CN106561070B - Flexible circuit board manufacturing method - Google Patents
Flexible circuit board manufacturing method Download PDFInfo
- Publication number
- CN106561070B CN106561070B CN201510638404.8A CN201510638404A CN106561070B CN 106561070 B CN106561070 B CN 106561070B CN 201510638404 A CN201510638404 A CN 201510638404A CN 106561070 B CN106561070 B CN 106561070B
- Authority
- CN
- China
- Prior art keywords
- substrate
- conducting wire
- photosensitive resin
- circuit board
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
Abstract
The present invention relates to a kind of flexible circuit board manufacturing methods, comprising steps of a photosensitive resin is formed in a removable substrate, the substrate is conductive metallic material；The part photosensitive resin is selectively removed by exposure development mode forms a plurality of groove, substrate described in the groove expose portion；Filling conductive metal forms conducting wire, the conducting wire surface and the photosensitive resin flush in the groove, and the conducting wire in the groove has the two sidewalls being parallel to each other, and the side wall is perpendicular to the substrate；The substrate is removed, the flexible circuit board of conducting wire insertion photosensitive resin is obtained.
Description
Technical field
The present invention relates to circuit board manufacturing area more particularly to a kind of flexible circuit board manufacturing methods.
Background technique
Currently, in the method for manufacturing circuit board that circuit board manufacturing area generallys use, as shown in Figure 10, in the route system of completion
After work, for 61 projection of conducting wire in substrate 62, the adhesion between conducting wire 61 and substrate 62 only relies on the conducting wire
Binding force between 61 surfaces 611 contacted with substrate 62 and substrate 62.As conducting wire develops towards fining direction, institute
The contact area stated between conducting wire and substrate gradually becomes smaller, so that the conducting wire is easy to remove with substrate, Jin Erzao
At short circuit.In addition, as shown in figure 11, when forming cover film 70 in the conducting wire 61, due to the glue of the cover film 70
Layer 71 is because the gap between the conducting wire 61 is filled in pressing, so that the circuit board surface after pressing is uneven, it is unfavorable
It is encapsulated in sequent surface.
Summary of the invention
In view of this, it is necessary to provide a kind of flexible circuit board manufacturing methods for overcoming the above problem.
A kind of flexible circuit board manufacturing method a, comprising steps of photosensitive resin is formed in a removable substrate, institute
Stating substrate is conductive metallic material；The part photosensitive resin is selectively removed by exposure development mode forms a plurality of groove,
Substrate described in the groove expose portion；Filling conductive metal forms conducting wire, the conducting wire table in the groove
Face and the photosensitive resin flush, the conducting wire in the groove have the two sidewalls being parallel to each other, and the side wall hangs down
Directly in the substrate；The substrate is removed, the flexible circuit board of conducting wire insertion photosensitive resin is obtained.
Compared with prior art, flexible circuit board manufacturing method provided by the invention, due to using photosensitive resin as base
Bottom, and conducting wire is embedded in the photosensitive resin, on the one hand, it can increase between the conducting wire and the substrate
Contact area, to increase the adhesion strength between the conducting wire and the substrate；On the other hand, it may make the soft of final molding
Property circuit board surface it is smooth, in favor of sequent surface encapsulation.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section for the substrate that embodiment of the present invention provides.
Fig. 2 is the diagrammatic cross-section after the opposite two sides of the substrate of Fig. 1 press photosensitive resin and photoresist layer respectively.
Fig. 3 is that the part photosensitive resin that selectivity removes in Fig. 2 forms a plurality of groove and by the photoresist layer
Production forms the stereoscopic schematic diagram after plating barrier layer.
Fig. 4 is diagrammatic cross-section of the Fig. 3 after photosensitive resin forms a plurality of groove.
Fig. 5 is to fill conductive metal in the groove from Fig. 4 to form the diagrammatic cross-section after conducting wire.
Fig. 6 is the diagrammatic cross-section after the plating barrier layer removed in Fig. 5.
Fig. 7 is that the photosensitive resin and conducting wire surface in Fig. 6 form the diagrammatic cross-section after the first cover film.
Fig. 8 is the substrate removed in Fig. 7, the diagrammatic cross-section after exposing the photosensitive resin and conducting wire.
Fig. 9 is after the photosensitive resin and conducting wire of Fig. 8 form the second cover film away from the first cover film side
Diagrammatic cross-section.
Figure 10 is the cross-sectional view completed after route production in the prior art.
Figure 11 is the cross-sectional view after the circuit surface of Figure 10 presses cover film.
Main element symbol description
Substrate 10,62
First surface 11
Second surface 12
Photosensitive resin 21
Photoresist layer 22
Groove 211
Plating barrier layer 31
Conducting wire 40,61
First cover film 51
First glue-line 511
First film layer 512
Second cover film 52
Second glue-line 521
Second film layer 522
Cover film 70
Glue-line 71
Surface 611
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Flexible circuit board manufacturing method provided by the invention is described in detail With reference to embodiment.
