JP2000196250A - Electronic circuit board protector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate assembling or disassembling an electronic circuit protector by forming protective members of electronic circuit components from the same base material as that of a circuit board the outside, most of which is covered with a metal thin film. SOLUTION: The right and left side faces, front face and rear face of a protector which is adjacent to the periphery of an electronic circuit board are formed from the same base material as that of this circuit board. On the front and back surfaces of a base board 25 made of an insulation material, conductive patterns 23, 26 are laminated with adhesives 24 inserted therebetween. When the base board 25 is bent like a box, electronic circuit components, external connecting connectors/internal connecting connectors, etc., are mounted on the conductive pattern 23 laid on the inner surface, and for the conductive pattern 26 on the outer surface, a Cu foil pattern is laminated over the entire surface. Thus a protector with electronic circuits assembled like a box inside becomes equivalent to a metal (Cu foil) plate by being laminated with the conductive pattern 26 on the outer surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a structure for covering a circuit board on which electronic circuit components are mounted.

[0002]

2. Description of the Related Art Electronic circuit boards used for conventional electronic equipment and information equipment have electronic circuit components mounted on one or both sides of a plate-shaped printed wiring board. The surrounding area is covered with a metal protective cover or a protective cover with a metal foil applied to the surface of the resin as a measure to shield noise that affects the equipment and external noise that affects the electronic circuit board. Was.

[0003]

When the electronic circuit board as described above is discarded, in the case of a metal protective cover, it is necessary to separate the recyclable metal protective cover, and it is necessary to separate the resin from the resin. In the case of a protective cover having a metal foil on the surface, it is difficult to separate the resin component from the metal foil, and most of them are discarded. In the future, recycling of parts will be increasingly required, and disposal of recyclable parts has become a major issue.

[0004] An object of the present invention is to solve the above problems.
An object of the present invention is to provide an electronic circuit protection device for an electronic circuit board of an electronic device and a peripheral device that can be easily assembled and disassembled.

[0005]

In order to solve the above-mentioned problems, an electronic circuit protection device of the present invention protects at least the electronic circuit component of an electronic circuit board having a base provided with a conductive pattern for the electronic circuit component. In the polyhedron electronic circuit board protection device included in the member, the protection member is formed of the same base material as the circuit board whose outer surface is mostly covered with a metal thin film portion. I do.

According to the above configuration, since the electronic circuit board protection device is formed of a conventional circuit board, it is inexpensive and can be discarded together with the wiring board without separation.

Since most of the outer surface is a metal thin film portion, the thin film portion absorbs external noise and noise generated from the inside, thereby making it possible to take measures against noise.

[0008] Further, the protection member is formed by bending a single plate-shaped base material having a groove formed inside a bent portion.

According to the above configuration, since the protection member is a single flat plate, its manufacture and storage are easy, and furthermore,
Since the groove is formed in the bent portion, it is easy to assemble, and it is possible to assemble without breaking the metal foil provided on the outer surface of the bendable protective member, thereby further increasing the noise effect. Becomes possible.

Further, the protection member is provided with the electronic circuit component on an inner surface.

[0011] According to the above configuration, since the electronic circuit board and the protection member can also be used, the size of the protection device can be reduced, which contributes to the miniaturization of the electronic device.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail using an embodiment of the present invention.

FIG. 1 is a perspective view showing the structure of an electronic circuit board unit according to an embodiment of the present invention. 1 shows the structure of the present invention in three dimensions.

1 is a lower case of a portable electronic device, and 2 is an electronic circuit board having a wiring pattern formed on an upper surface. The left and right side portions 4, the front surface portion 5, and the rear surface portion 6 of the protection portion are formed of the same base material as the electronic circuit substrate 3 so as to be connected to the periphery of the electronic circuit board 3, and similarly connected to the rear surface portion 6. The upper surface part 3 is formed.

Reference numeral 7 of the upper surface portion 3 is an assembly hole to be engaged with an assembly protrusion A8 formed on the front surface portion 5 and the side surface portion 4, and 9 formed on the front surface portion 5 and the rear surface portion 6 is provided. , Are assembly notches into which the assembling protrusions B10 of the left and right side surfaces 4 are fitted. 11 is an external connector hole for the external connector 12, 13 is a power connector hole for the power connector 14,
Reference numeral 15 denotes an internal connector hole for the internal connector 16. 17 is an electronic circuit component, 18 is a hole for dissipating electronic circuit components, 19 is a fixing hole for engaging with a fixing boss 20 formed in a lower case for fixing the electronic circuit board unit,
Reference numeral 21 denotes a groove for bending the electronic circuit board, and reference numeral 22 denotes an upper surface grounding part of the electronic circuit board.

As shown in FIG. 1, the electronic circuit board 2 has an upper surface portion 3, left and right side surfaces 4, a front surface portion 5, and a rear surface portion 6, which are formed on the same plane to form an integrated structure. ing.

The left and right side surfaces 4 and the front surface 5 of the electronic circuit board 2 are provided with assembling protrusions A8 (6 in this embodiment) for fixing the left and right side surfaces 4 and the front surface 5 to the upper surface 3.
And the upper surface 3 is provided with holes 7 (six in this embodiment) into which the protrusions A8 are inserted. Further, the left and right side portions 4 have assembling protrusions B10 (four places in the present embodiment) for fixing the left and right side portions 4 to the front portion 5 and the rear portion 6. Face part 6
Are provided with notches 9 for assembly (four in this embodiment) for fixing to the left and right side surfaces 4. Further, the left and right side surfaces 4 and the front surface 5 are provided with an electronic circuit board upper surface grounding portion 22 on three surfaces.

In order to assemble the unfolded electronic circuit board into a box shape, two assembling protrusions B10 on each of the left and right side portions 4 are provided.
Into the notch 9 for assembly of the front part 5 and the rear part 6. Thereafter, the six assembling protrusions A8 of the front part 5 and the right and left side parts 4 are pressed into the assembling holes 7 of the upper part 3. By press-fitting a total of 10 locations in this way, a coplanar substrate having six surfaces has a box shape. At this time, the upper surface grounding portion 22 contacts the upper surface portion. The upper surface grounding portion 22 is set for the purpose of electrically connecting the six surfaces, and the electrical role will be described in detail in FIG. The coplanar substrate has a groove 21 for bending at a boundary line for each surface. The groove 21 has eight,
Each has a V-shaped cross section. The V-shape enables easy bending. The V-shaped portion will be described in detail with reference to FIG.

The electronic circuit component 17 and the like are mounted on at least one surface (the bottom surface in this embodiment) of the six surfaces divided on the same plane substrate. The external connection connector 12 (three types in the present embodiment) and the power supply connector 14 are mounted at positions facing the rear surface, and the screw-fixed connector is screwed when the rear surface 6 is bent. The rear surface portion 6 has an external connection connector hole 11 and a power supply connector hole 13 at positions facing the respective external connection connectors. Further, the internal connector 16 (4 in this embodiment)
) Are mounted at positions facing the left and right side surfaces 4 and the front surface 5. Internal connection connector holes 15 are formed in the left and right side surfaces 4 and the front surface 5 at positions facing the respective internal connection connectors.

Further, a hole 1 for radiating electronic circuit components is provided on the upper surface.
8 is open. This opening serves to release heat generated by the electronic circuit components. In particular, since the electronic circuit component 17 having an integrated circuit function has a high temperature, the heat dissipation hole 18 is set at a position facing the electronic circuit component 17.

FIG. 2 is an enlarged sectional view of the groove 21 in one embodiment of the present invention. FIG. 2 shows a cross-sectional shape taken along the line AA in FIG. 1.

In FIG. 2, reference numeral 23 denotes conductive patterns A, 2
4 is an adhesive, 25 is a base substrate, 26 is a conductive pattern B
It is. 27 is the angle of the V-shaped groove, 28 is the R of the bottom of the V-shaped groove
It is.

