KR100298907B1 - method and device for combine of PCB sheet - Google Patents

Abstract

PURPOSE: A method and apparatus for coupling substrate sheet is provided to couple the circuit pattern part of a substrate sheet to the other substrate sheet in an easy manner, while reducing cost and improving productivity. CONSTITUTION: An apparatus comprises a substrate attachment plate(1) where substrate sheets(4,4') of a printed circuit board having a circuit pattern printed onto the printed circuit board, are disposed; a substrate attachment tape attached integrally with the substrate attachment plate along the circumference and bottom portion of substrate sheets so as to prevent substrate sheets from being moved; a groove formed between substrate sheets attached to both sides of the substrate attachment plate so as to allow an adhesive to be injected into the groove; a substrate attachment tape attached to the bottom portion and front and rear ends of the groove so as to prevent outflow of the adhesive; and covers(10) disposed onto the substrate sheets so as to protect the substrate sheets attached onto the substrate attachment plate.

Description

Method and device for combine of PCB sheet

The present invention relates to a substrate sheet joining method and apparatus for removing defective parts of a printed circuit board (hereinafter referred to as 'PCB') arranged in series on a sheet and bonding a new PCB sheet. And removing the defective circuit pattern of the circuit pattern printed on both sides of the substrate sheet, and positioning the substrate sheets on which one good circuit pattern is printed on both sides of the upper part of the substrate fixing plate, respectively, and the flow of the substrate sheet at the periphery of the both substrate sheets. In order to prevent this, a substrate fixing tape made of a heat resistant tape is installed integrally with the substrate fixing plate, and the curing agent for fixing the substrates between the two substrate sheets is continuously arranged on the sheet due to injection curing. One board sheet from which defective parts of PCB are removed can be easily combined with other board sheets The present invention relates to a substrate sheet joining method and apparatus that can be used by being easily fixed and used, as well as enabling the defective substrate sheet to be discarded accordingly.

In the conventionally known substrate sheet structure, as shown in FIG. 1, a circuit sheet 51 (51 ') printed on both left and right surfaces is arranged so that a substrate sheet 52 is printed. Is done.

In the conventional substrate sheet 52 as described above, the circuit patterns 51 are printed on both sides, and the same circuit patterns 51 and 51 'are printed on both sides of the substrate sheet 52 which are laminated in a plurality of layers. After forming a sheet on the sheet (Sheet), through the jig and fixture (Jig & Fixture) through the circuit pattern (51, 51 ') inspection work on both sides of the substrate to measure the good and defective, abnormal The non-defective substrate sheet 52 is used as a product, and when the defect is determined, the substrate sheet 52 is discarded.

However, during the inspection operation of the circuit patterns 51 and 51 'which are arranged in series on both sides of the substrate sheet 52 as described above, among the circuit boards 51 and 51' of both sides of the substrate sheet 52. When an abnormality occurs in one of the circuit patterns 51, the PCB printed with the other circuit pattern having no abnormality must be disposed of together with the substrate sheet 52.

In particular, in the above case, as well as the loss of the substrate sheet 52 by integrating with the printed good circuit pattern printed on the substrate sheet 52, as well as the workability according to the manufacturing of the substrate sheet and There have been many problems such as lowering productivity and raising the unit price of the product.

SUMMARY OF THE INVENTION The present invention has been made to solve various problems of the related art as described above, and an object thereof is to provide a circuit pattern portion of one substrate sheet from which the substrate sheet of the defective circuit pattern portion of the substrate sheet which is continuously arranged on both sides on the sheet is removed. It can be easily and easily combined and used with the substrate sheet, thereby enabling the production of defective substrate sheets discarded accordingly, increasing the yield of products by recycling the substrate sheet, and reducing product cost. It is to provide a coupling device of the substrate sheet capable of.

Another object of the present invention is to cut the substrate sheet on which the good circuit pattern is printed, and place it on a substrate fixing plate to easily combine both substrate sheets using a substrate fixing tape and a curing agent composed of a heat resistant tape. It is to provide a method of bonding a substrate sheet that can further improve the workability and productivity according to the production of the substrate sheet.

1 is a schematic perspective view showing a substrate sheet of a general printed circuit board arranged continuously on a sheet;

Figure 2 is a schematic exploded perspective view showing a state in which the circuit board printed circuit pattern is positioned on both sides of the substrate holding plate and coupled according to the present invention.

Figure 3 is a schematic perspective view of the bonding state of the substrate sheet of the present invention.

FIG. 4 is a structural diagram illustrating a portion A of FIG. 3. FIG.

Figure 5 is a front cross-sectional view showing a bonded state of the substrate sheet of the printed circuit board on both sides of the present invention.

