CN110184640A - Agitating device and electroplating device containing it - Google Patents
Agitating device and electroplating device containing it Download PDFInfo
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- CN110184640A CN110184640A CN201811612337.2A CN201811612337A CN110184640A CN 110184640 A CN110184640 A CN 110184640A CN 201811612337 A CN201811612337 A CN 201811612337A CN 110184640 A CN110184640 A CN 110184640A
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- 238000009713 electroplating Methods 0.000 title claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 238000003756 stirring Methods 0.000 claims abstract description 26
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- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 10
- 238000009827 uniform distribution Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 12
- 238000000151 deposition Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
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- 229910001431 copper ion Inorganic materials 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Chemical Kinetics & Catalysis (AREA)
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- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of agitating device and containing its electroplating device, agitating device includes: at least one agitating unit, and agitating unit has rotary shaft, and agitating unit is using rotary shaft as center circumference uniform distribution；Driving mechanism, driving mechanism are connected to agitating unit, and multiple agitating units is driven to rotate along corresponding rotary shaft.The agitating device drives the agitating unit to rotate along rotary shaft by driving mechanism, to realize the effect of stirring electroplate liquid by the rotation, and since agitating unit is using rotary shaft as center circumference, therefore can effectively avoid makes electroplate liquid generate bubble and vortex in whipping process, and can be improved electroplating velocity and electroplating evenness.
Description
Technical field
The present invention relates to field of electroplating, in particular to a kind of agitating device and the electroplating device containing it.
Background technique
Plating refers on the substrate containing thin seed layer through metal deposit, forms the metal layer with conducting wire
Process.Common electroplating technology such as deposits one layer of cover film by electrochemical method on the surface of a substrate, to fill cavity,
Such as through-hole or groove, wherein the uniformity of electroplated layer is vital for the reliability of final device.
Such as in TSV electroplating technology, via openings have several microns or bigger of diameter at present, via depth is reachable
Several hundred microns.The size of the TSV orders of magnitude more several greatly than the size of typical dual-damascene technics, therefore, to have it is so high in length and breadth
It metallizes than the cavity with depth, is a huge challenge with the thickness close to substrate itself.Wherein, electroplate liquid
The deposition rate of metallization is an important indicator, if deposition rate is too low, cannot be effectively applied in TSV manufacture.
In many electroplating technologies, electroplate liquid can form diffusion layer on the surface of workpiece to be electroplated, which reduces
The mass transfer efficiency of electrolyte in plating, and then electroplating evenness, speed and quality can be reduced.Chinese utility model patent
It is described in CN206109586U by way of enhancing workpiece surface fluid vortex to be electroplated and diffusion layer is thinned and improves matter
Amount transmitting, but increase the problems such as vortex can bring bubble and uneven plating.
In the prior art, meet the requirements the metallic deposition rate of electroplate liquid usually using churned mechanically means.So
And bubble and vortex are generated to avoid the significantly shaking of electroplate liquid, quality of coating is influenced, churned mechanically amplitude is all very
It is small, it the movements such as by level or moves back and forth up and down or waves to realize the function of stirring electroplate liquid, be unable to satisfy quickly
The requirement of metallization and electroplating evenness.
Summary of the invention
The technical problem to be solved by the present invention is in order to overcome in the prior art agitating device be avoid electroplate liquid generate gas
Bubble and vortex, lead to not significantly stir, and the metallic deposition rate of electroplate liquid is made to be unable to satisfy the defect of requirement, mention
For a kind of agitating device and containing its electroplating device.
The present invention is to solve above-mentioned technical problem by following technical proposals:
A kind of agitating device comprising:
At least one agitating unit, the agitating unit have a rotary shaft, during the agitating unit with the rotary shaft is
Heart circumference；
Driving mechanism, the driving mechanism are connected to the agitating unit, and drive multiple agitating units along corresponding
The rotary shaft rotation.
The agitating device drives the agitating unit to rotate along rotary shaft by driving mechanism, to realize stirring by the rotation
The effect of electroplate liquid, and since agitating unit is using rotary shaft as center circumference, it can effectively avoid in whipping process
Electroplate liquid is set to generate bubble and vortex.
