JP2008279762A - Multilayer structure metal mask and its manufacturing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a multilayer structure metal mask in which by putting an electroless plating layer the difference of plate thicknesses between a region inside the pattern region and a region outside the pattern region becomes smaller and the plate thickness of the region outside the pattern region becomes thicker as compared with electroplating, the strength as the metal mask entirety is raised, and the elongation at the time of printing can be decreased. <P>SOLUTION: The multilayer structure metal mask has a multilayer type film structure formed of an electroplating layer formed on an odd number layer including the first layer, and a electroless plating layer formed on an even number layer including the second layer. A manufacturing process of the multilayer structure metal mask includes the steps of applying a sensitive film resist on a base material, baking and hardening the sensitive film resist by exposure, removing a resist part which was not hardened to form the resist part which was hardened to become a pattern on the base material, forming an electroplating layer as the first layer on a part on which a resist part is not formed on the substrate, forming the electroless plating layer as the second layer on the electroplating layer of the first layer, removing the hardened resist part, and stripping the electroplating layer and the electroless plating layer from the base material. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a multilayer structure metal mask having a multilayer film structure including two or more layers including an electroless plating layer and an electroplating layer, and a method for manufacturing the same.

  Conventionally, a method of manufacturing a multilayer structure metal mask using electroplating is well known (for example, Patent Documents 1 and 2).

JP-A-4-166844 JP-A-5-85077

  In the conventional method of manufacturing a multi-layered metal mask, when a multi-layered metal mask is manufactured using electroplating, the thickness of the metal mask having a high-density pattern must be within the pattern area and other than the pattern area. There will be a large difference in thickness. In recent years, metal masks tend to be dense and thin. In this case, the coating volume is reduced as compared with a metal mask having a uniform plate thickness. A thin metal mask (10 to 80 μm) has an influence on the mask strength, and elongation occurs under high tension tension, resulting in a decrease in total pitch accuracy. In some cases, it may break under specified tension. Even within the pattern area, the plate thickness tends to be thin near the boundary with the area outside the pattern area. In that case, the volume of the printed body (conductive paste, resin, ink, etc.) to be printed is reduced, and there is a problem of variations in the printing amount.

  The present invention has been made to solve the above-described problems, and by using an electroless plating layer, it is necessary to use uniform precipitation (not excessive precipitation), which is a characteristic of electroless plating. A multi-layered film structure with two or more layers including an electroplating layer. By making the electroplating layer as thin as possible, the plate thickness is made uniform, and by making the plate thickness uniform, the total volume is not reduced and the elongation during printing is increased. The present invention provides a multi-layer metal mask having a high hardness film, which is another characteristic of an electroless plating film, and a method for manufacturing the same.

  In the multilayer structure metal mask according to the present invention, a multilayer type comprising an electroplating layer formed in an odd layer including the first layer and an electroless plating layer formed in an even layer including the second layer. It has a film structure.

  Further, in the method for producing a multilayer structure metal mask according to the present invention, a step of preparing a conductive substrate, removing oil and the like adhering to the conductive substrate, and a photosensitive film resist on the conductive substrate. A step of applying a photo resist, a step of baking and curing the photosensitive film resist by exposure, a step of removing a resist portion that has not been cured by exposure, and forming a cured resist portion that becomes a pattern on the conductive substrate, and A step of forming an electroplating layer as a first layer on a portion of the conductive base material where the resist portion is not formed, and an electroless layer as a second layer on the first electroplating layer The method includes a step of forming a plating layer, a step of removing the cured resist portion, and a step of integrally peeling the electroplating layer and the electroless plating layer from the conductive substrate.

  Further, in the method for producing a multilayer structure metal mask according to the present invention, a step of preparing a conductive substrate, removing oil and the like adhering to the conductive substrate, and a photosensitive film resist on the conductive substrate. A step of applying a photo resist, a step of baking and curing the photosensitive film resist by exposure, a step of removing a resist portion that has not been cured by exposure, and forming a cured resist portion that becomes a pattern on the conductive substrate, and A step of forming an electroplating layer as a first layer on a portion of the conductive base material where the resist portion is not formed, and an electroless layer as a second layer on the first electroplating layer A step of forming a plating layer, a step of alternately forming an electroplating layer and an electroless plating layer on the second electroless plating layer, a step of removing the cured resist portion, and a conductive group From electroplating layer to electroplating layer All of the electroless plating layer is obtained by a step of peeling integrally.

