CN216237330U

CN216237330U - Electroplating equipment for improving uniformity of electroplating process of circuit board

Info

Publication number: CN216237330U
Application number: CN202122144746.8U
Authority: CN
Inventors: 黄治国; 雷振峰; 柳会平; 王云
Original assignee: Yuehu Crystal Core Circuit Suzhou Co ltd
Current assignee: Yuehu Crystal Core Circuit Suzhou Co ltd
Priority date: 2021-09-07
Filing date: 2021-09-07
Publication date: 2022-04-08
Anticipated expiration: 2031-09-07

Abstract

The utility model discloses electroplating equipment for improving uniformity of an electroplating process of a circuit board, which comprises an equipment main body, wherein a first electroplating control mechanism and a second electroplating control mechanism are installed inside the equipment main body, a first electroplating conveying pipe and a second electroplating conveying pipe are installed on the inner side of the middle part of the equipment main body, an electroplating copper cylinder shielding seat is installed on the outer side of the second electroplating conveying pipe, a copper cylinder nozzle is installed on the outer side of the electroplating copper cylinder shielding seat, a U-shaped groove is installed at the bottom of the middle part of the equipment main body, and a U-shaped protection piece is installed on the inner side of the U-shaped groove. The electroplating equipment for improving the uniformity of the electroplating process of the circuit board is provided with the gluing and welding baffle and the U-shaped protection piece at the bottom, the bottom of the electroplating copper cylinder is additionally shielded, the U-shaped protection piece is additionally arranged at the bottom V-shaped groove of the electroplating groove, the positioning protection can be conveniently and better carried out, the uniformity of copper plating is improved by improving the shapes of the electrode and the electroplating groove, and the copper plating performance is more excellent.

Description

Electroplating equipment for improving uniformity of electroplating process of circuit board

Technical Field

The utility model relates to the field of circuit board electroplating, in particular to electroplating equipment for improving the uniformity of an electroplating process of a circuit board.

Background

Electroplating equipment is a support equipment that carries out circuit board electroplating, along with electronic product is towards the multifunctionality, the continuous innovation of intelligent direction and development also propose higher requirement to the carrier printed circuit board that bears electronic component, the promotion circuit board is to light, thin, short, little direction development, electroplating is one of the important flow in the circuit board production process, the quality of electroplating also can directly influence the production yield of product, along with the continuous development of science and technology, people also are more and more high to electroplating equipment's manufacturing process requirement.

The existing electroplating equipment has certain disadvantages when in use, firstly, in the chemical copper plating process, CU2+ ions obtain electrons to be reduced into metal copper, a reducing agent emits electrons to be oxidized, the reaction is substantially the same as the electrolysis process, only the process of getting lost electrons is carried out in a short circuit state, and the current circulation can not be seen outside, therefore, the chemical plating is a very energy-saving and efficient electrolysis process, because the chemical plating has no external power supply, the resistance drop and the energy consumption can not be caused during the electrolysis, but the uniformity of a plating layer can be influenced by the anode condition in the plating process of a product, the uniformity can directly influence the yield of a plated part and is not beneficial to the use of people, in addition, the defect of uneven plating layer thickness can be usually generated in the production practice, the average thickness on the surface of the whole plated part can only be calculated according to the electrolysis law, and the current density and the distribution of the plating layer are uneven even on a plane cathode which is completely equal to the cathode distance, the thickness of the plating layer on sharp corners and edges is obviously larger than the average thickness calculated theoretically, the thickness on the central surface of a plane cathode is obviously smaller than the average thickness, the deviation between the actual thickness and the average thickness is 20% -30%, certain adverse effects are brought to the use process of people, and therefore, the electroplating equipment for improving the uniformity of the electroplating process of the circuit board is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides electroplating equipment for improving the uniformity of the electroplating process of a circuit board.

(II) technical scheme

In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides an electroplating device that processing procedure homogeneity is improved is electroplated to circuit board, includes equipment principal, equipment principal's internally mounted has an electroplating control mechanism and electroplates control mechanism No. two, No. one electroplating conveying pipeline and No. two electroplating conveying pipelines are installed to equipment principal's middle part inboard, the seat is shielded to the copper electroplating jar is installed in No. two electroplating conveying pipelines's the outside, the copper electroplating jar shields the outside of seat and installs the copper jar nozzle, U type groove is installed to equipment principal's middle part bottom, U type protection piece is installed to the inboard in U type groove, the mid-mounting in U type groove has material drive assembly.