Copper foil is generally used for the conductive patterns A23 and B26, and an insulating laminate is often used for the base substrate 25. Epoxy resin and phenol resin are used as base materials such as paper, synthetic fiber cloth and glass. Are laminated. FIG.
As shown in FIG. 7, a V-shaped cut is made in the base substrate 25 to bend it to a required angle. In the present embodiment, the angle 27 of the V-shaped groove is set to 90 ° because of bending at a right angle, and the V-shaped groove bottom 28
It is desirable that R be 1 mm in radius to prevent peeling of the copper foil.

On the other hand, conductive patterns A23 and B26 are laminated on both sides of the base substrate 25 made of an insulating material with an adhesive 24 interposed therebetween. Base substrate 25
Is formed into a bent box shape, the electronic circuit component 17, the external connection connector 12, the internal connection connector 16 and the like are mounted on the conductive pattern A23 corresponding to the inner surface, and the conductive pattern B26 corresponding to the outer surface is a copper foil pattern. Are laminated.

As described above, the protection portion in which the electronic circuit is assembled in a box shape inside has the conductive pattern 26 on its outer surface.
Is equivalent to a metal (copper foil) plate. By bending the electronic circuit board at the bending groove 21, a box-shaped hexagonal shape is formed. At this time, three upper surface grounding portions 22 provided on the left and right side surface portions 4 and the front surface portion 5 come into contact with the upper surface portion 3, so that the hexahedral box-shaped shape is completely covered with metal.

As described above, according to the present embodiment, an integrated electronic circuit board having six surfaces on the same plane can be formed in a box shape by being bent at the bending groove 21. In addition, if the layout of the electronic circuit components 17 and the like is devised to increase the component placement surface and effectively use the internal space, the electronic circuit components 17 can be stored in a smaller space. Furthermore, since it is not necessary to connect a plurality of boards with a connector having a large number of pins, reduction in signal reliability and cost can be expected.

On the outer surface of the electronic circuit board on which the components are not mounted, a copper foil pattern is laminated on the entire surface, and since the electronic circuit board is covered with metal, it enters from the outside or enters from the inside. It can shield outgoing noise.

In the embodiment of the present invention, all the surfaces are formed by bending one plate-shaped base material. However, for example, only the side surfaces are made of the same base material, and the upper surface is made of another member, for example, an electronic device. It may be a case.

Furthermore, although only one surface is used as an electronic circuit board, the present invention is not limited to one surface, and electronic components may be mounted by providing conductive patterns on a plurality of inner surfaces.

In the case of a hexahedron as in the present embodiment, electronic components can be mounted on up to six surfaces, and in that case, space can be effectively used and space can be further reduced.

[0031]

As described above, according to the present invention, a plurality of surfaces of an electronic circuit board can be used, a space can be effectively used, and a space can be saved. In addition, since the same structure as when covered with metal can be obtained, it is not necessary to shield the noise by processing (plating, painting, vapor deposition, etc.) the metal on the resin material housing of the portable electronic device. The body resin material can be recycled as it is.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a structure of an electronic circuit board unit according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a folded portion of the electronic circuit board, showing a cross-sectional shape along the line AA in FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lower case of portable electronic equipment 2 Bottom part of electronic circuit board 3 Top part of electronic circuit board 4 Left and right side parts of electronic circuit board 5 Front part of electronic circuit board 6 Rear part of electronic circuit board 7 Assembly hole 8 Assembling projection A 9 Notch for assembly 10 Assembling projection B 21 Groove for bending electronic circuit board

Claims (3)

[Claims] 1. A polyhedral electronic circuit board protection device including a base member provided with a conductive pattern for electronic circuit components, wherein the protection member includes at least the electronic circuit component in a protection member. An electronic circuit protection device, wherein most of the surface is formed of the same base material as the circuit board covered with a metal thin film portion. 2. The electronic circuit protection device according to claim 1, wherein the protection member is formed by bending a single flat base material having a groove formed inside a bent portion. 3. The electronic circuit protection device according to claim 1, wherein the protection member includes the electronic circuit component on an inner surface.