  According to the present invention, a multi-layered film having two or more layers including an electroless plating layer and an electroplating layer utilizing the uniform precipitation (not excessive precipitation) which is a characteristic of electroless plating by always including an electroless plating layer. The thickness of the electroplating layer is made as thin as possible, and the plate thickness is made uniform. By making the plate thickness uniform, the total volume can be reduced and the elongation during printing can be reduced. It is possible to obtain a multi-layer structure metal mask having a high hardness film having the above characteristics.

Embodiment 1 FIG.
1 to 12 are cross-sectional views sequentially showing the steps of the manufacturing method of the multilayer structure metal mask according to Embodiment 1 of the present invention. FIG. 13 is a comparison of the multilayer structure metal mask of the present invention with the metal mask of the comparative example. 14 is a plan view showing the schematic structure of the pattern when evaluated, FIG. 14 is a comparison table showing the measured thickness values of the multilayer structure metal mask of the present invention and the metal mask of the comparative example, and FIG. 15 is a multilayer table of the present invention. FIG. 16 is a characteristic chart showing plate thickness measurement values at respective measurement points of the multilayer metal mask of the present invention and the metal mask of the comparative example, and FIG. FIG. 18 is a comparison table showing the elongation amount at the pitch distance between the multilayer structure metal mask of the present invention and the metal mask of the comparative example, and FIG. 18 shows the pitch of the multilayer structure metal mask of the present invention and the metal mask of the comparison example. Distance is a characteristic diagram showing the amount of elongation at.

In the method of manufacturing a multilayer metal mask according to the present invention, first, a conductive substrate (SUS or the like) 1 is prepared (see FIG. 1). Oil or the like adhering to the conductive substrate 1 is removed with a degreasing liquid 2 (see FIG. 2). A photosensitive film resist 3 is applied on the conductive substrate 1 from which oil or the like has been removed (see FIG. 3). Next, a negative type film 4 is placed on the side on which the pattern is provided and is printed by exposure (see FIG. 4). At this time, since light does not pass through the black portion of the film 4, the resist portion 3a is not cured, and the resist portion 3b through which light passes is cured. Here, the negative type film 4 is used, but the film 4 is not used in the case of direct drawing type exposure using ultraviolet light. Next, the resist portion 3a that has not been cured by exposure is removed by the developer 5 (see FIG. 5), and the cured resist portion 3b that becomes a pattern remains on the conductive substrate 1 (see FIG. 6). Next, on the surface of the portion of the conductive base material 1 where the resist portion 3b is not formed, as a first layer, the first current is set to a low current density capable of suppressing excessive precipitation, for example, a plate thickness of about 5 μm. The electroplating layer 6 is formed (see FIG. 7). The formation of the first electroplating layer 6 is, for example, nickel sulfamate 220 to 250 g / l, nickel chloride 20 to 50 g / l, citric acid 10 to 30 g / l, NTS (1.3.6-naphthalene triflate). (Sodium sulfonate) 1-3 g / l, current density 0.1-2 A / dm ² , pH 4.0, bath temperature 50 ° C. The current density is preferably is preferably in the range of 0.1~0.25A / dm ^2. Then, when the formation of the first electroplating layer 6 is completed, the electroplating layer 6 is pulled up and washed with water 7 (see FIG. 8).