Explanation of symbols on the main parts of the drawings

1 ... substrate holding plate 2 ... circuit pattern

3 ... printed circuit board 4,4 '... substrate sheet

5 ... substrate fixing tape 5 '... substrate fixing tape

6.Board fixing pin 7 ... Pin fixing hole

8 ... glue 9 ... recess

As a technical configuration for achieving the above object, the present invention provides a substrate fixing plate, each of which is located on the substrate sheet of the printed circuit board printed circuit patterns on both sides of the upper,

A substrate fixing tape comprising a heat-resistant tape which is mounted integrally with a substrate fixing plate on the periphery and the bottom of both substrate sheets to prevent flow of the substrate sheet;

A groove having a space for injecting an adhesive between the substrate sheets fixed to both sides of the substrate fixing plate;

A substrate fixing tape composed of a heat resistant tape installed at the bottom and front and rear ends of the groove to prevent the adhesive from leaking out;

In order to protect the substrate sheet to be fixed to both sides of the upper part of the substrate fixing plate by providing a coupling device of the substrate sheet, characterized in that it comprises a cover portion installed on the upper side of the substrate sheet.

In addition, the present invention, the bad circuit pattern removal step of performing a cutting operation by cutting the substrate sheets in the center of both circuit patterns in order to remove the defective circuit pattern of the substrate sheet is printed on both sides of the surface of the substrate sheet,

A substrate sheet position fixing step of placing a substrate sheet on which a good circuit pattern is printed and a substrate sheet on which a circuit pattern is printed are fixed to a substrate fixing plate by fixing the substrate sheet on a substrate fixing plate;

In order to prevent the flow of the substrate sheet on the periphery and the bottom of the substrate sheet positioned on both sides of the substrate fixing plate, a double-sided substrate fixing tape composed of a heat resistant tape is integrally installed with the substrate fixing plate, and A substrate sheet fixing step of installing a substrate fixing tape composed of a heat resistant tape to prevent leakage of the adhesive at the front and rear ends, and the bottom of the groove formed between 1 and 5 mm between the substrate sheets positioned on both sides of the upper side;

An adhesive injection and curing step of injecting an epoxy-based adhesive in which a volatile component is removed in a recess between the two substrate sheets to cure at a temperature of 120 ° to 200 ° in a drying furnace;

After removing the substrate fixing tape installed on the periphery of both substrate sheets on which the curing of the adhesive by the heating was completed, and the substrate fixing tapes installed on the bottom and front and rear ends of the grooves, the substrate fixing pins of the substrate fixing plate were removed. From the substrate holding plate separating step of separating the substrate from the substrate bonding method of the substrate sheet, characterized in that to complete the joining operation of the two substrate sheets.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a schematic perspective view showing a state in which the substrate sheet printed circuit pattern is bonded to both sides of the substrate holding plate according to the present invention, Figure 4 is a structure diagram of the main portion of the substrate sheet of the present invention, the substrate fixing Substrate sheets 4 and 4 'of the printed circuit board 3, on which the circuit pattern 2 is printed, are positioned on both sides of the upper plate 1, respectively, and peripheral portions of the both substrate sheets 4 and 4'. And at the bottom, a double-sided substrate fixing tape 5 made of a heat resistant tape is installed integrally with the substrate fixing plate 1 to prevent the flow of the substrate sheets 4 and 4 '. .

The substrate fixing plate 1 is provided with substrate fixing pins 6 protruding from the corners thereof, and pin fixing holes 7 at the corners of the substrate sheets 4 and 4 'positioned at both upper sides thereof. Is formed, and the substrate fixing pin 6 of the substrate fixing plate 1 is inserted into the pin fixing hole 7 of the substrate sheet to be supported.

In addition, grooves 9 for injecting the adhesive 8 are formed between the two substrate sheets 4 and 4 ', and at the bottom and front and rear ends of the grooves 9, In order to prevent the outflow, a substrate fixing tape 5 'made of a heat resistant tape is installed.

In addition, a cover portion 10 is installed above the substrate sheets 4 and 4 ′ which are fixed to both upper sides of the substrate fixing plate 1 to protect the substrate sheet and to expose the grooves 9 to the outside. In the inside), the adhesive 8 is injected and cured, and the two substrate sheets 4 and 4 'are bonded to each other.

Referring to the substrate sheet bonding method of the present invention having such a configuration as follows.

As shown in Figs. 2 to 5, an error occurs in the circuit pattern of one of the printed circuit boards 3 of the substrate sheet on which the circuit patterns 2 and 2 are continuously arranged on the left and right surfaces. In order to remove the circuit pattern judged to be defective, cutting the center of the substrate sheet 4 on which the circuit pattern has been printed on both sides of the surface of the substrate sheet by using a router or a cutting machine is performed. The substrate sheet 4 on which the circuit pattern 2 is printed is prepared, and other good circuit patterns are integrally combined with the printed substrate sheet 4 '.