The flexible circuit board manufacturing method that embodiment of the present invention provides, comprising steps of
The first step, referring to Fig. 1, providing a substrate 10.
The substrate 10 includes opposite first surface 11 and second surface 12.The substrate 10 can be led for copper, aluminium, silver etc.
Electric metal material.In present embodiment, the substrate 10 is fine copper.
Second step a, referring to Fig. 2, photosensitive resin 21 is formed in the substrate 10.
In present embodiment, the photosensitive resin 21 is formed in the first table of the substrate 10 by vacuum pressing-combining mode
On face 11.The substrate 10 can be removed from the photosensitive resin 21.In present embodiment, a photosensitive resin 21 is being formed in institute
While stating on first surface 11, in the 12 vacuum pressing-combining photoresist layer 22 of second surface.
The first surface 11 is completely covered in the photosensitive resin 21.The photoresist layer 22 is completely covered described second
Surface 12.In present embodiment, the photoresist layer 22 is common dry film.The photosensitive resin 21 has excellent fire-retardant
Property, without antimony Halogen, the advantages such as resolution is high, excellent anti-ion transport and resistance toization gold, repellency are low.The photosensitive resin
21 photoresist layers 22 have relatively low lost factor D f (Dissipation Factor) and dielectric constant Dk
(Dielectric Constant).In present embodiment, the dielectric constant Dk of the photosensitive resin 21 is 2.8, and scatter and disappear factor D f
It is 0.005.The thickness of the photosensitive resin 21 can be 25,30,38 or 45 microns.
Third step, referring to Figure 2 together, Fig. 3 and Fig. 4, selectivity remove the part photosensitive resin 21 and form a plurality of ditch
Slot 211.
In present embodiment, the part photosensitive resin 21 is selectively removed by exposure development mode, described in being formed
Groove 211.The first surface 11 of substrate 10 described in 211 exposed portion of groove.Every groove 211 has two side walls
2111.In present embodiment, the side wall 2111 is parallel to each other, and the side wall 2111 is perpendicular to the first table of the substrate 10
Face 11.
In present embodiment, while photosensitive resin 21 of selectively removal part, to the photoresist layer 22
It is exposed and is developed to plating barrier layer 31.The second surface 12 is completely covered in the plating barrier layer 31.
4th step, referring to Fig. 5, filling conductive metal in the groove 211 forms conducting wire 40.
The conducting wire 40 is embedded in the photosensitive resin 21.The surface of the conducting wire 40 and the photosensitive resin
21 flush.That is, the conducting wire 40 deviates from the base away from the surface of the substrate 10 and the photosensitive resin 21
The surface at bottom 10 is in the same plane.
In present embodiment, the conducting wire 40 can be formed by plating mode.
5th step removes the plating barrier layer 31 also referring to Fig. 5 and Fig. 6, exposes the substrate 10.
6th step, referring to Fig. 7, forming the first cover film 51 in the photosensitive resin 21 and 40 surface of conducting wire.
First cover film 51 includes the first glue-line 511 and the first film layer 512.First glue-line 511 more described
One film layer 512 is close to the photosensitive resin 21 and conducting wire 40.
7th step removes the substrate 10, exposes the photosensitive resin 21 and conducting wire referring to Figure 7 together and Fig. 8
40。
In present embodiment, the substrate 10 is removed using etching mode.
8th step is covered in the photosensitive resin 21 and conducting wire 40 away from described first also referring to Fig. 8 and Fig. 9
51 side of epiphragma forms the second cover film 52.
Second cover film 52 includes the second glue-line 521 and the second film layer 522.Second glue-line 521 more described
Two film layers 522 are close to the photosensitive resin 21 and conducting wire 40.
It is understood that in other embodiments, aforementioned 5th step and the 6th convertible sequence of step.
It is understood that the flexible circuit board manufacturing method also may not include in the base in other embodiments
The 12 vacuum pressing-combining photoresist layer 22 of second surface at bottom 10；The plating resist is formed to 22 exposure development of photoresist layer
Barrier 31；And the step of removing the plating barrier layer 31, exposing substrate 10.It is led at this point, being filled in the groove 211
While electric metal forms conducting wire 40, coating is formed in the second surface 12 of the substrate 10；Removing the substrate 10
While, remove the coating on the second surface 12 of the substrate 10.
It is understood that the substrate 10 can be used dielectric material and be made in other embodiments.At this point, described
Before filling conductive metal forms the conducting wire 40 in groove 211, the first table of the substrate 10 first exposed to the open air in the groove 211
The side wall 2111 of face 11 and the groove 211 forms plating seed layer.
Compared with prior art, flexible circuit board manufacturing method provided by the invention, due to using photosensitive resin as base
Bottom, and conducting wire is embedded in the photosensitive resin, on the one hand, it can increase between the conducting wire and the substrate
Contact area, to increase the adhesion strength between the conducting wire and the substrate；On the other hand, it may make the soft of final molding
Property circuit board surface it is smooth, in favor of sequent surface encapsulation.
