JPS58105592A - Device and method of locally treating tab of printed circuit board or like - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION A printed circuit board is carried generally vertically along a path;
Dip the bottom tab into the electrolyte. A substrate is automatically transferred through a pair of rolls arranged in series facing each other. The roll pair drives the substrate along the path. As the substrate is transported along the path, Vlasov sweeps the substrate to prevent contact with the electrolyte above the desired touch level. The electrolyte solution is continuously replenished and made turbulent by feeding the solution, which has insoluble metal ions within it, by pumping the solution from a reservoir and along each individual passageway. Fresh electrolyte is pumped through a series of nozzles, creating turbulence in the electrolyte. Since a sufficiently low level of potential is applied to the nozzle, corrosion thereof can be prevented. Electrical contact with the printed circuit boards is made by sequentially engaging the boards as the boards are transported along the path 1 by means of successive conductor springs along each individual board.

This allows a charge to be applied to the submerged tab, which acts as a cathode to electrodeposit metal ions onto the tab. A pair of opposing rolls is used to drive the substrate. One roll of each pair of rolls is the drive roll, and the opposing roll acts as an idler roll, forming an interference fit between the rolls when carrying a substrate therebetween. An idler roll is disposed on the linkage and is adjustably positioned to accommodate substrates of different thicknesses. The electrical contacts at the top of the substrate can be similarly adjustable and positioned to accommodate substrates of different heights.

BACKGROUND OF THE INVENTION In the art of manufacturing printed circuit boards, it is known to plate the tabs of the board with various materials, especially gold, and generally a nickel plating is performed first before the gold strike plating, which improves the resistance. The purpose is to increase electrical conductivity and corrosion resistance at the contacts defined in the tabs. The problem encountered was in supplying a sufficient amount of electrolyte to the tab at a sufficient density while the tab remained in solution.

SUMMARY OF THE INVENTION The present invention provides good electrical contact with a printed circuit board;
The substrate is actively driven while the tab of the substrate is immersed along the path of the substrate, and an electrolyte is supplied near the tab by a supply nozzle arranged along the path of the tab, so that the nozzle acts as an electrode. It relates to the method and apparatus used.

The primary object of the present invention is to provide a new electroplating apparatus for electroplating tabs of printed circuit boards.

Another object of the present invention is to achieve the above objects by electroplating the tab by electrodepositing gold on the tab.

Another object of the invention is to implement the method achieved by the device described above.

Yet another object of the present invention is to provide M speed adjustment when driving substrates through the passageway, so that substrates of different thicknesses can be accommodated in the passageway.

Another object of the present invention is to make electrical contact with the printed circuit board at the top edge of the printed circuit board outside of contact with the electrolytic bath, but to make this contact adjustable so that boards of different heights can be accommodated. That's true.

Yet another object of the invention is to transport printed circuit boards through a passageway to a processing station.

Still another object of the present invention is to achieve the above object,
The purpose of the present invention is to properly guide the substrate when the substrate is transferred through the passage.

Another object of the present invention is to transport a substrate through an apparatus by means of opposing rolls so that the substrate is elastically sandwiched between the rolls as the substrate is transported along a path. It is to engage.

Other objects and advantages of the present invention will be readily apparent to those skilled in the art from reading the brief description of the drawings, the detailed description of the preferred embodiments, and the scope of the claims.

FIG. 1 is a vertical cross-sectional view taken along the line 1--[ of FIG. The tab i1 is cut off in FIG. 1, but this is because it is shortened in the longitudinal direction for convenience of drawing.

FIG. 2 is a cross-sectional view taken along the line ■--■ in FIG. 1, clearly showing the roll for driving the substrate, the nozzle, and the means for electrically contacting the substrate, together with these means.

Figure 3 is a plan view of most of the enlarged section of the line ■-■ in Figure 2, showing the drive device, which is a device that drives the substrate along a predetermined path, and shows that part as a cross section. 2 is an enlarged horizontal cross-sectional view of a portion of FIG.

FIG. 5 is a mostly horizontal cross-sectional view of the enlarged line ■-v line in the a-Z diagram of the present invention, and illustrates the state of the driving roll and idler roll that transport the substrate along the path, and the idler roll connection body is the idler roll assembly. FIG. 6 is an enlarged partial horizontal cross-sectional view through the substrate as the substrate is transferred through the electrolyte along the passageway, with a series of nozzles along each side of the passageway of the substrate; is shown as a cross section.

Figure 7 is an enlarged partial view similar to a portion of Figure 2;
Figure 5 illustrates another embodiment of driving a substrate tube through the apparatus.

FIG. 8 is a vertical cross-sectional view of FIG. 7 taken along line 7--7, more clearly showing the air reservoir means which applies a resilient opposing force to the drive roll. This figure is partially cut away to show the slideable idler roll.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the drawings. First, in FIG. 1, the tab plating device is indicated by the number 20 as a whole, and this device includes the left end and right end 4i 121 and 22, side walls 23 and 24.
, has a reservoir bottom 25 and an upper lid 26. The long vertical slot holes 27 and 28 are respectively 1122 and 2
1, and serve as an inlet and an outlet for the printed circuit board 30 when the apparatus 20 accommodates the printed circuit board 30. The substrate is then transported along a predetermined path 3 in the direction of flow shown by arrow 31 in FIG. 1, the path being explained later.

Electrolyte 32! ! '21 to 24 and the bottom of the reservoir 25
It is in a reservoir defined by.

The electrolyte is fed from the liquid reservoir 32 by a pump (not shown) in the liquid reservoir 32, and is supplied upward through all the supply pipes 33 and 34 located inside. , are connected to manifolds 35 and 36, respectively. A plurality of such tubes 33
or 34 delivers electrolyte to manifolds 35 and 36;

1 and 2 show an elongated array of nozzle connections 37 and 38 extending horizontally between the inlet 1122 and outlet walls, which connect the nozzles 40, respectively, to the lower end of the printed circuit board 30. is placed along the side of the passageway through which the electrolyte passes through the orifice 4 of the nozzle 40.
1 and hits both sides of the substrate 300.

The nozzle connections 37 and 38 are located in the bath 43 and below the liquid level 44 of the bath. And open by collar 47 46
Electrolyte is supplied under pressure through a suitable nipple 45 mounted in the zero seating position.

The collar 47 is threadedly engaged with a threaded member 48 and also threadedly engaged with an elbow 5o that connects with the manifold 35 or 36.

The electrolyte is passed from the reservoir 32 through the conduits 33 and 34, through the manifolds 35 and 36, through the elbow 50, through the threaded member 48, through the nipple 45, and into the nozzle connector 3.
7 and 38 and is fed through the orifice 41 of the nozzle 4°. On the other hand, the nozzle 44 has a bath water rate 44 in the bath area 43.
The electrolyte is supplied through the orifice 41 of the nozzle and thereby the bath region 43 is immersed in the electrolyte below.
turbulence in the acid solution to help uniformly distribute the insoluble ions contained in the acid solution throughout the bath region 43.

It should be noted that the flow rate of the electrolyte flowing into the bath region 43 is at a sufficiently high level to maintain the liquid level 44, and the overflow port 51 is connected to the wall of the gutter forming the bath region at a bath water rate of 44. 5
2 and 53 outside the gutter walls 52 and 53
The electrolyte can be returned to 2 and circulated. A return hole 55 for returning the electrolyte may be provided at the bottom of the trough 54, thereby facilitating the flow of electrolyte into the bath sump 32 and increasing the agitation caused by the flow of electrolyte in the bath region 43. I can do it.

It should also be noted that a plurality of lower guide rolls 57 are rotatably carried on a shaft 58, which is in a long groove 60 in a U-shaped rail member 61, and that the shaft is 112
The gutter 5 is connected by a vertical post 62 extending between 2 and 210.
It is supported from the bottom 56 of 4. The roll 57 acts as an idler roll and guides the lower edge of one printed circuit board 307 as it is transferred through the device 20 together with the upper inner portion of the upright feet 63.

Referring specifically to FIG. 1, it will be seen that there is a stripe 65 or masked portion that is spaced slightly upwardly from the bottom edge of each of the printed circuit boards. The mask 65 may be a bonded sheet, but
A substance such as paint may be applied across the conductive portion of the board in areas below which plating is desired, but above which plating is not desired. do. Mask region 65 therefore serves to restrict the passage of electrolyte to the area of substrate 30 below mask region 65 .

It should also be noted that the slit 41 in the ori 7 of the nozzle is positioned at a level for plating the tab portion 66 of the substrate 30 as it passes therethrough, as shown in FIG.

It should be noted that the longitudinally extending wiper 67 is mounted approximately at the level of the mask area 65 of the substrate 30. This wiper 67 is a brush consisting of a large number of filaments, and although it is stiff as a whole, when the printed circuit board is transferred, it flexibly engages one opposite side.As shown in FIG. or bath level 44
If there is any electrolytic solution that has splashed up in the vicinity of the mask area 65 above the mask area 65 or is in contact with the substrate 30 in the mask area 65, this is wiped off from the substrate 30.

Wiper 67 generally extends longitudinally between walls 21 and 220 and is carried by a suitable support 68. This is the second
As shown in the cross-sectional view of the figure. A support 68 is carried under the upper bath area covers 70 and 71 on opposite sides of the board passageway, and opposing roll pairs 72 and 73 are provided with inlet openings along the printed circuit board passageway. Provided between the hole 27 and the outlet opening 28, rolls 72 and 73 are on opposite sides of the passage, roll 73 being the idle roll at each moment of the trap and roll 72 being the driving roll at each moment. . There is a gap between the rolls 72 and 73, which is provided corresponding to a predetermined thickness of the printed circuit board 30, so that at each moment the printed circuit board 30 is placed between the rolls 72 and 73.
and 73, there is an interference fit with these rolls.

It is necessary to drive only one roll 72 or 73 of each roll pair at this moment. It should also be noted that the rotating surfaces of rolls 72 and 730 have a resilient, non-conductive coating material to provide better retention of the printed circuit board while it is being transported through the apparatus 20.

The idler roll 73 is carried in the mounting block 74 by a shaft 75 which extends between the legs 76 and 77 of the mounting block 74 and has a C-shaped cross-section. The block 74 has a plurality of slotted holes 77 through which the lower end of the connecting member 78 is threadedly engaged in the upper plate 70 at 80 to receive the connecting member 78 therethrough. As will be appreciated, the mounting member 4 can be adjusted in position to move away from or closer to the printed circuit board transfer path between the rolls, as desired, and the rolls 72 or 73 are simply By loosening screw member 78, the attachment can reposition member 74 further away from or closer to roll 72 as desired.

The drive roll 72 is fixed to a drive shirt 82,
Its lower end has a "t" bushing 83 attached to the upper member 71. When the shaft 82 is driven, it causes the drive roll 721 to actively rotate. In interlocking engagement, the shaft 86 is driven by a suitable motor 87.

Vertical support member 87 has bushing 88 and is attached at 4124'. This supports the upper end of the shaft 82, and also supports the umbrella wheel 84 and shaft support 90 attached to it,
Support 90 bears main drive shaft 86 .

The upper guide rail 92ti has an inverted U-shaped cross section of 1 kV, as shown in the cross-sectional view in FIG. The rail 92 extends between the inlet @ 22 and the outlet 1121 of the device and has dependent legs 93 and 94, which are connected by a web 95, as shown in FIG. A plurality of upper guide rolls 97 are provided at the upper end of the opening 96 of the rail 92, and the upper end 9 of the substrate 30
8 to guide the substrate as it is transported along the path of the apparatus.

Roll 97t! Shaft 100 as a type of play roll
The circuit board 30 is rotatably mounted on the rail 96 and the projecting shaft portion engages opposite legs 93 and 93 of the rail member 92.
A continuous long conductor 103t is provided on each side of the passageway, extending from wall 22 at one end of the device to wall 21 at the other end. These conductors 103 are connected to suitable lead wires 10.
4 through the guide member 92, electrically feeding the upper end of the printed circuit board 30 through a plurality of sequentially arranged pressure springs 105, which are not fully separated from the conductor 103. ing. Then, the inner 11 is fixed to the opposite a of the printed circuit board 30.
0, and when the board passes therethrough, the presser spring 105 biasly engages the opposite side of the board.
The spring 105 resiliently engages the substrate 30 and makes an electrical connection along the top edge of the substrate and its conductive portion. The conductive part at the top of the board should be determined in 1. when designing the entire board. It is conveniently connected to a tab 66 at the lower end of the substrate.

In order to accommodate printed circuit boards 30 of different sizes, the V-rail 92 has a guide roll 97i inserted therein, into which a long conductor 103 is inserted. And the positioning can be adjusted to various heights. For this purpose, the east-west member 92 is provided with a plurality of tapped holes 108 along its length into which a plurality of threaded connections 110' are received for threaded engagement. The screw coupling 110 can be slid into position by a vertical slot Ill in the rail support 112, and can be slid into position in the upper wall 26 of the rail support 112rIi.
carried by. The number of rail supports 112 is sufficient to support the length K of the rail.

As will be apparent, the means for providing electrical connections to the top of the printed circuit board and the means for guiding the top of the printed circuit board can all be vertically positioned and adjusted without interfering with the drive of the drive rows 72. I can do it.

Another embodiment for driving the substrate 30 will be described with particular reference to FIG. In this embodiment, opposing drive rolls 151 and 152 engage the substrate 30 and the substrate is sequentially transferred therebetween. This corresponds to rolls 72 and 7 mentioned above.
This is done in the same way as 3.

However, in this case, roll 152 is pressed resiliently against substrate 30, and rolls 151 and 152 sandwich substrate 30 between them. Each roll 151 has a shaft extension 153 carried within a bushing 154.
The bushing 154 is attached to the lower end of the plate 1.
56 with a blind hole 155. For downward installation, use plate 15
6 is a horizontal frame member 15 using a suitable bolt 158 or the like.
It is carried on top of 7. Horizontal plate 157 is at a similar level to horizontal plate 70 in the embodiment of FIG. 2 above. Although not shown in FIG. 7, the relationship of liquid levels, nozzles, etc. to plate 157 is similar to that of plate 70 in the previously described embodiment. A spacer plate 160 is mounted on a support plate 156 which carries an upper support plate 161 which has a 151 ft linear array of rolls mounted on one side of a vertical substrate receiving hole 162. Place it along. Shaft portion 163 at the upper end of roll 151
is bush attached to upper support plate 161 at 164, and plate 161 is attached to spacer plate 160 by suitable fasteners 165. The umbrella wheel 166U is attached to the upper end of the roll shaft above the shaft portion 163.

As can be seen, each roll 151 lying to the left of the receiving hole 162 is similar to that shown in Figure 7, with a drive umbrella wheel 167 carried on a drive shaft 168 driving each roll; It rotates with this. driving shirt)
Although 168 is shown as having a circular cross section, it may have a rectangular or other cross section if desired.

At the far right end in FIG.
7, the plate 170 carries a play bracket support plate 171 above the plate by suitable fasteners 172. A plurality of recessed slideways 173 are provided in the support plate 171, and one slidable idler roll mounting A174 is slidably attached to each slideway, so that the slideways 173 can be moved leftward or rightward in FIG. , or upward or downward relative to the paper in FIG. The mounting fixture 174 is provided with upper and lower holes 175 and 176 for correspondingly receiving the upper and lower ends of the shaft portions carried by the corresponding idler rolls 153, as shown in the figure. At the right end it carries a spacer member 177 thereon, plate 171 carries an upper plate 18B fixed by a pole 190, plate 188 is mounted in a position such that it forms an upper sliding surface 191 with respect to the upper surface 192 of fixture 174. form. Plates 171 and 188 thus surround the slidable mounting section 174 from above and below, and the slideways 173 allow the sliding mounting section to slide upwardly or downwardly in the plane of the paper in FIG.

The longitudinal bladder member 193, which in its free state has a generally rectangular cylindrical cross-section, typically receives compressed air supplied from a suitable gas source and generally runs along the length of the device from the inlet end of the device. To the exit end, a plurality of attachments extend behind section 174 such that the attachments continuously apply a resilient force against section 174;
The attachment forces the idle roll 152 carried by the portion 174 to always engage towards the drive roll 151, and the substrate 30 springs between rolls 151 and 152 as it moves between them. An appropriate compressed air supply source is prepared to supply compressed air to the air reservoir 193. It should be noted that in FIG. 7, the air reservoir 193 is shown somewhat flattened, and the attachment indicates that the air reservoir is compressed by the presence of the section 174. Also, it should be noted that the mounting portion 174 carries the idler wheel 152, but the mounting portion 174 carries the idler wheel 152,
0 can move regardless as it progresses through the device.

As will also be seen, wipers 149 and 179 are provided similarly to wiper 67 and suitably carried by platens 159 and 169 at the lower ends of plates 157 and 170, facing each other across receiving hole 162. Suitable supporting elements beneath the substrate, such as rolls such as 57 shown in FIG. 2, are not specifically indicated in FIG. 7, but may be provided. Similarly, suitable members for supporting the upper part of the substrate 30 may be provided, similar to or different from the vertically articulably repositionable roll guide shown at the top of FIG. Although not shown in Figure 7, the operating elements of the Shinkin Bank shown in Figure 2 are shown in Figure 7.
Similar arrangements may be made to the extent consistent with the specific embodiments illustrated.

Suitable conductors 195 and 196 are typically threaded fixtures 197
and 198. These conductors 195 and 196 are long continuous conductors, one on each side of the passageway of the substrate 30, and the attachment traverses the mating length of the plates 161 and 188, respectively. conductors 195 and 196
are electrically connected by suitable leads 200 to conduct electricity to the top of the printed circuit board 30. It connects through a plurality of parallel downwardly extending pressure springs 201 and 202, which are partially separated from conductors 195 and 196 by vertical slits.

Pressure springs 201 and 202 extend inwardly toward the passageway of substrate 300 sandwiched between them. Press it 201
and 202 are biased into engagement with opposite sides of the substrate being transferred therebetween and spring-engaged with the substrate 30 to provide electrical connection with the top of the substrate above the liquid level in the apparatus.

The liquid level is not shown, but is below the lower surfaces of plates 157 and 170 in FIG. As in the embodiments described above, the printed circuit board is designed to conveniently connect with tabs not shown at the bottom edge of the board in the rough version of FIG. , similar to the previous embodiment, the lower end or tab of the substrate 30 is immersed below the bath level in a bath of electrolyte, with nozzle-type electrodes formed as connections along each side of the passageway of the tab in the substrate. As in the previous embodiment, means are provided for immersing the electrode in an electrolyte and for generating an electric potential between the electrodes.

This device can consist of a plurality of modules connected end-to-end with each other based on the principles and connection means of U.S. Pat. No. 4,015,706. For this purpose, the modules are provided with dowel pins 120, and the pins 120 are then inserted into the mating holes 121 of the modules to be connected to align the modules with each other. Also, a mounting having a tapped hole 123 therein is used for block 1221, and along each side the mounting is connected to the adjacent end of the next adjacent module by a threaded member of the module having block 122''Ik. The drive rod 86 extends substantially through the hole 124 of the module adjacent to the tap hole 123 to engage the tapped hole 123, thus providing a means for aligning and connecting the modules. It may also be extended and configured as a single drive rod between @22 and wall 21. The end of the drive rod may be of the Bragg type similar to the disclosure of U.S. Pat. No. 4,015,706. They can be connected by a connecting member.

A filter may be provided within the electrolyte in reservoir 32. This filter is covered by U.S. Patent No. 3,776.8.
Similar to the disclosure of No. 00, it can be movably provided in the reservoir. As is clear from the above description, the board 30
Its conductor portion acts as an electrode with a tab portion 66 to be electroplated. These tabs 66 generally constitute cathodes.

The anode is preferably a nozzle 40 and preferably a complete nozzle combination 37 and 38. Connection members 45 and 47 are electrically connected to a suitable power source by means of connectors 49. As is clear from history, AC power is generally used and converted to a suitable power source by a rectifier (not shown).

As history has shown, the foregoing disclosure essentially teaches that the tab 66 of a printed circuit board is in the form of non-bathable gold ions in an electrolyte.
Although it is described in principle as part of the electroplating process for electroplating gold on gold, this device [22] I can do it. A non-electrolytic solution, such as a degreasing solution, can be used in the apparatus 20 after which the printed circuit board can be transferred to the next adjacent module. It is also possible to perform nickel plating according to electroplating technology, followed by gold plating,
Appropriate rinsing and air drying operations can then be performed. These are the steps necessary to carry out the entire process.

It will also be appreciated that any suitable material may be used at the top end for electrical connection to the circuit board.

For example, the guides forming the rails 92 can be constructed from polypropylene if desired. This also applies to the guide member 61 forming the lower guide rail.

It will also be clear that various other modifications may be made to the apparatus of the invention. For example, baffles can be used in bath 43 to achieve the desired flow conditions. Furthermore, apart from the device actually acting as an electrode, the various elements of this device, in particular those in the bath and those in the immediate vicinity of the bath, may be constructed of or coated with electrically non-conductive materials. . As will be further appreciated, although the method relates to electroplating gold on the tabs of a board, the apparatus and techniques disclosed herein may also be used to electroplate portions of a printed circuit board with other metals or such. It can also be used to electroplate other metals on other parts to be electroplated, provided the parts have the necessary structural features for use in the second aspect of the invention. Accordingly, various changes may be made in the calling side of the structure, as well as in its use and operation, while remaining within the spirit of the invention, as defined in the appended claims.

[Brief explanation of the drawing]

1 is a longitudinal sectional view taken along the line ■-■ in FIG. 2, showing the device of the present invention; FIG.
■A cross-sectional view taken along the horizontal line, Figure 3 is an enlarged partial plan view of the line T1 in Figure 2 showing the drive mechanism, and Figure 4 is an enlarged view of the PI/-P/ line in Figure 2 showing the pressing spring. 5 is a horizontal cross-sectional view of the dog part, and FIG. 5 shows the drive and play rolls;
FIG. 6 is a horizontal cross-sectional view of most of the enlarged part on the v line, FIG. 6 is a vertical cross-sectional view of the enlarged part on the VS-Vi line of FIG. 2, showing the nozzle connection body, and FIG. It is a front view,
FIG. 8 is a cross-sectional view taken along the vertical line ``--'' in FIG. 7. 20... Electroplating device, 30... Circuit board, 32
...Liquid reservoir, 37.38...Nozzle connection body, 40.
...Nozzle, 41... Orifice, 43... Electrolyte bath, 44... Level of electrolyte bath, 57.97... Roll, 66... Tab, 67... Wiper means, 72・・・
- Drive roll, 73...Idle roll, 92...Upper guide rail, 103...Long conductor, 105...Press spring, 193...Air reservoir. Patent Applicant: Chemcut Cooperation Patent Application Agent Patent Attorney: Akira Aomizu, Patent Attorney Kazuyuki Nishidate, Patent Attorney Tera 1) Yutaka Patent Attorney, Akiyuki Yamaguchi

Claims (1)

[Scope of Claims] 1. An apparatus for locally electroplating a tab of a printed circuit board, etc., comprising: means for defining a bath area of an electrolyte; Make circuit boards popular! means for transporting the substrate such that the tabs at the lower end of the substrate are moved through the bath region, and sufficient electrolyte to maintain the bath depth at a predetermined desired level. means for supplying a flow of water to the bath region, and arranged above said predetermined nine levels to the printed circuit board above said arrangement position! A wiper means for wiping off the electrolyte that comes in contact with the electrolyte and for transporting the printed circuit board through the solution automatically and sequentially engages the portion of the board that is outside the solution and continuously connects it to the electrical contact. a nozzle connection included in said separating means for supplying an electrolyte at a position along the substrate path; Apparatus for processing tabs, such as printed circuit boards, comprising means for connecting and dipping the nozzle to act as a large electrode, and means for generating an electrical potential between these electrodes. 2. The device according to claim 1, wherein the nozzle, which does not dissolve in the electrolytic solution, is applied to a sufficiently low potential to serve as an anode so as to reduce corrosion of the nozzle by 1. 2. The apparatus of claim 1, wherein the λ nozzle and wiper means are arranged along opposite sides of the substrate path. 4. The device of claim 1, wherein the wiper means is made of non-conductive black. 5. The apparatus of claim 5, wherein the transfer means is attached to each of the substrate passageways outside the bath region. 6. Opposing rolls of each pair of rolls have resilient surfaces that engage the substrate and are mounted to rotate relative to each other into an interference fit with the substrate when the substrate is received between the rolls. An apparatus according to claim 5. 7. Each roll pair t-1t, one roll 2>Ekl[1
1: In the L-roll, the other roll is an idler roll, and the idler rolls are rotatably mounted on a common frame, and the frame is laterally moved from the substrate path to accommodate substrates of different thicknesses. 6. A device as claimed in claim 5, having adjustable positioning means for moving it away from and towards it. & Apparatus according to claim 1, wherein the means for electrically contacting the substrate extends in the direction of the substrate path. 9. The device according to claim 1, further comprising means for positioning the means for electrically contacting the upper end of the substrate so as to be able to move vertically in order to accommodate substrates of different heights. 10. A rail capable of vertically adjustable positioning, having means for electrically contacting the substrate and vertically adjustable means for accommodating substrates of different heights. 9. A device as claimed in claim 8, in which a continuous long conductor is carried. 11. The apparatus of claim 1, further comprising an upper guide roll for guiding the upper end of the substrate as it is transferred along the substrate path. 12. The apparatus of claim 1, further comprising a lower guide roll for guiding the lower end of the substrate as it is transported along the substrate path. lλ When transferring the substrate along the substrate path. 2. The device of claim 1, further comprising an upper guide roll for guiding the upper end of the substrate, said roll being disposed in said rail above said conductor. 14 The four-inviting means includes an overflow means for discharging the electrolyte from the bath region above a predetermined desired level, a reservoir means for collecting the electrolyte thus discharged, and an electrolytic solution from the reservoir means to the nozzle. 2. The device according to claim 1, further comprising a single stage pump Ef for feeding the liquid. (5) Nozzles and wiper means are disposed along both sides of the path of movement of the substrate, the wiper means is made of brushwood, a non-conductive material, and the transfer means is mounted on a bathtub and holds the substrate between the rolls. and the opposing rolls of each pair of rolls have resilient surfaces that engage the substrate and rotate relative to each other to form an interference fit with the substrate when the substrate is received between the rolls. mounted, each pair of rolls having one roll as a drive roll and the other roll as an idler roll, the plurality of idler rolls being rotatably mounted on a common frame;
The frame has adjustable positioning means for laterally moving the frame away from or closer to the substrate passageway to accommodate substrates of different thicknesses, and means for electrically contacting the substrates are provided at each corner of the upper end of the substrate passageway. a continuous length of conductor carried by a support means, each conductor having a plurality of electrically conductive compression springs carried in turn by a support means, and each conductor having a portion of the substrate for electrical engagement with the substrate; means for vertically positioning a hand R extending laterally in the path of the board and in electrical contact with the board for accommodating boards of different heights; has an upper guide roll for guiding the upper end of the substrate when transferring the substrate, a lower guide roll for guiding the lower end of the substrate when transferring the substrate along the substrate path; overflow means for draining the electrolyte from the bath region above a predetermined desired level;
An apparatus according to claim 2, comprising a reservoir means for collecting the electrolyte thus discharged, and a pump means for delivering the electrolyte from the reservoir means to the nozzle. A method of locally electroplating tabs at the bottom edge of a printed circuit board, comprising: providing a bath area of an electrolyte solution, and positioning a printed circuit board generally vertically along a predetermined generally vertical path; and supplying a sufficient flow of electrolyte to the bath region to maintain the bath depth at a predetermined desired level, and positioned at a level just above the bath depth to provide a printed circuit. A printed circuit that sweeps the electrolyte that comes into contact with the substrate as it moves along the path, connects the nozzle with electrical components, causes the nozzle to act as an immersed electrode, and generates an electrical potential between these electrodes. How to treat tabs such as substrates. □ 17. The method according to claim 16, comprising the step of guiding the board tube along the upper and lower ends of the printed circuit board when the printed circuit board is transported along the path. 18.K for driving the printed circuit board along the path
17. The method of claim 16, further comprising the steps of successively interference-fittingly engaging the substrates with the rolls. 19. An apparatus for locally processing a tab of a printed circuit board, etc., comprising means for defining a processing area, and a general Kf! A means for transporting a generally orthogonally disposed lower edge tab of a printed circuit board along a straight path, the means having a plurality of opposing roll pairs along the path outside the processing area; one roll is mounted in each of the passageways, the rolls engaging the substrate between the rolls, the opposing rolls of each pair of rolls having resilient surfaces for engaging the substrate and rotating relative to each other; localizing a tab, such as a printed circuit board, having a transfer means mounted for a tight fit with the board when the board is received between the rolls, and means for supplying a processing fluid to the board within the processing region; A device that processes I, each roll pair C, one roll car drive 1: I-roll,
The other roll is an idler roll, and the idler rolls are mounted for rotation within a common frame and moved laterally away from and closer to the passageway to accommodate thicker substrates. 20. The device of claim 19, further comprising means for adjusting the position of the device. 21. Apparatus for locally electroplating tabs, such as printed circuit boards, comprising means for defining a bath area of an electrolyte, and generally direct plating of the printed circuit board along a predetermined generally perpendicular path. means for locating and transporting the tab at the bottom edge of the substrate; means for providing a flow of electrolyte sufficient to the bath region to maintain the bath depth at a predetermined desired level; and a printed circuit board. t- means for automatically and sequentially engaging and continuously electrically contacting the top edge of the substrate outside the solution as it is transported through the solution, causing the tabs of the immersed substrate to act as electrodes; the substrate transfer means having a plurality of opposing roll pairs along said passageway outside the bath region, one roll of each roll pair being attached to each of the passageways with the substrate therebetween; The rolls of each pair of rolls are biased toward each other and elastically engaged, and the substrate Q-tab is sandwiched between them and elastically engaged. A device for locally electroplating. Each pair of rolls slides separately such that one roll is a drive roll and the other four rolls are idler rolls, and the idler roll can move toward or away from its mating drive roll. 5. The device according to claim 4, wherein the device is optionally deposited. The apparatus according to claim #E22, wherein an air reservoir means for pressing the idler roll toward the drive roll is arranged with respect to the idler roll. A slidable idler roll support is provided, each associated idler roll is attached thereto, and stationary means are provided, and an air retaining means is provided between the slidable support and the stationary means;
A device according to claim 1, comprising a single elongated bladder extending substantially along the length of the device. 6. Place a wiper (hand mt) above a predetermined electrolyte level and wipe the electrolyte in contact with the printed circuit board above the level of the wiper means, so that the electrolyte supply means is aligned along the path of the board. It consists of a nozzle assembly for supplying electrolyte with a means for electrically connecting with this nozzle, so that the nozzle acts with the immersed electrode and generates a potential between the electrodes. The device according to claim 1, wherein the means for electrically contacting the substrate comprises a continuous elongated conductor means carried in each of the passages of the substrate, A device according to claim 1, wherein the spring carries the conductor means in turn and extends between the passages of the substrate and into electrical engagement with the substrate. A method of locally electroplating, wherein a bath area of an electrolyte is provided, a generally vertically oriented printed circuit board is passed along a predetermined, generally straight path through the electrolytic bath, and the tabs are passed through the bath. providing a flow of electrolyte sufficient to transport the electrolyte and maintain the electrolyte depth at a predetermined predetermined level; and automatically and sequentially adjusting the bath level as the substrate is transferred through the electrolytic bath. externally to a portion of the substrate in electrical contact with the substrate, thereby causing the tabs of the substrate to act as electrodes in the electrolytic bath;
In the transfer step, the substrates are sequentially engaged between pairs of opposing rolls, and continuous elasticity is applied to the idler rolls of the pair of rollers, where one roll is a drive roll and the other roll is a slidable idler roll. A method of localized plating of tabs, such as printed circuit boards, by applying force and pushing them against a mating drive roll.