Preferably, the agitating unit has through-hole.These through-holes can be for or without rotary shaft.Agitating unit institute
The through-hole number having is unlimited, and when through-hole is without rotary shaft, which is entity axis.
Preferably, the through-hole passes through the rotary shaft.By being arranged through the through-hole of rotary shaft on agitating unit, make
Agitating unit can not act on electroplate liquid when rotated, since the center is in hollow out state, and then further avoid
Electroplate liquid is set to generate bubble and vortex in whipping process.Preferably, through-hole number possessed by the agitating unit is 1, and should
Through-hole passes through rotary shaft and symmetrical by symmetry axis of rotary shaft.
Compared to solid agitating unit, there is the agitating unit of through-hole, is imitated in terms of thinned diffusion layer, reduction bubble and vortex
Fruit is more preferably.
Preferably, the agitating unit is arranged by center even circumferential of the rotary shaft.
By making agitating unit with rotary shaft center even circumferential arrangement, make agitating unit in electroplate liquid with rotary shaft
Centered on be in equilibrium state, further reduced bubble and vortex generate probability.
The agitating device solves the problems, such as that agitating device is easy electroplate liquid and generates bubble and vortex by above structure, makes
Obtaining the agitating device can significantly be stirred in electroplate liquid, meet the requirements the metallic deposition rate of electroplate liquid.
Preferably, the agitating unit includes:
Mixing part, the through-hole are set to the mixing part；
Interconnecting piece, the interconnecting piece are connected to one end of the mixing part, the driving machine along the direction of the rotary shaft
Structure drives the mixing part rotation by the interconnecting piece.
When the agitating unit is solid construction, the mixing part of the agitating unit can be solid cylinder structure.
Preferably, the through-hole passes through the rotary shaft and symmetrical as symmetry axis using the rotary shaft.Specifically,
In the case where turning Man Yizhou, the covered volume of through-hole circumference can account for the 1/ of entire the covered volume of mixing part circumference
10~1/2, such as 1/6~1/3, then such as 1/4~1/5.
By setting interconnecting piece to connect mixing part and driving mechanism, enable driving mechanism and the electricity for being immersed in mixing part
Plating solution keeps enough spacing, and electroplate liquid is avoided to damage the operation of driving mechanism.
Preferably, the interconnecting piece is the cylindrical body centered on the rotary shaft.
It is arranged with this configuration, so that interconnecting piece is closed on one end of mixing part when being immersed in electroplate liquid, even if with driving
The driving of mechanism and rotate, also due to the structure of own cylindrical body and electroplate liquid can not be stirred, the company of effectively preventing
The case where socket part stirs electroplate liquid and generates bubble and be vortexed.
Preferably, the agitating device further includes frame, the frame loops are around being set to the four of multiple agitating units
Week, and the frame is connected to the driving mechanism；
The agitating unit further includes extension, and the extension is connected to the another of mixing part along the direction of the rotary shaft
One end, the extension rotation are connected to the frame.
By the way that the extension of agitating unit is connected with frame, mention the both ends of mixing part and connecting with other component
The structural rigidity of high mixing part avoids agitating unit from shaking due to by external force in whipping process, influences electroplate liquid
The case where mixing quality, occurs.
Preferably, being arranged between multiple agitating units along the direction parallel side-by-side perpendicular to the rotary shaft.Depending on feelings
Condition can be set side by side between the agitating unit in same plane, can also be set side by side in multiple planes.
Preferably, the multiple agitating units of driving mechanism driving rotate synchronously, to avoid multiple agitating units it
Between alternate rotation or not with identical speed rotation and generate vortex.
Preferably, the agitating device further includes transmission mechanism, the driving mechanism is connected to by the transmission mechanism
Multiple agitating units.
