CN202954122U - Circuit board electroplating device - Google Patents
Circuit board electroplating device Download PDFInfo
- Publication number
- CN202954122U CN202954122U CN 201220645071 CN201220645071U CN202954122U CN 202954122 U CN202954122 U CN 202954122U CN 201220645071 CN201220645071 CN 201220645071 CN 201220645071 U CN201220645071 U CN 201220645071U CN 202954122 U CN202954122 U CN 202954122U
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- CN
- China
- Prior art keywords
- circuit board
- gate
- anode
- electroplating device
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a circuit board electroplating device. The circuit board electroplating device comprises an electroplating cylinder, wherein an anode and a cathode floating frame are arranged in the electroplating cylinder; a shield gate is arranged between the anode and the cathode floating frame; a fixed plate is arranged on the lower side of the shield gate; a gate frame is arranged on the upper side of the shield gate; a chute is formed in the gate frame; a moving plate is arranged in the fixed plate; a gate cavity is formed between the moving plate and the gate frame; and both sides of the moving plate are located in the chute correspondingly, and can move up and down along the chute. According to the circuit board electroplating device, the shield gate is arranged between the anode and the cathode floating frame in the electroplating cylinder; the size of the shield gate can be adjusted according to the size of a to-be-plated PCB (printed circuit board) so as to allow positive ions generated by the anode to exactly pass through the gate cavity to arrive at the to-be-plated PCB; and residual parts are shielded by the fixed plate and the moving plate in the shield gate. The circuit board electroplating device provided by the utility model can overcome the disadvantage of nonuniform thickness of the electroplated layer on the to-be-plated PCB, and can improve the PCB electroplating uniformity.
Description
Technical field
The utility model belongs to the printed circuit board manufacture technology field, and what be specifically related to is a kind of circuit board electroplating device, particularly a kind of inhomogeneity electroplanting device of circuit board electroplating that improves.
Background technology
Plating is that pcb board is manufactured the important procedure in process, by the process of electrolysis process formation of deposits coating on base material, while usually electroplating, coated metal is done anode, be oxidized to positively charged ion and enter electroplate liquid, pcb board to be plated is done negative electrode, and the positively charged ion of coated metal is reduced formation coating on the pcb board surface.When pcb board is electroplated at present, need to guarantee the homogeneity of thickness of coating, and at present during the PCB Electroplating Production, because there are the inconsistent problem of size in anode and the negative electrode electroplated, therefore the shorter end of pcb board to be plated can be reduced to form and pile up coating, cause this part thickness of coating thicker than other parts, make the homogeneity of pcb board coating to be plated poor.
The utility model content
For this reason, the purpose of this utility model is to provide a kind of circuit board electroplating device, to improve the homogeneity of current circuit board electroplating, avoids occurring that the part thickness of coating forms the problem of piling up.
The purpose of this utility model is achieved through the following technical solutions.
A kind of circuit board electroplating device, comprise and electroplate cylinder (1), be provided with anode (2) and negative electrode scaffold (3) in described plating cylinder (1), be provided with a shielding barrier (5) between described anode (2) and negative electrode scaffold (3), this shielding barrier (5) downside is retaining plate (502), upside is doorframe (501), be provided with chute (503) in described doorframe (501), be provided with a portable plate (504) in described retaining plate (502), be formed with a cavity (505) between this portable plate (504) and doorframe (501), and portable plate (504) both sides correspondence is arranged in chute (503), and can move up and down along chute (503).
Preferably, be provided with the pcb board (4) of electroplated on described negative electrode scaffold (3), this pcb board (4) is parallel with shielding barrier (5), and the projection of pcb board (4) on shielding barrier (5) is arranged in the cavity of answering the door (505).
Preferably, described negative electrode scaffold (3) and retaining plate (502) upper end are on same level.
The utility model compared with prior art, beneficial effect is: the circuit board electroplating device that the utility model provides, by between plating cylinder Anodic and negative electrode scaffold, shielding barrier being set, and according to the size adjusting shielding barrier of electroplated pcb board, the positively charged ion that anode is produced can just arrive electroplated PCB by the door cavity, and unnecessary part is shielded by the retaining plate in shielding barrier and portable plate.The utility model has been avoided the inconsistent problem of plate face thickness of coating of electroplated pcb board, has improved the homogeneity that pcb board is electroplated.
The accompanying drawing explanation
The structural representation that Fig. 1 is the utility model circuit board electroplating device.
The structural representation that Fig. 2 is the utility model circuit board electroplating device shielding barrier.
