CN204434755U - A kind of level plating shutter device - Google Patents
A kind of level plating shutter device Download PDFInfo
- Publication number
- CN204434755U CN204434755U CN201520087650.4U CN201520087650U CN204434755U CN 204434755 U CN204434755 U CN 204434755U CN 201520087650 U CN201520087650 U CN 201520087650U CN 204434755 U CN204434755 U CN 204434755U
- Authority
- CN
- China
- Prior art keywords
- plated item
- shutter device
- plating
- cover plate
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of level plating shutter device, it is arranged in plating tank, upper and lower positive plate and plated item is provided with in plating tank, plated item is arranged between upper and lower positive plate, this level plating shutter device comprises and slides bar, anode cover plate assembly, slide the top that bar is arranged at upper anode plate, two ends are fixed on the axle bed of electroplating cell body; The two ends of sliding bar are arranged with sliding connector, and it can move sliding bar both ends horizontal; Anode cover plate assembly is fixedly connected with sliding connector, and anode cover plate assembly arranges a plurality of aperture, and is arranged between plated item and upper and lower positive plate, in order to part overlaid plated item.The utility model structure is simple, reasonable in design, by arranging anode cover plate between plated item two ends and positive plate, suitable blocking can be carried out to plated item two ends, thus avoid plated item two ends coating film thickness blocked up, make plated item two ends even with middle coating film thickness, ensure that electroplating effect and plated item quality.
Description
Technical field
The utility model relates to a kind of level plating shutter device, particularly relates to a kind of plating size that can regulate electroplate, makes the uniform shutter device of plated item surface coating thickness.
Background technology
Plating is the principle utilizing normal solution, and will be deposited on plated item for metallizing further.In general electroplating activity, plated item is connected to negative electrode and is placed in the plating tank with positive ion electrospray plating solution, then logical direct supply, makes the positive ion in solution be attracted to negative electrode place and be reduced into the plated item top layer that atom accumulates in negative electrode, and then completes electroplating work procedure.
Further say, plating is the characteristic utilizing ion migration, makes the positively charged ion in electroplate liquid, under the two like magnetic poles repel each other being subject to positive terminal and the attracting principle effect of the different electricity of cathode terminal, makes positively charged ion group all move toward cathode terminal and reach the object of plating.But in real standard electroplating work procedure, because the current densities of the dual-side of plating tank is bigger than normal relative to middle portion, current density is different, result often causes the coating film thickness at plated item two ends larger, intermediate coated film thickness is less, cause the coating film thickness of whole plated item inconsistent, the plated item obtained like this is underproof, can have a strong impact on the functional quality in the subsequent handling of plated item.
Therefore, need to provide a kind of level to electroplate shutter device, suitable blocking is carried out to plated item two ends, thus solve the plated item two ends problem uneven with the middle coating film thickness electroplated.
Utility model content
In order to solve the problems of the technologies described above, the purpose of this utility model is to provide a kind of level to electroplate shutter device, it can carry out suitable blocking to plated item two ends, thus avoid plated item two ends coating film thickness blocked up, make plated item two ends even with middle coating film thickness, ensure that electroplating effect and plated item quality.
To achieve these goals, the technical solution adopted in the utility model is:
A kind of level plating shutter device, it is arranged in plating tank, is provided with jet apparatus, upper and lower positive plate and plated item in described plating tank, and plated item is arranged between upper and lower positive plate;
This level plating shutter device comprises and slides bar, anode cover plate assembly, described in slide the top that bar is arranged at upper anode plate, two ends are fixed on the axle bed at plating tank cell body two ends; Described two ends of sliding bar are arranged with sliding connector, and sliding connector can move horizontally along sliding bar at the two ends of sliding bar; Described anode cover plate assembly is fixedly connected with this sliding connector, and described anode cover plate assembly is provided with a plurality of aperture, and described anode cover plate assembly is arranged between plated item and upper and lower positive plate, in order to part overlaid plated item.
As one of preferred version of the present utility model, described anode cover plate assembly is arranged at the two ends of plated item respectively.
As one of preferred version of the present utility model, described anode cover plate assembly comprises shield and lower shield, described upper shield and lower shield are provided with a plurality of aperture, and described upper shield is arranged between plated item and upper anode plate, and described lower shield is arranged between plated item and lower positive plate.
Further, described upper shield and lower shield be arranged in parallel.
As one of preferred embodiment, described level plating shutter device comprises two and slides bar.
Preferred, described upper shield is all fixedly connected with the lower end of sliding connector with lower shield.
Preferably, level plating shutter device is made of plastics.
