CN210438851U

CN210438851U - Even electroplating device of PCB circuit board

Info

Publication number: CN210438851U
Application number: CN201921341192.7U
Authority: CN
Inventors: 沈海平; 章亚萍; 沈兴学; 高建华
Original assignee: Guangde Dongfeng Electronics Co ltd
Current assignee: Guangde Dongfeng Electronics Co ltd
Priority date: 2019-08-18
Filing date: 2019-08-18
Publication date: 2020-05-01
Anticipated expiration: 2029-08-18

Abstract

The utility model discloses a device is evenly electroplated to PCB circuit board, including first electroplating box and second electroplating box, fixed mounting has the toper pipe on the opposite face of first electroplating box and second electroplating box, through intercommunication pipeline fixed connection between the toper pipe, be provided with the electroplating assembly on the second electroplating box, fixed mounting has first leading electrical pillar on the up end of first electroplating box, fixed mounting has the inlet on the up end of first electroplating box, the utility model relates to a device is evenly electroplated to PCB circuit board has reached the circuit board and has electroplated even effect through setting up conducting strip, fastening pad and false plating hole etc. has solved present PCB circuit board electroplating device, and most of electroplating effects are relatively poor, electroplate inhomogeneously for the problem of the quality decline of circuit board.

Description

Even electroplating device of PCB circuit board

Technical Field

The utility model relates to a technical field is electroplated to the circuit board, specifically is a device is evenly electroplated to PCB circuit board.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. The outer layer of many coins is also plated.

The inside of the hole of the PCB circuit board needs to be electroplated to realize the conductive performance, most of the prior PCB circuit board electroplating devices have poor electroplating effect and uneven electroplating, so that the quality of the circuit board is reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an even electroplating device of PCB circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a device is evenly electroplated to PCB circuit board, includes first electroplating box and second electroplating box, fixed mounting has the toper pipe on the opposite face of first electroplating box and second electroplating box, through intercommunication pipeline fixed connection between the toper pipe, be provided with the electroplating assembly on the second electroplating box.

Preferably, a first conductive column is fixedly mounted on the upper end face of the first electroplating box, and a liquid inlet is fixedly mounted on the upper end face of the first electroplating box.

Preferably, the electroplating component comprises a mounting plate, a second conductive column is fixedly mounted on the upper end face of the mounting plate, a left-right symmetrically distributed plugboard is fixedly mounted on the lower end face of the mounting plate, the plugboard is plugged in the second electroplating box, left-right symmetrically distributed clamping plates are arranged on the inner side of the plugboard, a plurality of uniformly distributed telescopic rods are fixedly mounted between the clamping plates and the plugboard, springs are sleeved on the telescopic rods, and circuit board components are arranged between the clamping plates.

Preferably, the opposite surface of the clamping plate is fixedly provided with a conducting strip, the conducting strip is contacted with the circuit board part, the opposite surface of the clamping plate is fixedly provided with a plurality of fastening pads which are symmetrically distributed, and the fastening pads are contacted with the circuit board part.

Preferably, the circuit board assembly comprises a circuit board main body, a through hole is formed in the circuit board main body, an electroplating film is arranged on the end face of the left side of the circuit board main body, and a hole is formed in the position, corresponding to the through hole, of the electroplating film.

Preferably, the electroplating film is provided with a pseudo-plating hole, and trapezoidal pads are arranged inside the opening hole and the pseudo-plating hole.

