CN208038575U - Electroplanting device with locomotive function jet flow bar - Google Patents
Electroplanting device with locomotive function jet flow bar Download PDFInfo
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- CN208038575U CN208038575U CN201721273595.3U CN201721273595U CN208038575U CN 208038575 U CN208038575 U CN 208038575U CN 201721273595 U CN201721273595 U CN 201721273595U CN 208038575 U CN208038575 U CN 208038575U
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Abstract
The utility model discloses a kind of electroplanting devices with locomotive function jet flow bar, it includes:Electroplating bath, anode, cathode, electroplate liquid jet system and power plant.Wherein the electroplate liquid jet system includes the first inlet tube, the second inlet tube, pump, triple valve and four total bars of jet flow.The jet flow bar with locomotive function of the electroplanting device of the utility model adjusts the relative position between spray orifice and printed circuit board by being moved back and forth up and down with vertical direction, solution of the electroplating solution in printed circuit board surface, through hole and hole is enhanced in the case where not influencing whole solution cycle to exchange, and then effectively promotes the coating uniformity of plating and the perforation ability of solution.The electroplanting device with locomotive function jet flow bar of the utility model, jet flow bar can be moved up and down with vertical direction, so that the coating uniformity of the printed circuit board, the brightness of plating area is consistent, substantially increases the quality of plating, and simple in structure.
Description
Technical field
The utility model is related to a kind of electroplanting device, more particularly to a kind of electroplanting device with locomotive function jet flow bar.
Background technology
In through-hole filling plating, other than electroplating solution is formulated, the flow velocity and spray angle of electroplating solution also can be to molten
Liquid fills different-diameter and the ability of the through-hole of depth has an immense impact on.The prior art depends on fixed jet system, this
System can only vertical printed circuit plate surface jet flow solution.According to the size of through-hole, increased or decreased by manual or frequency converter
Flow velocity is to improve through-hole loading.The improvement of through-hole loading can directly affect whole mixing effect in electroplating bath, to produce
There is the possibility burnt and improve in raw other unpredictalbe consequences, such as high current density area, needed for disperse chemical additive
Time lengthening, filter efficiency decline etc..
The plating of the substrates such as printed circuit board is influenced by the factor of many interactions, in the collaboration of these factors
Under effect, acceptable electroplated product could be obtained.These factors include the design of substrate, the design of equipment and for being electroplated
Chemicals etc..In equipment design, solution stirring or solution jet flow are to influence a big principal element of finished product acceptability.
Solution jet flow can generate factors significant impact, such as discarded chemicals supplement and remained gas bubble deflation work(
Fluid exchange in energy can allow additive it is anticipated that playing a role, keeping bulk solution homogenization temperature and chemical concentrations
The diffusion into the surface layer thickness of component, and determine the maximum operating currenbt density etc. of electroplating time and overall yield.
In the technique of copper facing filling micro-blind vias, correct liquid inventory is the key that ensure appropriately to fill.On the whole, molten
Liquid mixing direction is to ensure that filling perforation additive is appropriate during micro through hole is filled perpendicular to printed circuit board surface and low flow velocity
The necessary condition to play a role.Micro through hole filling is easy to cause perpendicular to printed circuit board surface with high flow rate progress filling perforation not fill
Point, to form more massive whole recess.In many cases, this large-scale recess can interfere follow-up printed circuit
Plate processing step, therefore preferably avoid.If necessary to stack multiple through-holes, it is necessary to ensure that lowest level fills via hole with flat
Smooth surface.Uneven surface may influence to form the post laser drilling quality of stack micro through hole.
In many sector applications, jet system and drawing liquid amount are set to fixed value, can not be set according to printed circuit board
Meter makes a change.In some other systems, pump machine is realized by being equipped with frequency converter to passing through unadjustable jet system
Drawing liquid amount fine tuning.If in order to coordinate specific printed circuit board to design corresponding specific type via hole or through-hole aperture
And liquid inventory must be reduced, and then printed circuit board edge is burnt in order to prevent, it may be necessary to working current density is sacrificed, and
And then lead to the decline of output.
