resultant structure. The defective printed circuit board is cut from the printed circuit board sheet in such a manner that the cut surfaces of the printed circuit board sheet and defective printed circuit board have stepped portions.

Description

Method for connecting printed circuit board sheet {Method for connecting PCB sheet}

The present invention relates to a method of connecting a printed circuit board sheet, and more particularly, in order to form a defective printed circuit board so that a stage is formed on a cut surface of the defective printed circuit board in a printed circuit board sheet composed of a plurality of printed circuit boards. The present invention relates to a method of connecting a printed circuit board sheet for cutting, and connecting a good printed circuit board with an adhesive to the cut surface.

In general, a printed circuit board (PCB) is a circuit line pattern formed by printing a conductive material such as copper on an electrically insulating substrate, and refers to a board immediately before mounting an electronic component.

When a bad printed circuit board is generated from a printed circuit board sheet composed of a plurality of printed circuit boards, the productivity of the printed circuit board is lowered by discarding not only the corresponding defective printed circuit board but also other good printed circuit boards. There was a problem to increase the production cost.

In order to solve this problem, as a method of bonding a printed circuit board sheet, Korean Patent Publication No. 1999-0072847 (Boarding Method and Device for Board Sheet), Patent Publication No. 2001-0036619 (Boarding Method and Device for Board Sheet), Patent Publication No. 2001-0036620 (Method and Apparatus for Bonding Substrate Sheet), Patent Publication No. 2001-0036621 (Method and Apparatus for Joining Substrate Sheet) and Patent Publication No. 2001-0036622 (Method and Apparatus for Bonding Printed Circuit Board) And the like.

The bonding method of the printed circuit board sheet disclosed in Korean Patent Laid-Open No. 2001-0036621 is made by the method disclosed in FIGS. 1 and 2.

Referring to the drawings, a conventional method for bonding a printed circuit board sheet is a poor printing of the substrate sheet 4, which is provided with a plurality of printed circuit boards 2 through the connection portion 20 on the surface of the substrate sheet (4) A notch groove forming step of forming a notch groove 22 connected to the substrate separation groove k by performing cutting of the substrate sheet around the connection part of the defective printed circuit board 2 'to remove the circuit board 2'; In addition, the printed circuit board 21 is integrally formed with the connection part 20 inside the cutout groove 22, which is a defective printed circuit board 2 ′ removal portion in the substrate sheet 4 on which the printed circuit board 2 is printed. A substrate sheet positioning step of inserting and fixing a position through the positioning unit 12 into the fixing plate 1, and a flow of the substrate sheet and the good printed circuit board 21 which are positioned and coupled to the upper portion of the substrate fixing plate 1. The substrate sheet 4 and the good printed circuit board 21 by the fixing part to prevent The space portion 13 is formed integrally with the fixing plate 1, and the space portion 13 is formed between the substrate sheet 4 and the good printed circuit board 21 positioned on the substrate fixing plate 1. A) the injection and curing step of injecting and curing the adhesive (8) made of epoxy-based volatiles in a drying furnace to a temperature of 120 ~ 200 ?? and the printed circuit board (2) of the substrate sheet (4) and its After installing the cover part to protect the good quality printed circuit board 21 inserted through the connection part 20 'from the inside, and removing the substrate positioning part installed on the board sheet which completed hardening of the adhesive by heating, The substrate fixing plate 1 is separated to complete the joining operation of the substrate sheet 4 and the good printed circuit board 21.

In the substrate sheet positioned on the substrate fixing plate 1, a heat resistant substrate fixing tape 5 is placed on the periphery and the bottom of the substrate sheet to prevent the flow of the substrate sheet.

However, such a method of bonding a printed circuit board sheet (including the methods disclosed in Korean Patent Publication No. 1999-0072847, Patent Publication No. 2001-0036619, Patent Publication No. 2001-0036620 and Patent Publication No. 2001-0036622). When cutting a bad printed circuit board from a silver substrate sheet, a cut surface is formed perpendicular to the surface of the substrate sheet, and in order to connect a good printed circuit board to the cut surface, a separate fixing plate and a fixing tape are required. Even when a sheet and a good printed circuit board are combined, it is difficult to secure a desirable adhesive strength.

