TWM546084U - Circuit board module structure improvement - Google Patents

Circuit board module structure improvement Download PDF

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Publication number
TWM546084U
TWM546084U TW106205544U TW106205544U TWM546084U TW M546084 U TWM546084 U TW M546084U TW 106205544 U TW106205544 U TW 106205544U TW 106205544 U TW106205544 U TW 106205544U TW M546084 U TWM546084 U TW M546084U
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Taiwan
Prior art keywords
casing
circuit board
electronic module
improved
housing
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TW106205544U
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Chinese (zh)
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Jiang-Rong Xie
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Jiang-Rong Xie
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Priority to TW106205544U priority Critical patent/TWM546084U/en
Publication of TWM546084U publication Critical patent/TWM546084U/en

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Description

電路板模組結構改良 Circuit board module structure improvement

本創作係關於一種電路板模組結構改良,尤指一種一體成型該電子模組與該殼體,藉由外殼與電路板密合而使其防止進水而短路,進而達到防止其電路板漏電之功能者。 The present invention relates to an improved circuit board module structure, in particular to an integral molding of the electronic module and the housing, which is prevented from entering the water and short-circuited by the outer casing and the circuit board, thereby preventing leakage of the circuit board. The function of the person.

按,電路板為許多電子設備產品不可或缺的零件之一,其功能在於提供不同電子元件之間的電子訊號傳輸,隨著電路板及電子元件製作技術的進步,電路板及電子元件之設計漸漸朝向小尺寸的方向前進,以符合現代電子產品微型化的需求,然而,隨著電子設備的種類不同,其內部的電路板態樣及接線型態亦有所不同,然而有些型態的電路板會暴露在各式各樣的環境中,比如廁所的感測裝置或電動柵欄門之感應裝置,而有可能使電路板受水氣或小生物的干擾,因此需要藉由裝設一外殼或組設於不會受影響的地方,而一般而言,電路板會經由組接完訊號電線再以黏膠或以螺絲鎖定於一殼體內部,再藉由鎖上蓋子將電路板設於其內,達到保護電路板的功能。 According to the circuit board, it is one of the indispensable parts of many electronic equipment products. Its function is to provide electronic signal transmission between different electronic components. With the advancement of circuit board and electronic component manufacturing technology, the design of circuit boards and electronic components Gradually moving toward a small size to meet the needs of miniaturization of modern electronic products. However, with the different types of electronic devices, the internal circuit board patterns and wiring patterns are also different, but some types of circuits The board will be exposed to a wide variety of environments, such as the sensing device of the toilet or the sensing device of the electric fence door, which may cause the board to be disturbed by moisture or small organisms, so it is necessary to install an outer casing or The group is placed in a place that will not be affected. Generally, the circuit board will be connected to the inside of the casing with glue or screws by connecting the signal wires, and then the circuit board is placed on the casing by locking the cover. Inside, the function of protecting the circuit board is achieved.

然,就上述習知而言,由於習知電路板外殼結構,係以組合 方式組裝於電路板上,氣密性相對不佳,而內部之電路板更可能用黏膠進行固定,更可能沾黏到電路板重要之部位而產生短路或因黏膠覆蓋於上端而使散熱不佳,雖然習知電路板外殼可以阻擋潑水或些微水氣,但可能經由長時間而經由外殼結合的縫隙或鎖固螺絲的地方滲入,而使電路板短路或失靈等事端發生,而有些電路板因需要有散熱之空間,更導致外殼無法保護其電路板而使其電路板損壞或失效,致使需要更換或修理,實為一大弊端問題,而亟待加以改良。 However, as far as the above is concerned, due to the conventional circuit board outer casing structure, The method is assembled on the circuit board, and the airtightness is relatively poor, and the internal circuit board is more likely to be fixed by the adhesive, and it is more likely to be stuck to an important part of the circuit board to cause a short circuit or to be dissipated by the adhesive covering the upper end. Poor, although the circuit board case can block the splashing of water or some water vapor, it may penetrate through the gap of the outer casing or the place where the locking screw is inserted for a long time, so that the circuit board is short-circuited or malfunctions, and some circuits occur. Because the board needs to have space for heat dissipation, it also causes the outer casing to fail to protect its circuit board and damage or invalidate its circuit board, which necessitates replacement or repair, which is a major drawback, and needs to be improved.