Preferably, the transmission mechanism includes:
Multiple worm gears, the worm gear are arranged in a one-to-one correspondence with the agitating unit, and axis is connected to the corresponding stirring
Unit；
Worm screw, the worm screw and the shaft of the driving mechanism are coaxially connected, row of multiple worm gears along the agitating unit
Column direction is successively engaged in the worm screw, to enable driving mechanism to drive multiple agitating units simultaneously by worm gear structure
It rotates synchronously.
Preferably, the agitating device further includes controller, the controller is electrically connected to the driving mechanism, the control
Device processed drives the agitating unit to switch between rotating and reverse for controlling the driving mechanism.
Switched repeatedly by setting controller with controlling agitating unit between rotating and reverse, makes agitating unit will not
When breaking the acceleration effect changed over the electroplating solution, make the bubble rapid disruption in electroplate liquid, to destroy in substrate surface
Gas-liquid critical layer reduces the diffusion bilayer thickness of electroplate liquid, the copper ion in electroplate liquid is allowed to rapidly enter in cavity, to pass through foot
Enough metallic deposition rates and obtain the electroplated layer of high uniformity.
Preferably, each agitating unit all has multiple through-holes, the through-hole along the direction of the rotary shaft successively
Setting, to meet the demand to the specific shape of agitating unit by the way that multiple through-holes are arranged on single agitating unit.
A kind of electroplating device comprising agitating device as described above.
The electroplating device can effectively reduce the problem of bubble being easy to produce when substantially stirring electroplate liquid and vortex, so as to stir
Mixing device can keep significantly stirring in electroplate liquid, so that the metallic deposition rate of electroplate liquid be made to meet the requirements.
Preferably, the electroplating device further includes cathode plate and anode plate, the agitating device be located at the cathode plate and
Between the anode plate, the agitating device is close to the cathode plate and parallel with the cathode plate.
Preferably, the electroplating device is for horizontal plating or vertical plating.More preferably, the electroplating device is for vertical
Plating.
The positive effect of the present invention is that:
The agitating device drives the agitating unit to rotate along rotary shaft by driving mechanism, to realize stirring by the rotation
The effect of electroplate liquid, and since agitating unit is using rotary shaft as center circumference, it can effectively avoid in whipping process
So that electroplate liquid is generated bubble and vortex, and can be improved electroplating velocity and electroplating evenness.
Detailed description of the invention
Fig. 1 is the positive structure diagram of the agitating device of the embodiment of the present invention 1.
Fig. 2 is the structural schematic diagram of the agitating unit of the embodiment of the present invention 1.
Fig. 3 is the cross-sectional structure schematic diagram of the mixing part of the agitating unit of the embodiment of the present invention 1.
Fig. 4 is the overlooking structure diagram of the agitating device of the embodiment of the present invention 1, wherein dust cover is hidden.
Fig. 5 is the electroplating pool schematic diagram of internal structure of the electroplating device of the embodiment of the present invention 1.
Fig. 6 is the structural schematic diagram of the agitating unit of the embodiment of the present invention 2.
Fig. 7 is the cross-sectional structure schematic diagram of the mixing part of the agitating unit of the embodiment of the present invention 3.
Description of symbols:
Electroplating device 100
Agitating device 1
Agitating unit 11, through-hole H, rotary shaft S
Mixing part 111
Interconnecting piece 112
Extension 113
Driving mechanism 12, shaft 121
Frame 13
Transmission mechanism 14
Worm gear 141
Worm screw 142
Dust cover 15
Electroplating pool 2
Cathode plate 3
Anode plate 4
Specific embodiment
The present invention is further illustrated below by the mode of embodiment, but does not therefore limit the present invention to the reality
It applies among a range.
