CN215713466U - Auxiliary jig for electroplating substrate - Google Patents

Abstract

The utility model provides an auxiliary fixture that base plate was electroplated, includes frame splint, its characterized in that: the frame splint are the local electrically conductive frame splint, and the frame splint are the rectangle frame of day font, and the upper portion of frame splint is electrically conductive region, and the lower part of frame splint is insulating region, and the product setting is fixed through the electrically conductive frame of clip and electrically conductive regional lower extreme in the electrically conductive region of frame splint, and during the electroplating, the frame splint are planted side by side in the bottom of electroplating equipment in proper order, and the product is seamless with the frame splint, and is seamless between the adjacent frame splint. The utility model has reasonable structure, can improve the electroplating uniformity by using conventional electroplating equipment, ensures that the copper thickness of a product is uniform, is beneficial to the stability of a rear-stage process, improves the consistency of a circuit, does not need to invest an expensive automatic feeding and discharging system, and has lower cost.

Description

Auxiliary jig for electroplating substrate

Technical Field

The utility model relates to electroplating equipment, in particular to an auxiliary jig for electroplating a substrate.

Background

The substrate is a basic material for manufacturing a PCB (printed circuit board), and generally, the substrate is a Copper Clad Laminate, and in manufacturing of a single-sided or double-sided printed circuit board, a hole processing, an electroless Copper plating, an electrolytic Copper plating, an etching, and the like are selectively performed on a substrate material, namely, a Copper Clad Laminate (CCL), to obtain a desired circuit pattern. It has the functions of conducting electricity, insulating and supporting. The performance, quality, workability in manufacturing, manufacturing cost, manufacturing level, and the like of the printed board greatly depend on the substrate material, and therefore it is important how to improve the plating quality of the conductive layer of the substrate.

The product is fixed to current base plate adoption splint mode when electroplating, and splint have and take frame splint and do not take frame splint two kinds, and its excellent shortcoming is as follows:

the clamping plate with the frame is an insulating clamping plate 10, as shown in figure 1, a product 2 is fixed on the insulating frame through stainless steel clamps 3 on the left side and the right side, and electroplating equipment is a vertical continuous electroplating line and has the advantages that: the upper plate is easy, and has the following disadvantages: because the stainless steel clips 3 are arranged on the side faces, and in order to prevent the clips from shielding and influencing the effective electroplating area of the product, the size of the product to be electroplated needs to be slightly smaller than the frame (as marked by e in a CAD (computer-aided design) figure 1), so that a gap d exists between adjacent clamping plates 10, and the gap area is non-conductive, current can be gathered at the edge of the product 2, the current density of the area is increased, the edge electroplating rate is higher than the middle, so that the thickness of electroplated copper at the edge is higher than that at the middle, seamless electroplating cannot be realized, and the uniformity of coatings at two sides is poor;

do not take frame splint, the product is fixed on equipment automatic fixture, and electroplating device is perpendicular continuous plating line, automatic hypoplastron, and the advantage is: the automation degree is high, and the defects are that: equipment is expensive, especially for plating thinner products; moreover, the sizes of products to be electroplated are consistent, so that raw materials are wasted on partial products;

therefore, a new auxiliary electroplating jig needs to be designed, which can effectively improve the electroplating uniformity and reduce the cost.

Disclosure of Invention

The utility model aims to provide an auxiliary jig for electroplating a substrate, which has a reasonable structure, a good use effect and low cost, aiming at the technical current situation and can effectively improve the uniformity of electroplating.

The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model provides an auxiliary fixture that base plate was electroplated, includes frame splint, its characterized in that: the frame splint are the local electrically conductive frame splint, and the frame splint are the rectangle frame of day font, and the upper portion of frame splint is electrically conductive region, and the lower part of frame splint is insulating region, and the product setting is fixed through the electrically conductive frame of clip and electrically conductive regional lower extreme in the electrically conductive region of frame splint, and during the electroplating, the frame splint are planted side by side in the bottom of electroplating equipment in proper order, and the product is seamless with the frame splint, and is seamless between the adjacent frame splint.

As an improvement, the conductive area consists of an upper conductive frame, a lower conductive frame, a left conductive frame, a right conductive frame, an insulating area consists of a left insulating frame, a right insulating frame and a bottom insulating frame, and the size of the inner wall of the conductive frame of the conductive area is matched with the size of a product.

Further, the frame clamping plate adopts a copper-clad plate with the thickness of 1.0-1.5mm as a raw material plate, copper sheets on the surface are selectively removed through etching, and then the copper sheets are processed into required sizes through a milling machine.