This difficulty in securing the adhesive strength is more serious when a defective product occurs at both ends of the substrate sheet. This is because when a bad printed circuit board is generated at both ends of the printed circuit board sheet, the good printed circuit board that replaces the bad printed circuit board is caused by its own weight, which causes the entire printed circuit board to bend, thereby weakening the coupling part. Because it causes. In particular, when the printed circuit board is used in a BGA (Ball Grid Array) package that meets the requirements of miniaturization, light weight, and functionalization of products such as various electronic devices and communication devices, the thickness of the printed circuit board used in the BGA package is different. Since it is much thinner than the thickness of the printed circuit board, it is more difficult to secure the strength than other printed circuit boards.

The present invention was created to solve the above problems, and cut a bad printed circuit board so that a step is formed on the cut surface of the bad printed circuit board in a printed circuit board sheet consisting of a plurality of printed circuit boards, and It is an object of the present invention to provide an improved method of connecting a printed circuit board sheet so that a good printed circuit board can be connected to the cut surface through an adhesive.

1 is a perspective view illustrating a process of replacing a printed circuit board in accordance with a conventional method of connecting a printed circuit board sheet.

Figure 2 is an enlarged view of the connection portion according to the connection method of a conventional printed circuit board sheet.

3 is a view showing a connection method of a printed circuit board sheet according to an embodiment of the present invention.

Figure 4 is a view showing a coupling portion of the printed circuit board sheet according to an embodiment of the present invention.

Figure 5a is a cross-sectional view of the coupling portion connected by a conventional method of connecting a printed circuit board sheet.

Figure 5b is a cross-sectional view of the coupling portion connected by the method of connecting the printed circuit board sheet according to an embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

100 ... Printed circuit board sheet 102, 104 ... Upper cut

106 ... positioning hole 110 ... bad printed circuit board

120 ... Good quality printed circuit board 122,124 ... Lower cutout

130 ... glue

In order to achieve the above object, the present invention is to remove and remove the defective printed circuit board from the printed circuit board sheet consisting of a plurality of printed circuit board, the end of the printed circuit board sheet and the poor printed circuit board Cutting a bad printed circuit board from the printed circuit board sheet to form a; And a connecting step of bonding and curing the printed circuit board of a good product through an adhesive to a cut surface of the printed circuit board sheet. As used herein, the term " end is formed " means that the printed circuit board is three-dimensionally, that is, not cut two-dimensionally perpendicularly to the surface of the circuit board when the defective printed circuit board is cut as in the prior art. It includes all the various methods of cutting three-dimensionally. For example, it also includes the case where the cut surface is formed zigzag three-dimensionally.

Here, the good printed circuit board is preferably formed with a cut surface forming a stage corresponding to the cut surface of the printed circuit board sheet.

In addition, the printed circuit board sheet preferably includes at least one positioning hole.

In addition, the cutting step is preferably performed by a computer numerical router (CNC router).

Finally, the connecting step may include a fixing step of seating and fixing the printed circuit board sheet from which the defective printed circuit board is removed to a fixing plate having at least one fixing pin inserted into the positioning hole of the printed circuit board sheet; After applying the adhesive to the cut surface of the printed circuit board sheet, the bonding step of bonding and bonding the cut surface of the good printed circuit board and the curing of the adhesive between the cut surface of the printed circuit board sheet and the cut surface of the good printed circuit board It can be made, including.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a view illustrating a method of connecting a printed circuit board sheet according to an embodiment of the present invention, and FIG. 4 is a view illustrating a coupling portion of a printed circuit board sheet according to an embodiment of the present invention.

3 and 4, a method of connecting a printed circuit board sheet may include a cutting step and a connecting step.

The cutting step is a step of cutting and removing the defective printed circuit board 110, which is determined as defective in the printed circuit board sheet 100, from the printed circuit board sheet 100. Here, the printed circuit board sheet 100 refers to a sheet in which a plurality of printed circuit boards are arranged and connected.

The defective printed circuit board 110 may be determined through an inspection operation using a jig and a fixture that is performed in units of the printed circuit board sheet 100 before the electronic component insertion process.

In the present embodiment, a case where the printed circuit board at the right end of the drawing is a defective printed circuit board 110 that has received a defective determination will be described.

