CN202558955U - Stirring assembly for printed circuit board or wafer electroplating device - Google Patents
Stirring assembly for printed circuit board or wafer electroplating device Download PDFInfo
- Publication number
- CN202558955U CN202558955U CN2012202076961U CN201220207696U CN202558955U CN 202558955 U CN202558955 U CN 202558955U CN 2012202076961 U CN2012202076961 U CN 2012202076961U CN 201220207696 U CN201220207696 U CN 201220207696U CN 202558955 U CN202558955 U CN 202558955U
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- circuit board
- printed circuit
- wafer
- stirring parts
- stirring assembly
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Abstract
The utility model relates to a stirring assembly for a printed circuit board or a wafer electroplating device. The stirring assembly is arranged on one side of an electroplating surface of the printed circuit board or a wafer in an electroplating tank, namely arranged between a shielding plate and the printed circuit board or the wafer. The stirring assembly comprises a fixing frame and at least stirring bar which is horizontally or vertically arranged in the fixing frame; the section of the stirring bar is in a shape of a triangle, a diamond or a straight ruler; the width direction of the straight ruler is vertical to or forms an included angle with the printed circuit board or the wafer; and the length of the stirring assembly is larger than or equal to the length of the printed circuit board or the diameter of the wafer. The stirring assembly disclosed by the utility model can effectively improve the uniformity of the thickness of an electroplating layer of the printed circuit board in an electroplating process, reduce risks of short circuit and open circuit caused by non-uniformity of the thickness of the electroplating layer, improve the production yield of the printed circuit board, and reduce the manufacturing cost.
Description
Technical field
The utility model relates to electroplanting device, and particularly a kind of printed circuit board or wafer electroplanting device are used stirring parts.
Background technology
Generally at ± 10-30%, promptly when the electrolytic coating mean thickness of a printed circuit board was 20um, the maximum ga(u)ge at its some position was 22-26um to the electrolytic coating thickness deviation of printed circuit board electroplanting device in the market, and minimum thickness is 18-14um.The thickness of plating layer deviation is big more, and it gives pressure of back-end process (developments-etching-one-tenths circuit) also just big more, the circuit etching short circuit that causes owing to electrolytic coating uneven thickness one and to open circuit bad be the major technique bottleneck of present each circuit board plant.
The liquid medicine of existing printed circuit board electroplanting device stirs the technology that adopt pneumatic blending or nozzle ejection to stir more, and these methods are easy to generate the phenomenon that the printed circuit board surface local stirs, and this is one of reason of printed circuit board electrolytic coating uneven thickness one.
Secondly; The masking technique of existing printed circuit board electroplanting device; The modes that adopt the part to cover more; The marginal edge angle part that promptly existing masking shield only merely covers printed circuit board, this mode of covering can't be carried out all covering of position to whole printed circuit board (particularly region intermediate), and this is former therefore two of a printed circuit board electrolytic coating uneven thickness one.
Summary of the invention
The purpose of the utility model is to design a kind of printed circuit board or the wafer electroplanting device is used stirring parts; In electroplating process, can improve printed circuit board or wafer thickness of plating layer homogeneity effectively; Reduce the circuit etching that causes because of electrolytic coating uneven thickness one in printed circuit board or the wafer back-end process bad (short circuit with open circuit), finally reach the purpose of reduction printed circuit board manufacturing cost.
For achieving the above object, a technical scheme of the utility model is:
Printed circuit board or wafer electroplanting device are used stirring parts, it is characterized in that, are arranged at plating face one side of interior printed circuit board of plating tank or wafer, promptly between masking shield and printed circuit board or wafer; This stirring parts comprises a fixed frame and at least one level or is vertically installed in the stirring rod in the fixed frame; Described stirring rod cross section is a trilateral, or rhombus, or, ruler shape structure; The ruler width becomes vertical or a pitch angle with printed circuit board or wafer plating face; Stirring parts length is more than or equal to printed circuit board length or diameter wafer.
Further, keep closely between described stirring parts and printed circuit board or the wafer plating face, distance range is 5 ~ 100mm.
During plating; Stirring parts is directly faced the plating face of printed circuit board; Through its tilting mechanism stirring parts is swung back and forth along the plating face of printed circuit board or wafer, make electroplate liquid play uniform stirring action the surface (through hole, blind hole, figure) of printed circuit board or wafer.
Stirring parts and printed circuit board or the crystal column surface keeping parallelism is contactless oscillates.
Like product is compared in the utility model and the prior art, and difference has 2 points:
The utility model alr mode uses novel stirring parts, and the mixing component that stirring parts is made up of some stirring rod provides in-plant uniform liquid medicine to stir in electroplating process can for printed circuit board or wafer.The alr mode of prior art is the alr mode of pneumatic blending or nozzle ejection.
Newly design through stirring parts; Solved the even stirring of problem liquid medicine is implemented to(for) printed circuit board or wafer plate surface of electroplating; Improved printed circuit board or wafer electrolytic coating uniform in thickness property, reduced the thickness of plating layer deviation, reduced the short circuit and the problem that opens circuit in the back segment circuit etching processing procedure that brings out because of electrolytic coating uneven thickness one to ± 5-10%; Improve printed circuit board or wafer production yield, finally reduce manufacturing cost.
Description of drawings
Fig. 1 is the front view of the utility model stirring parts embodiment one.
Fig. 2 is the sectional view of Fig. 1.
Fig. 3 is the sectional view of the utility model stirring parts embodiment two.
Fig. 4 is the sectional view of the utility model stirring parts embodiment three.
Fig. 5 is the utility model embodiment working state schematic representation.