As an optimal technical scheme, the reference column is installed to material drive assembly's upper end, the connection support is installed to the upper end of reference column, actuating mechanism is installed in the outside of connecting the support, conveying assembly is installed in material drive assembly's the outside, install the circuit board conveyer belt between conveying assembly and the actuating mechanism, the top mount pad is installed to the upper end of equipment main part.

As an optimal technical scheme, No. one electroplates connecting wire is installed to No. one electroplating control mechanism's upper end, No. two electroplating control mechanism's upper end is installed No. two and is electroplated connecting wire, the location base is installed to the bottom in U type groove, No. one electroplating feeding drive seat is installed to one side of location base, No. two electroplating feeding drive seats are installed to the opposite side of location base, fixed mounting seat is installed to the bottom of location base, the equipment base is installed to the bottom of equipment main part, the feeding seat is installed to one side of equipment base.

As a preferred technical scheme, No. two baffles and No. one baffle are installed to the inboard of U type protection piece, No. one beat the glue seat is installed in the outside of No. two baffles, No. two beat the glue seat in the outside of No. one baffle, No. two baffles and No. one beat and install No. one between the glue seat and weld the seat, No. two beat and install No. two weld the seat between glue seat and the baffle.

As a preferred technical scheme, the U-shaped protection piece, the second baffle and the first baffle are combined into a U shape, the outer side of the second electroplating conveying pipeline is connected with one end of a copper cylinder nozzle in a positioning mode through an electroplated copper cylinder shielding seat, and an air nozzle at the position of the electroplated copper cylinder shielding seat is cut off by 10 mm.

As a preferred technical scheme, a positioning mechanism is arranged between the equipment main body and the equipment base, the bottom of the equipment main body is connected with the upper end of the equipment base in a positioning mode through the positioning mechanism, and the upper end of the equipment base is connected with the lower end of the positioning base in a positioning mode through a fixed mounting seat.

As an optimal technical scheme, a first installation connecting seat is arranged between the positioning base and the first electroplating feeding driving seat, one side of the positioning base is connected with the inner side of the first electroplating feeding driving seat in a positioning mode through the first installation connecting seat, a second installation connecting seat is arranged between the positioning base and the second electroplating feeding driving seat, and the other side of the positioning base is connected with the inner side of the second electroplating feeding driving seat in a positioning mode through the second installation connecting seat.

As a preferred technical scheme, the circuit board conveying belt moves between the conveying assembly and the driving mechanism, and the upper end of the material driving assembly is connected with the lower end of the connecting support in a positioning mode through the positioning column.

(III) advantageous effects

Compared with the prior art, the utility model provides electroplating equipment for improving the uniformity of the electroplating process of a circuit board, which has the following beneficial effects: the electroplating equipment for improving the uniformity of the electroplating process of the circuit board is provided with a gluing and welding baffle and a U-shaped protection piece at the bottom, the bottom of an electroplating copper cylinder is additionally shielded, the U-shaped protection piece is additionally arranged at the bottom V groove of the electroplating groove, the positioning protection can be conveniently and better carried out, the uniformity of copper plating is improved by improving the shapes of an electrode and an electroplating groove, the copper plating performance is more excellent, a material body enters the inner position of an equipment main body from the position of a feeding seat, the electroplating material body is uniformly conveyed to the inner positions of a first electroplating conveying pipe and a second electroplating conveying pipe through a first electroplating feeding driving seat and a second electroplating feeding driving seat, a first electroplating control mechanism, a first electroplating connecting wire, a second electroplating connecting wire and a second electroplating control mechanism are used for controlling, the circuit board is conveyed at the position of a circuit board conveying belt and is conveyed by a driving mechanism and a conveying assembly, the circuit board is subjected to copper plating operation at the position of a nozzle of the copper cylinder, the electro-coppering jar shields the seat and shields, and the electro-coppering jar shields the air cock of seat department and cuts away 10mm, protects, and the position in U type groove is provided with U type protection piece, fixes a position the protection through a baffle and No. two baffles, fixes with the mode of beating glue earlier, then fixes a position through the mode of welding, and is more firm, increases barrier propterty, whole electroplating device simple structure, convenient operation, the effect of use is better for traditional mode.

Drawings

FIG. 1 is a schematic diagram of an overall structure of an electroplating apparatus for improving uniformity of a circuit board electroplating process according to the present invention.

FIG. 2 is a schematic structural diagram of a glue-applying welding baffle in an electroplating device for improving the uniformity of the electroplating process of a circuit board according to the present invention.