Compared with the prior art, the beneficial effects of the utility model are that: a PCB circuit board uniform electroplating device, a first electroplating box, a second electroplating box, a conical conduit and a communicating pipeline form an electroplating processing place, the conical conduit and the communicating pipeline are arranged, the moving speed of metal ions is improved, the electroplating efficiency is improved, after a circuit board component is fixedly clamped through a telescopic rod, a spring and a clamping plate, the conical conduit and the communicating pipeline are inserted into the second electroplating box, electroplating is carried out through electrifying a first conductive post and a second conductive post, the second conductive post is electrically connected with the conductive posts, a fastening pad improves the clamping stability of the clamping plate on the circuit board component, an electroplating-free area is shielded through an electroplating film, the surface and the inside of a through hole are electroplated, current gathers at the through hole during electroplating, the through hole is not uniformly distributed, more current gathers to a hole with a relatively isolated position, and the current density of the hole at a vertical position is higher than that of other holes, the plating layer of these holes is thick; in the region that the through-hole is denser, because the current density in this region is less relatively that leads to more porous sharing, the plating layer in these places is just thinner, and false plated hole makes the regional distribution of electroplating even, and it is even to electroplate, and the electroplating characteristic makes through-hole outer lane department simultaneously, and outer lane department is thick, and inner circle department is thin, and trapezoidal pad sets up for the surface is even. The utility model relates to a device is evenly electroplated to PCB circuit board, through setting up conducting strip, fastening pad and false plated hole etc. has reached the circuit board and has electroplated even effect, has solved present PCB circuit board and has electroplated the device, and most of electroplating effect is relatively poor, electroplates inhomogeneously for the problem of the quality degradation of circuit board.

Drawings

FIG. 1 is a schematic structural diagram of a PCB circuit board uniform electroplating device;

FIG. 2 is a schematic diagram of the internal structure of a second electroplating tank in the PCB uniform electroplating device;

FIG. 3 is a schematic structural view of a position A of a PCB uniform electroplating device;

FIG. 4 is a schematic structural diagram of a circuit board component in a PCB circuit board uniform electroplating device.

In the figure: 1-a first electroplating tank, 2-a second electroplating tank, 3-a tapered conduit, 4-a communication pipeline, 5-a liquid inlet, 6-a first conductive column, 7-an electroplating component, 8-a circuit board component, 9-a mounting plate, 10-a second conductive column, 11-a plug plate, 12-a telescopic rod, 13-a spring, 14-a clamping plate, 15-a conductive sheet, 16-a fastening pad, 17-a circuit board body, 18-a through hole, 19-an electroplating film, 20-an opening hole, 21-a false plating hole and 22-a trapezoidal pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides a device is evenly electroplated to PCB circuit board, includes first electroplating box 1 and second electroplating box 2, fixed mounting has toper pipe 3 on the opposite face of first electroplating box 1 and second electroplating box 2, through 4 fixed connection of intercommunication pipeline between the toper pipe 3, be provided with electroplating component 7 on the second electroplating box 2.

The first electroplating box 1, the second electroplating box 2, the conical conduit 3 and the communicating pipeline 4 form the electroplating processing place, and the conical conduit 3 and the communicating pipeline 4 are arranged, so that the moving speed of metal ions is increased, and the electroplating efficiency is improved.

The upper end face of the first electroplating box 1 is fixedly provided with a first conductive column 6, and the upper end face of the first electroplating box 1 is fixedly provided with a liquid inlet 5.

Electroplating assembly 7 includes mounting panel 9, fixed mounting has the second to lead electrical pillar 10 on the up end of mounting panel 9, fixed mounting has bilateral symmetry's plugboard 11 on the lower terminal surface of mounting panel 9, plugboard 11 pegs graft in the inside of second electroplating box 2, the inboard of plugboard 11 is provided with bilateral symmetry's splint 14, fixed mounting has a plurality of evenly distributed's telescopic link 12 between splint 14 and the plugboard 11, the cover is equipped with spring 13 on the telescopic link 12, be provided with circuit board part 8 between the splint 14.

The circuit board is characterized in that a conducting strip 15 is fixedly mounted on the opposite surface of the clamping plate 14, the conducting strip 15 is in contact with the circuit board component 8, a plurality of symmetrically-distributed fastening pads 16 are fixedly mounted on the opposite surface of the clamping plate 14, and the fastening pads 16 are in contact with the circuit board component 8.