Embodiment
Referring to Fig. 1 ~ Fig. 5, the utility model printed circuit board or wafer electroplanting device are arranged at plating face one side of plating tank 10 interior printed circuit boards or wafer 20, promptly between masking shield 30 and printed circuit board or wafer 20 with stirring parts 1; This stirring parts 1 comprises a fixed frame 11 and at least one level or is vertically installed in the stirring rod 12 in the fixed frame 11; Described stirring rod 12 cross sections are trilateral, or rhombus, or, ruler shape structure; The ruler width becomes vertical or a pitch angle with printed circuit board or wafer 20 plating faces; Stirring parts 1 length is more than or equal to printed circuit board length or diameter wafer.
Further, keep closely between described stirring parts 1 and printed circuit board or the wafer 20 plating faces, distance range is 5 ~ 100mm.
In the present embodiment, described stirring parts 1 is directly faced the plating face of printed circuit board or wafer 20.Stirring parts is under the effect of tilting mechanism, along about the printed circuit board plate surface or teeter.Keep closely between stirring parts and printed circuit board or the wafer plate surface, distance range is 5-100mm.
In sum; The utility model is compared with class methods with of the prior art; Because the utility model has used novel stirring parts in common printed circuit board electroplating device; The stirring system (pneumatic blending or nozzle stir) that has solved existing electroplating device can only carry out the problem that the local problem that stirs and existing masking shield can't effectively cover the printed circuit board region intermediate to printed circuit board, has improved the homogeneity of printed circuit board electrolytic coating thickness widely; Thereby the fraction defective that reduces the circuit etching short circuit and open circuit has finally reduced the manufacturing cost of printed circuit board.
Claims (2)
1. printed circuit board or wafer electroplanting device are used stirring parts, it is characterized in that, are arranged at plating face one side of interior printed circuit board of plating tank or wafer, promptly between masking shield and printed circuit board or wafer; This stirring parts comprises a fixed frame and at least one level or is vertically installed in the stirring rod in the fixed frame; Described stirring rod cross section is a trilateral, or rhombus, or, ruler shape structure; The ruler width becomes vertical or a pitch angle with printed circuit board or wafer plating face; Stirring parts length is more than or equal to printed circuit board length or diameter wafer.
2.. printed circuit board as claimed in claim 1 or wafer electroplanting device are used stirring parts, it is characterized in that, keep closely between described stirring parts and printed circuit board or the wafer plating face, distance range is 5 ~ 100mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202076961U CN202558955U (en) | 2012-05-10 | 2012-05-10 | Stirring assembly for printed circuit board or wafer electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202076961U CN202558955U (en) | 2012-05-10 | 2012-05-10 | Stirring assembly for printed circuit board or wafer electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202558955U true CN202558955U (en) | 2012-11-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202076961U Expired - Lifetime CN202558955U (en) | 2012-05-10 | 2012-05-10 | Stirring assembly for printed circuit board or wafer electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202558955U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108396364A (en) * | 2017-02-06 | 2018-08-14 | 株式会社荏原制作所 | Blade, the plater and coating method for having the blade |
| CN110184640A (en) * | 2018-12-27 | 2019-08-30 | 新阳硅密（上海）半导体技术有限公司 | Agitating device and electroplating device containing it |
| CN110219038A (en) * | 2018-03-01 | 2019-09-10 | 株式会社荏原制作所 | Blender, plater and coating method |
| CN110318086A (en) * | 2018-03-28 | 2019-10-11 | 姜力 | Electroplating tank structure |
| CN110629264A (en) * | 2019-11-11 | 2019-12-31 | 生益电子股份有限公司 | PCB electroplating device |
-
2012
- 2012-05-10 CN CN2012202076961U patent/CN202558955U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108396364A (en) * | 2017-02-06 | 2018-08-14 | 株式会社荏原制作所 | Blade, the plater and coating method for having the blade |
| US10946351B2 (en) | 2017-02-06 | 2021-03-16 | Ebara Corporation | Paddle, plating apparatus equipped with the paddle, and plating method |
| TWI808073B (en) * | 2017-02-06 | 2023-07-11 | 日商荏原製作所股份有限公司 | Paddle, plating apparatus equipped with the paddle, and plating method |
| US11717796B2 (en) | 2017-02-06 | 2023-08-08 | Ebara Corporation | Paddle, plating apparatus equipped with the paddle, and plating method |
| CN110219038A (en) * | 2018-03-01 | 2019-09-10 | 株式会社荏原制作所 | Blender, plater and coating method |
| CN110219038B (en) * | 2018-03-01 | 2021-07-27 | 株式会社荏原制作所 | Stirrer, plating device and plating method |
| CN110318086A (en) * | 2018-03-28 | 2019-10-11 | 姜力 | Electroplating tank structure |
| CN110184640A (en) * | 2018-12-27 | 2019-08-30 | 新阳硅密（上海）半导体技术有限公司 | Agitating device and electroplating device containing it |
| CN110629264A (en) * | 2019-11-11 | 2019-12-31 | 生益电子股份有限公司 | PCB electroplating device |
| CN110629264B (en) * | 2019-11-11 | 2021-09-24 | 生益电子股份有限公司 | PCB electroplating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170828 Address after: The Yangcheng Lake Road Development Zone in Kunshan City, Jiangsu province 215334 No. 248 room 3 Patentee after: Kunshan success Environmental Protection Technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215011 Suzhou District No. 1088 Binhe Road, Jinhe Nga Court 1-608 Patentee before: Wu Yan |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121128 |
|
| CX01 | Expiry of patent term |