The substrate sheet 4 on which the cutting operation is completed is fixed to the substrate fixing plate 1 together with the other substrate sheets 4 'and fixed at this time. The pins 6 are inserted into the pin fixing holes 7 formed at the corners of both substrate sheets 4 and 4 'so that the substrate sheets 4 and 4' are fixed in position above the substrate fixing plate 1. do.

As described above, the substrate sheets 4 and 4 'positioned on both sides of the substrate fixing plate 1 are heat resistant in order to prevent the substrate sheets 4 and 4' from flowing at the periphery and the bottom thereof. The double-sided substrate fixing tape 5 made of a tape is installed integrally with the substrate fixing plate 1, wherein the substrate fixing tape 5 allows the deformation by the heat to be minimized and the substrate sheet. When the bonding is complete, it consists of a heat-resistant tape for easy removal.

Subsequently, a space is formed between the substrate sheets 4 and 4 'positioned on both sides of the substrate fixing plate 1 by a distance of about 1 to 5 mm for the injection of the adhesive 8 therebetween. In order to prevent the leakage of the adhesive 8 which is provided at the bottom of the groove 9 and the front and rear ends of the groove 9, the tape for fixing the substrate 5 is also made of a heat resistant tape 5 Erect ').

At this time, when the separation distance t between the upper both side substrate sheets 4 and 4 'of the substrate fixing plate 1 is less than or equal to 1 mm, it is injected into the recess 9 formed by the separation distance. And the adhesive 8 to be hardened cannot sufficiently bond both substrate sheets 4 and 4 ', and when the separation distance t exceeds 5 mm, the bonding of both substrate sheets is sufficient. Expensive adhesive is excessively injected into the space of the groove to be enlarged, so that there is an economical disadvantage. Preferably, about 2 mm is suitable in the embodiment of the present invention.

On the other hand, the both side substrate sheets 4 and 4 which have been fixed by the substrate fixing tape 5, which is a heat resistant tape, and the substrate fixing tape 5 'installed on the bottom and front and rear ends of the groove 9 as described above. ') Is injected into the groove (9) therebetween to cure in the drying furnace, wherein the adhesive (8) is made of epoxy-based volatiles removed to minimize thermal expansion or shrinkage deformation And curing agent at 120 ° -200 °, and the adhesive 8 is added with a curing agent composed of a high-temperature epoxy resin so that both substrate sheets can be firmly adhered without thermal deformation. The addition ratio of the curing agent is added at a ratio of 1-5 wt% of the curing agent to 99-95 wt% of the adhesive.

As described above, a plate-shaped cover portion 10 is installed on both sides of the substrate sheets 4 and 4 ′ in which the adhesive 8 is injected into the grooves 9, thereby forming the substrate sheets 4 and 4 ′. To protect it from heat, and the adhesive (8) filled in the groove (9) is exposed to the outside, and then the substrate fixing plate (1) integrally with the substrate sheet (4) (4 ') as a heating furnace By transferring and heating to a temperature of 120 ° -200 °, the adhesive 8 between the two substrate sheets 4, 4 'is cured.

Both substrate sheets 4 and 4 'having completed the curing of the adhesive by heating are tapes 5' installed on the bottom and front and rear ends of the substrate fixing tape 5 and grooves 9 installed on the periphery thereof. ), And then the two substrate sheets 4, 4 'are joined by the operation of separating the two substrate sheets 4, 4' from the substrate fixing pins 6 of the substrate fixing plate 1. This is done.

As described above, according to the method and apparatus for joining the substrate sheet, the circuit pattern portion of one substrate sheet from which the defective circuit pattern portions of the substrate sheets arranged on both sides in succession on the sheet is removed easily and easily from other substrate sheets. In addition to being able to be fixed and utilized, it is also possible to commercialize the discarded substrate sheet accordingly, it is possible to reduce the product cost while increasing the product yield according to the recycling of the substrate sheet, The bonding is made simple, there is an excellent effect that can further improve the workability and productivity according to the production of the substrate sheet.

While the invention has been shown and described with respect to specific embodiments thereof, it will be appreciated that the invention can be varied and modified without departing from the spirit or scope of the invention as set forth in the claims below. It will be clear to those skilled in the art that it can be easily understood.