本創作提供一種電路板模組結構改良,其包含:一殼體、一電子模組及一組設板;其中:該殼體,係具有一設於該殼體前端之外殼部;一組設部,係設於該外殼部內側而形成一組設空間,複數個穿設孔,係設於該組設部側邊處;該電子模組,係組設於該殼體之組設部的組設空間處,係具有一板體,係以電子元件組設而成;以及複數個連接線,係穿設於該殼體之組設部的各穿設孔處而與該板體呈電性連結狀態;及該組設板,係與該電子模組之板體後端呈結合狀態;其特徵在於:該殼體之組設部形狀係配合該電子模組之大小形狀而呈一體成型之型態,並藉由該殼體之組設部的組設空間與該組設板呈密合狀態,致使該電子模組完全組設於該殼體與該組設板之間而呈密合狀態;其中該殼體係選自射出成型、熱壓成型或吹塑成型之任一者所呈現;其中該殼體之外殼部係以圓形、方形、多邊形形態或不規則形態之任 一者或任一組合所呈現;其中該殼體之組設部的穿設孔數量,係以該電子模組之連接線的數量而增減;其中該殼體更可增設複數個支撐部,其設於該外殼部內側而連接於該組設部外緣處;其中該電子模組之連接線尾端處,係以無接頭、插銷式接頭或組接式接頭之任一者所呈現;其中該組設板係選自金屬材質或具有散熱效果之材料所製成;其中該殼體更增設複數個樞設孔,供鎖固元件穿設使用;其中該殼體之外殼部更設有一貫通於該組設部之容置孔,供該電子模組之感測元件或插槽置於其外;其中該殼體內部之電子模組及組設板係可依照使用需求增設為複數個。 The present invention provides a circuit board module structure improvement, comprising: a casing, an electronic module and a set of plates; wherein: the casing has a casing portion disposed at a front end of the casing; And a plurality of through holes are disposed at a side of the assembly portion; The space is provided with a plate body, which is formed by electronic components; and a plurality of connecting wires are disposed at the respective through holes of the assembly portion of the casing and electrically connected to the plate body. The state of the connection state; and the set of the board is combined with the rear end of the board of the electronic module; wherein the shape of the assembly portion of the housing is integrally formed with the size and shape of the electronic module And the assembled space of the assembly portion of the housing is in close contact with the assembled plate, so that the electronic module is completely assembled between the housing and the set plate to be dense a state in which the housing is selected from any one of injection molding, thermoforming, or blow molding; wherein the housing System housing portion in any circular, square, polygonal shape or of irregular shape One or any combination of the present invention; wherein the number of the through holes of the assembly portion of the housing is increased or decreased by the number of connecting lines of the electronic module; wherein the housing can be further provided with a plurality of supporting portions. It is disposed on the inner side of the outer casing portion and is connected to the outer edge of the assembly portion; wherein the tail end of the connection line of the electronic module is presented by any one of a jointless, a pin type joint or a joint type joint; The set of the plate is made of a metal material or a material having a heat dissipation effect; wherein the casing is further provided with a plurality of pivot holes for the locking component to be used; wherein the outer casing of the casing is further provided with a The accommodating hole of the electronic component is disposed outside the accommodating hole of the electronic component; wherein the electronic module and the component slab inside the casing can be added to the plurality according to the use requirement .

本創作之主要目的係在於:提供一種電路板模組結構改良,經由該電子模組與該殼體呈一體成型方式,藉由該殼體與電子模組密合而使其防止水氣進入進而短路,而達到防止該電子模組漏電而延長使用壽命之功能。 The main purpose of the present invention is to provide an improved circuit board module structure, which is integrally formed with the housing via the electronic module, and the housing is sealed with the electronic module to prevent moisture from entering. The short circuit is used to prevent the electronic module from leaking and prolonging the service life.