After the circuit board component 8 is fixedly clamped through the telescopic rod 12, the spring 13 and the clamping plate 14, the circuit board component 8 is inserted into the second electroplating box 2, the first conductive column 6 and the second conductive column 10 are electrified for electroplating, the second conductive column 10 is electrically connected with the conductive sheet 15, and the clamping stability of the clamping plate 14 on the circuit board component 8 is improved through the fastening pad 16.

The circuit board assembly 8 comprises a circuit board main body 17, a through hole 18 is formed in the circuit board main body 17, an electroplating film 19 is arranged on the left end face of the circuit board main body 17, and an opening 20 is formed in the position, corresponding to the through hole 18, of the electroplating film 19.

The electroplating film 19 is provided with a dummy plating hole 21, and trapezoidal pads 22 are arranged inside the opening hole 20 and the dummy plating hole 21.

The electroplating film 19 is used for shielding the area which does not need to be electroplated, the surface and the interior of the through hole 18 are electroplated, current gathers at the through hole 18 during electroplating, the through hole 18 is not uniformly distributed, more current gathers at a hole with a relatively isolated position, the current density of the hole at the isolated position is higher than that of other holes, and the electroplated layer of the holes is thicker; in the areas with dense through holes 18, the current density in the areas is relatively small due to the distribution of more holes, the electroplated layers in the areas are thin, the electroplated areas are uniformly distributed and electroplated through the pseudo-plated holes 21, meanwhile, the outer openings of the through holes 18 are thick at the outer ring and thin at the inner ring due to the electroplating characteristics, and the surfaces are uniform due to the arrangement of the trapezoidal pads 22.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a PCB circuit board evenly electroplates device, includes first electroplating box (1) and second electroplating box (2), its characterized in that: the electroplating device is characterized in that conical guide pipes (3) are fixedly mounted on opposite surfaces of the first electroplating box (1) and the second electroplating box (2), the conical guide pipes (3) are fixedly connected through communicating pipes (4), and electroplating assemblies (7) are arranged on the second electroplating box (2).

2. The PCB uniform electroplating device of claim 1, wherein: the electroplating device is characterized in that a first conductive column (6) is fixedly mounted on the upper end face of the first electroplating box (1), and a liquid inlet (5) is fixedly mounted on the upper end face of the first electroplating box (1).

3. The PCB uniform electroplating device of claim 2, wherein: electroplating assembly (7) including mounting panel (9), fixed mounting has the second to lead electrical pillar (10) on the up end of mounting panel (9), fixed mounting has plugboard (11) of bilateral symmetry distribution on the lower terminal surface of mounting panel (9), plugboard (11) are pegged graft in the inside of second electroplating box (2), the inboard of plugboard (11) is provided with splint (14) of bilateral symmetry distribution, fixed mounting has a plurality of evenly distributed's telescopic link (12) between splint (14) and plugboard (11), the cover is equipped with spring (13) on telescopic link (12), be provided with circuit board part (8) between splint (14).

4. A PCB board uniform plating apparatus according to claim 3, wherein: fixed mounting has conducting strip (15) on the opposite face of splint (14), conducting strip (15) and circuit board part (8) contact, fixed mounting has fastening pad (16) of a plurality of symmetric distribution on the opposite face of splint (14), fastening pad (16) and circuit board part (8) contact.

5. The PCB uniform electroplating device of claim 4, wherein: the circuit board assembly (8) comprises a circuit board main body (17), a through hole (18) is formed in the circuit board main body (17), an electroplating film (19) is arranged on the left end face of the circuit board main body (17), and a hole (20) is formed in the position, corresponding to the through hole (18), of the electroplating film (19).

6. A PCB circuit board uniform plating device according to claim 5, characterized in that: the electroplating film (19) is provided with a pseudo-plating hole (21), and trapezoidal pads (22) are arranged inside the open hole (20) and the pseudo-plating hole (21).