A feature of the present invention is that an electroless plating layer 8 that does not excessively deposit is formed as a second layer on the first electroplating layer 6 (see FIG. 9). Formation of the second electroless plating layer 8 is, for example, nickel sulfate 20 g / l, glycine 5 g / l, sodium hypophosphite 20 g / l, bismuth 0.2 ppm, pH 6.0, bath temperature 60 ° C. It is performed by putting it in an electroless plating bath consisting of an electroless plating bath. Here, as the second layer is formed on the first electroplating layer 6, for example, by forming the electroless plating layer 8 that does not excessively precipitate so that the plate thickness is about 30 μm, the variation in the plate thickness can be reduced. The difference is smaller within the pattern area and outside the pattern area. That is, it is possible to increase the plate thickness outside the pattern region. As a result, the strength of the entire metal mask is increased, and the elongation can be reduced. Further, by reducing the variation in the plate thickness in the pattern area, the variation in the amount of solder to be printed is reduced. When the formation of the second electroless plating layer 8 is completed, the electroless plating layer 8 is lifted from the electroless plating tank and washed 9 (see FIG. 10). Next, the second electroplating layer 10 is formed as a third layer on the second electroless plating layer 8 at a low current density capable of suppressing excessive precipitation, for example, so that the plate thickness is about 5 μm. Form (see FIG. 11). The formation of the second electroplating layer 10 of the third layer is the same as that of the first electroplating layer 6. For example, nickel sulfamate 220 to 250 g / l, nickel chloride 20 to 50 g / l, citric acid 10 to 30 g / L, NTS (1.3.6-Naphthalene sodium trisulfonate) 1 to 3 g / l, current density 0.1 to ^{2 A} / dm ² , pH 4.0, bath temperature 50 ° C. nickel sulfamate bath This is done by placing it in a plating tank. The current density is preferably is preferably in the range of 0.1~0.25A / dm ^2. Then, after the formation of the third layer of electroplating 10 is finished, the resist layer 3b is removed from the electroplating tank, is removed from the conductive substrate 1 by removing the resist portion 3b cured by the stripping solution. Is completed (see FIG. 12). In the completed three-layer structure metal mask, the plate thickness ratio of the total plate thickness of the electroplating layer (5 μm + 5 μm = 10 μm) and the total plate thickness of the electroless plating layer (30 μm) is 1: 3.
The multilayer structure metal mask according to the present invention has a thickness ratio between the total thickness of the electroplated layers formed alternately and the total thickness of the electroless plated layers in the range of 1: 0.5 to 30. A range of 1: 2 to 10 is preferable. The reason is that if the plate thickness of the electroplating layer is too thin, there is a high possibility that pinholes are generated in the electroplating layer. Moreover, if the plate thickness of the electroless plating layer is too thick, electroless plating takes too much time and the working time becomes longer. The thickness ratio is 1: 0.5 in the case of a three-layer structure metal mask. The thicknesses of the first and third electroplating layers are 5 μm and the second layer has no thickness. In this case, the thickness of the electrolytic plating layer is 5 μm.

  FIG. 13 is a schematic diagram of a pattern when the multilayer structure metal mask of the present invention is evaluated in comparison with the metal mask of the comparative example. The pattern used has an opening diameter of 0.15 mm, a distance between openings: 0.045 mm, The arrangement range is a circular pattern area 11 having a diameter of about 18 cm. A straight line XX passing through the center of the circular pattern is taken, and it is divided into 16 equal parts within the circle, and the plate thicknesses of the respective measurement locations No. X3 to X18 are measured. About measurement location No. X1, X2, X19, X20, it is the plate | board thickness of the base part outside the circular pattern area 11. FIG. The same applies to the straight line YY passing through the center of the circular pattern.

FIG. 14 is a comparison table showing plate thickness measurement values at each measurement location of the multilayer structure metal mask of the present invention and the metal mask of the comparative example. A mask (1) at the upper left end of the table is a metal mask as Comparative Example 1 created with a current density of 0.5 A / dm ² as a working condition. The middle mask (2) at the left end of the table is a metal mask as a comparative example 2 created by using a current density of 0.25 A / dm ² as a working condition. The lower left mask (3) has a first electroplating layer having a current density of 0.25 A / dm ^{2 and} a thickness of about 5 μm, for example. As a layer, for example, an electroless plating layer that does not excessively precipitate is formed so that the plate thickness is about 30 μm, and further, as a third layer, a current density of 0.25 A / dm ² , for example, a plate thickness of about 5 μm. This is a multilayer structure metal mask of the present invention in which a second electroplating layer is formed so that The measured value indicates the measured value of each measurement location No. X1 to X20 in the unit: μm.