The defective printed circuit board 110 determined as defective is separated from the printed circuit board sheet 100 through a cutting operation. At this time, the cut surface of the printed circuit board sheet 100 and the bad printed circuit board 110, it is preferable to cut the bad printed circuit board 110 so that a step (형성) is formed unlike the conventional method.

In other words, in the conventional method, the cut surfaces of the printed circuit board sheet and the defective printed circuit board are vertically formed with respect to the substrate surface, so there is no upper and lower division of the cut portion.

However, according to an embodiment of the present invention, the cut surfaces of the printed circuit board sheet 100 and the defective printed circuit board 110 are formed with respect to the substrate surface. Therefore, it is possible to distinguish the top and bottom of the cut portion, and the cut surface is widened by the area of the stage.

In this embodiment, the cut portions of the printed circuit board sheet 100 become upper cut portions 102 and 104, and the cut portions of the defective printed circuit board and cut portions 122 and 124 of the good printed circuit board become the lower cut portions.

The cutting operation may be performed through a cutter (not shown), and in particular, a numerical control router (not shown) in which the operation of the machine is automatically controlled by computer-controlled numerical information (signs and values). Preferably).

Meanwhile, the printed circuit board sheet 100 may include a plurality of positioning holes 106. This is a jig test and in the process of replacing the defective printed circuit board 110 with a good quality printed circuit board 120, it is possible to smoothly perform the test and connection step by fixing the printed circuit board sheet 100.

The connecting step is a step of connecting the good quality printed circuit board 120 using the adhesive 130 to the cut surface of the printed circuit board sheet 100 from which the bad printed circuit board 110 has been removed. It can be made including a curing step.

The good quality printed circuit board 120 is preferably a printed circuit board that is determined to operate normally in a test operation performed in advance. In particular, the good printed circuit board 120 is preferably formed with a cut surface forming a stage corresponding to the cut surface of the printed circuit board sheet 100 from which the defective printed circuit board 110 has been removed.

Therefore, when the good quality printed circuit board 120 is coupled to the printed circuit board sheet 100, the cut surfaces forming the corresponding stages are in contact with each other. As a result, the good quality printed circuit board 120 is connected to the printed circuit board sheet as compared with the conventional method. The area to be bonded is made wider by the area of the formed end.

In the fixing step, the printed circuit board sheet 100 from which the good printed circuit board 120 and the defective printed circuit board 110 are removed is fixed to the fixing plate 200. The good quality printed circuit board 120 is preferably positioned where the defective printed circuit board 110 is removed and seated on the fixed plate 200.

The fixed plate 200 allows the good printed circuit board 120 and the printed circuit board sheet 100 to be fixed in the step of connecting the printed circuit board sheet 100 and the good printed circuit board 120. Therefore, the fixing plate 200 preferably has a plurality of fixing pins 202 inserted into the positioning holes 106 of the printed circuit board sheet 100.

On the other hand, the good quality printed circuit board 120 is formed with a cutting surface forming a stage corresponding to the cutting surface of the printed circuit board sheet 100, it is easier to combine the good quality printed circuit board 120 than the conventional method There is an advantage that the location to be determined can be determined.

In the combining step, after applying the adhesive to the cut surface of the printed circuit board sheet 100 and the bad printed circuit board 110, the printed circuit board sheet 100 is removed, the cut surface and the printed circuit of the good printed circuit board 120 The cut surface of the substrate sheet 100 is in close contact with each other.

The adhesive 130 is an epoxy-based volatile component is removed, preferably less thermal expansion or contraction deformation, it is preferable to add a curing agent to be firmly bonded without deformation by heat.

In this step, since the adhesive 130 is directly applied to the cut surface of the good quality printed circuit board 120 and the printed circuit board sheet 100, unlike the conventional method, the space where the adhesive is to be injected, that is, the good printed circuit board and printing There is no need to form a separate space for the adhesive to be injected by spaced apart between the circuit board sheets, and the installation of the tape to prevent leakage of the injected adhesive is unnecessary. This simplifies the process of connecting good quality printed circuit boards, resulting in lower production costs.

In the curing step, the adhesive 130 applied between the cut surface of the printed circuit board sheet 100 and the cut surface of the good printed circuit board 120 is cured to finish the process of connecting the good printed circuit board 120.