本創作之電路板模組結構改良,其功效在於:藉由該電子模組結合於該組設板,並以該電子模組其形狀大小於前端製成一體成型之該殼體,致使該電子模組容置於該殼體內部,並以該組設板蓋設於其上端呈 密合狀態,更不需使用鎖固工具及黏合工具進行結合,達到使其電子模組於使用或裝設時具有防水之功能,而安全確保內部之零件不致接觸到水或水氣,達到藉由外殼與該電子模組密合而使其防止水氣進入進而短路,而達到防止該電子模組漏電而延長使用壽命之功能者。 The circuit board module of the present invention has an improved structure, wherein the electronic module is combined with the set of boards, and the electronic module has a shape and a size formed at the front end to form the integrally formed housing, thereby causing the electronic The module is disposed inside the casing, and the set plate is disposed at the upper end thereof In the tight state, it is not necessary to use the locking tool and the bonding tool to achieve the function of waterproofing the electronic module when it is used or installed, and it is safe to ensure that the internal parts are not exposed to water or moisture. The outer casing is in close contact with the electronic module to prevent moisture from entering and short-circuiting, thereby achieving the function of preventing leakage of the electronic module and prolonging the service life.

本創作: This creation:

1‧‧‧殼體 1‧‧‧shell

11‧‧‧外殼部 11‧‧‧ Shell Department

111‧‧‧樞設孔 111‧‧‧ pivot hole

112‧‧‧容置孔 112‧‧‧ accommodating holes

12‧‧‧組設部 12‧‧‧Team Department

121‧‧‧組設空間 121‧‧‧Set space

122‧‧‧穿設孔 122‧‧‧through holes

13‧‧‧支撐部 13‧‧‧Support

2‧‧‧電子模組 2‧‧‧Electronic module

21‧‧‧板體 21‧‧‧ board

22‧‧‧連接線 22‧‧‧Connecting line

3‧‧‧組設板 3‧‧‧Set board

第1圖係本創作第一較佳實施例之立體示意圖。 Figure 1 is a perspective view of a first preferred embodiment of the present invention.

第2圖係本創作第一較佳實施例之立體分解圖。 Figure 2 is an exploded perspective view of the first preferred embodiment of the present invention.

第3圖係本創作第一較佳實施例之另一角度立體分解圖。 Figure 3 is another perspective exploded view of the first preferred embodiment of the present invention.

第4圖係本創作第一較佳實施例之另一角度剖面圖。 Figure 4 is another angled cross-sectional view of the first preferred embodiment of the present invention.

第5圖係本創作第二較佳實施例之立體示意圖。 Figure 5 is a perspective view of a second preferred embodiment of the present invention.

第6圖係本創作第二較佳實施例之另一角度立體示意圖。 Figure 6 is a perspective view of another perspective of the second preferred embodiment of the present invention.

第7圖係本創作第一較佳實施例之使用狀態圖(一)。 Figure 7 is a diagram (I) of the use state of the first preferred embodiment of the present invention.

第8圖係本創作第一較佳實施例之使用狀態圖(二)。 Figure 8 is a diagram showing the state of use of the first preferred embodiment of the present creation (2).

第9圖係本創作第二較佳實施例之使用狀態圖(一)。 Figure 9 is a diagram showing the state of use of the second preferred embodiment of the present invention (1).

第10圖係本創作第二較佳實施例之使用狀態圖(二)。 Figure 10 is a diagram showing the state of use of the second preferred embodiment of the present invention (2).