Utility model content
In order to overcome the defects of the prior art, the utility model provides a kind of plating with locomotive function jet flow bar
Device, the electroplanting device can change solution spray angle, and solution is reduced in the case where not influencing whole solution flow rate to print
The pressure that printed circuit board surface generates.
In order to realize that the purpose of this utility model, the technical solution of the utility model are as follows：
The utility model provides a kind of electroplanting device with locomotive function jet flow bar, it includes:
Electroplating bath, two anodes, cathode, electroplate liquid jet system and power plant, wherein
The electroplating bath includes electroplating part and is formulated with electroplate liquid wherein；
Described two anodes are arranged relatively close to the electroplating bath two side；
The electroplate liquid jet system includes the first inlet tube, the second inlet tube, pump, triple valve and four total bars of jet flow,
Wherein described first inlet tube and the second inlet tube are for the fluid communication between electroplating bath and the total bar of jet flow, and the total bar of jet flow can
It is respectively equipped with an appropriate number of jet flow bar according to plating piece size and groove body size, every jet flow bar can be according to plating piece size and groove body
Size is respectively arranged with an appropriate number of spray orifice and the spray orifice is arranged on the surface of the jet flow bar, wherein two jet flows are total
Bar is fixed on the top of jet flow bar respectively, and the total bar of other two jet flows is fixed on the bottom end of jet flow bar, the jet flow respectively
Total bar is oppositely disposed at two-by-two between anode and cathode and the total bar of the jet flow is secured to the jet flow bar fluid company of connection
It is logical；
The power plant is used for that the total bar of four jet flows is pushed to move up and down, to drive on the spray orifice on jet flow bar
Lower movement.
In a preferred embodiment of the utility model, first inlet tube one end passes through the hole of plating trench bottom to reach plating
In liquid, the other end is connect with triple valve, total for two jet flows that electroplate liquid is respectively allocated to be fixed on jet flow bar top
Bar, triple valve is connect with the open end of two total bars of jet flow respectively by the second inlet tube, to realize electroplating bath and jet flow
Fluid communication between total bar, wherein pump is connected on the first inlet tube, for the electroplate liquid in electroplating bath is pumped into the total bar of jet flow
In；
First inlet tube one end passes through the hole of plating trench bottom to reach in electroplate liquid, and the other end is connect with triple valve, is used for
Electroplate liquid is respectively allocated to be fixed on two total bars of jet flow of jet flow bar bottom end, triple valve by the second inlet tube respectively with
The open ends of two total bars of jet flow connects, to realize the fluid communication between electroplating bath and the total bar of jet flow, wherein first into
Pump is connected in liquid pipe, for the electroplate liquid in electroplating bath to be pumped into the total bar of jet flow.
In a preferred embodiment of the utility model, the jet direction of the spray orifice and the folder perpendicular to jet flow bar direction
Angle is -45 degree to 45 degree.
In a preferred embodiment of the utility model, the power plant includes turbine, turbine rod and motor, turbine
Bar is vertically fixed on the centre position of the total bar of jet flow for being arranged on jet flow bar top and the rotation axis of turbine is connected with motor
It connects.
In a more preferred embodiment of the utility model, it is arranged on the total bar of every jet flow on jet flow bar top and hangs down
It directly is fixed with a turbine rod, each turbine rod is meshed with a turbine, and the rotation axis of each turbine is connected with a motor.
In a preferred embodiment of the utility model, the spacing of the jet flow bar be set in 10 centimetres to 20 centimetres it
Between.
In a preferred embodiment of the utility model, the spacing of the spray orifice is set between 5 centimetres to 20 centimetres.
Spray orifice on the jet flow bar of the electroplanting device of the utility model is according to the common normal pitch of printed circuit board industry
It is assembled with to printed circuit board surface distance design.The horizontal or vertical mounting means of jet flow bar ensures to be set on jet flow bar surface
The jet direction for the spray orifice set with respect to plated PC card surface -45 degree to 45 degree (i.e. the jet direction of spray orifice with it is vertical
In jet flow bar direction angle be -45 degree to 45 degree) between.
