CN216919456U

CN216919456U - Accompanying plating plate for improving electroplating uniformity

Info

Publication number: CN216919456U
Application number: CN202220383337.5U
Authority: CN
Inventors: 廖发盆; 王海平; 陈军民; 夏军; 徐承升
Original assignee: Dongguan Cojoin Circuits Co ltd
Current assignee: Dongguan Cojoin Circuits Co ltd
Priority date: 2022-02-23
Filing date: 2022-02-23
Publication date: 2022-07-08
Anticipated expiration: 2032-02-23

Abstract

The utility model relates to the technical field of electroplating, in particular to a plating accompanying plate for improving electroplating uniformity, which comprises a substrate, wherein movable plates are respectively attached to the upper surface and the lower surface of the substrate, the movable plates are detachably connected to the substrate through a connecting mechanism, a conductive assembly is fixed on the surface of one side, away from the substrate, of each movable plate, each conductive assembly comprises a conductive metal plate and a conductive metal grid, the conductive metal plate is fixed at a flying-bus clamping position on each movable plate, the conductive metal grids are covered and fixed on the rest parts of the movable plates, and the conductive metal plates are fixedly connected with the conductive metal grids. According to the utility model, the grid-shaped conductive metal grid is adopted in the conductive component, so that current can be transmitted through the conductive metal grid, the electroplating effect is more uniform, and the improvement of the yield of products is facilitated.

Description

Accompanying plating plate for improving electroplating uniformity

Technical Field

The utility model relates to the technical field of electroplating, in particular to a plating accompanying plate for improving electroplating uniformity.

Background

The vertical continuous electroplating process is generally used in the electroplating process of the printed circuit board, and one characteristic of the electroplating process is that current is required to be applied in sections, so that a large number of plating accompanying plates with the same size as a production plate are required to fill a target section of electroplating cylinder body, and normal current applying electroplating of the production plate can be carried out. At present, most manufacturers directly adopt a copper-clad plate as a plating accompanying plate, metal is plated on the surface of the plating accompanying plate during electroplating, and the plating accompanying plate is discarded or the metal plated on the surface is removed after the plating accompanying plate is used to a certain degree and then is continuously used. In the VCP vertical electroplating process, a plating plate is required to balance current before production every time, the conventional plating plate-accompanied electroplating process greatly wastes internal production cost, and the actual balance effect on electroplating is not great.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects that the conventional plating accompanying plate whole plate electroplating process wastes internal production cost greatly and has small practical balance effect on electroplating in the prior art, and provides a plating accompanying plate for improving electroplating uniformity.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a design is improved accompanying of electroplating homogeneity and is plated board, includes the base plate, the laminating is provided with a fly leaf on the upper surface of base plate and the lower surface respectively, the fly leaf all can dismantle the connection on the base plate through coupling mechanism, it all is fixed with conductive component to keep away from base plate side surface on the fly leaf, conductive component includes conductive metal plate, conductive metal net, it is fixed with conductive metal plate to fly a clamp position department on the fly leaf, the remainder on the fly leaf covers and is fixed with conductive metal net, conductive metal plate and conductive metal net fixed connection are in the same place.

Preferably, the connecting mechanism comprises slots and inserts, the two sides of the upper surface and the lower surface of the substrate are respectively provided with one slot, each insert is inserted into each slot, and the two inserts are fixedly connected with the corresponding movable plates.

Preferably, the thickness of the conductive metal plate and the conductive metal grid is controlled to be 0.5-1 mm.

Preferably, the conductive metal plate and the conductive metal grid are made of copper.

Preferably, the substrate is made of epoxy resin, phenolic resin, polyimide resin or polytetrafluoroethylene.

The plating accompanying plate for improving the electroplating uniformity has the beneficial effects that: when the electric plating device is used, the grid-shaped conductive metal grid is arranged in the conductive assembly, and the conductive metal plate is arranged at the clamping position, so that the flying bar clamping pair is not influenced, current is transmitted through the conductive metal grid during plating, the current can be ensured while the cylinder is dragged, the plating effect is more uniform, and the yield of plated products is improved. Meanwhile, the conductive assembly is arranged on the movable plate, the movable plate is detachably arranged on the substrate, and in the using process of the conductive assembly in the long time after the use, if the metal layer covered on the surface of the conductive assembly is difficult to clean, the two movable plates can be directly detached from the substrate, and then the movable plate with the new conductive assembly is replaced, so that the whole plating accompanying plate is not required to be directly replaced, the plate can be continuously used on the premise that the conductive capability of the plating accompanying plate is normal, and the production cost can be greatly reduced.

Drawings

FIG. 1 is a first structural diagram of a plating assistant plate for improving electroplating uniformity according to the present invention;

FIG. 2 is a second schematic structural view of a plating assistant plate for improving electroplating uniformity according to the present invention;

FIG. 3 is a top view of a plating assistant plate for improving uniformity of plating according to the present invention;

FIG. 4 is a cross-sectional view taken along plane A-A of FIG. 3;

fig. 5 is a partial structural view of a portion a of fig. 4.

