CN205420584U - Negative pole floating frame and PCB electro -coppering production line - Google Patents
Negative pole floating frame and PCB electro -coppering production line Download PDFInfo
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- CN205420584U CN205420584U CN201620117459.4U CN201620117459U CN205420584U CN 205420584 U CN205420584 U CN 205420584U CN 201620117459 U CN201620117459 U CN 201620117459U CN 205420584 U CN205420584 U CN 205420584U
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- shield
- sunshade
- negative electrode
- vertical direction
- pcb board
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Abstract
The utility model discloses a negative pole floating frame, be in including support body and setting the first sunshade of the support body left and right sides, still include with sliding connection's second sunshade is hugged closely in vertical direction to first sunshade, the density of second sunshade is greater than medicine density of water. Besides, the utility model also discloses a PCB electro -coppering production line, includes if above -mentioned negative pole floating frame, still include the floating frame shielding plate of level setting at coating bath bottom upper surface. Since increased with first sunshade can be in vertical direction can relative motion the second sunshade, when putting the biggest PCB board into production, first sunshade with overlapping area between the second sunshade is the biggest, when putting little PCB board into production, first sunshade rises, and the ascending motion of vertical side can not take place because density is greater than medicine density of water for the second sunshade, has increased the negative pole bottom and has sheltered from the height, has solved bottom problem thick partially when electroplating little PCB board.
Description
Technical field
This utility model relates to PCB and electroplates manufacture field, particularly relates to a kind of negative electrode scaffold and PCB electro-coppering produces.
Background technology
PCB (PrintedCircuitBoard) is the abbreviation of printed circuit board, also known as printed substrate, is important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Owing to it is to use electron printing to make, therefore it is referred to as " printing "Circuit board。
Pcb board height dimension is typically 16 at present "-26 " between, when producing different size pcb board, as it is shown in figure 1, owing to Anode titanium basket for electroplating 110 (or insoluble anode) height is decided by the maximum plate height of plating when design.Tradition plating line uses monolayer cathodes scaffold 120 to block bottom pcb board, blocks bottom electric lines of force, it is to avoid pcb board base causes coating to thicken because of edge effect, affects the uniformity bottom pcb board.When switching to little pcb board, monolayer cathodes scaffold reduces along with the height of plate, floats corresponding height, effectively blocks bottom pcb board.But because the height of shield is a definite value.When the height of plate little to certain altitude time, can not effectively block electric lines of force, then can cause after plating serious the thickest bottom PCB.
Utility model content
The purpose of this utility model is to provide a kind of negative electrode scaffold and PCB electro-coppering production line, when effectively solving to electroplate little pcb board bottom partially thick problem.
For solving above-mentioned technical problem, this utility model embodiment provides, including support body and the first shield being arranged on the described support body left and right sides, also including the second shield be close to described first shield at vertical direction and be slidably connected, the density of described second shield is more than the density of liquid medicine.
Wherein, described first shield has the stripe shape through hole at least two vertical direction, and described second shield is connected with described first shield through described stripe shape through hole by using column type pipe.
Wherein, described first shield or described second shield have draw-in groove and the projection of vertical direction axis, and the shape of described draw-in groove cooperates with the shape of described projection, in the described draw-in groove of described protruding embedding.
Wherein, described first shield or described second shield have the multipair parallel of vertical direction axis and the described draw-in groove of form fit and described projection.
Wherein, described projection is T-shaped projection.
Wherein, described projection is that vertical direction continuous print is protruding.
Wherein, described second shield is PVC the second shield.
In addition, this utility model embodiment additionally provides a kind of PCB electro-coppering production line, including negative electrode scaffold as described above, also includes the scaffold shutter being horizontally set on coating bath upper base surface.
Negative electrode scaffold that this utility model embodiment is provided and PCB electro-coppering production line, compared with prior art, have the advantage that
The negative electrode scaffold that this utility model embodiment is provided, including support body and the first shield being arranged on the described support body left and right sides, also include being close to and the density of the second shield described in the second shield of being slidably connected is more than the density of liquid medicine at vertical direction with described first shield.
The PCB electro-coppering production line that this utility model embodiment is provided, including negative electrode scaffold as described above, also includes the scaffold shutter being horizontally set on coating bath upper base surface.
Can the second shield of relative motion with in the vertical direction with described first shield owing to adding, when producing maximum pcb board, the overlapping area of described first shield and described second shield is maximum, when producing little pcb board, described first shield rises, and described second shield is owing to density is more than the density of liquid medicine, and the motion on vertical direction will not occur, add cathode bottom and block height, solve problem partially thick bottom when electroplating little pcb board.
In sum, negative electrode scaffold that this utility model embodiment is provided and PCB electro-coppering production line, the second shield being flexibly connected with the first shield vertical direction by increase, make when producing little pcb board, add cathode bottom and block height, solve problem partially thick bottom when electroplating little pcb board.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is embodiments more of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the negative electrode scaffold of the prior art structural representation at plating PCB；
Fig. 2 is the Facad structure schematic diagram of the negative electrode scaffold in a kind of concrete mode of this utility model embodiment；
Fig. 3 is the left view structural representation of the negative electrode scaffold in a kind of concrete mode of this utility model embodiment；
Fig. 4 is the PCB electro-coppering production line structural representation in a kind of concrete mode of this utility model embodiment.
Detailed description of the invention
The most as described in the background section, tradition plating line uses monolayer cathodes scaffold to block bottom pcb board, blocks bottom electric lines of force, it is to avoid pcb board base causes coating to thicken because of edge effect, affects the uniformity bottom pcb board.When switching to little pcb board, monolayer cathodes scaffold reduces along with the height of plate, floats corresponding height, effectively blocks bottom pcb board.But because the height of shield is a definite value.When the height of plate little to certain altitude time, can not effectively block Anode power line, then can cause after plating serious the thickest bottom PCB.
Concrete, as it is shown in figure 1, when electroplating the bigger pcb board of size, such as the left side in Fig. 1, for occurring because of partially thick bottom guaranteeing from design, difference in height B would generally be designed with at the bottom of anode titanium basket 110 (or insoluble anode) distance from bottom pcb board.When electroplating less pcb board (on the right side of Fig. 1), owing to titanium basket (or insoluble anode) is level altitude, and the shutter 130 of negative electrode scaffold 120 automatically float in tank liquor after shield portions be only illustrated dimensions A, can not effectively block electric lines of force, because edge effect causes bottom electroplating thickness the thickest.After plating, uniformity does not reaches requirement.
Based on this, this utility model embodiment provides a kind of negative electrode scaffold, including support body and the first shield being arranged on the described support body left and right sides, also include being close to and the density of the second shield described in the second shield of being slidably connected is more than the density of liquid medicine at vertical direction with described first shield.
In addition, this utility model embodiment additionally provides a kind of PCB electro-coppering production line, including negative electrode scaffold as described above, also includes the scaffold shutter being horizontally set on coating bath upper base surface.
It should be noted that, in this utility model, to be that the left and right sides to described pcb board is carried out simultaneously copper-plated for copper facing to pcb board, therefore, second shield is also the both sides that are arranged on described support body the same with the first shield, the width of described second shield is identical with the width of described first shield, highly between the height that height and first shield of the first shield can not block when scaffold floats, specifically combine the second shield and block height setting in the actual installation position of the first shield and scalable, only it is such that and maximum pcb board and minimum pcb board are carried out normal copper facing.
In sum, the negative electrode scaffold of this utility model embodiment offer and PCB electro-coppering production line, can can the second shield of relative motion with in the vertical direction with described first shield owing to adding, double-deck shield is become from monolayer shield of the prior art, when producing maximum pcb board, first shield of internal layer and the second shield overlapping area of outer layer are maximum, when producing little pcb board, first shield of internal layer rises, and the second shield of outer layer is owing to density is more than the density of liquid medicine, motion on vertical direction will not occur, the shielded area making the first shield and the second shield increases, add cathode bottom and block height, solve problem partially thick bottom when electroplating little pcb board.
Understandable for enabling above-mentioned purpose of the present utility model, feature and advantage to become apparent from, below in conjunction with the accompanying drawings detailed description of the invention of the present utility model is described in detail.
Elaborate detail in the following description so that fully understanding this utility model.But this utility model can be different from alternate manner described here implement with multiple, those skilled in the art can do similar popularization in the case of this utility model intension.Therefore this utility model is not limited by following public being embodied as.
Refer to the Facad structure schematic diagram of negative electrode scaffold in a kind of concrete mode that Fig. 2-Fig. 4, Fig. 2 are this utility model embodiment；Fig. 3 is the left view structural representation of the negative electrode scaffold in a kind of concrete mode of this utility model embodiment；Fig. 4 is the PCB electro-coppering production line structural representation in a kind of concrete mode of this utility model embodiment.
In a kind of detailed description of the invention, described negative electrode scaffold, including support body 210 and the first shield 220 being arranged on described support body 210 side, also including the second shield 230 be close to described first shield 220 at vertical direction and be slidably connected, the density of described second shield 230 is more than the density of liquid medicine.
First shield 220 is PP material, and PP is polyacrylic writing a Chinese character in simplified form, and density is less than the density of liquid medicine.