首先,請參閱第1圖至第4圖所示,為本創作之「電路板模組結構改良」第一較佳實施例說明;係包括:一殼體1、一電子模組2及一組設板3;其中: 該殼體1,係選自射出成型、熱壓成型或吹塑成型之任一者所呈現,該殼體1前端係具有一外殼部11;一組設部12,係設於該外殼部11內側而形成一組設空間121,複數個穿設孔122,係設於該組設部12側邊處;該電子模組2,係組設於該殼體1之組設部12的組設空間121處,係具有一板體21,係以電子元件組設而成;以及複數個連接線22,用以供訊號及電源傳輸使用,係穿設於該殼體1之組設部12的各穿設孔122處而與該板體21呈電性連結狀態;及該組設板3,係選自金屬材質或具有散熱效果之材料所製成,係與該電子模組2之板體21後端呈結合狀態,藉此可達到幫助該電子模組2散熱之功效;而本創作其特徵在於:該殼體1之組設部12形狀大小係配合該電子模組2之大小形狀並藉由塑膠成型技術製造而呈一體成型之型態,並藉由該殼體1之組設部12的組設空間121與該組設板3呈密合狀態,致使該電子模組2完全組設於該殼體1與該組設板之3間而呈密合狀態,產生防水、防漏電等功能。 First, please refer to FIG. 1 to FIG. 4 for the first preferred embodiment of the "circuit board module structure improvement" of the present invention; the system includes: a casing 1, an electronic module 2 and a group Set board 3; where: The housing 1 is selected from any one of injection molding, thermoforming, or blow molding. The front end of the housing 1 has a housing portion 11 , and a set of 12 is disposed on the housing portion 11 . a plurality of installation spaces 121 are formed on the inner side, and a plurality of through holes 122 are disposed at the side of the assembly portion 12; the electronic module 2 is assembled in the assembly portion 12 of the housing 1 The space 121 has a plate body 21 which is formed by electronic components, and a plurality of connecting wires 22 for signal and power transmission, which are disposed through the assembly portion 12 of the casing 1. Each of the through holes 122 is electrically connected to the plate body 21; and the set plate 3 is made of a metal material or a material having a heat dissipation effect, and is a plate body of the electronic module 2 The back end of the 21 is in a combined state, thereby achieving the effect of helping the electronic module 2 to dissipate heat. The present invention is characterized in that the shape of the assembly 12 of the housing 1 is matched to the size and shape of the electronic module 2 and Formed in one piece by plastic molding technology, and formed by the assembly space 121 of the assembly portion 12 of the housing 1 and the set plate 3 Engagement state, so that the electronic module 2 is fully set disposed in the housing 1 is provided with the set plate 3 and the closely fitted state, a waterproof, leak-proof and so on.

藉由以上所述,茲更進一步詳述如后:前述該殼體1之外殼部11係以圓形、方形、多邊形形態或不規則形態之任一者或任一組合所呈現,藉以產生一保護該電子模組2之功能;前述該殼體1之組設部12的穿設孔122數量,係以該電子模組2 之連接線22的數量而增減,用以供該電子模組2訊號傳輸或電源供應所需之連接線22穿設其中;前述該電子模組2之連接線22尾端處,係以無接頭、插銷式接頭或組接式接頭之任一者所呈現。 As described above, the following further details: the outer casing portion 11 of the casing 1 is presented in any one or any combination of a circular shape, a square shape, a polygonal shape or an irregular shape, thereby generating a The function of the electronic module 2 is protected; the number of the through holes 122 of the assembly portion 12 of the housing 1 is determined by the electronic module 2 The number of the connecting lines 22 is increased or decreased, and the connecting line 22 required for the signal transmission or power supply of the electronic module 2 is disposed therein; the rear end of the connecting line 22 of the electronic module 2 is Presented by either a connector, a pin connector, or a modular connector.

前述該殼體1更可增設複數個支撐部13,其設於該外殼部11內側而連接於該組設部12外緣處,當該殼體1受到壓迫或擠壓時,藉由該支撐部13而達到支撐之功能,致使不會令該殼體1凹陷而擠壓到該電子模組2而使其功能失常或損壞。 The housing 1 can be further provided with a plurality of supporting portions 13 disposed on the inner side of the outer casing portion 11 and connected to the outer edge of the assembly portion 12. When the housing 1 is pressed or pressed, the support is supported by the support. The function of the portion 13 reaches the support so that the housing 1 is not recessed and is pressed against the electronic module 2 to cause malfunction or damage.

續請參閱第5圖至第6圖所示,並輔以參閱第2圖,為本創作「電路板模組結構改良」第二較佳實施例之說明,藉由前述之結構,進一步詳述如后:前述該殼體1之外殼部11更增設複數個樞設孔111,當使用上需要固定於牆面或機械之內部時,供複數個鎖固元件穿設鎖定使用;前述該殼體1之外殼部11更設有一貫通於該組設部12之容置孔112,供該電子模組2之感測元件或插槽(圖中未顯示)置於其外;續請參閱第7圖至第10圖所示,為本創作「電路板模組結構改良」較佳實施例之使用狀態之說明,本創作係包括一殼體1、一電子模組2及一組設板3;其中:其中該一殼體1、一電子模組2及一組設板3其各個整體結構已於前述敘明,故不再贅述; 本創作於使用時,可藉由黏接方式組設,該殼體係以一體成型方式介由射出成型、熱壓成型或吹塑成型而形成,可依照組設部12成型所需之外型,而該電子模組2之連接線22更能隱藏於組設部12後方,使其所需部分外露,另外,前述該殼體1內部之電子模組2及組設板3係可根據使用需求而增設為複數個,用以供不同需求而使用。 Please refer to FIG. 5 to FIG. 6 and with reference to FIG. 2 for the description of the second preferred embodiment of the "Modified Circuit Board Module Structure", which is further detailed by the foregoing structure. For example, the outer casing portion 11 of the casing 1 is further provided with a plurality of pivot holes 111. When it is required to be fixed to the wall or the inside of the machine, a plurality of locking components are used for locking and locking; The outer casing portion 11 of the casing 1 is further provided with a receiving hole 112 extending through the assembly portion 12 for the sensing element or slot (not shown) of the electronic module 2 to be placed outside; Figure 10 to Figure 10 is a description of the state of use of the preferred embodiment of the circuit board module structure improvement, the present invention includes a housing 1, an electronic module 2 and a set of panels 3; Wherein: the overall structure of the one casing 1, the electronic module 2 and the set of panels 3 has been described above, and therefore will not be described again; When the present invention is used, it can be assembled by means of bonding, and the casing is formed by injection molding, hot press molding or blow molding in an integral molding manner, and can be formed according to the shape of the assembly portion 12, The connection line 22 of the electronic module 2 can be hidden behind the assembly unit 12 to expose the required portion. In addition, the electronic module 2 and the assembly board 3 inside the housing 1 can be used according to the needs of the application. It is added to a plurality of ones for use in different needs.

再者,本創作可藉由該殼體1之外殼部11增設各該樞設孔111設於所需之處,達到可利用鎖固元件固定組設,而該殼體1增設之外殼部11的複數個樞設孔111,係設於該殼體1之外殼部11而不會因穿孔組接鎖固元件而干擾其防水功能,而本創作之電子模組2具有感測元件或插槽(圖中未顯示)而需要使前端部分外露時,更能藉由增設貫通於該殼體1之外殼部11及組設部12之容置孔112,使其感測元件或插槽(圖中未顯示)外露於該殼體1前端;經由該外殼部11之容置孔112,使其該電子模組2的感測元件及插槽(圖中未顯示)功能得以展現,而該殼體1之外殼部11的容置孔112射出成型、熱壓成型或吹塑成型而形成,致使該電子模組2之部分組件包覆於該殼體1內側,達到不會因水氣入侵而使其功能失常。 Furthermore, the present invention can be provided by adding the respective pivot holes 111 of the outer casing portion 11 of the casing 1 to a desired position, so that the outer casing portion 11 can be fixedly assembled by the locking member. The plurality of pivot holes 111 are disposed on the outer casing portion 11 of the casing 1 without interfering with the waterproof function by the perforation group, and the electronic module 2 of the present invention has a sensing component or a slot. When the front end portion needs to be exposed (not shown), it is more possible to provide a sensing element or a slot by adding a receiving hole 112 penetrating through the outer casing portion 11 and the assembly portion 12 of the casing 1 (Fig. Exposed to the front end of the casing 1; the sensing element and the slot (not shown) of the electronic module 2 are displayed through the receiving hole 112 of the outer casing portion 11, and the casing is displayed. The receiving hole 112 of the outer casing portion 11 of the body 1 is formed by injection molding, hot press forming or blow molding, so that some components of the electronic module 2 are wrapped on the inner side of the casing 1 so as not to be invaded by moisture. Make it malfunction.

另外,前述該殼體1內部之電子模組2、組設板3以及該殼體1外殼部11的容置孔112係可根據使用需求而增設為複數個,用以供不同需求而使用。 In addition, the electronic module 2, the assembly board 3, and the receiving hole 112 of the housing portion 11 of the housing 1 can be added to a plurality of applications for different needs.

藉此,藉由以上所述之本創作較佳實施例說明中,本創作係以一體成 型之方式所製成,而本創作於裝設時,可用黏貼方式或藉由該殼體1之外殼部11的樞設孔111利用鎖固元件而固定於所需之地點,而該電子模組2之連接線22與其他設備作電性連結時,該電子模組2之連接線22尾端處可根據需求選用無接頭、插銷式接頭或組接式接頭等方式作為組接方式使用;而當裝設完畢而進一步於使用時,可能會組設於廁所等地方或於人多混雜的地點作為感應使用,因此本創作該殼體1之外殼部11具有保護內部該電子模組2之功能,而由於該電子模組2係以一體成型的方式藉由該殼體1該與該組設板3結合所組成而呈密合狀態,因此可防止液體潑灑其中或水氣的侵入,更進一步防止漏電,而用於一般電腦設備時更因該殼體1之外殼部11防止灰塵沾染該電子模組2之板體21而使該電子模組2延長使用壽命;因此,本創作之電路板模組結構改良,所達到功效在於:藉由該電子模組2結合該組設板3,並以該電子模組2其形狀大小於前端製成一體成型之該殼體1,致使該電子模組2容置於該殼體1內部,並以該組設板3蓋設於其上端呈密合狀態,更不需使用鎖固工具及黏合工具進行結合,達到使其電子模組2於使用或裝設時具有防水之功能,而安全確保內部之零件不致碰到水或水氣,藉由達到該外殼1與該電子模組2密合而使其防止進水而短路,進而達到防止其電路板漏電之功能。 Thereby, in the description of the preferred embodiment of the present invention described above, the creation system is integrated into one. In the manner of the type, the present invention can be fixed at a desired location by means of a fastening means or by a locking hole 111 of the outer casing portion 11 of the casing 1 when the device is installed, and the electronic mold is fixed at a desired position. When the connection line 22 of the group 2 is electrically connected to other devices, the end of the connection line 22 of the electronic module 2 can be used as a connection mode by using a connectorless, pin-type connector or a combination connector according to requirements; When the device is installed and further used, it may be set up in a toilet or the like or used in a place where people are mixed. Therefore, the outer casing portion 11 of the casing 1 has the inside of the electronic module 2 protected. The function of the electronic module 2 is in an integrated state by the combination of the casing 1 and the assembled plate 3, thereby preventing liquid from splashing or invading the water and gas. Further preventing leakage, and for the general computer equipment, the outer casing portion 11 of the casing 1 prevents dust from contaminating the plate body 21 of the electronic module 2, thereby extending the service life of the electronic module 2; therefore, the circuit of the present invention The board module structure is improved and achieved The effect is that the electronic module 2 is combined with the set of panels 3, and the housing 1 is integrally formed at the front end of the electronic module 2, so that the electronic module 2 is received in the shell. The inside of the body 1 is covered with the set plate 3 at its upper end, and the combination of the locking tool and the bonding tool is not required, so that the electronic module 2 is waterproof when used or installed. The function is safe to ensure that the internal parts are not exposed to water or moisture, and the outer casing 1 is prevented from entering the water by short-circuiting with the electronic module 2, thereby preventing the leakage of the circuit board.

綜合以上所述,一種電路板模組結構改良又未曾見於諸書刊或公開使 用,誠符合新型專利申請要件,懇請 鈞局明鑑,早日准予專利,至為感禱。需陳明者,以上所述乃是本創作之具體實施例及所運用之技術原理,若依本創作之構想所作之改變,其所產生之功能作用仍未超出說明書及圖式所涵蓋之精神時,均應在本創作之範圍內,合予陳明。 In summary, the improvement of a circuit board module structure has not been seen in various books or publications. Use, in line with the requirements of the new patent application, please ask the Bureau to understand the patent, as soon as possible to grant patents, to pray. To be clear, the above is the specific embodiment of the creation and the technical principles applied. If the changes made according to the concept of this creation, the functional role produced by it does not exceed the spirit of the manual and the drawings. At the time, it should be combined with Chen Ming within the scope of this creation.

1‧‧‧殼體 1‧‧‧shell

11‧‧‧外殼部 11‧‧‧ Shell Department

12‧‧‧組設部 12‧‧‧Team Department

121‧‧‧組設空間 121‧‧‧Set space

122‧‧‧穿設孔 122‧‧‧through holes

2‧‧‧電子模組 2‧‧‧Electronic module

21‧‧‧板體 21‧‧‧ board

22‧‧‧連接線 22‧‧‧Connecting line

3‧‧‧組設板 3‧‧‧Set board

Claims (10)