The printed circuit board sheet 100 to which the good printed circuit board 120 is coupled by means of the adhesive 130 may be subjected to a curing step of 1 hour to 4 hours at a temperature of 130 degrees to 190 degrees. In this case, the cover may be covered so that the good printed circuit board 120 and the printed circuit board sheet 100 may be protected.

As described above, the printed circuit board sheet connected by the printed circuit board connection method according to an embodiment of the present invention has the effect of strengthening the bonding strength while simplifying the process than the conventional method.

Compared to the case of the printed circuit board connected by the conventional method will be described in more detail the strengthening of the bonding strength.

Figure 5a is a cross-sectional view of the coupling portion connected by a conventional method of connecting a printed circuit board sheet, Figure 5b is a cross-sectional view of the coupling portion connected by a connection method of a printed circuit board sheet according to an embodiment of the present invention.

Referring to FIG. 5A, in the case of the conventional method of connecting a printed circuit board sheet, the printed circuit board sheet 4 and the good printed circuit board 21 are bonded by means of an adhesive 8, and the adhesive surface is cut. It is a vertical plane.

Therefore, when a bad printed circuit board is generated at both ends of the printed circuit board sheet, the good printed circuit board that replaces the bad printed circuit board has a bending effect due to its own weight, which makes it difficult to secure the strength.

Referring to Figure 5b, when the printed circuit board sheet connection method according to an embodiment of the present invention, the printed circuit board sheet 100 and the good quality printed circuit board 120 is glued by means of an adhesive 130 And, the adhesive surface corresponds to the area of the formed end is wider than the case by the conventional method.

Therefore, in the case where the thickness of the FGA as well as the printed circuit board used in the BGA package is extremely thin, the conventional printed circuit board cutting and connecting method could not secure sufficient strength, but the sheet cutting of the printed circuit board of the present invention. And when using the connection method it is possible to ensure a sufficient bond strength. In addition, even when a bad printed circuit board is generated at both ends of the printed circuit board sheet it is possible to effectively secure the strength.

As described above, in the method of connecting the printed circuit board sheet according to the present invention, the defective printed circuit board is cut such that a stage is formed on the cut surface of the defective printed circuit board in the printed circuit board sheet including the plurality of printed circuit boards. By connecting the good quality printed circuit board to the cut surface through the adhesive, the work process is simplified and the strength of the connecting portion is enhanced.

It is to be understood that the invention is not limited to that described above and illustrated in the drawings and that many more modifications and variations are possible within the scope of the following claims.

Claims (6)

The defective printed circuit board is cut and removed from the printed circuit board sheet having a plurality of printed circuit boards, and the bad printed circuit board is formed on the printed circuit board sheet so that the cut surfaces of the printed circuit board sheet and the bad printed circuit board are formed three-dimensionally. Cutting a substrate; And A connecting step of bonding and curing the printed circuit board of the good product through the adhesive on the cut surface of the printed circuit board sheet Connection method of a printed circuit board sheet comprising a. The method of claim 1, Cutting the printed circuit board sheet and the cut surface of the bad printed circuit board to be three-dimensionally formed is a bad printed circuit in the printed circuit board sheet so that a step is formed on the cut surface of the printed circuit board sheet and the bad printed circuit board. Method for connecting a printed circuit board sheet, characterized in that for cutting the substrate. The method of claim 2, The printed circuit board of the good article is a method of connecting a printed circuit board sheet, characterized in that the cut surface forming a stage corresponding to the cut surface of the printed circuit board sheet. The method of claim 1, And the printed circuit board sheet has at least one positioning hole. The method of claim 1, The cutting step is a connection method of a printed circuit board sheet, characterized in that made by a computer numerical control router (CNC router). The method of claim 4, wherein The connecting step A fixing step of seating and fixing the printed circuit board sheet from which the defective printed circuit board is removed to a fixing plate having at least one fixing pin inserted into the positioning hole of the printed circuit board sheet; After applying the adhesive to the cut surface of the printed circuit board sheet, the bonding step of bonding the cut surface of the good printed circuit board in close contact and A curing step of curing the adhesive between the cut surface of the printed circuit board sheet and the cut surface of a good quality printed circuit board; Connection method of a printed circuit board sheet comprising a.