CN210117448U - Floating frame for plating copper uniformly on plate surface of vertical continuous plating bath - Google Patents
Floating frame for plating copper uniformly on plate surface of vertical continuous plating bath Download PDFInfo
- Publication number
- CN210117448U CN210117448U CN201920817737.0U CN201920817737U CN210117448U CN 210117448 U CN210117448 U CN 210117448U CN 201920817737 U CN201920817737 U CN 201920817737U CN 210117448 U CN210117448 U CN 210117448U
- Authority
- CN
- China
- Prior art keywords
- side plate
- bottom plate
- supporting seat
- strip supporting
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000007747 plating Methods 0.000 title claims abstract description 29
- 238000007667 floating Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 16
- 239000010949 copper Substances 0.000 title claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to a floating frame for the copper plating uniformity of a vertical continuous plating bath surface, which comprises a left end headstock, a right end headstock, a front side plate, a rear side plate, a bottom plate strip and a bottom plate strip supporting seat; the plane of the front side plate and the plane of the rear side plate are arranged in parallel, a left end headstock and a right end headstock are fixed at the left end part and the right end part of the front side plate and the rear side plate, a bottom plate strip supporting seat is fixed between the front side plate and the rear side plate, the upper end part of the bottom plate strip supporting seat protrudes out of the upper surfaces of the front side plate and the rear side plate, the bottom plate strip supporting seat is provided with a V-shaped opening, a bottom plate strip is fixed on the bottom plate strip supporting seat below the V-shaped opening, and the front side plate and the rear side plate are provided with a front overflow hole and a rear overflow; the V-shaped pressing strip is buckled at the upper end part of the bottom plate strip supporting seat and clings to a V-shaped opening of the bottom plate strip supporting seat. The utility model discloses avoided board direct contact bottom plate strip supporting seat, prevented the wearing and tearing of bottom plate strip supporting seat, greatly reduced use cost, improved the life of whole floating frame device.
Description
Technical Field
The utility model relates to a perpendicular floating frame of plating bath face copper facing homogeneity in succession, the utility model belongs to the technical field of printed circuit board apparatus for producing.
Background
With the trend of light, thin, integrated and multifunctional consumer electronics, the requirements for the manufacturing process of the printed circuit board are higher and higher. In line with this trend, PCB fabrication is moving toward HDI boards with features of fine lines, small apertures, thin panels, etc., and electroplating is known to be an integral part of the PCB fabrication process, wherein a vertically continuous electroplating is a relatively stable, high-yield, high-quality device in the electroplating process. The main auxiliary modes of the traditional vertical continuous electroplating for thickening the copper surface of the PCB comprise circular filtration, eccentric 45-degree swing, high-frequency vibration, air blowing, air inflation, stirring, a rectifying mechanism, a floating frame and the like.
The gantry crane belongs to vertical continuous electroplating, PCB electroplating is rack plating, but only one end of the clamp (anode) close to a flying target end is fixed, a circulating stirring device for aerating and the like is designed in a copper plating tank and a tin plating tank in an electroplating tank, and the lower end of a board surface can deviate from the center due to the impact of liquid accelerated flowing of the electroplating tank liquid on the PCB under the circulating and aerating effects, so that serious consequences such as uneven copper plating, insufficient hole filling and the like are generated on the PCB.
In order to avoid the bad electroplating condition from affecting the post-processing process of the PCB, the floating frame is generated.
The floating frame is fixed on two sides of the wall of the tank by guide rods in the copper plating tank and moves up and down along with the lifting and falling of the PCB, so that the PCB only moves up and down at the central position of the plating tank without deviating or even contacting with an anode, however, the traditional floating frame basically belongs to a V-shaped undetachable style, and the defects of difficult deformation, bending and lifting for a long time, serious deviation from the controllable range of a floating bed and the like under the fluctuation of a swinging mechanism of the copper plating tank cause irreversible troubles to the quality, the safety and the cost of the PCB, and the manufacturing process of the high-end PCB is difficult to meet without adding any improvement technology.
Disclosure of Invention
The utility model aims at overcoming the deficiencies in the prior art and providing a floating frame which can avoid the direct contact of a PCB plate with a bottom plate strip supporting seat and improve the copper plating uniformity of a vertical continuous plating bath surface and has long service life.
According to the technical scheme provided by the utility model, the floating frame for plating copper uniformly on the surface of the vertical continuous plating bath comprises a left end headstock, a right end headstock, a front side plate, a rear side plate, a bottom plate strip and a bottom plate strip supporting seat; the plane of the front side plate and the plane of the rear side plate are arranged in parallel, a left end headstock is fixed at the left end parts of the front side plate and the rear side plate, a right end headstock is fixed at the right end parts of the front side plate and the rear side plate, a bottom plate strip supporting seat is fixed between the front side plate and the rear side plate, the upper end part of the bottom plate strip supporting seat protrudes out of the upper surfaces of the front side plate and the rear side plate, the bottom plate strip supporting seat is provided with a V-shaped opening, a bottom plate strip is fixed on the bottom plate strip supporting seat below the V-shaped opening, a front overflow hole is formed in the front side plate, and a rear overflow hole is formed in the rear side plate; the V-shaped pressing strip is buckled at the upper end part of the bottom plate strip supporting seat and clings to a V-shaped opening of the bottom plate strip supporting seat.
The front overflow holes are provided with three rows or more than three rows, and the front overflow holes of two adjacent rows are arranged in a staggered manner. The back overflow holes are provided with three rows or more than three rows, and the two adjacent rows of back overflow holes are arranged in a staggered manner.
And a reinforcing rod is fixed between the front side plate and the rear side plate and is arranged between two adjacent bottom plate strip supporting seats.
The utility model discloses avoided PCB plate direct contact bottom plate strip supporting seat, prevented the wearing and tearing of bottom plate strip supporting seat, greatly reduced use cost, improved the life of whole floating frame device.
Drawings
Fig. 1 is a front view of the present invention.
Fig. 2 is a rear view of the present invention.
Fig. 3 is a plan view of the present invention.
Fig. 4 is an enlarged view of a portion a in fig. 1.
Fig. 5 is an enlarged view of a portion B in fig. 2.
Detailed Description
The present invention will be further described with reference to the following specific embodiments.
The utility model discloses a floating frame for the uniformity of plating copper on the surface of a vertical continuous plating bath, which comprises a left end headstock 1, a right end headstock 2, a front edge plate 3, a rear edge plate 4, bottom plate strips 5 and a bottom plate strip supporting seat 6; the plane of the front side plate 3 and the plane of the rear side plate 4 are arranged in parallel, a left end headstock 1 is fixed at the left end parts of the front side plate 3 and the rear side plate 4, a right end headstock 2 is fixed at the right end parts of the front side plate 3 and the rear side plate 4, a bottom plate strip supporting seat 6 is fixed between the front side plate 3 and the rear side plate 4, the upper end part of the bottom plate strip supporting seat 6 protrudes out of the upper surfaces of the front side plate 3 and the rear side plate 4, the bottom plate strip supporting seat 6 is provided with a V-shaped opening, a bottom plate strip 5 is fixed on the bottom plate strip supporting seat 6 below the V-shaped opening, a front overflow hole 31 is formed in the front side plate 3, and a rear overflow hole 41 is formed in the rear side plate 4; still include V-arrangement suppression strip 7, V-arrangement suppression strip 7 is detained at the upper end of bottom plate strip supporting seat 6, and V-arrangement suppression strip 7 is detachable connection with bottom plate strip supporting seat 6, and V-arrangement suppression strip 7 hugs closely the V-arrangement mouth of bottom plate strip supporting seat 6.
The front overflow holes 31 are provided with three rows or more than three rows, and the front overflow holes 31 in two adjacent rows are arranged in a staggered manner.
The rear overflow holes 41 are provided with three rows or more than three rows, and two adjacent rows of rear overflow holes 41 are arranged in a staggered manner.
And a reinforcing rod 8 is fixed between the front side plate 3 and the rear side plate 4, and the reinforcing rod 8 is arranged between two adjacent bottom plate strip supporting seats 6.
In the utility model, the V-shaped pressing strips 7 are additionally arranged, so that the PCB can be prevented from directly contacting the bottom plate strip supporting seat 6 during electroplating, the bottom plate strip supporting seat 6 is prevented from being worn, and the service life of the whole floating frame device is prolonged; after the V-shaped pressing strip 7 is worn and cannot be used, a new V-shaped pressing strip 7 is directly replaced, the replacement operation is very convenient, and the use cost is greatly reduced.
The utility model discloses in, preceding overflow hole 31 has three rows or the effect more than three rows with back overflow hole 41 and has improved the exchange rate of plating solution, shortens the electroplating time, has improved the homogeneity of electroplating layer on the PCB plate.
The utility model discloses in, install the effect of reinforcement pole 8 additional and be the intensity that can improve whole device, avoid the too early deformation of whole device, improved the life of whole floating frame device.
Claims (4)
1. A floating frame for plating copper uniformly on a plate surface of a vertical continuous plating bath comprises a left end headstock (1), a right end headstock (2), a front edge plate (3), a rear edge plate (4), bottom plate strips (5) and a bottom plate strip supporting seat (6); the plane of the front side plate (3) and the plane of the rear side plate (4) are arranged in parallel, a left end headstock (1) is fixed at the left end parts of the front side plate (3) and the rear side plate (4), a right end headstock (2) is fixed at the right end parts of the front side plate (3) and the rear side plate (4), a bottom plate strip supporting seat (6) is fixed between the front side plate (3) and the rear side plate (4), the upper end part of the bottom plate strip supporting seat (6) protrudes out of the upper surfaces of the front side plate (3) and the rear side plate (4), the bottom plate strip supporting seat (6) is provided with a V-shaped opening, a bottom plate strip (5) is fixed on the bottom plate strip supporting seat (6) below the V-shaped opening, a front overflow hole (31) is formed in the front side plate (3), and a rear overflow hole (41) is formed in the rear side plate (4); the method is characterized in that: the pressing device is characterized by further comprising a V-shaped pressing strip (7), wherein the V-shaped pressing strip (7) is buckled at the upper end part of the bottom plate strip supporting seat (6), and the V-shaped pressing strip (7) is tightly attached to a V-shaped opening of the bottom plate strip supporting seat (6).
2. The floating frame for the uniformity of plating copper on the plate surface of the vertical continuous plating bath according to claim 1, which is characterized in that: the front overflow holes (31) are provided with three rows or more than three rows, and the front overflow holes (31) in two adjacent rows are arranged in a staggered manner.
3. The floating frame for the uniformity of plating copper on the plate surface of the vertical continuous plating bath according to claim 1, which is characterized in that: the rear overflow holes (41) are provided with three rows or more than three rows, and the two adjacent rows of rear overflow holes (41) are arranged in a staggered manner.
4. The floating frame for the uniformity of plating copper on the plate surface of the vertical continuous plating bath according to claim 1, which is characterized in that: be fixed with stiffening rod (8) between preceding sideboard (3) and back sideboard (4), stiffening rod (8) set up between two adjacent bottom plate strip supporting seats (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920817737.0U CN210117448U (en) | 2019-05-31 | 2019-05-31 | Floating frame for plating copper uniformly on plate surface of vertical continuous plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920817737.0U CN210117448U (en) | 2019-05-31 | 2019-05-31 | Floating frame for plating copper uniformly on plate surface of vertical continuous plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210117448U true CN210117448U (en) | 2020-02-28 |
Family
ID=69616633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920817737.0U Expired - Fee Related CN210117448U (en) | 2019-05-31 | 2019-05-31 | Floating frame for plating copper uniformly on plate surface of vertical continuous plating bath |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210117448U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110029392A (en) * | 2019-05-31 | 2019-07-19 | 高德（无锡）电子有限公司 | The scaffold of vertical continuous electroplating bath plate face copper facing uniformity |
-
2019
- 2019-05-31 CN CN201920817737.0U patent/CN210117448U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110029392A (en) * | 2019-05-31 | 2019-07-19 | 高德（无锡）电子有限公司 | The scaffold of vertical continuous electroplating bath plate face copper facing uniformity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200228 |