When to big pcb board copper facing, first shield 220 of described negative electrode scaffold and the second shield 230 shrink automatically at bottom land, it is not take up cell body space, when electroplating little pcb board, along with pcb board height reduces, two-layer cathode scaffold floats corresponding height, effectively block bottom PCB, block bottom electric lines of force, thus avoid pcb board base to cause coating to thicken because of edge effect, the final uniformity ensureing whole plate.Thus when solving to electroplate platelet, the thickest problem in bottom.After making plating, uniformity reaches electroplating technology requirement.
Described negative electrode scaffold, can can the second shield 230 of relative motion with in the vertical direction with described first shield 220 owing to adding, being become double-deck shield from monolayer shield of the prior art, double-deck shield here refers to the first shield and the inside and outside setting of the second shield, forms double-decker.When producing maximum pcb board, overlapping area between first shield 220 and second shield 230 of outer layer of internal layer is maximum, when producing little pcb board, first shield 220 of internal layer rises less than the density of liquid medicine due to density, and the second shield 230 of outer layer is owing to density is more than the density of liquid medicine, motion on vertical direction will not occur, the shielded area making the first shield 220 and the second shield 230 increases, add cathode bottom and block height, solve problem partially thick bottom when electroplating little pcb board.
As shown in Figure 2, described negative electrode scaffold blocks size after elongation has height A of the prior art to become A+C, add the scope of blocking, when making to electroplate platelet, bottom thickness is within claimed range, and when the size of pcb board is between full-size and minimum dimension, owing to the first shield 220 can automatically adjust according to the height of pcb board, can effectively block electric lines of force bottom all specification pcb boards, it is to avoid because edge effect makes bottom coating thicken, it is ensured that the uniformity bottom pcb board.
In one embodiment, described first shield 220 has the stripe shape through hole 231 at least two vertical direction, and described second shield 230 is connected with described first shield 220 through described stripe shape through hole 231 by using column type pipe.Described second shield 230 generally uses PVC pipe through the stripe shape through hole 231 on the vertical direction of described first shield 220 (such as Fig. 2, shown in 3), realize the relation that cooperates of described first shield 220 and described second shield 230, make at described first shield 220 because the medicine buoyancy of water being subject to is more than the gravity of self, first shield 220 rises, second shield 230 is static less than the gravity of self because of the medicine buoyancy of water being subject to, making to stretch between the first shield 220 and the second shield 230, shielded area increases.
Described first shield is usually PP material, it is welded on described support body, or use bolt to be connected with described support body bolt by two, the left and right side plate of described first shield, it is also possible to using other mode by affixed with described support body for described first shield, this is not specifically limited by this utility model.
It should be noted that, the length and width of described stripe shape through hole 231 is not specifically limited by this utility model, the length of described stripe shape through hole 231 is typically determined by the height of the first shield 220, the full-size of pcb board and minimum dimension, and the width of described strip through-hole 231 is corresponding with the diameter of the column type pipe of use, described cylindrical tube, in addition to using pvc pipe, also uses the pipe of other material.
nullIn another embodiment，Described first shield 220 or described second shield 230 have draw-in groove and the projection of vertical direction axis，The shape of described draw-in groove cooperates with the shape of described projection，In the described draw-in groove of described protruding embedding，Between the most described first shield 220 and the second shield 230, draw-in groove and projection by being distributed in surface each other cooperate，When the medicine buoyancy of water that the first shield 220 is subject to is more than the gravity of self，Stretch between first shield 220 and the second shield 230，Realize double-deck scaffold is become elongation from contraction，Add the scope of blocking，When making to electroplate platelet, bottom thickness is in claimed range，Can be that the first shield 220 has draw-in groove，Second shield 230 has projection，Or the first shield 220 has draw-in groove，Second shield 230 has projection，Remaining is identical with above-mentioned annexation.
It should be noted that, described protruding and described draw-in groove is corresponding, described projection can not depart from from described draw-in groove in the horizontal direction, and described draw-in groove and protruding size are not limited by this utility model, and the figure of the general protruding cross section with draw-in groove is complementary.
The first shield 220 and the second shield 230 is generally avoided to occur relative displacement, described first shield 220 or described second shield 230 to have the multipair parallel of vertical direction axis and the described draw-in groove of form fit and described projection in the horizontal direction.
Wherein, described projection is T-shaped projection, and corresponding described draw-in groove is T-shaped draw-in groove, and certain described draw-in groove and described projection can also is that other shapes of structure, and this utility model does not limits.
Described projection is that vertical direction continuous print is protruding, and when not affecting the first shield 220 and the second shield 230 relative motion at vertical direction, it is also possible to use interrupted projection, interrupted projection can save manufacturing cost.It should be noted that the spacing between protruding breakpoint is not limited by this utility model.
