CN218372574U

CN218372574U - Arc guiding structure of electroplating bath of integrated circuit lead frame

Info

Publication number: CN218372574U
Application number: CN202222038291.6U
Authority: CN
Inventors: 苏骞; 王磊
Original assignee: Dongguan Allmerit Technology Co Ltd
Current assignee: Dongguan Allmerit Technology Co Ltd
Priority date: 2022-08-03
Filing date: 2022-08-03
Publication date: 2023-01-24
Anticipated expiration: 2032-08-03

Abstract

The utility model relates to an integrated circuit lead frame electroplating technology field, in particular to an electric arc guiding structure of an integrated circuit lead frame electroplating bath, which comprises an anode conducting structure arranged along the advancing direction of the electroplating bath, wherein a guiding piece advancing the material strip in a guiding way is arranged in the electroplating bath, the guiding piece comprises a guiding plate which is arranged along the length direction and is guided to pass by a feeding strip, a shielding piece shielding the plate edge of the material strip is formed on the guiding plate, and the shielding piece continuously reduces the shielding area of the plate edge of the material strip along the advancing direction; the material area that needs to electroplate enters into the plating bath to go forward along the deflector, positive pole conducting structure takes place conductive reaction with the material area simultaneously, and the flange department in material area is nearer with positive pole conducting structure distance, can shield positive pole conducting structure and the conductive arc who takes the flange limit through the shielding piece, makes the face that the shielding piece was walked around with the material area to electric arc conductive, can not concentrate ground and electroplate in the flange limit department in material area, makes to electroplate the local comparatively even, and it is better to electroplate the quality.

Description

Arc guiding structure of integrated circuit lead frame electroplating bath

Technical Field

The utility model relates to an integrated circuit lead frame electroplates technical field, especially relates to electric arc guide structure of integrated circuit lead frame plating bath.

Background

The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.

Electroplating is a process of plating a thin layer of other metals or alloys on certain metal surfaces, such as lead frames, by using the principle of electrolysis, and is a process of adhering a layer of metal film on the surface of a metal or other material part by using the action of electrolysis so as to prevent metal oxidation, such as corrosion, improve wear resistance, conductivity, reflectivity, corrosion resistance, beauty and the like, and the conductive protection device of the electroplating bath can be used for daily maintenance and guarantee of electroplating equipment.

When the electroplating bath electroplates the lead frame, the lead frame is electrically conducted with the anode and the cathode respectively, free electric ions in the electroplating bath react with the lead frame to be attached with a layer of metal film, the speed of electron dissociation is related to the speed of electric arc conduction, the existing anode conducting end is usually positioned at two sides of the advancing direction of the bath, after the lead frame enters the electroplating bath, the side edge of the lead frame is closer to the anode conducting end, the electric arc of the anode conducting end can intensively react with the edge part of the lead frame, so that the electric ions in the electrolyte can intensively approach the edge part of the lead frame and react, the metal film electroplated is uneven, and the electroplating effect of other areas is more general.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electric arc guide structure of integrated circuit lead frame plating bath to the not enough of prior art.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

electric arc guide structure of integrated circuit lead frame plating bath, including the cell body, positive pole conducting structure has been arranged along the direction of advance in the cell body, still be provided with the guide that leads to the direction of taking the material in the cell body, the guide is provided with the shielding piece that shelters from to the board limit along length direction, the area that the shielding piece sheltered from to the flange department in material area constantly diminishes along the direction of advance, the spout subassembly of difference to material area top surface and bottom surface hydrojet is installed to the cell body, the spout subassembly includes last spray tube and lower spray tube of arranging along cell body length direction, the interval of going up spray tube and guide equals the interval of spray tube and guide down.

Further: the guide piece comprises a guide plate which is arranged along the length direction and is provided with a feed belt to guide and penetrate through, and a shielding piece for shielding the plate edge is arranged on the guide plate along the length direction.

And further: the anode conductive structures are respectively positioned on two sides of the advancing direction of the tank body and comprise metal baskets longitudinally arranged on the tank body, and metal blocks are placed in the metal baskets.