一種電路板模組結構改良,其包含:一殼體、一電子模組及一組設板;其中:該殼體,係具有一設於該殼體前端之外殼部;一組設部,係設於該外殼部內側而形成一組設空間,複數個穿設孔,係設於該組設部側邊處;該電子模組,係組設於該殼體之組設部的組設空間處,係具有一板體,係以電子元件組設而成;以及複數個連接線,係穿設於該殼體之組設部的各穿設孔處而與該板體呈電性連結狀態;及該組設板,係與該電子模組之板體後端呈結合狀態;其特徵在於:該殼體之組設部形狀係配合該電子模組之大小形狀而呈一體成型之型態,並藉由該殼體之組設部的組設空間與該組設板呈密合狀態,致使該電子模組完全組設於該殼體與該組設板之間而呈密合狀態。 An improved circuit board module structure includes: a casing, an electronic module and a set of plates; wherein: the casing has a casing portion disposed at a front end of the casing; and a set of portions a plurality of installation holes are formed on the inner side of the outer casing portion, and a plurality of through holes are disposed at the side of the assembly portion; the electronic module is assembled in the assembly space of the assembly portion of the casing Wherein, there is a plate body, which is formed by electronic components; and a plurality of connecting wires are inserted through the respective through holes of the assembly portion of the casing to be electrically connected to the plate body. And the set of the board is in a state of being coupled with the rear end of the board of the electronic module; and the feature is that the shape of the set of the shell is integrally formed with the size and shape of the electronic module. And the assembled space of the assembly portion of the casing is in close contact with the assembled plate, so that the electronic module is completely assembled between the casing and the assembled plate to be in a close state. 如請求項1所述之電路板模組結構改良,其中該殼體係選自射出成型、熱壓成型或吹塑成型之任一者所呈現。 The circuit board module structure of claim 1 is improved, wherein the housing is selected from any one of injection molding, thermoforming, or blow molding. 如請求項1所述之電路板模組結構改良,其中該殼體之外殼部係以圓形、方形、多邊形形態或不規則形態之任一者或任一組合所呈現。 The circuit board module structure according to claim 1 is improved, wherein the outer casing portion of the casing is presented in any one or any combination of a circular shape, a square shape, a polygonal shape or an irregular shape. 如請求項1所述之電路板模組結構改良,其中該殼體之組設部的穿設孔數量,係以該電子模組之連接線的數量而增減。 The circuit board module structure according to claim 1 is improved, wherein the number of the through holes of the assembly portion of the housing is increased or decreased by the number of connecting lines of the electronic module. 如請求項1所述之電路板模組結構改良,其中該殼體更可增設複數個支撐部,其設於該外殼部內側而連接於該組設部外緣處。 The structure of the circuit board module according to claim 1 is improved, wherein the housing is further provided with a plurality of supporting portions disposed on the inner side of the outer casing portion and connected to the outer edge of the assembled portion. 如請求項1所述之電路板模組結構改良,其中該電子模組之連接線尾端處,係以無接頭、插銷式接頭或組接式接頭之任一者所呈現。 The circuit board module structure as claimed in claim 1 is improved, wherein the end of the connecting line of the electronic module is presented by any one of a connectorless connector, a pin connector or a combination connector. 如請求項1所述之電路板模組結構改良,其中該組設板係選自金屬材質或具有散熱效果之材料所製成。 The circuit board module structure according to claim 1 is improved, wherein the set of the board is made of a metal material or a material having a heat dissipation effect. 如請求項1所述之電路板模組結構改良,其中該殼體更增設複數個樞設孔,供鎖固元件穿設使用。 The structure of the circuit board module according to claim 1 is improved, wherein the housing is further provided with a plurality of pivot holes for the locking components to be used. 如請求項1所述之電路板模組結構改良,其中該殼體之外殼部更設有一貫通於該組設部之容置孔,供該電子模組之感測元件或插槽置於其外。 The structure of the circuit board module according to claim 1 is improved, wherein the outer casing of the casing further has a receiving hole penetrating through the assembly portion, wherein the sensing component or slot of the electronic module is placed outer. 如請求項1所述之電路板模組結構改良,其中該殼體內部之電子模組及組設板係可依照使用需求增設為複數個。 The circuit board module structure as claimed in claim 1 is improved, wherein the electronic module and the group board in the housing can be increased into a plurality according to the use requirement.
TW106205544U 2017-04-21 2017-04-21 Circuit board module structure improvement TWM546084U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI661751B (en) * 2017-08-31 2019-06-01 Avary Holding (Shenzhen) Co., Limited. Printed circuit board and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI661751B (en) * 2017-08-31 2019-06-01 Avary Holding (Shenzhen) Co., Limited. Printed circuit board and method for manufacturing the same

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