In the figure: 1. a substrate; 2. a movable plate; 3. a conductive metal plate; 4. a conductive metal grid; 5. a slot; 6. and (4) inserting the components.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Example 1

Referring to fig. 1-5, a plating accompanying plate for improving electroplating uniformity comprises a substrate 1, wherein the substrate 1 is made of epoxy resin, phenolic resin, polyimide resin or polytetrafluoroethylene. The upper surface and the lower surface of base plate 1 are laminated respectively and are provided with a fly leaf 2, fly leaf 2 all can dismantle the connection on base plate 1 through coupling mechanism, keep away from 1 side surface of base plate on fly leaf 2 and all be fixed with conductive component, conductive component includes conductive metal board 3, conductive metal net 4, fly the position of holding on fly 2 and be fixed with conductive metal board 3, the surplus on fly leaf 2 covers and is fixed with conductive metal net 4, conductive metal board 3 is in the same place with conductive metal net 4 fixed connection. The thickness of the conductive metal plate 3 and the conductive metal grid 4 is controlled to be 0.5-1 mm. The conductive metal plate 3 and the conductive metal grid 4 are made of copper. The conductive metal plate 3 and the conductive metal grid 4 may be directly formed by using a single thin copper plate, and then directly subjected to press forming by using a press machine, and then the press-formed conductive metal plate 3 and the conductive metal grid 4 connected together are fixed to the movable plate 2.

When the electric plating device is used, the grid-shaped conductive metal grid 4 is arranged in the conductive assembly, and the conductive metal plate 3 is arranged at the clamping position, so that the flying bar clamping position pair can not be influenced, current is transmitted through the conductive metal grid 4 during electroplating, the current can be ensured while the cylinder is dragged, the electroplating effect is more uniform, and the yield of the electroplated product is improved. Have conductive component to install on fly leaf 2 simultaneously, and fly leaf 2 demountable installation is on base plate 1, in the long-term use of back period, if the metal level of conductive component's surface covering is difficult to clear up, just can directly dismantle two fly leaves 2 from base plate 1, then change fly leaf 2 that has new conductive component, just so need not directly change whole plating plate of accompanying, just can keep on using under the normal prerequisite of the plate conductivity of accompanying in the assurance, can be very reduction in production cost.

Example 2

Referring to fig. 1 to 5, as another preferred embodiment of the present invention, the difference from embodiment 1 is that the connection mechanism includes slots 5 and inserts 6, two side edges of the upper surface and the lower surface of the substrate 1 are respectively provided with one slot 5, one insert 6 is inserted into each slot 5, and both inserts 6 are fixedly connected with the corresponding movable plate 2. The cross section of the slot 5 is L-shaped, the cross section of the corresponding plug-in unit 6 is L-shaped, the slot 5 can only be arranged in parallel to the length or width direction of the substrate 1, the length of the slot 5 is smaller than the length and width of the substrate 1, one end of the slot is arranged in an open mode, the other end of the slot is arranged in a closed mode, and therefore the two movable plates 2 can only slide towards a specific direction along the slot 5 and can only be separated from the substrate 1.

When the connecting mechanism is used, the movable plate 2 can be pushed away from the substrate 1 only by pushing the movable plate 2 towards one side, and then the movable plate 2 provided with a new conductive component can be replaced, so that the plate accompanying plating is more convenient to use.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. The utility model provides a promote board of accompanying and plating of electroplating homogeneity, includes base plate (1), its characterized in that, it is provided with one fly leaf (2) to laminate respectively on the upper surface and the lower surface of base plate (1), fly leaf (2) all can dismantle through coupling mechanism and connect on base plate (1), keep away from base plate (1) side surface on fly leaf (2) and all be fixed with conductive component, conductive component includes conductive metal plate (3), conductive metal net (4), fly a clamp position department on fly leaf (2) and be fixed with conductive metal plate (3), the surplus on fly leaf (2) covers and is fixed with conductive metal net (4), conductive metal plate (3) are in the same place with conductive metal net (4) fixed connection.

2. The plating assisting plate for improving the electroplating uniformity as claimed in claim 1, wherein the connecting mechanism comprises slots (5) and inserts (6), one slot (5) is respectively arranged on each of two side edges of the upper surface and the lower surface of the base plate (1), one insert (6) is inserted into each slot (5), and the two inserts (6) are fixedly connected with the corresponding movable plate (2).

3. The co-plating plate for improving the plating uniformity as recited in claim 1, wherein the thickness of the conductive metal plate (3) and the conductive metal grid (4) is controlled to be 0.5-1 mm.

4. The plating assisting plate for improving the electroplating uniformity as claimed in claim 1, wherein the material of the conductive metal plate (3) and the conductive metal grid (4) is copper.

5. The plating accompanying plate for improving electroplating uniformity as claimed in claim 1, wherein the material of the substrate (1) is epoxy resin, phenolic resin, polyimide resin or polytetrafluoroethylene.