Embodiment 1
As shown in Figure 1, Figure 2 and Figure 3, the present embodiment provides a kind of agitating devices 1, the same of diffusion layer can be thinned efficient
When, inhibit bubble and vortex, while realizing flash-metallised and electroplating evenness requirement, which includes multiple
Agitating unit 11 and a driving mechanism 12.Wherein, the equal rotary shaft S of each agitating unit 11, agitating unit 11 are with rotary shaft S
Center circumferential arrangement, and along the direction parallel side-by-side setting perpendicular to rotary shaft S between multiple agitating units 11, optionally,
It can be set side by side, can also be set side by side in multiple planes in same plane between multiple agitating units 11.And driving mechanism 12 is then
It is connected with these agitating units 11, the driving mechanism 12 is for driving all agitating units 11 along corresponding rotary shaft S
With the synchronous rotation of direction shown in arrow in Fig. 3.The agitating device 1 drives agitating unit 11 along rotary shaft by driving mechanism 12
Turn S, to realize the effect of stirring electroplate liquid by the rotation, and since agitating unit 11 is using rotary shaft S as center circumference cloth
It sets, therefore can effectively avoid makes electroplate liquid generate bubble and vortex in whipping process, while can improve electroplating velocity and plating
Uniformity.
In the present embodiment, also there is the agitating unit 11 of the agitating device 1 through-hole H, through-hole H to pass through rotary shaft S, with
In agitating unit 11 when rotating and stirring electroplate liquid, due to agitating unit 11 at rotation center due to being in hollow out state and
Electroplate liquid can not be acted on, further avoids that electroplate liquid is made to generate bubble and vortex in whipping process.In addition, in the present embodiment
In, agitating device 1 includes 15 agitating units 11, and the spacing between two agitating units 11 of arbitrary neighborhood is identical, and
It is arranged in a manner of single-row arrangement.However, in other examples, the spacing between adjacent agitating unit 11 can not also
Together, and can be arranged in a manner of multiple row and agitating unit 11 between arrangement shape can adapt to be wanted
The workpiece shapes of plating, to improve the mixing effect to electroplate liquid.
Compared to solid agitating unit, the agitating unit 11 with through-hole H in thinned diffusion layer, reduces bubble and vortex
Aspect better effect.In addition, the part that agitating unit 11 is contacted with liquid can be lines that are jagged, raised or rising and falling,
It can be the lines of smooth smoothness, wherein the lines of smooth smoothness are reducing bubble than lines that are jagged, raised or rising and falling
With vortex aspect better effect.
In addition, agitating unit 11 can be arranged in such a way that even circumferential or circumference are non-uniform centered on rotary shaft S.
In the present embodiment, agitating unit 11 is arranged by center even circumferential of rotary shaft S, can by above-mentioned this layout type
So that agitating unit 11 is in equilibrium state centered on rotary shaft S in electroplate liquid, further reduced bubble and vortex generates
Probability.
The agitating device 1 solves the problems, such as that agitating device 1 is easy electroplate liquid and generates bubble and vortex by above structure,
The agitating device 1 is significantly stirred in electroplate liquid, meets the requirements the metallic deposition rate of electroplate liquid.
As shown in Fig. 2, the agitating unit 11 of the agitating device 1 includes mixing part 111 and interconnecting piece 112.Wherein, through-hole
H is located on mixing part 111, and the mixing part 111 is for being immersed in be stirred to electroplate liquid in electroplate liquid, and interconnecting piece 112
One end of mixing part 111 is then connected to along the direction of rotary shaft S, so that agitating unit 11 can be driven by interconnecting piece 112
Mixing part 111 rotates.By setting interconnecting piece 112 to connect mixing part 111 and driving mechanism 12, enable driving mechanism 12 with
The electroplate liquid for being immersed in mixing part 111 keeps enough spacing, and electroplate liquid is avoided to damage the operation of driving mechanism 12.Its
In, in the present embodiment, which is that the cylindrical body centered on rotary shaft S makes to connect to be arranged with this configuration
One end of mixing part 111 is closed on when being immersed in electroplate liquid by portion 112, even if rotating with the driving of driving mechanism 12, also can
Due to own cylindrical body structure and electroplate liquid can not be stirred, effectively prevent interconnecting piece 112 stir electroplate liquid and produce
The case where anger is steeped and is vortexed.