FIG. 15 is a comparison table showing the difference in plate thickness between the multilayer structure metal mask of the present invention and the metal mask of the comparative example. A mask (1) at the upper left end of the table is a metal mask as Comparative Example 1 created with a current density of 0.5 A / dm ² as a working condition. The middle mask (2) at the left end of the table is a metal mask as a comparative example 2 created by using a current density of 0.25 A / dm ² as a working condition. The lower left mask (3) has a first electroplating layer having a current density of 0.25 A / dm ^{2 and} a thickness of about 5 μm, for example. As a layer, for example, an electroless plating layer that does not excessively precipitate is formed so that the plate thickness is about 30 μm, and further, as a third layer, a current density of 0.25 A / dm ² , for example, a plate thickness of about 5 μm. This is a multilayer structure metal mask of the present invention in which a second electroplating layer is formed so that The plate thickness difference indicates the difference in measured values between the base and the pattern in the unit of μm.
FIG. 16 is a characteristic diagram showing the plate thickness measurement values at each measurement point of the multilayer structure metal mask of the present invention and the metal mask of the comparative example. The horizontal axis represents each measurement point No. X1 to X20, and the vertical axis represents the plate thickness (μm It can be seen that the thickness difference of the multilayer structure metal mask of the present invention is the smallest.

Next, a description will be given of the results of measuring the amount of elongation at the pitch distance after the frame attachment of the multilayer structure metal mask of the present invention and the metal mask of the comparative example. As the combination specifications, frame type = casting frame 650 mm * 550 mm, cocoon tension = Tetron mesh: # 225, square tension, tension = 0.60 mm (when using tension gauge STG-75B), pitch distance = 180 mm. The measuring method was left at a temperature of 20 ° C. and a humidity of 55% and measured once a day (measured in the X and Y directions).
FIG. 17 is a comparison table showing the elongation amount at the pitch distance between the multilayer structure metal mask of the present invention and the metal mask of the comparative example. The masks (1) X and Y at the upper left end of the table are metal masks as Comparative Example 1 created by using a current density of 0.5 A / dm ² as a working condition. Further, the masks (2) X and Y at the center of the left end of the table are metal masks as Comparative Example 2 created by using a current density of 0.25 A / dm ² as a working condition. Further, the mask (3) X and Y at the lower left end of the front surface is formed with a first electroplating layer so that the plate thickness is about 5 μm at a current density of 0.25 A / dm ² , For example, an electroless plating layer that does not excessively precipitate is formed as a second layer, for example, so that the plate thickness is about 30 μm, and a third layer is formed thereon with a current density of 0.25 A / dm ² , for example, the plate thickness Is a multilayer structure metal mask of the present invention in which the second electroplating layer is formed so that the thickness of the film is about 5 μm. The pitch measurement results are as follows: the amount of elongation at a distance of 180 mm between the measurement points No. X3 and No. X18 in the pattern schematic diagram shown in FIG. 13 and the distance of 180 mm between the measurement points No. Y3 and No. Y18 in the pattern schematic diagram. It is shown by the amount of elongation (μm). Moreover, the amount of growth in 8 days when the first day is zero is shown.
FIG. 18 is a characteristic diagram showing the amount of elongation at the pitch distance of the multilayer structure metal mask of the present invention and the metal mask of the comparative example. It can be seen that the amount of elongation of the multilayer structure metal mask of the present invention is the smallest.

  According to this invention, the first layer has an electroplating layer, the second layer has an electroless plating layer, the third layer has an electroplating layer, and the intermediate layer has an electroless plating layer. As a result of the insertion, the difference in the plate thickness variation between the pattern area and the non-pattern area is smaller than that of a metal mask produced by electroplating. That is, by using the present invention, it is possible to increase the plate thickness outside the pattern region. As a result, the strength of the entire metal mask is increased, so that elongation during printing can be reduced. Further, by reducing the variation in the plate thickness in the pattern area, the variation in the amount of solder to be printed is reduced.