Claims (12)

A substrate fixing plate 1 on which the substrate sheets 4 and 4 'of the printed circuit board 3, on which the circuit pattern 2 is printed, on both sides thereof, are positioned; For fixing both sides of the substrate substrate 4 and 4 'on the periphery and bottom of the substrate substrate 4 and 4', which are integrally mounted with the substrate fixing plate 1 to prevent flow of the substrate sheets 4 and 4 '. Tape 5, A recess 9 formed between the substrate sheets 4 and 4 ′ fixed to both sides of the upper part of the substrate fixing plate 1 to form an injection space for the adhesive 8; A substrate fixing tape 5 'installed on the bottom and front and rear ends of the groove 9 to prevent the adhesive 8 from leaking out; And a cover part 10 mounted above the substrate sheets 4 and 4 'to protect the substrate sheets 4 and 4' which are fixed to both sides of the upper part of the substrate fixing plate 1. Bonding device for substrate sheet. The substrate holding plate (1) of claim 1, wherein the substrate holding pins (6) protrude from the corners of the substrate holding plate (1), and the substrate holding plates (1) are located at the corners of the substrate sheets (4) (4 ') located on both sides thereof. A pinning hole (7) is formed so that the substrate fixing pin (6) of the substrate fixing plate (1) is inserted into the pin fixing hole (7) of the substrate sheet so as to be supported. The bonding of the substrate sheet according to claim 1, wherein the adhesive (8) injected into the groove (9) formed between the both side substrate sheets (4) and 4 'is cured. Device. 2. The substrate according to claim 1, wherein the substrate sheet is protected, and an adhesive 8 is injected and cured in the recess 9 to be exposed to the outside to bond both substrate sheets 4 and 4 '. Coupling device of sheet. The substrate fixing tape (5) mounted on the periphery and the bottom of the substrate sheet to prevent the flow of the substrate sheets (4) (4 ') located on both sides of the substrate holding plate (1), Bonding device of the substrate sheet, characterized in that composed of a heat-resistant tape to prevent thermal deformation. The groove (9) according to claim 1, wherein the groove (9) formed for the injection of the adhesive (8) between the substrate sheets (4) and 4 'located on both sides of the upper part of the substrate fixing plate (1) is (4) A bonding apparatus for a substrate sheet, characterized in that a space is formed by forming a separation distance of 1-5 mm between (4 '). The tape (5 ') according to claim 1, wherein the tape (5') is installed at the bottom and front and rear ends of the groove (9) formed between the both side substrate sheets (4) (4 ') to prevent leakage of the adhesive (8). Bonding device of the substrate sheet, characterized in that composed of a heat-resistant tape to prevent deformation. Removing a defective circuit pattern by separating a defective circuit pattern by performing a cutting operation on the center of the substrate sheet on which both circuit patterns are formed by a cutter to remove the defective circuit pattern of the substrate sheet printed on both sides of the substrate sheet; A substrate sheet position fixing step of placing a substrate sheet on which a good circuit pattern is printed and a substrate sheet on which another good circuit pattern is printed on a substrate fixing plate and fixing it through a substrate fixing pin protruding at a corner; Double-sided substrate fixing tape made of a heat-resistant tape for preventing the flow of the substrate sheet on the periphery and the bottom of the two substrate sheets positioned on both sides of the substrate fixing plate, and integrally mounted with the substrate fixing plate, and fixing the substrate A substrate sheet fixing step of installing a tape to prevent leakage of the adhesive at the bottom of the groove formed at a length of 1 to 5 mm between the substrate sheets positioned at both sides of the upper part of the plate, and the front and rear ends; An adhesive injection and curing step of injecting an epoxy-based adhesive in which a volatile component is removed in a recess between the two substrate sheets to cure at a temperature of 120 ° C. to 200 ° C. in a drying furnace; The substrate fixing tape placed on the periphery of both substrate sheets on which the curing of the adhesive by the heating is completed, and the tapes mounted on the bottom and front and rear ends of the grooves are removed, and the substrate sheet is fixed to the substrate fixing plate to support the substrate sheet. A method of joining a substrate sheet, characterized in that the joining operation of both substrate sheets is completed through a substrate holding plate separation step of separating the substrate holding plate from the pins to separate the substrate holding plate. 10. The method of claim 8, wherein the adhesive filled in the grooves between the two substrate sheets is added with a curing agent composed of a heat resistant epoxy resin so that both substrate sheets can be bonded without deformation due to heat. . The method of claim 10, wherein the addition ratio of the curing agent added to the adhesive is added at a ratio of 1-5 wt% of the curing agent to 99-95 wt% of the adhesive. 9. The method of joining a substrate sheet according to claim 8, wherein a plate-shaped cover portion for protecting the substrate sheet from heat is installed on both sides of the substrate sheet into which the adhesive is injected. The method of claim 8, wherein the adhesive filled in the groove between the two substrate sheets is exposed to the outside.