Owing to the second shield 230 simply plays the effect blocked, requirement to material is not the highest, and described second shield 230 generally PVC the second shield 230, as long as the density of the second shield 230 is more than the density of liquid medicine, do not affect normal plating, have enough mechanical strengths.
In addition, this utility model embodiment additionally provides a kind of PCB electro-coppering production line, as shown in Figure 4, including negative electrode scaffold as described above, also includes the scaffold shutter 240 being horizontally set on coating bath upper base surface.General by arranging scaffold shutter 240 bottom coating bath, it is to avoid the second shield 230 collides with coating bath base element.
In sum, the negative electrode scaffold of this utility model embodiment offer and PCB electro-coppering production line, can can the second shield of relative motion with in the vertical direction with described first shield owing to adding, double-deck shield is become from monolayer shield of the prior art, when producing maximum pcb board, overlapping area between first shield and second shield of outer layer of internal layer is maximum, when producing little pcb board, first shield of internal layer rises, and the second shield of outer layer is owing to density is more than the density of liquid medicine, motion on vertical direction will not occur, the shielded area making the first shield and the second shield increases, add cathode bottom and block height, solve problem partially thick bottom when electroplating little pcb board.
Above negative electrode scaffold provided by the utility model and PCB electro-coppering production line are described in detail.Principle of the present utility model and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; on the premise of without departing from this utility model principle, it is also possible to this utility model is carried out some improvement and modification, these improve and modification also falls in this utility model scope of the claims.
Claims (8)
1. a negative electrode scaffold, it is characterised in that include support body and be arranged on the first shield of the described support body left and right sides, also including the second shield be close to described first shield at vertical direction and be slidably connected, the density of described second shield is more than the density of liquid medicine.
2. negative electrode scaffold as claimed in claim 1, it is characterised in that described first shield has the stripe shape through hole at least two vertical direction, described second shield is connected with described first shield through described stripe shape through hole by using column type pipe.
3. negative electrode scaffold as claimed in claim 1, it is characterised in that described first shield or described second shield have draw-in groove and the projection of vertical direction axis, and the shape of described draw-in groove cooperates with the shape of described projection, in the described draw-in groove of described protruding embedding.
4. negative electrode scaffold as claimed in claim 3, it is characterised in that described first shield or described second shield have the multipair parallel of vertical direction axis and the described draw-in groove of form fit and described projection.
5. negative electrode scaffold as claimed in claim 4, it is characterised in that described projection is T-shaped projection.
6. negative electrode scaffold as claimed in claim 5, it is characterised in that described projection is that vertical direction continuous print is protruding.
7. negative electrode scaffold as claimed in claim 1, it is characterised in that described second shield is PVC the second shield.
8. a PCB electro-coppering production line, it is characterised in that include the negative electrode scaffold as described in any one of claim 1-7, also includes the scaffold shutter being horizontally set on coating bath upper base surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620117459.4U CN205420584U (en) | 2016-02-05 | 2016-02-05 | Negative pole floating frame and PCB electro -coppering production line |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620117459.4U CN205420584U (en) | 2016-02-05 | 2016-02-05 | Negative pole floating frame and PCB electro -coppering production line |
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| CN205420584U true CN205420584U (en) | 2016-08-03 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109972188A (en) * | 2017-12-28 | 2019-07-05 | 亚硕企业股份有限公司 | The movable protective mechanism of electroplating device |
| CN110592652A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | Shielding assembly and electrolytic device applying same |
| CN113564672A (en) * | 2021-07-30 | 2021-10-29 | 苏州浪潮智能科技有限公司 | Promote PCB board electroplating uniformity's tool and plating bath of sheltering from |
| CN114635176A (en) * | 2022-02-18 | 2022-06-17 | 上海山崎电路板有限公司 | Floating bed baffle device and method for VCP copper-plated wire |
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2016
- 2016-02-05 CN CN201620117459.4U patent/CN205420584U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109972188A (en) * | 2017-12-28 | 2019-07-05 | 亚硕企业股份有限公司 | The movable protective mechanism of electroplating device |
| CN110592652A (en) * | 2019-09-03 | 2019-12-20 | 昆山东威科技股份有限公司 | Shielding assembly and electrolytic device applying same |
| CN113564672A (en) * | 2021-07-30 | 2021-10-29 | 苏州浪潮智能科技有限公司 | Promote PCB board electroplating uniformity's tool and plating bath of sheltering from |
| CN114635176A (en) * | 2022-02-18 | 2022-06-17 | 上海山崎电路板有限公司 | Floating bed baffle device and method for VCP copper-plated wire |
| CN114635176B (en) * | 2022-02-18 | 2024-01-02 | 上海山崎电路板有限公司 | VCP copper plating wire and copper plating method |
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