If specific printed circuit board design requirement can be arranged a spray orifice, be made spray orifice using maximum fluid challenge dynamics
Jet direction with printed circuit board surface vertical realize.If application request uses minimum fluid challenge dynamics,
It can be realized by adjusting angle between the jet direction and printed circuit board of spray orifice, this adjustment can reduce jet flow
While flow, keep the whole flow in bulk solution constant, to ensure that the other desired flow characteristics of solution will not be by
It influences.
The utility model allows solution with arrival plated PC card table different in flow rate while optimizing solution stirring
Face.Solution is by adjusting the jet flow side for the spray orifice being arranged on jet flow bar surface with arrival printed circuit board surface different in flow rate
To that is, at -45 to 45 degree, (i.e. the jet direction of spray orifice and the angle perpendicular to jet flow bar direction are -45 degree for spray angle setting
To 45 degree) between.When -45 degree of spray angle approach and 45 degree, it is hardly formed direct fluid challenge, and when the jet flow of spray orifice
When direction is vertical with jet flow bar, impact effect is most notable.Constant emission speed ensure that the consistency of solution stirring, to avoid
There is the problems such as high current density area is burnt, solution blending reduces and filter efficiency declines.
The electroplanting device with locomotive function jet flow bar of the utility model due to jet flow bar with vertical direction up and down reciprocatingly
Movement, so that the coating of the printed circuit board can not form uneven coating aggregation so that bright between plating area
Degree is consistent, substantially increases the quality of plating, and simple in structure.
The jet flow bar with locomotive function of the electroplanting device of the utility model with vertical direction by being moved back and forth up and down
The relative position between spray orifice and printed circuit board is adjusted, it is molten to enhance plating in the case where not influencing whole solution cycle
Solution of the liquid in printed circuit board surface, through hole and hole exchanges, so effectively promoted plating coating uniformity and
The perforation ability of solution.
Description of the drawings
Fig. 1 is the structural schematic diagram of one embodiment of the utility model；
Fig. 2 is that the connection of the jet flow total bar, jet flow bar, turbine and turbine rod from direction shown in arrow a in Fig. 1 is shown
It is intended to.
Specific implementation mode
It elaborates with reference to the accompanying drawings and examples to the utility model.
The utility model provides a kind of electroplanting device with locomotive function jet flow bar (referring to Fig. 1).The electroplanting device
Including 1, two anode 2 of electroplating bath, cathode (printed circuit board) 5, electroplate liquid jet system 41 and power plant 20.2 He of anode
Cathode 5 is fixed on by common fixed component in electroplating bath 1, and electroplating bath 1 includes common electroplating part and is formulated with electricity
Plating solution 42.Two anodes 2 are arranged relatively close to 1 two side of electroplating bath.Electroplate liquid jet system 41 includes that the first inlet tube is (soft
Pipe) (referring to the 6a indicated in Fig. 1,6b), the second inlet tube (hose) (referring to the 12a indicated in Fig. 1,12b) and four jet flows
(one end of the wherein total bar of jet flow 9 is open end 14, the other end to total bar 9 (being to show the total bar of jet flow 9 from front-rear direction in Fig. 1)
For closed end 15), wherein several (such as 10) jet flow bars 3 are respectively fixed with (between jet flow bar 3 on the total bar of four jet flows 9
Between being set in 10 centimetres to 20 centimetres, such as 15 centimetres), the total bar of two jet flows 9 is fixed on the top of jet flow bar 3 respectively
End, in addition the total bar of two jet flows 9 be fixed on the bottom end of jet flow bar 3 respectively.The total bar of four jet flows 9 is oppositely disposed at two-by-two
Between anode 2 and cathode 5, and the jet flow bar 3 for being secured to connection is in fluid communication.First inlet tube 6a and the second inlet tube
12a is for the fluid communication between electroplating bath 1 and the total bar of jet flow 9 for being arranged on jet flow bar top, the first inlet tube 6a mono-
The hole 13a across 1 bottom of electroplating bath is held to reach in electroplate liquid 42, the other end is connect with triple valve 8a, for dividing electroplate liquid 42
The total bar of two jet flows 9 is not distributed to.Connection pump 7a on first inlet tube 6a, for the electroplate liquid 42 in electroplating bath 1 is pumped into spray
It flows in total bar 9.Triple valve 8a is connect by the total bar of the second inlet tube 12a and the jet flow for being arranged on 3 top of jet flow bar 9, specifically
Ground says, is connect with the open end 14 of the total bar of the jet flow for being arranged on 3 top of jet flow bar 9, to realize electroplating bath 1 and the total bar of jet flow
Fluid communication between 9.First inlet tube 6b and the second inlet tube 12b is for electroplating bath 1 and to be arranged on 3 bottom end of jet flow bar
The total bar of jet flow 9 between fluid communication, first one end inlet tube 6b passes through the hole 13b of 1 bottom of electroplating bath to reach electroplate liquid 42
In, the other end is connect with triple valve 8b, for being respectively allocated to electroplate liquid 42 to be arranged on two jet flows of 3 bottom end of jet flow bar
Total bar 9.Connection pump 7b on first inlet tube 6b, for the electroplate liquid 42 in electroplating bath 1 to be pumped into the total bar of jet flow 9.Triple valve
8b is connect by the total bar of the second inlet tube 12b and the jet flow for being arranged on jet flow bar bottom end 9, specifically, with spray is arranged on
The open end 14 of the total bar of the jet flow of flow post bottom end 9 connects, to realize electroplating bath 1 and be arranged on jet flow bar bottom end jet flow it is total
Fluid communication between bar 9.Several spray orifices 4 (such as 4) are respectively equipped on jet flow bar 3, the spacing of wherein spray orifice 4 is set in
Between 5 centimetres to 20 centimetres, such as 10 centimetres, be used for spraying the electroplate liquid 42 in jet flow bar 3 and the jet direction of spray orifice 4 with
Jet flow bar 3 is vertical.Electroplate liquid 42 (is indicated by the hole (13a indicated in Fig. 1,13b) of 1 bottom of electroplating bath by pump in Fig. 1
7a, 7b) extraction exports to the total bar of jet flow 9 through triple valve (8a indicated in Fig. 1,8b) and then is given to connected to it every respectively
A jet flow bar 3 is finally sprayed by the spray orifice 4 on jet flow bar 3.Spray orifice 4 on jet flow bar 3 is for being sprayed to printed circuit board 5
Electroplate liquid 42, they are this to blowing the aperture (spy that can so that electroplate liquid 42 is easier into printed circuit board 5 mutually to blowing
When not being that printed circuit board radius-thickness ratio is bigger) in, convenient for completing that entire printed circuit board is electroplated.
Power plant 20 includes turbine 10, turbine rod 11 and motor (not shown), and 11 one end of turbine rod is vertically solid
It is scheduled on the centre position for the total bar of jet flow 9 for being arranged on jet flow bar top, the other end is connected with supporting arrangement (not shown).Whirlpool
Wheel 10 is meshed with turbine rod 11, and the rotation axis of turbine 10 is connected with motor (not shown), which drives whirlpool
10 rotation of wheel.The motor is set to mutually positive and negative rotation at regular intervals, so that 10 both forward and reverse directions interval of turbine rotates,
So that turbine rod 11 moves back and forth up and down, to drive total 9 vertical direction of bar of jet flow to move back and forth up and down, to drive jet flow bar
3 move up and down.It is arranged on the total bar of every jet flow 9 on jet flow bar top and is vertically and fixedly provided with a turbine rod 11, each turbine
Bar 11 is meshed with a turbine 10, and the rotation axis of each turbine 10 is connected with a motor.
When cathode 5 is electroplated, conventional control mode can be used in a controller (not shown) so that power
The motor of device 20 is run simultaneously so that the spray orifice 4 on jet flow bar 3 plating when can in electroplate liquid 42 vertical direction
It moves back and forth up and down.
The electroplanting device with locomotive function jet flow bar of the utility model due to the spray orifice on jet flow bar carry out it is upper sagging
Histogram is to reciprocating movement, so that the coating of the printed circuit board can not form uneven coating aggregation, and entire plating
Brightness between region is consistent, substantially increases the quality of plating, and simple in structure.It is also indicated that by experiment, the utility model
The electroplanting device with locomotive function jet flow bar the electroplating quality of product can be made significantly to improve, meet absolutely be mostly have it is micro-
The plating requirement of the printed circuit board of aperture.
Claims (2)
1. the electroplanting device with locomotive function jet flow bar, which is characterized in that it includes:
Electroplating bath, two anodes, cathode, electroplate liquid jet system and power plant, wherein
The electroplating bath includes electroplating part and is formulated with electroplate liquid wherein；
Described two anodes are arranged relatively close to the electroplating bath two side；
The electroplate liquid jet system includes the first inlet tube, the second inlet tube, pump, triple valve and four total bars of jet flow, wherein
First inlet tube and the second inlet tube are for the fluid communication between electroplating bath and the total bar of jet flow, and the total bar of jet flow can
Several jet flow bars are respectively equipped with according to plating piece size and groove body size, every jet flow bar can be according to plating piece size and groove body size point
It is not provided with several spray orifices and the spray orifice is arranged on the surface of the jet flow bar, wherein two total bars of jet flow are fixed respectively
On the top of jet flow bar, the total bar of other two jet flows is fixed on the bottom end of jet flow bar respectively, and the total bar of jet flow is opposite two-by-two
Ground setting is between the anode and cathode and the total bar of the jet flow is secured to the jet flow bar connected and is in fluid communication；
The power plant includes turbine, turbine rod and motor, and turbine rod, which is vertically fixed on, is arranged on jet flow bar top
The centre position of the total bar of the jet flow and rotation axis of turbine is connected with motor,
Be arranged on the total bar of every jet flow on jet flow bar top and be vertically and fixedly provided with a turbine rod, each turbine rod with a whirlpool
Wheel is meshed, and the rotation axis of each turbine is connected with a motor,
The power plant is used for that the total bar of four jet flows is pushed to move back and forth up and down, to drive on the spray orifice on jet flow bar
Lower reciprocating movement,
First inlet tube one end passes through the hole of plating trench bottom to reach in electroplate liquid, and the other end is connect with triple valve, and being used for will be electric
Plating solution is respectively allocated to be fixed on two total bars of jet flow on jet flow bar top, triple valve by the second inlet tube respectively with this two
The open end of the total bar of root jet flow connects, to realize the fluid communication between electroplating bath and the total bar of jet flow, wherein the first inlet tube
Upper connection pump, for the electroplate liquid in electroplating bath to be pumped into the total bar of jet flow；
First inlet tube one end passes through the hole of plating trench bottom to reach in electroplate liquid, and the other end is connect with triple valve, and being used for will be electric
Plating solution is respectively allocated to be fixed on two total bars of jet flow of jet flow bar bottom end, triple valve by the second inlet tube respectively with this two
The open end of the total bar of root jet flow connects, to realize the fluid communication between electroplating bath and the total bar of jet flow, wherein the first inlet tube
Upper connection pump, for the electroplate liquid in electroplating bath to be pumped into the total bar of jet flow；
The spacing of the jet flow bar is set between 10 centimetres to 20 centimetres,
The spacing of the spray orifice is set between 5 centimetres to 20 centimetres.
2. the electroplanting device according to claim 1 with locomotive function jet flow bar, which is characterized in that the spray of the spray orifice
Stream direction and angle perpendicular to jet flow bar direction are -45 degree to 45 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721273595.3U CN208038575U (en) | 2017-09-29 | 2017-09-29 | Electroplanting device with locomotive function jet flow bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721273595.3U CN208038575U (en) | 2017-09-29 | 2017-09-29 | Electroplanting device with locomotive function jet flow bar |
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| Publication Number | Publication Date |
|---|---|
| CN208038575U true CN208038575U (en) | 2018-11-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721273595.3U Active CN208038575U (en) | 2017-09-29 | 2017-09-29 | Electroplanting device with locomotive function jet flow bar |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112437558A (en) * | 2020-11-16 | 2021-03-02 | 淮安特创科技有限公司 | Blind hole electroplating hole filling method and circuit board |
-
2017
- 2017-09-29 CN CN201721273595.3U patent/CN208038575U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112437558A (en) * | 2020-11-16 | 2021-03-02 | 淮安特创科技有限公司 | Blind hole electroplating hole filling method and circuit board |
| CN112437558B (en) * | 2020-11-16 | 2022-05-17 | 淮安特创科技有限公司 | Blind hole electroplating hole filling method and circuit board |
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