Identifier declaration in figure: electroplate cylinder 1, anode 2, negative electrode scaffold 3, pcb board 4, shielding barrier 5, doorframe 501, retaining plate 502, chute 503, portable plate 504, door cavity 505.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Refer to shown in Fig. 1, Fig. 2 the structural representation that Fig. 1 is the utility model circuit board electroplating device; The structural representation that Fig. 2 is the utility model circuit board electroplating device shielding barrier.The utility model provides a kind of circuit board electroplating device, is mainly used in improving the homogeneity of current circuit board electroplating, avoids occurring that the part thickness of coating forms the problem of piling up.
Wherein this electroplanting device includes and electroplates cylinder 1, be provided with anode 2 and negative electrode scaffold 3 in described plating cylinder 1, described anode 2 is when electroplating, can correspondingly produce positively charged ion, enter electroplate liquid, be fixed with the pcb board 4 of electroplated on negative electrode scaffold 3, corresponding pcb board 4 places that arrive of the positively charged ion in electroplate liquid, form coating on its surface.
Be provided with a shielding barrier 5 between anode 2 and negative electrode scaffold 3, the downside of this shielding barrier 5 is retaining plate 502, upside is doorframe 501, be provided with chute 503 in described doorframe 501, be provided with a portable plate 504 in described retaining plate 502, form door cavity 505 between this portable plate 504 and doorframe 501, the positively charged ion in electroplate liquid can correspondingly arrive negative electrode scaffold 3 through above-mentioned door cavity 505.
Wherein the left and right sides correspondence of portable plate 504 is arranged in chute 503, can realize that by controlling it moves up and down along chute 503, to reach the purpose of control gate cavity 505 sizes.
The utility model fixing pcb board 4 of electroplated on negative electrode scaffold 3, this pcb board 4, shielding barrier 5 and anode 2 threes are in parastate, and the projection of pcb board 4 on shielding barrier 5 is arranged in the cavity 505 of answering the door.
When pcb board 4 is carried out to electroplating processes, need to move up and down by the corresponding portable plate 504 of controlling according to the size dimension of pcb board 4, to adjust the size of door cavity 505, must make the projection of pcb board 4 be positioned at the inside of a cavity 505, shielding is blocked by portable plate 504 and retaining plate 502 in other zones, to prevent positively charged ion, at the fringe region of pcb board 4, forms accumulation.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (3)
1. a circuit board electroplating device, comprise and electroplate cylinder (1), it is characterized in that in described plating cylinder (1) being provided with anode (2) and negative electrode scaffold (3), be provided with a shielding barrier (5) between described anode (2) and negative electrode scaffold (3), this shielding barrier (5) downside is retaining plate (502), upside is doorframe (501), be provided with chute (503) in described doorframe (501), be provided with a portable plate (504) in described retaining plate (502), be formed with a cavity (505) between this portable plate (504) and doorframe (501), and portable plate (504) both sides correspondence is arranged in chute (503), and can move up and down along chute (503).
2. circuit board electroplating device according to claim 1, it is characterized in that being provided with on described negative electrode scaffold (3) pcb board (4) of electroplated, this pcb board (4) is parallel with shielding barrier (5), and the projection of pcb board (4) on shielding barrier (5) is arranged in the cavity of answering the door (505).
3. circuit board electroplating device according to claim 1, is characterized in that described negative electrode scaffold (3) and retaining plate (502) upper end are on same level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220645071 CN202954122U (en) | 2012-11-29 | 2012-11-29 | Circuit board electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220645071 CN202954122U (en) | 2012-11-29 | 2012-11-29 | Circuit board electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202954122U true CN202954122U (en) | 2013-05-29 |
Family
ID=48459703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220645071 Expired - Fee Related CN202954122U (en) | 2012-11-29 | 2012-11-29 | Circuit board electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202954122U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106149033A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
| CN107090589A (en) * | 2017-06-07 | 2017-08-25 | 东莞市品升电子有限公司 | PCB electroplanting devices and electroplating thickness control method |
-
2012
- 2012-11-29 CN CN 201220645071 patent/CN202954122U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106149033A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
| CN107090589A (en) * | 2017-06-07 | 2017-08-25 | 东莞市品升电子有限公司 | PCB electroplanting devices and electroplating thickness control method |
| CN107090589B (en) * | 2017-06-07 | 2022-03-08 | 陕西克莱铭节能科技有限公司 | PCB electroplating device and electroplating thickness control method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130529 Termination date: 20141129 |
|
| EXPY | Termination of patent right or utility model |