Embodiment 2. FIG.
In the first embodiment, a three-layer structure metal mask having a three-layer coating structure in which the first layer is an electroplating layer, the second layer is an electroless plating layer, and the third layer is an electroplating layer has been described. However, a two-layer metal mask having a two-layer coating structure in which the first layer is an electroplating layer and the second layer is an electroless plating layer, or the first layer is an electroplating layer and the second layer Electroless plating layer, 4-layer metal mask having a four-layer coating structure in which the third layer is an electroplating layer and the fourth layer is an electroless plating layer, or the first layer is an electroplating layer, second 5-layer metal mask having a 5-layer coating structure in which the layer is an electroless plating layer, the third layer is an electroplating layer, the fourth layer is an electroless plating layer, and the fifth layer is an electroplating layer. An electroplating layer and an electroless plating layer are alternately formed on the second electroless plating layer. It is possible to structure a metal mask.

  If the thickness of the electroless plating layer is increased once, there is a problem that the electroless plating takes too much time and the delivery time is delayed. Therefore, four layers having a four-layer coating structure in which the first layer is an electroplating layer, the second layer is an electroless plating layer, the third layer is an electroplating layer, and the fourth layer is an electroless plating layer. Structural metal mask or first layer electroplated layer, second layer electroless plated layer, third layer electroplated layer, fourth layer electroless plated layer, fifth layer electroplated A multi-layer metal mask in which an electroplating layer and an electroless plating layer are alternately formed on the second electroless plating layer, such as a five-layer structure metal mask having a five-layer coating structure as a layer. As described above, if the thickness of each electroless plating layer that takes too much time is made thin to form a plurality of electroless plating layers, the electroless plating takes too much time and the delivery time is delayed. Can be resolved.

  The multilayer structure metal mask of the present invention includes a solder printing mask, a slate mask, a ball mounting mask, a wafer bump printing mask, a vapor deposition mask represented by an EL & shadow mask, a solder ball sieve mask, and a conductive paste. The present invention can be applied to a metal mask such as a printing mask, a multilayer mask having a mesh structure in an opening, and a suspend mask.

It is sectional drawing which shows the 1st process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the next process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is sectional drawing which shows the last process of the manufacturing method of the multilayer structure metal mask in Embodiment 1 of this invention. It is a top view which shows the pattern schematic structure when evaluating the multilayer structure metal mask in Embodiment 1 of this invention compared with the metal mask of a comparative example. It is a comparison table | surface which shows the plate | board thickness measured value in each measurement location of the multilayer structure metal mask of this invention, and the metal mask of a comparative example. It is a comparison table | surface which shows the board | plate thickness difference of the multilayer structure metal mask of this invention, and the metal mask of a comparative example. It is a characteristic view which shows the plate | board thickness measured value in each measurement location of the multilayer structure metal mask of this invention, and the metal mask of a comparative example. It is a comparison table | surface which shows the elongation amount in the pitch distance of the multilayer structure metal mask of this invention, and the metal mask of a comparative example. It is a characteristic view which shows the elongation amount in the pitch distance of the multilayer structure metal mask of this invention, and the metal mask of a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Conductive base material 2 Degreasing liquid 3 Photoresist resist 3a Resist part 3b which did not harden | cure Resist part 4 Film 5 Developer 6 1st electroplating layer (1st layer)
7 Washing with water 8 Electroless plating layer (second layer)
9 Washing 10 Second electroplating layer (third layer)
11 Circular pattern area

Claims (9)