Further: more than two metal baskets are arranged on each side of the groove body, and the two adjacent metal baskets are in conductive connection.

Further: the guide plate is positioned on the inner side of the anode conductive structure, and a guide groove with a triangular section is formed on the inner side of the guide plate along the length direction.

Further: the shielding part comprises insulating plates which are respectively arranged at the top and the bottom of the guide plate, and the width of the insulating plates is continuously reduced along the advancing direction of the material belt.

And further: the cell body still is provided with the installation component to the deflector installation, and the installation component includes the current conducting plate of arranging along the cell body width direction respectively, and slidable mounting has the pull rod on the current conducting plate, and the pull rod bottom is connected with the deflector hoist and mount are in the cell body.

Further: the current-conducting plate is formed with an adjusting groove along the length direction thereof for mounting a pull rod, and the pull rod is mounted on the adjusting groove in a position-adjustable manner.

Further: be provided with in the cell body and carry out the end supporting component that supports to spray tube down, go up the spray tube both ends and be provided with the top supporting component who installs at the current conducting plate.

Further: the upper liquid spraying pipe and the lower liquid spraying pipe are parallel to each other, the end parts of the upper liquid spraying pipe and the lower liquid spraying pipe are aligned with each other, and a plurality of liquid spraying holes which are arranged at equal intervals are formed in each liquid spraying pipe along the length direction.

The utility model has the advantages that: the strip to be electroplated enters the electroplating bath and advances along the guide piece, the anode conductive structure and the strip are subjected to conductive reaction at the same time, the edge of the strip is close to the anode conductive structure, the anode conductive structure and the conductive arc at the edge of the strip can be shielded through the shielding piece, so that the arc bypasses the shielding piece to be conductive with the surface of the strip, the electroplating at the edge of the strip can not be concentrated, the electroplating local area is uniform, and the electroplating quality is better; in addition, when the integrated circuit lead frame initially enters the shielding piece of the electroplating bath, more electric arcs can be shielded, the integrated circuit lead frame continuously advances, the folding area of the shielding piece to the plate edge of the integrated circuit lead frame is continuously reduced, and metal ions can be more uniformly and quickly dissociated to the surface of the integrated circuit lead frame under the impact of the liquid spraying pipe.

Drawings

FIG. 1 is a schematic view of the structure of the plating bath.

FIG. 2 is a schematic view of another perspective of the plating cell, with one side plate hidden.

FIG. 3 is a schematic view of a portion of the plating tank in a top view.

Fig. 4 is a partial structural diagram of fig. 2.

The reference numerals include:

1-plating bath,

10-anode conductive structure, 11-metal basket, 12-titanium basket bag, 13-conductive block,

2-a guide member,

21-guide plate, 22-guide groove, 23-insulating plate,

3-mounting components,

31-conductive plate, 32-adjusting groove, 33-pull rod, 34-knob block,

4-a spray pipe component,

41-upper liquid spray pipe, 42-lower liquid spray pipe, 43-liquid spray port, 44-bottom support component,

45-top support assembly.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1-4, the arc guiding structure of the integrated circuit lead frame electroplating bath includes a bath body, the bath body is an electroplating bath 1, an anode conductive structure 10 is arranged along the advancing direction of the electroplating bath 1, the electroplating bath 1 is filled with an electrolyte, the anode conductive structures 10 are respectively located on two sides of the advancing direction of the electroplating bath 1, the anode conductive structure 10 includes a metal basket 11 longitudinally installed on the electroplating bath 1, a metal block is placed in the metal basket 11, and the metal block is installed in a titanium basket bag 12. Each side of plating bath 1 all is provided with metal basket 11 more than two, and two adjacent metal baskets 11 are electrically conducted through conducting block 13 and are connected, and plating bath 1 still is provided with transverse arrangement's current conducting plate 31, and current conducting plate 31 is the metal sheet that has electrically conductive function, and the metal sheet realizes electrically conductive the connecting with the metal basket 11 of both sides through conducting block 13.