Further, the clamp of the electroplating equipment is directly clamped at the conductive position at the top end of the frame, so that the product is conductive and fixed, and the clamp is clamped on the upper guide frame of the conductive area and is fixed with the upper end of the product.

Finally, electroplating device's bottom is equipped with the high automatically regulated of product, is used for shielding the kickboard device of product bottom edge electric current, the lower part insulating region of frame splint plants in the kickboard device, electrically conductive regional lower electrically conductive frame also is located the kickboard device, the up end of electrically conductive frame flushes mutually with the up end of kickboard device down, treat like this that all there is electrically conductive tool protection around the electroplating product, electrically conductive tool has shared the electric current in the intensive region of marginal power line, make the current density distribution on the product even, reach the purpose that promotes product cladding material thickness homogeneity.

Compared with the prior art, the utility model has the advantages that: design into local conductive frame splint with traditional insulating frame splint, make the product setting in the conductive region, the clip is fixed on product bottom and lower conductive frame, and product and direction frame are seamless like this, and seamless between the adjacent conductive frame has effectively solved current in the past and can lead to the thick problem of edge electro-coppering in the gathering of product edge. The utility model has reasonable structure, can improve the electroplating uniformity by using conventional electroplating equipment, ensures that the copper thickness of a product is uniform, is beneficial to the stability of a rear-stage process, improves the consistency of a circuit, does not need to invest an expensive automatic feeding and discharging system, and has lower cost.

Drawings

FIG. 1 is a flow chart of an improved auxiliary electroplating jig;

FIG. 2 is a flow chart of the use of the plating assist of the present invention.

Detailed Description

The utility model is described in further detail below with reference to the accompanying examples.

As shown in fig. 2, an auxiliary jig for electroplating a substrate, including frame splint 1, frame splint 1 is the local electrically conductive frame splint, frame splint 1 is the rectangle frame of day font, the upper portion of frame splint 1 is electrically conductive regional 11, the lower part of frame splint 1 is insulating region 12, the product sets up electrically conductive regional 11 at frame splint 1, it is fixed with the electrically conductive frame of electrically conductive regional 11 lower extreme through clip 3, during electroplating, frame splint 1 plants side by side in proper order on chuck 4 of electroplating equipment, product 2 is seamless with frame splint 1, no gap between the adjacent frame splint 1.

The concrete structure is as follows: the conductive area 11 is composed of upper, lower, left and right conductive frames 1b, 1a, 1c and 1c, the insulating area 12 is composed of left and right insulating frames and a bottom insulating frame, and the size of the inner wall of the conductive area 11 is matched with that of the product 2. The frame clamping plate 1 adopts a copper-clad plate with the thickness of 1.0-1.5mm as a raw material plate, and the copper sheet on the surface is selectively removed through etching. The utility model uses the conventional copper-clad plate as a raw material plate, the material of the copper-clad plate is a mixture of glass fiber, resin and filler, the copper-clad plate can rebound to the original shape after the external force is removed, the elastic modulus is good, and the jig can not deform; the conductive part of the jig can be synchronously electroplated and thickened in the process of electroplating products; taking copper electroplating as an example, the conductive position of the jig can be electroplated with copper in the copper electroplating process, when the thickened copper layer at the conductive position reaches a certain thickness, the copper at the conductive position needs to be thinned, otherwise the clamping plate effect of the electroplating clamp can be influenced, and copper powder and copper plating on the frame fall into a copper plating solution to pollute the tank body; in order to make the jig reusable, the following improvements are made: the copper-clad plate is used as a raw material plate, and the copper sheet is removed by etching the whole plate; the method is characterized in that a layer of protective metal such as titanium, nickel and the like is electroplated at a conductive position, the electroplating mode can be vacuum sputtering or chemical plating, or other processes capable of depositing metal on an insulating layer, for example, copper electroplating is taken as an example, when the thickness of copper at the conductive position of the jig is increased to a certain thickness, copper corrosion liquid with characteristic concentration such as sulfuric acid and hydrogen peroxide can be used, the copper corrosion liquid can corrode copper but can not corrode the protective metal on the jig such as titanium, nickel and the like, and after the copper is corroded, the protective metal at the bottom is still conductive, so that the purpose of recycling is achieved, and the consumption of raw materials and the processing procedures of the jig are greatly reduced. Thereby overcoming some of the disadvantages associated with the use of stainless steel or other metal plates: firstly, if a large-size metal plate is directly used for processing, the cost is high, and local electric conduction cannot be manufactured; secondly, if the cut raw materials are directly used for welding, the precision of the welding size is poor, and the product requirements cannot be met; and thirdly, the product clamping plate is easy to deform and cannot rebound after being subjected to external force. And then processed into required size by a milling machine. Electroplating device electric connection anchor clamps 4 press from both sides in the upside position of frame splint 1, and anchor clamps 4 are connected with electroplating device's negative pole, and anchor clamps 4 centre gripping is fixed with product 2 upper end at the last direction frame 1b of conducting region 11. The bottom of electroplating device is equipped with can be along with the high automatically regulated of product 2, be used for shielding 2 bottom edge current's of product floating plate device 5, and the lower insulating region 12 of frame splint 1 is planted in floating plate device 5, and electrically conductive region 11's lower electrically conductive frame 1a also is located floating plate device 5, and the up end of lower electrically conductive frame 1a flushes mutually with the up end of floating plate device 5.