Compared with prior art, the beneficial effects of the utility model are:
The utility model structure is simple, reasonable in design, by arranging anode cover plate between plated item two ends and positive plate, shield arranges aperture, suitable blocking can be carried out to plated item two ends, thus avoid plated item two ends coating film thickness blocked up, make plated item two ends even with middle coating film thickness, ensure that electroplating effect and plated item quality.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model constitutional features and technical essential, below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Fig. 1 is the perspective view of level disclosed in the utility model plating shutter device;
Fig. 2 is the perspective view that level disclosed in the utility model plating shutter device removes upper anode plate;
Fig. 3 is the front view of level disclosed in the utility model plating shutter device;
Fig. 4 is the stereographic map of the application state of the level plating shutter device disclosed in utility model;
Fig. 5 is the front view of the application state of the level plating shutter device disclosed in utility model;
Fig. 6 is the side-view of the application state of level disclosed in the utility model plating shutter device.
Description of reference numerals: 1-plating tank, 10-axle bed, 2-level plating shutter device, 20-slides bar, 21-anode cover plate assembly, the upper shield of 21a-, shield under 21b-, 21c-aperture, 22-sliding connector, 3-jet apparatus, 41-upper anode plate, positive plate under 42-, 4-plated item.
Embodiment
Below in conjunction with the accompanying drawing in the present embodiment, carry out specifically, clearly and completely describing to the technical scheme in embodiment.
See shown in Fig. 1 to Fig. 2, be a kind of level plating shutter device 2 of the present embodiment, it is made of metal, and comprises and slides bar 20, anode cover plate assembly 21, and preferably, described level plating shutter device 2 comprises two and slides bar 20.Describedly slide the top that bar 20 is arranged at upper anode plate 41, two ends are fixed on the axle bed 10 at plating tank 1 cell body two ends; Described two ends of sliding bar 20 are arranged with sliding connector 22, and sliding connector 22 can move horizontally along sliding bar 20 at the two ends of sliding bar 20; Described anode cover plate assembly 21 is arranged at the two ends of plated item 4 respectively, and is fixedly connected with sliding connector 22, and the slip by sliding connector 22 drives the movement of anode cover plate assembly 21, thus the size covering in plated item 4 two ends is regulated arbitrarily.
Described anode cover plate assembly 21 comprises shield 21a and lower shield 21b, and both are arranged in parallel.Described upper shield 21a and lower shield 21b is provided with a plurality of aperture 21c, described upper shield 21a is arranged between plated item 4 and upper anode plate 41, described lower shield 21b is arranged between plated item 4 and lower positive plate 42, and described upper shield 21a is all fixedly connected with the lower end of sliding connector 22 with lower shield 21b.The setting of aperture 21c is in order to covering part plated item, and parcel plating liquid passes through, thus avoids the two ends plated film of plated item 4 blocked up, makes coating film thickness even.
As shown in Figures 3 to 6, disclosed in the present embodiment, level plating shutter device is when applying, be placed in plating tank 1, jet apparatus 3, upper anode plate 41, lower positive plate 42 and plated item 4 is provided with in described plating tank 1, plated item 4 is arranged between upper anode plate 41 and lower positive plate 42, jet apparatus 3 is arranged at the both ends of plated item 4, upper anode plate 41 and lower positive plate 42, in order to provide electroplate liquid.Upper shield 21a is arranged between plated item 4 and upper anode plate 41, and lower shield 21b is arranged between plated item 4 and lower positive plate 42, in order to part overlaid plated item 4, thus avoids the two ends plated film of plated item 4 blocked up, makes coating film thickness even.
In sum, the utility model structure is simple, reasonable in design, by arranging anode cover plate between plated item two ends and positive plate, shield arranges aperture, suitable blocking can be carried out to plated item two ends, thus avoid plated item two ends coating film thickness blocked up, make plated item two ends even with middle coating film thickness, ensure that electroplating effect and plated item quality.
Above-mentioned embodiment; be only and technical conceive of the present utility model and constitutional features are described; object is to allow the stakeholder being familiar with technique implement according to this; but above said content does not limit protection domain of the present utility model; every any equivalence done according to spirit of the present utility model changes or modifies, and all should fall within protection domain of the present utility model.
Claims (7)
1. a level plating shutter device, it is arranged in plating tank, and be provided with jet apparatus, upper and lower positive plate and plated item in described plating tank, plated item is arranged between upper and lower positive plate, it is characterized in that,
This level plating shutter device comprises and slides bar, anode cover plate assembly, described in slide the top that bar is arranged at upper anode plate, two ends are fixed on the axle bed at plating tank cell body two ends; Described two ends of sliding bar are arranged with sliding connector, and sliding connector can move horizontally along sliding bar at the two ends of sliding bar; Described anode cover plate assembly is fixedly connected with this sliding connector, and described anode cover plate assembly is provided with a plurality of aperture, and described anode cover plate assembly is arranged between plated item and upper and lower positive plate, in order to part overlaid plated item.
2. a kind of level plating shutter device according to claim 1, it is characterized in that, described anode cover plate assembly is arranged at the two ends of plated item respectively.