Be provided with guide 2 in the plating bath 1, guide 2 includes a pair of deflector 21 that arranges along length direction and supply the direction of integrated circuit lead frame to pass, deflector 21 is provided with the negative pole conducting structure who is connected with the integrated circuit lead frame electricity, deflector 21 is located metal basket 11 inboard, deflector 21 inboard is along length direction shaping have the cross-section to be triangle-shaped's guide way 22, the integrated circuit lead frame that enters into in the plating bath 1 cooperates with deflector 21, the flange of lead frame moves along guide way 22 forward, circular telegram metal basket 11 takes place conductive reaction with the integrated circuit lead frame, make the metal ion of the metal block in the metal basket 11 constantly take place reaction with the integrated circuit lead frame under the free assistance of electrolyte along conductive arc, realize the electroplating.

After the integrated circuit lead frame enters the electroplating bath 1 along the through opening, the side edge of the integrated circuit lead frame is closer to the anode conductive end, and the electric arc of the anode conductive end can intensively react with the edge part of the integrated circuit lead frame, so that the electric ions in the electrolyte can intensively approach the edge part of the integrated circuit lead frame and react, and the electroplated and molded metal film is uneven; in order to solve the problems, a shielding part is formed on the guide plate 21 and comprises insulating plates 23 respectively installed at the top and the bottom of the guide plate 21, the insulating plates 23 shield the plate edges of the top surface and the bottom surface of the integrated circuit lead frame, the plate edges of the circuit board are closer to the metal basket 11, the anode conductive structure 10 and the conductive electric arc of the plate edges of the integrated circuit lead frame can be shielded through the insulating plates 23, the electric arc bypasses the insulating plates 23 to be conductive with the plate surface of the integrated circuit lead frame, the electric arc is arc-shaped and cannot be directly and electrically connected with the plate edge with the shortest distance in a guiding mode, the electric arc can be relatively dispersedly and uniformly electrically connected with the plate surface of the integrated circuit lead frame, metal ions of metal blocks in the metal basket 11 continuously react with the plate surface of the integrated circuit lead frame along the conductive electric arc under the free assistance of electrolyte, and electroplating is realized.

In addition, the width of insulation board 23 constantly reduces along integrated circuit lead frame direction of advance, insulation board 23 is right trapezoid, the straight line limit of insulation board 23 aligns with the long limit of deflector 21, integrated circuit lead frame enters into the initial time of plating bath 1, make the area that the shield sheltered from integrated circuit lead frame flange department constantly diminish along the direction of advance, when integrated circuit lead frame entered into plating bath 1, the tip of insulation board 23 sheltered from integrated circuit lead frame flange, can shield more electric arc, integrated circuit lead frame constantly gos forward, along with insulation board 23 constantly diminishes the flange folding area of this integrated circuit lead frame, make metal ion can comparatively dissociate integrated circuit lead frame face uniformly.

The current-conducting plate 31 is arranged along the width direction of the electroplating bath 1 and is perpendicular to the guide plate 21, the current-conducting plate 31 is respectively positioned at two ends of the electroplating bath 1, the current-conducting plate 31 is formed with an adjusting groove 32 along the length direction thereof, a pull rod 33 is slidably mounted in the adjusting groove 32, and the bottom of the pull rod 33 is connected with the guide plate 21 and hoists the guide plate 21 in the electroplating bath 1. The pull rod 33 is nested with a knob block 34, and the knob block 34 can fix the pull rod 33 after the pull rod 33 is adjusted to a specified position.

The distance between the two guide plates 21 can be adjusted by adjusting the position of the pull rod 33 in the adjusting groove 32, so that the lead frame guide device is suitable for the lead frames of the integrated circuits with different widths to pass through.