As shown in figure 3, in the present embodiment, the mixing part 111 of agitating unit 11 is divided into because being provided with a through-hole H
Left and right Liang Ge branch, the two branches are symmetrical centered on rotary shaft S, to avoid bubble is generated in whipping process.Mixing part
111 Liang Ge branch is vertical linear type in the present embodiment, so as to reduce the manufacture difficulty of the agitating unit 11, still
Other for shaped form (such as spiral shape etc.) 111 shape of mixing part also can be realized in the present invention reduce electroplate liquid vortex it is gentle
The effect of bubble, therefore also fall within protection scope of the present invention.
As depicted in figs. 1 and 2, which further includes having frame 13, and it is single which is circumferentially positioned at multiple stirrings
The surrounding of member 11, and the frame 13 and driving mechanism 12 keep connecting.And agitating unit 11 further includes having extension 113, this prolongs
It stretches and is connected to along the direction of rotary shaft S on the other end of mixing part 111, and rotate connection between extension 113 and frame 13.
By the way that the extension 113 of agitating unit 11 is connected with frame 13, make the both ends of mixing part 111 by with other portions
Part connects and improves the structural rigidity of mixing part 111, and agitating unit 11 is avoided to occur due to by external force in whipping process
The case where shaking, influencing electroplate liquid mixing quality generation.
As shown in Figure 1 and Figure 4, which further includes having transmission mechanism 14, and driving mechanism 12 passes through transmission mechanism 14
It is connected with multiple agitating units 11.In the present embodiment, transmission mechanism 14 includes multiple worm gears 141 and a worm screw 142,
Wherein, be the state that is arranged in a one-to-one correspondence between multiple worm gears 141 and multiple agitating units 11, and worm screw 142 with it is corresponding
Agitating unit 11 be coupled, and worm screw 142 is then coaxially connected state between the shaft 121 of driving mechanism 12, these snails
Wheel 141 is successively meshed with worm screw 142 along the orientation of agitating unit 11, to make to drive by 141 worm screw of worm gear, 142 structure
Motivation structure 12 can drive multiple agitating units 11 to rotate synchronously simultaneously.Wherein, in the present embodiment, driving mechanism 12 is rotation
Motor, shaft 121 are connect by shaft coupling and the direct axis of worm screw 142 and drive its rotation.Meanwhile in the outside of transmission mechanism 14
It is coated with dust cover 15, surprisingly splash to avoid electroplate liquid and is entered in transmission mechanism 14, and influences the normal fortune of agitating device 1
Turn.
It should be strongly noted that " synchronous rotation " between multiple agitating units 11 herein, refers to multiple stirrings
Rotation speed between unit 11 is identical, but the rotation direction not limited between multiple agitating units 11 is identical, i.e., adjacent
It is also possible to rotate synchronously in opposite direction between two agitating units 11.
In addition, the agitating device 1 further includes having controller (not shown), which is connected by way of electrical connection
It is connected to driving mechanism 12, to control for the operating status to driving mechanism 12, is rotating and reverse agitating unit 11
Between switch.
Switched repeatedly by setting controller with controlling agitating unit 11 between rotating and reverse, agitating unit 11 is made to exist
When by continually changing acceleration effect over the electroplating solution, make the bubble rapid disruption in electroplate liquid, to destroy in substrate table
The gas-liquid critical layer in face reduces the diffusion bilayer thickness of electroplate liquid, the copper ion in electroplate liquid is allowed to rapidly enter in cavity, with logical
It crosses enough metallic deposition rates and obtains the electroplated layer of high uniformity.
Wherein, switching can be by time change alternately between rotating and reverse, can also be by stirring in same row
The motor that more than two independent controls are set on unit 11 is mixed, is realized and is rotated forward and anti-by the switching operating between different motors
The switching turned, alternatively, between can also being realized and rotating and reverse by making the engagement between worm and gear in different directions
Switching.
This diversification for making the rotation direction between agitating unit 11, or make the agitating unit 11 rotated synchronously not
With the mode that temporal direction is switched fast, can contribute to improve the electroplating evenness of product.
As shown in figure 5, the present embodiment also provides a kind of electroplating device 100 comprising there is agitating device 1 as described above,
By applying the agitating device 1 in the present invention in the electroplating pool 2 for accommodating electroplate liquid, it can effectively reduce and substantially stir the plating
The problem of bubble and vortex for being easy to produce when liquid, so that agitating device 1 can keep significantly stirring in electroplate liquid, from
And meet the requirements the metallic deposition rate of electroplate liquid.
In addition, the electroplating device 100 further includes having cathode plate 3 and anode plate 4, agitating device 1 is located at cathode plate 3 and anode
Between plate 4, and agitating device 1 close to cathode plate 3 be arranged and with 3 keeping parallelism of cathode plate.Further, anode plate 4 arrives
The distance between cathode plate 3 is generally 40-80mm, when being arranged agitating device 1 between cathode plate 3 and anode plate 4, cathode
There is also enough spacing between plate 3, agitating device 1 and anode plate 4, so that the electroplating device 100 can be additional by being arranged
Cylinder control the whole reciprocating swing between cathode plate 3 and anode plate 4 of agitating device 1, set with further increasing the plating
The uniformity of standby 100 plating.
In general, agitating device 1 is closer to cathode plate 3, electroplating effect is better, such as distance between the two can be
1.5cm is hereinafter, such as 3mm~8mm, then such as 5mm.In addition, it is found that when the two distance is 5mm, if the stirring of agitating device 1
, it can be achieved that the Quick uniform under current density 25ASD is electroplated when revolving speed is 500 turns/min.And herein in the case of distance, if stirring
, it can be achieved that the Quick uniform under current density 14ASD is electroplated when revolving speed is 300 turns/min.
It is important to note that although the present embodiment specifically illustrates this hair so that agitating device stirs electroplate liquid as an example
The specific structure and principle of the agitating device of bright offer, but the stirring object of the agitating device should not be limited only to electroplate liquid, it can also
To be used to stir other liquid used in semiconductor production field, or for cleaning semiconductor container equipment, even
Water flow etc. in routine use, such as stirring fish jar.
Embodiment 2
The present embodiment 2 provide agitating device 1 and electroplating device 100 provided with embodiment 1 it is roughly the same, difference
Be in, as shown in fig. 6, each agitating unit 11 all has multiple through-hole H, and these through-holes H along rotary shaft S direction according to
Secondary setting, such as in the present embodiment, 111 shape of mixing part of agitating unit 11 is " 8 " font, so that agitating unit 11 into one
Step meets the requirement of specific shape.
Embodiment 3
The present embodiment 3 provide agitating device 1 and electroplating device 100 provided with embodiment 1 it is roughly the same, difference
It is in as shown in fig. 7, in the present embodiment, there are three branch, these three branches for the tool of mixing part 111 of the agitating unit 11
Angled relationships centered on rotary shaft S between symmetrical and each branch and other Liang Ge branches in 120 °, to be divided by increasing
The quantity of branch, improves single agitating unit 11 to the stirring capacity of electroplate liquid.But expansion is being thinned in the agitating unit of Liang Ge branch
It dissipates layer, reduce bubble and vortex aspect, than three better effects with top set.
Embodiment 4
The agitating device and electroplating device that the present embodiment 4 provides provide roughly the same with embodiment 1, and difference exists
In in the present embodiment, the shape of the frame of the agitating device is different from the shape of frame shown in Fig. 1, and lower end can be with
To be arc-shaped so that electroplating device for when wafer is electroplated, make the lower end of agitating device shape and wafer it is outer
Shape size is consistent, to obtain better mixing effect.Certainly, the frame shape of agitating device provided by the present invention is simultaneously
Be not limited to it is rectangular or arc-shaped, other can match with the electroplating pool shape for the electroplating device installed or be electroplated
The frame shape that matches of workpiece shapes also each fall within protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " on ", "lower", "front", "rear", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "top", "bottom", "inner", "outside" is orientation based on the figure or position
Relationship is set, is merely for convenience of description of the present invention and simplification of the description, rather than the device or component of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
Although specific embodiments of the present invention have been described above, it will be appreciated by those of skill in the art that this is only
For example, protection scope of the present invention is to be defined by the appended claims.Those skilled in the art without departing substantially from
Under the premise of the principle and substance of the present invention, many changes and modifications may be made, but these change and
Modification each falls within protection scope of the present invention.
Claims (16)
1. a kind of agitating device, characterized in that it comprises:
At least one agitating unit, the agitating unit have rotary shaft, agitating unit circle centered on the rotary shaft
Week arranges；
Driving mechanism, the driving mechanism are connected to the agitating unit, and drive the agitating unit along the corresponding rotation
Shaft rotation.
2. agitating device as described in claim 1, which is characterized in that the agitating unit has through-hole.
3. agitating device as claimed in claim 2, which is characterized in that the through-hole passes through the rotary shaft.
4. agitating device as claimed in claim 3, which is characterized in that the through-hole is symmetrical axial symmetry point with the rotary shaft
Cloth.
5. agitating device as claimed in claim 2, which is characterized in that the agitating unit is using the rotary shaft as center circumference
It is evenly arranged.
6. agitating device as claimed in claim 2, which is characterized in that the agitating unit includes:
Mixing part, the through-hole are set to the mixing part；
Interconnecting piece, the interconnecting piece are connected to one end of the mixing part along the direction of the rotary shaft, and the driving mechanism is logical
It crosses the interconnecting piece and drives the mixing part rotation.
7. agitating device as claimed in claim 6, which is characterized in that the interconnecting piece is the circle centered on the rotary shaft
Cylinder.
8. agitating device as claimed in claim 6, which is characterized in that the agitating device further includes frame, the frame loops
Around the surrounding for being set to multiple agitating units, and the frame is connected to the driving mechanism；
The agitating unit further includes extension, and the extension is connected to the another of mixing part along the direction of the rotary shaft
End, the extension rotation are connected to the frame.
9. agitating device as described in claim 1, which is characterized in that along perpendicular to the rotation between multiple agitating units
The direction parallel side-by-side of shaft is arranged.
10. agitating device as claimed in claim 9, which is characterized in that the driving mechanism drives multiple agitating units
It rotates synchronously.
11. agitating device as claimed in claim 9, which is characterized in that the agitating device further includes transmission mechanism, the drive
Motivation structure is connected to multiple agitating units by the transmission mechanism.
12. agitating device as claimed in claim 11, which is characterized in that the transmission mechanism includes:
Multiple worm gears, the worm gear are arranged in a one-to-one correspondence with the agitating unit, and axis is connected to the corresponding agitating unit；
Worm screw, the worm screw and the shaft of the driving mechanism are coaxially connected, and multiple worm gears are along the arrangement side of the agitating unit
To being successively engaged in the worm screw.
13. such as the described in any item agitating devices of claim 1-12, which is characterized in that the agitating device further includes control
Device, the controller are electrically connected to the driving mechanism, and the controller drives the stirring for controlling the driving mechanism
Unit switches between rotating and reverse.
14. such as the described in any item agitating devices of claim 2-8, which is characterized in that each agitating unit all has more
A through-hole, the through-hole are set gradually along the direction of the rotary shaft.
15. a kind of electroplating device, which is characterized in that it includes such as the described in any item agitating devices of claim 1-14.
16. electroplating device as claimed in claim 15, which is characterized in that the electroplating device further includes cathode plate and anode
Plate, the agitating device between the cathode plate and the anode plate, the agitating device close to the cathode plate and with
The cathode plate is parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811612337.2A CN110184640A (en) | 2018-12-27 | 2018-12-27 | Agitating device and electroplating device containing it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811612337.2A CN110184640A (en) | 2018-12-27 | 2018-12-27 | Agitating device and electroplating device containing it |
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| CN110184640A true CN110184640A (en) | 2019-08-30 |
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ID=67713931
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811612337.2A Pending CN110184640A (en) | 2018-12-27 | 2018-12-27 | Agitating device and electroplating device containing it |
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| Country | Link |
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| CN (1) | CN110184640A (en) |
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| CN114892253A (en) * | 2022-05-31 | 2022-08-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer plating solution rabbling mechanism |
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