FIG. 3 is a schematic structural diagram of a bottom U-shaped protection member in an electroplating apparatus for improving uniformity of an electroplating process of a circuit board according to the present invention.

In the figure: 1. an apparatus main body; 2. a U-shaped protector; 3. a delivery assembly; 4. a first electroplating feeding driving seat; 5. a feeding seat; 6. electroplating a material conveying pipe; 7. a circuit board conveyor belt; 8. a drive mechanism; 9. connecting a support; 10. a top mount; 11. a positioning column; 12. electroplating a material conveying pipe; 13. a shielding seat of the copper electroplating cylinder; 14. a copper cylinder nozzle; 15. a first baffle plate; 16. a material drive assembly; 17. a second electroplating feeding driving seat; 18. a U-shaped groove; 19. electroplating a connecting wire; 20. a first electroplating control mechanism; 21. electroplating a connecting wire; 22. a second electroplating control mechanism; 23. positioning a base; 24. fixing the mounting seat; 25. an equipment base; 26. a second baffle plate; 27. a first gluing seat; 28. a first welding seat; 29. a second welding seat; 30. and a second glue applying seat.

Detailed Description

The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings and the detailed description, but those skilled in the art will understand that the following described embodiments are some, not all, of the embodiments of the present invention, and are only used for illustrating the present invention, and should not be construed as limiting the scope of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows:

as shown in fig. 1-3, an electroplating apparatus for improving uniformity of a circuit board electroplating process includes an apparatus main body 1, a first electroplating control mechanism 20 and a second electroplating control mechanism 22 are installed inside the apparatus main body 1, a first electroplating delivery pipe 6 and a second electroplating delivery pipe 12 are installed inside a middle portion of the apparatus main body 1, an electroplated copper cylinder shielding seat 13 is installed outside the second electroplating delivery pipe 12, a copper cylinder nozzle 14 is installed outside the electroplated copper cylinder shielding seat 13, a U-shaped groove 18 is installed at a bottom portion of the middle portion of the apparatus main body 1, a U-shaped protection member 2 is installed inside the U-shaped groove 18, and a material driving assembly 16 is installed in a middle portion of the U-shaped groove 18.

No. two baffles 26 and No. one baffle 15 are installed to U type protection piece 2's inboard, No. one beat the gluey seat 27 of outside installation of No. two baffles 26, No. two beat gluey seats 30 are installed in the outside of No. one baffle 15, install No. one between No. two baffles 26 and the gluey seat 27 and burn No. one and weld the seat 28, do not number two beat and glue the seat 30 and install No. two between the baffle 15 and burn No. two and weld the seat 29, top mount pad 10 is installed to the upper end of equipment main part 1.

The U-shaped protection piece 2, the second baffle 26 and the first baffle 15 are combined into a U shape, the outer side of the second electroplating conveying pipeline 12 is connected with one end of the copper cylinder nozzle 14 in a positioning mode through the electroplated copper cylinder shielding seat 13, and an air nozzle at the position of the electroplated copper cylinder shielding seat 13 is cut off by 10 mm.

Example two:

on the basis of the first embodiment, as shown in fig. 1 to 3, an electroplating apparatus for improving uniformity of a circuit board electroplating process includes an apparatus main body 1, a first electroplating control mechanism 20 and a second electroplating control mechanism 22 are installed inside the apparatus main body 1, a first electroplating delivery pipe 6 and a second electroplating delivery pipe 12 are installed inside a middle portion of the apparatus main body 1, an electroplated copper cylinder shielding seat 13 is installed outside the second electroplating delivery pipe 12, a copper cylinder nozzle 14 is installed outside the electroplated copper cylinder shielding seat 13, a U-shaped groove 18 is installed at a bottom portion of the middle portion of the apparatus main body 1, a U-shaped protection member 2 is installed inside the U-shaped groove 18, and a material driving component 16 is installed in a middle portion of the U-shaped groove 18.

A positioning column 11 is installed at the upper end of a material driving assembly 16, a connecting support 9 is installed at the upper end of the positioning column 11, a driving mechanism 8 is installed on the outer side of the connecting support 9, a conveying assembly 3 is installed on the outer side of the material driving assembly 16, and a circuit board conveying belt 7 is installed between the conveying assembly 3 and the driving mechanism 8.

The circuit board conveyer belt 7 moves between the conveyer component 3 and the driving mechanism 8, and the upper end of the material driving component 16 is connected with the lower end of the connecting support 9 in a positioning way through the positioning column 11.