The specific operation steps are as follows:

1. making frame splint 1

Copper clad plates with the thickness of 1.0-1.5mm are used; etching to remove the copper sheet on the surface and leaving the insulating layer of the copper-clad plate; the insulating layer material of the copper-clad plate consists of epoxy resin and glass fiber cloth, and is a tough hard material; processing the insulating layer of the copper-clad plate into a required size by using a milling machine;

2. placing a product into the upper conductive area 11 of the frame clamping plate 1, and fixing the lower end of the product with the lower conductive frame 1a through the clamp 3;

3. put into electroplating device in proper order with the frame splint 1 of assembling product 2, the lower part insulating region 12 of frame splint 1 plants in kickboard device 5, and the lower electrically conductive frame 1a of electrically conductive region 11 also is located kickboard device 5, and the up end of lower electrically conductive frame 1a flushes the upside of frame splint 1 mutually with the up end of kickboard device 5 and is equipped with and electroplating device electric connection's anchor clamps 4, and the anchor clamps 4 centre gripping is fixed in the last direction frame 1b and the product 2 upper end of electrically conductive region 11.

Because the clamp 3 is clamped at the lower end of the product 2, no gap exists between the conductive frames of the adjacent frame clamping plates, and no gap exists between the product and the left and right sides of the conductive frames, thereby effectively solving the problem that the edge of the product 2 is plated with copper thick due to the accumulation of current in the past; the lower part of the frame clamping plate 1 is an insulating area 12, so that the bottom of the frame clamping plate 1 can be prevented from being electrified, and the current is prevented from being dispersed unevenly; electroplating device bottom sets up kickboard device 5, can effectively shield the electric current at 2 bottom edges of product along with the high automatically regulated of product 2, prevents that bottom copper electroplating layer is too thick.

The electroplating auxiliary jig of this embodiment can promote the homogeneity of electroplating greatly for product copper is thick even, does benefit to the stability of back end process, promotes the ability of circuit uniformity.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the technical principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (5)

1. The utility model provides an auxiliary fixture that base plate was electroplated, includes frame splint, its characterized in that: the frame splint are the local electrically conductive frame splint, and the frame splint are the rectangle frame of day font, and the upper portion of frame splint is electrically conductive region, and the lower part of frame splint is insulating region, and the product setting is fixed through the electrically conductive frame of clip and electrically conductive regional lower extreme in the electrically conductive region of frame splint, and during the electroplating, the frame splint are planted side by side in the bottom of electroplating equipment in proper order, and the product is seamless with the frame splint, and is seamless between the adjacent frame splint.

2. The auxiliary tool for electroplating a substrate according to claim 1, wherein: the conductive area is composed of upper, lower, left and right conductive frames, the insulating area is composed of left and right insulating frames and a bottom insulating frame, and the size of the inner wall of the conductive frame of the conductive area is matched with the size of a product.

3. The auxiliary tool for electroplating a substrate according to claim 2, wherein: the frame clamping plate adopts a copper-clad plate with the thickness of 1.0-1.5mm as a raw material plate.

4. The auxiliary tool for electroplating a substrate according to claim 3, wherein: the clamp of the electroplating equipment is directly clamped at the conductive position at the top end of the frame to realize the conduction and fixation of the product, and the clamp is clamped on the upper guide frame of the conductive area and fixed with the upper end of the product.

5. The auxiliary tool for electroplating a substrate according to claim 4, wherein: the bottom of the electroplating equipment is provided with a floating plate device which can be automatically adjusted along with the height of a product and is used for shielding the edge current at the bottom of the product, the lower insulating area of the frame clamping plate is inserted into the floating plate device, the lower conductive frame of the conductive area is also positioned in the floating plate device, and the upper end surface of the lower conductive frame is flush with the upper end surface of the floating plate device.

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