The electroplating bath 1 is provided with a spray pipe assembly 4 for spraying liquid to the top surface and the bottom surface of an integrated circuit lead frame respectively, the spray pipe assembly 4 comprises an upper spray pipe 41 and a lower spray pipe 42 which are arranged along the length direction of the electroplating bath 1, the spray pipes 41 and the lower spray pipe 42 are parallel to each other, the end parts of the spray pipes are aligned with each other, a plurality of uniformly distributed liquid spraying openings 43 are formed in the upper spray pipe 41 and the lower spray pipe 42, the liquid in the electroplating bath 1 can flow when the liquid is sprayed out, metal ions in the electroplating bath 1 can rapidly dissociate on the integrated circuit lead frame, and the electroplating efficiency is improved; a bottom support assembly 44 for supporting the lower spray pipe 42 is provided in the plating tank 1, and top support assemblies 45 installed on the conductive plate 31 are provided at both ends of the upper spray pipe 41, so that the upper spray pipe 41 and the lower spray pipe 42 are stably installed in the plating tank 1.

In conclusion, the present invention has the above-mentioned excellent characteristics, so that it can be used to enhance the effectiveness of the prior art and provide a practical product.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims

1. Electric arc guide structure of integrated circuit lead frame plating bath, including the cell body, positive pole conducting structure, its characterized in that have been arranged along the direction of advance in the cell body: still be provided with the guide that advances to the direction of taking the material in the cell body, the guide is provided with the shielding piece that shelters from to the board limit along length direction, and the area that the shielding piece sheltered from to the board limit department in material area constantly diminishes along the direction of advance, and the spout subassembly of liquid spray to material top surface and bottom surface respectively is installed to the cell body, and the spout subassembly includes the last spray tube and the lower spray tube of arranging along cell body length direction, goes up the interval of spray tube and guide and equals the interval of spray tube and guide down.

2. The arc guiding structure of an integrated circuit lead frame plating bath of claim 1, wherein: the guide piece comprises a guide plate which is arranged along the length direction and is guided to pass through by the feeding belt, and a shielding piece for shielding the plate edge is arranged on the guide plate along the length direction.

3. The arc guiding structure of the integrated circuit lead frame plating bath of claim 2, wherein: the anode conductive structures are respectively positioned on two sides of the advancing direction of the tank body, each anode conductive structure comprises a metal basket which is longitudinally arranged on the tank body, and a metal block is placed in each metal basket.

4. The arc guiding structure of an integrated circuit lead frame plating bath of claim 1, wherein: more than two metal baskets are arranged on each side of the groove body, and the two adjacent metal baskets are in conductive connection.

5. The arc guiding structure of an integrated circuit lead frame plating bath of claim 2, wherein: the guide plate is positioned on the inner side of the anode conductive structure, and a guide groove with a triangular section is formed on the inner side of the guide plate along the length direction.

6. The arc guiding structure of the integrated circuit lead frame plating bath of claim 5, wherein: the shielding part comprises insulating plates which are respectively arranged at the top and the bottom of the guide plate, and the width of the insulating plates is continuously reduced along the advancing direction of the material belt.

7. The arc guiding structure of an integrated circuit lead frame plating bath of claim 6, wherein: the cell body still is provided with the installation component to the deflector installation, and the installation component includes the current conducting plate of arranging along cell body width direction respectively, and slidable mounting has the pull rod on the current conducting plate, and the pull rod bottom is connected with the deflector hoist and mount are in the cell body.

8. The arc guiding structure of an integrated circuit lead frame plating bath of claim 7, wherein: the current-conducting plate is formed with the adjustment tank that is used for installing the pull rod along its length direction, and pull rod adjustable position ground is installed on the adjustment tank.

9. The arc guiding structure of an integrated circuit lead frame plating bath of claim 1, wherein: be provided with the end supporting component that supports lower spray tube in the cell body, go up the spray tube both ends and be provided with the top supporting component of installing at the current conducting plate.

10. The arc guiding structure of an integrated circuit lead frame plating bath of claim 9, wherein: go up spray tube and spray tube parallel to each other and the tip aligns each other down, every spray tube is along the shaping of length direction has a plurality of equidistance liquid spraying hole of arranging.