  A multilayer structure characterized by having a multilayer film structure comprising an electroplating layer formed on an odd layer including the first layer and an electroless plating layer formed on an even layer including the second layer Metal mask. A step of preparing a conductive substrate and removing oil and the like adhering to the conductive substrate;
Applying a photoresist resist on the conductive substrate;
Baking and curing the photoresist resist by exposure; and
Removing the resist portion that has not been cured by exposure, and forming a cured resist portion that becomes a pattern on the conductive substrate;
A step of forming an electroplating layer as a first layer in a portion where the resist portion on the conductive substrate is not formed;
Forming an electroless plating layer as a second layer on the first electroplating layer;
Removing the cured resist portion;
Removing the electroplating layer and the electroless plating layer integrally from the conductive substrate;
A method for producing a multi-layer structure metal mask, comprising: A step of preparing a conductive substrate and removing oil and the like adhering to the conductive substrate;
Applying a photoresist resist on the conductive substrate;
Baking and curing the photoresist resist by exposure; and
Removing the resist portion that has not been cured by exposure, and forming a cured resist portion that becomes a pattern on the conductive substrate;
Forming a first electroplating layer as a first layer in a portion where the resist portion on the conductive substrate is not formed;
Forming an electroless plating layer as a second layer on the first electroplating layer;
Forming a second electroplating layer as a third layer on the second electroless plating layer;
Removing the cured resist portion;
Integrally peeling the first electroplating layer, the electroless plating layer and the second electroplating layer from the conductive substrate;
A method for producing a multi-layer structure metal mask, comprising: A step of preparing a conductive substrate and removing oil and the like adhering to the conductive substrate;
Applying a photoresist resist on the conductive substrate;
Baking and curing the photoresist resist by exposure; and
Removing the resist portion that has not been cured by exposure, and forming a cured resist portion that becomes a pattern on the conductive substrate;
A step of forming an electroplating layer as a first layer in a portion where the resist portion on the conductive substrate is not formed;
Forming an electroless plating layer as a second layer on the first electroplating layer;
Forming an electroplating layer and an electroless plating layer alternately on the second electroless plating layer; and
Removing the cured resist portion;
A step of integrally removing all of the electroplating layer and the electroless plating layer from the conductive substrate;
A method for producing a multi-layer structure metal mask, comprising:   A metal mask having a multilayer film structure, wherein an electroplating layer and an electroless plating layer that does not excessively deposit are alternately laminated to reduce a difference in plate thickness on the same plane.   The plate thickness ratio of the total plate thickness of the electroplating layers formed alternately and the total plate thickness of the electroless plating layer is in the range of 1: 0.5 to 30, characterized in that The multilayer metal mask described. A step of preparing a conductive substrate and removing oil and the like adhering to the conductive substrate;
Applying a photoresist resist on the conductive substrate;
Baking and curing the photoresist resist by exposure; and
Removing the resist portion that has not been cured by exposure, and forming a cured resist portion that becomes a pattern on the conductive substrate;
Forming an electroplating layer at a low current density capable of suppressing excessive precipitation as a first layer in a portion where the resist portion on the conductive substrate is not formed;
Forming an electroless plating layer that does not excessively deposit as a second layer on the first electroplating layer; and
Removing the cured resist portion;
Removing the electroplating layer and the electroless plating layer integrally from the conductive substrate;
A method for producing a multi-layer structure metal mask, comprising: A step of preparing a conductive substrate and removing oil and the like adhering to the conductive substrate;
Applying a photoresist resist on the conductive substrate;
Baking and curing the photoresist resist by exposure; and
Removing the resist portion that has not been cured by exposure, and forming a cured resist portion that becomes a pattern on the conductive substrate;
Forming a first electroplating layer at a low current density capable of suppressing excessive precipitation as a first layer in a portion where the resist portion on the conductive substrate is not formed;
Forming an electroless plating layer that does not excessively deposit as a second layer on the first electroplating layer; and
Forming a second electroplating layer on the second electroless plating layer at a low current density capable of suppressing excessive precipitation as a third layer;
Removing the cured resist portion;
Integrally peeling the first electroplating layer, the electroless plating layer and the second electroplating layer from the conductive substrate;
A method for producing a multi-layer structure metal mask, comprising: A step of preparing a conductive substrate and removing oil and the like adhering to the conductive substrate;
Applying a photoresist resist on the conductive substrate;
Baking and curing the photoresist resist by exposure; and
Removing the resist portion that has not been cured by exposure, and forming a cured resist portion that becomes a pattern on the conductive substrate;
Forming an electroplating layer at a low current density capable of suppressing excessive precipitation as a first layer in a portion where the resist portion on the conductive substrate is not formed;
Forming an electroless plating layer that does not excessively deposit as a second layer on the first electroplating layer; and
On the second electroless plating layer, alternately forming an electroplating layer and an electroless plating layer that does not excessively precipitate at a low current density capable of suppressing excessive precipitation; and
Removing the cured resist portion;
A step of integrally removing all of the electroplating layer and the electroless plating layer from the conductive substrate;
A method for producing a multi-layer structure metal mask, comprising:

Images