It is understood that for those of ordinary skill in the art, can do in accordance with the technical idea of the present invention
Various other changes and modifications out, and all these changes and deformation all should belong to the protection model of the claims in the present invention
It encloses.
Claims (5)
1. a kind of flexible circuit board manufacturing method, comprising steps of
One photosensitive resin is formed in a removable substrate, the substrate is conductive metallic material；By exposure development side
Formula selectively removes the part photosensitive resin and forms a plurality of groove, substrate described in the groove expose portion；
Filling conductive metal forms conducting wire in the groove, and the conducting wire surface and the photosensitive resin surface are flat
Together, the conducting wire in the groove has the two sidewalls being parallel to each other, and the side wall is perpendicular to the substrate；
The substrate is removed, the flexible circuit board of conducting wire insertion photosensitive resin is obtained.
2. flexible circuit board manufacturing method as described in claim 1, which is characterized in that fill conductive metal in the groove
It is formed after conducting wire, and further includes in the photosensitive resin and conducting wire surface shape before the removal substrate
At the first cover film.
3. flexible circuit board manufacturing method as claimed in claim 2, which is characterized in that after removing the substrate, further include
The second cover film is formed away from first cover film side in the conducting wire and photosensitive resin.
4. flexible circuit board manufacturing method as described in claim 1, which is characterized in that photosensitive by one by vacuum pressing-combining mode
Resin is formed in a removable substrate.
5. flexible circuit board manufacturing method as described in claim 1, which is characterized in that in the groove by plating mode
It fills conductive metal and forms conducting wire.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510638404.8A CN106561070B (en) | 2015-10-06 | 2015-10-06 | Flexible circuit board manufacturing method |
| TW104133453A TWI599287B (en) | 2015-10-06 | 2015-10-13 | Method for manufacturing flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510638404.8A CN106561070B (en) | 2015-10-06 | 2015-10-06 | Flexible circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106561070A CN106561070A (en) | 2017-04-12 |
| CN106561070B true CN106561070B (en) | 2019-06-11 |
Family
ID=58485293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510638404.8A Active CN106561070B (en) | 2015-10-06 | 2015-10-06 | Flexible circuit board manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106561070B (en) |
| TW (1) | TWI599287B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109360674A (en) * | 2018-10-18 | 2019-02-19 | 吴江友鑫新材料科技有限公司 | A kind of transparent conductive metal grid film and preparation method thereof |
| CN113950204B (en) * | 2020-07-16 | 2024-04-12 | 深南电路股份有限公司 | Manufacturing method of prefabricated circuit board and prefabricated circuit board |
| CN114171663A (en) * | 2021-12-07 | 2022-03-11 | 丰鹏电子(珠海)有限公司 | Heat dissipation substrate and preparation method thereof |
| CN114786329A (en) * | 2022-05-26 | 2022-07-22 | 大连吉星电子股份有限公司 | High-leveling-degree flexible circuit board and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1709016A (en) * | 2002-12-09 | 2005-12-14 | 野田士克林股份有限公司 | Method for manufacturing printed circuit board |
| CN1799292A (en) * | 2003-06-04 | 2006-07-05 | 大见忠弘 | Substrate and process for producing the same |
| CN1947478A (en) * | 2004-03-31 | 2007-04-11 | 日本瑞翁株式会社 | Circuit board, circuit board manufacturing method and display apparatus provided with circuit board |
| CN102296006A (en) * | 2010-06-28 | 2011-12-28 | 拉姆科技有限公司 | Cleaning composition and method for forming semiconductor figure using the same |
| CN104219876A (en) * | 2013-05-31 | 2014-12-17 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacture method thereof |
| CN104349579A (en) * | 2013-07-26 | 2015-02-11 | 易鼎股份有限公司 | Leveling coating structure of flexible circuit board |
-
2015
- 2015-10-06 CN CN201510638404.8A patent/CN106561070B/en active Active
- 2015-10-13 TW TW104133453A patent/TWI599287B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1709016A (en) * | 2002-12-09 | 2005-12-14 | 野田士克林股份有限公司 | Method for manufacturing printed circuit board |
| CN1799292A (en) * | 2003-06-04 | 2006-07-05 | 大见忠弘 | Substrate and process for producing the same |
| CN1947478A (en) * | 2004-03-31 | 2007-04-11 | 日本瑞翁株式会社 | Circuit board, circuit board manufacturing method and display apparatus provided with circuit board |
| CN102296006A (en) * | 2010-06-28 | 2011-12-28 | 拉姆科技有限公司 | Cleaning composition and method for forming semiconductor figure using the same |
| CN104219876A (en) * | 2013-05-31 | 2014-12-17 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacture method thereof |
| CN104349579A (en) * | 2013-07-26 | 2015-02-11 | 易鼎股份有限公司 | Leveling coating structure of flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI599287B (en) | 2017-09-11 |
| TW201720256A (en) | 2017-06-01 |
| CN106561070A (en) | 2017-04-12 |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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