Example three:

on the basis of the second embodiment, as shown in fig. 1-3, an electroplating apparatus for improving uniformity of a circuit board electroplating process includes an apparatus main body 1, a first electroplating control mechanism 20 and a second electroplating control mechanism 22 are installed inside the apparatus main body 1, a first electroplating delivery pipe 6 and a second electroplating delivery pipe 12 are installed inside the middle of the apparatus main body 1, an electroplated copper cylinder shielding seat 13 is installed outside the second electroplating delivery pipe 12, a copper cylinder nozzle 14 is installed outside the electroplated copper cylinder shielding seat 13, a U-shaped groove 18 is installed at the bottom of the middle of the apparatus main body 1, a U-shaped protection member 2 is installed inside the U-shaped groove 18, and a material driving component 16 is installed in the middle of the U-shaped groove 18.

No. one electroplates 20 upper end of control mechanism and installs No. one and electroplate connecting wire 19, No. two electroplates 22 upper ends of control mechanism and installs No. two and electroplate connecting wire 21, location base 23 is installed to the bottom in U type groove 18, No. one electroplate feeding drive seat 4 is installed to one side of location base 23, No. two electroplate feeding drive seat 17 is installed to the opposite side of location base 23, fixed mounting seat 24 is installed to the bottom of location base 23, equipment base 25 is installed to the bottom of equipment main part 1, feeding seat 5 is installed to one side of equipment base 25.

No. two baffles 26 and No. one baffle 15 are installed to U type protection piece 2's inboard, and No. one beat the gluey seat 27 is installed in the outside of No. two baffles 26, and No. two beat gluey seats 30 are installed in the outside of No. one baffle 15, install No. one between No. two baffles 26 and No. one beat gluey seat 27 and weld the seat 28, do not install No. two between No. two beat gluey seats 30 and the baffle 15 and weld the seat 29.

A positioning mechanism is arranged between the equipment main body 1 and the equipment base 25, the bottom of the equipment main body 1 is connected with the upper end of the equipment base 25 in a positioning mode through the positioning mechanism, and the upper end of the equipment base 25 is connected with the lower end of the positioning base 23 in a positioning mode through the fixed mounting seat 24.

Be provided with the erection joint seat No. one between location base 23 and the electroplating feeding drive seat 4, one side of location base 23 is connected through the inboard location of an erection joint seat and an electroplating feeding drive seat 4, is provided with the erection joint seat No. two between location base 23 and the electroplating feeding drive seat No. two 17, and the opposite side of location base 23 is connected through the inboard location of erection joint seat and electroplating feeding drive seat No. two 17.

The working principle is as follows: the utility model comprises an equipment main body 1, a U-shaped protection piece 2, a conveying component 3, a first electroplating feeding driving seat 4, a feeding seat 5, a first electroplating conveying pipe 6, a circuit board conveying belt 7, a driving mechanism 8, a connecting support 9, a top mounting seat 10, a positioning column 11, a second electroplating conveying pipe 12, an electroplating copper cylinder shielding seat 13, a copper cylinder nozzle 14, a first baffle 15, a material driving component 16, a second electroplating feeding driving seat 17, a U-shaped groove 18, a first electroplating connecting lead 19, a first electroplating control mechanism 20, a second electroplating connecting lead 21, a second electroplating control mechanism 22, a positioning base 23, a fixed mounting seat 24, an equipment base 25, a second baffle 26, a first glue printing seat 27, a first solder printing seat 28, a second solder printing seat 29 and a second glue printing seat 30, wherein when in use, a material body enters the internal position of the equipment main body 1 from the position of the feeding seat 5, the electroplating material is uniformly conveyed to the inner positions of a first electroplating conveying pipe 6 and a second electroplating conveying pipe 12 through a first electroplating feeding driving seat 4 and a second electroplating feeding driving seat 17, a first electroplating control mechanism 20, a first electroplating connecting lead 19, a second electroplating connecting lead 21 and a second electroplating control mechanism 22 are used for controlling, a circuit board is conveyed at the position of a circuit board conveying belt 7 and is conveyed by a driving mechanism 8 and a conveying assembly 3, the circuit board is subjected to copper plating operation at the position of a copper cylinder nozzle 14, an electroplating copper cylinder shielding seat 13 is shielded, an air nozzle at the position of the electroplating copper cylinder shielding seat 13 is cut by 10mm for protection, a U-shaped protection piece 2 is arranged at the position of a U-shaped groove 18, positioning protection is carried out through a first baffle 15 and a second baffle 26, fixing is carried out in a glue-applying mode, and then positioning is carried out in a welding mode, more firm, increase barrier propterty, the increase of electroplated copper jar bottom is shielded, and electroplating tank bottom V groove increases U type protection, can make things convenient for better location protection, improves the copper facing homogeneity through the shape that improves electrode and plating bath, and the copper facing performance is more excellent.

It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed.

Claims

1. The utility model provides an electroplating equipment that circuit board electroplating process homogeneity improves, includes equipment main part (1), its characterized in that: the internally mounted of equipment main body (1) has electroplating control mechanism (20) and electroplates control mechanism (22) No. two, the middle part inboard of equipment main body (1) is installed one and is electroplated conveying pipeline (6) and No. two electroplating conveying pipelines (12), the copper electroplating jar is installed in the outside of No. two electroplating conveying pipelines (12) and is shielded seat (13), copper electroplating jar shields the outside of seat (13) and installs copper jar nozzle (14), U type groove (18) are installed to the middle part bottom of equipment main body (1), U type protection piece (2) are installed to the inboard in U type groove (18), the mid-mounting in U type groove (18) has material drive assembly (16).

2. An electroplating apparatus for improving uniformity of a circuit board electroplating process according to claim 1, wherein: reference column (11) are installed to the upper end of material drive assembly (16), connection support (9) are installed to the upper end of reference column (11), actuating mechanism (8) are installed in the outside of connecting support (9), conveying assembly (3) are installed in the outside of material drive assembly (16), install circuit board conveyer belt (7) between conveying assembly (3) and actuating mechanism (8), top mount pad (10) are installed to the upper end of equipment main part (1).

3. An electroplating apparatus for improving uniformity of a circuit board electroplating process according to claim 1, wherein: no. one electroplate connecting wire (19) is installed to the upper end of an electroplating control mechanism (20), No. two electroplating connecting wire (21) are installed to the upper end of No. two electroplating control mechanism (22), location base (23) are installed to the bottom in U type groove (18), one side of location base (23) is installed one and is electroplated feeding drive seat (4) No. one, the opposite side of location base (23) is installed two and is electroplated feeding drive seat (17), fixed mounting seat (24) are installed to the bottom of location base (23), equipment base (25) are installed to the bottom of equipment main part (1), feeding seat (5) are installed to one side of equipment base (25).

4. An electroplating apparatus for improving uniformity of a circuit board electroplating process according to claim 1, wherein: no. two baffles (26) and No. one baffle (15) are installed to the inboard of U type protection piece (2), No. one beat gluey seat (27) is installed in the outside of No. two baffles (26), No. two beat gluey seat (30) are installed in the outside of a baffle (15), No. one burn-in seat (28) is installed between No. two baffles (26) and one beat gluey seat (27), No. two burn-in seat (29) are installed between No. two beat gluey seat (30) and a baffle (15).

5. An electroplating apparatus for improving uniformity of electroplating process of circuit board according to claim 4, wherein: u type protection piece (2), No. two baffles (26) and No. one baffle (15) between constitute the U type, the outside of No. two electroplating conveying pipeline (12) is shielded seat (13) and copper jar one end location connection of nozzle (14) through the copper electroplating jar, the copper electroplating jar shields the air cock of seat (13) department and cuts off 10 mm.

6. An electroplating apparatus according to claim 3, wherein the electroplating apparatus comprises: be provided with positioning mechanism between equipment main part (1) and equipment base (25), the bottom of equipment main part (1) is passed through positioning mechanism and is connected with the upper end location of equipment base (25), the upper end of equipment base (25) is passed through fixed mounting seat (24) and is connected with the lower extreme location of location base (23).

7. An electroplating apparatus according to claim 3, wherein the electroplating apparatus comprises: be provided with the erection joint seat No. one between location base (23) and the electroplating feeding drive seat (4), one side of location base (23) is connected through the inboard location of an erection joint seat and an electroplating feeding drive seat (4), be provided with the erection joint seat No. two between location base (23) and the electroplating feeding drive seat No. two (17), the opposite side of location base (23) is connected through the inboard location of erection joint seat and electroplating feeding drive seat No. two (17).

8. An electroplating apparatus for improving uniformity of a circuit board electroplating process according to claim 2, wherein: the circuit board conveying belt (7) moves between the conveying assembly (3) and the driving mechanism (8), and the upper end of the material driving assembly (16) is connected with the lower end of the connecting support (9) in a positioning mode through the positioning column (11).