3. a kind of level plating shutter device according to claim 1 and 2, it is characterized in that, described anode cover plate assembly comprises shield and lower shield, described upper shield and lower shield are provided with a plurality of aperture, described upper shield is arranged between plated item and upper anode plate, and described lower shield is arranged between plated item and lower positive plate.
4. a kind of level plating shutter device according to claim 3, it is characterized in that, described upper shield and lower shield be arranged in parallel.
5. a kind of level plating shutter device according to claim 1, it is characterized in that, described level plating shutter device comprises two and slides bar.
6. a kind of level plating shutter device according to claim 3, it is characterized in that, described upper shield is all fixedly connected with the lower end of sliding connector with lower shield.
7. a kind of level plating shutter device according to any one of claim 1-2, it is characterized in that, level plating shutter device is made of plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520087650.4U CN204434755U (en) | 2015-02-06 | 2015-02-06 | A kind of level plating shutter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520087650.4U CN204434755U (en) | 2015-02-06 | 2015-02-06 | A kind of level plating shutter device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204434755U true CN204434755U (en) | 2015-07-01 |
Family
ID=53602649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520087650.4U Active CN204434755U (en) | 2015-02-06 | 2015-02-06 | A kind of level plating shutter device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204434755U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109811392A (en) * | 2019-02-19 | 2019-05-28 | 昆山科比精工设备有限公司 | The roll-to-roll horizontal galvanic anode radical occlusion device of one kind and electroplating device |
| CN110528054A (en) * | 2019-08-31 | 2019-12-03 | 珠海市万顺睿通科技有限公司 | The device and method that a kind of pcb board does not stop slot electric deposition nickel |
| CN115369464A (en) * | 2022-08-24 | 2022-11-22 | 合肥微睿光电科技有限公司 | Method for generating oxide film on surface of upper electrode, upper electrode and cathode plate |
-
2015
- 2015-02-06 CN CN201520087650.4U patent/CN204434755U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109811392A (en) * | 2019-02-19 | 2019-05-28 | 昆山科比精工设备有限公司 | The roll-to-roll horizontal galvanic anode radical occlusion device of one kind and electroplating device |
| CN110528054A (en) * | 2019-08-31 | 2019-12-03 | 珠海市万顺睿通科技有限公司 | The device and method that a kind of pcb board does not stop slot electric deposition nickel |
| CN110528054B (en) * | 2019-08-31 | 2021-05-18 | 江西豪越群电子有限公司 | Device and method for electrodepositing nickel on PCB without stopping groove |
| CN115369464A (en) * | 2022-08-24 | 2022-11-22 | 合肥微睿光电科技有限公司 | Method for generating oxide film on surface of upper electrode, upper electrode and cathode plate |
| CN115369464B (en) * | 2022-08-24 | 2023-07-18 | 合肥微睿光电科技有限公司 | Method for generating oxide film on surface of upper electrode, upper electrode and cathode plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204434755U (en) | A kind of level plating shutter device | |
| CN104862767B (en) | Copper plating tank | |
| CN201574206U (en) | Electroplating bath with shielding plate | |
| CN105088323B (en) | Board-like Electropolating hangers | |
| CN102534733B (en) | Electroplanting device and electro-plating method | |
| CN105742643A (en) | Carbon-based zinc material and preparation method thereof | |
| CN202164371U (en) | Shielding device of electroplating device | |
| CN204111904U (en) | A kind of double-deck fixture for application and plating | |
| CN106103812B (en) | The solar cell substrate electroplanting device of the two is plated using photoinduction plating and forward bias | |
| CN203855680U (en) | Electroplating device capable of performing continuous rolling electrodeposition on zipper teeth | |
| CN203238341U (en) | Electroplating device | |
| CN207749197U (en) | Electroplating bath | |
| CN207828440U (en) | Electroplating system | |
| CN207632908U (en) | A kind of electroplating bath for continuous ribbon-like materials | |
| CN101570876B (en) | Electroplating device and electroplating method for electroplating drills | |
| CN205774869U (en) | The electronic component electroplating bath of thickness and color high uniformity | |
| CN202954122U (en) | Circuit board electroplating device | |
| CN205576338U (en) | Stores pylon for electroplating | |
| CN112126966A (en) | Electroplating device for crystalline silicon solar cell electrode | |
| CN210438851U (en) | Even electroplating device of PCB circuit board | |
| CN109518260A (en) | Accessory plate and the electroplating system using it is electroplated | |
| CN105274608B (en) | Electroplating connector and electroplating equipment | |
| CN208949431U (en) | A kind of electroplating current shielding smelting tool | |
| CN206109581U (en) | Barrel -plating groove tin zinc alloy plating device | |
| CN218539874U (en) | Novel titanium blue and coating film device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |