JPS6146559B2 - - Google Patents
Info
- Publication number
- JPS6146559B2 JPS6146559B2 JP14219080A JP14219080A JPS6146559B2 JP S6146559 B2 JPS6146559 B2 JP S6146559B2 JP 14219080 A JP14219080 A JP 14219080A JP 14219080 A JP14219080 A JP 14219080A JP S6146559 B2 JPS6146559 B2 JP S6146559B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- electroplating
- anode
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 74
- 239000007788 liquid Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims 1
- 238000003756 stirring Methods 0.000 description 20
- 238000013019 agitation Methods 0.000 description 13
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 5
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 210000003746 feather Anatomy 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 210000005252 bulbus oculi Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本発明は高速電気めつき方法に関し、特にプリ
ント基板のスルーホールめつきに好適に採用され
るめつき方法に関する。
従来より、電気めつき、特にプリント基板のス
ルーホールめつきの生産性を向上させるため、め
つき時間の短縮が望まれている。めつき時間を短
縮するには電流密度を高めることが必要である
が、高電流密度でめつきを行うにはプリント基板
表面のめつき液の撹拌を高めることが重要であ
る。しかもこの場合、正常なめつき膜を得るため
には、液撹拌を単に高めるだけではなく、均一な
液撹拌を与えることが必要で、撹拌が不均一であ
ると、スルーホールの付近が無めつきもしくは薄
いめつき状態となる段地めつき（スキツププレー
テイング）が生じ、いわゆる“目玉”或いは
“涙”現象が生じるなど、プリント基板表面のめ
つきがムラになる。
従来、プリント基板表面のめつき液の撹拌を高
める方法としては、ポンプによりめつき液をプリ
ント基板表面に吹付ける方法や、めつき液を流動
させる方法が提唱されているが、いずれの場合も
めつき槽の広さ、深さの影響で液の撹拌状態が異
なり、プリント基板表面の液撹拌を均一にするこ
とが困難である。このため、液撹拌の不均一によ
つてプリント基板表面のめつき状態にムラを生
じ、まためつき液がプリント基板表面を同一方向
に流動することによりスルーホール周辺が歪なめ
つきになる等の問題を有する。
本発明は上記事情を改善したもので、プリント
基板等の板状被めつき物表面の液撹拌が不均一に
なつたりめつき液が同一方向に流動することなく
液の撹拌を高めることができ、これにより高速め
つき、特に高電流密度でのプリント基板のスルー
ホールめつきを可能としためつき方法を提供する
ことを目的とする。
以下、本発明の一実施例につき図面を参照して
説明する。
第１図は本発明方法の実施に使用する装置の一
例を示すもので、第１図において、１はピロリン
酸銅めつき液等のめつき液２を収容するめつき槽
であり、３，３はそれぞれ陽極ブスバー４，４に
吊持された陽極板、５は陰極ブスバー６にハンガ
ー７を介して吊持された板状の被めつき物（例え
ばプリント基板）であつて、陽極ブスバー４，４
と陰極ブスバー６との間に所定電圧を印加するこ
とにより、陽極３，３と被めつき物５との間に所
定電流密度において電流が流れるようになつてい
る。なお、図示していないが、めつき槽１には所
望により必要な装置、例えばめつき液加熱装置、
めつき液過装置等が付帯される。
８は、振動撹拌部材で、この撹拌部材８は、第
２図に詳しく示したように、２個の枠状羽根板支
持体９，９にそれぞれ水平方向に沿つて複数枚の
羽根板１０を取り付け、かつ上記両支持体９，９
の上端部を連結板１１にて連結された構成を有
し、第１図に示したように陽極３，３と被めつき
物５との間にそれぞれ羽根板１０の面１０ａが水
平方向に沿つてかつ被めつき物５の両面（被めつ
き面）に対し直角方向に沿つて配置されるように
振動撹拌部材８を配備したものである。そして、
この撹拌部材８は、上記連結板１１にその上方に
配設した油圧シリンダ１２の第１図において上下
方向に移動し得るピストン棒１３の先端部が固定
され、これにより撹拌部材８が上下方向に移動
（振動）し得るように構成されている。
次に、上記構成の装置を用いてめつきを行う方
法につき説明すると、陽極３，３と被めつき物５
との間に所定の電圧を印加し、所定電流密度にお
いて被めつき物両面の被めつき面を電気めつきす
るものであるが、本発明においては、このような
電気めつきを行う場合に上記ピストン棒１３を上
下動させることにより振動撹拌部材８を上下方向
に、即ち羽根板１０の各面１０ａに対し直角方向
（被めつき物の被めつき面に平行）かつ被めつき
物５との離間距離を一定に保持して振動すること
により、めつき液２を撹拌するものである。
この場合、振動撹拌部材８、従つて羽根板１０
の振動数は１〜20サイクル／秒とするもので、特
に５〜10サイクル／秒とすることが好ましく、こ
の範囲において確実に陰極電流密度（Ｄk）5A／
ｄcm以上の高電流密度でめつきすることができ
る。また、振幅は被めつき物５の大きさ、めつき
槽１の大きさ、深さ等により相違するが、10〜
200mmの範囲であり、特に20〜100mmの範囲とする
ことが好ましく、かつ各羽根板１０間の間隔と同
じにすることが良好な結果を与える。換言すれ
ば、各羽根板１０間の間隔は振動撹拌部材８（羽
根板１０）の振幅と同一にするのが最良であり、
羽根板１０が被めつき物５の近傍に配置されてい
ても、被めつき物表面の電流分布を乱すことがな
く、良好なめつき膜を与えることができる。な
お、各羽根板１０の先端と被めつき物５との間の
間隔は10〜200mmとする。また、２個の羽根板支
持体９，９にそれぞれ羽根板１０を取り付ける場
合、一方の支持体９の羽根板１０と他方の支持体
９の羽根板１０とは被めつき物５に対し対称的に
する（互に対向させる）よりも位相を変える方が
好ましく、これにより例えばプリント基板のスル
ーホールめつきを行う場合にスルーホール内への
めつき液の流通が良好になり、効果的である。
而して、上述して条件下において羽根板１０を
振動しつつめつきすることにより、高電流密度で
めつきすることができる。例えば、ピロリン酸銅
めつき液や硫酸銅めつき液を用いてプリント基板
のスルーホールめつきを行う場合、標準浴組成に
おいて電流密度は通常２〜4A／ｄm2程度である
が、上述したように振動数１〜20サイクル／秒の
振動を与えてめつきすることにより５〜25A／ｄ
m2、特に8A／ｄm2以上の電流密度とすることが
でき、通常の２〜10倍の速度でめつきすることが
可能となり、高速めつきが達成される。しかも、
上述した振動撹拌法によれば、プリント基板表面
の撹拌が均一であり、かつめつき液が同一方向に
流れることがなく、従つてめつきがムラづきする
ことなく全体的に均質なめつきが得られると共
に、スルーホール内も良好にめつきされ、スルー
ホール付近に段地めつきが生じて歪なめつきにな
ることもない。
本発明法が適用できるめつき液には特に制限は
なく、上述したピロリン酸銅めつき液や硫酸銅め
つき液のほか、ニツケルめつき、錫めつき、半田
めつき、金めつき等、種々のめつき液に採用する
ことが可能である。また、板状被めつき物の種類
も制限されないが、特にプリント基板に対し好適
に採用し得る。
なお、第１，２図に示した振動撹拌部材８は各
羽根板１０を水平方向に沿つて配設し、上下方向
に振動させるようにしたが、本発明はこれに限ら
れるものではなく、第３図に示したように各羽根
板を垂直方向に沿つて配設し、これを水平方向に
（羽根板面に対し直角方向に、即ち第３図中矢印
方向に）振動させるようにしてもよい。また、振
動撹拌部材８（羽根板１０）の振動方法も油圧シ
リンダを用いる方法に限られず、例えばカム機構
を採用するなど、種々の変形が可能である。更
に、本発明においては、必要により通常の撹拌方
法、例えば空気撹拌やカソードロツカー等との併
用も可能である。
次に実施例を示し、本発明を更に具体的に説明
する。
〔実施例 １〕
幅20mm、長さ450mmの各羽根板を水平方向に沿
つて配設した（各羽根板支持体にそれぞれ所定数
の羽根板を配備）第２図に示したような振動撹拌
部材を製作した。
次に、これを第１図に示したように装備し、下
記組成のピロリン酸銅めつき液を用い、下記の条
件で400×400mmのプリント基板のスルーホールめ
つきを行つた。
めつき液組成
ピロリン酸銅（Cu2P2O7・3H2O 95ｇ／
ピロリン酸カリ 360 〃
アンモニア 2.5c.c.／
光択剤 １ 〃
PH 8.6
めつき条件
めつき温度 55℃
陽極 銅
撹拌 羽根板の振動
振動撹拌部材の振動数、振巾及び羽根板の間隔
を変えた場合の限界陰極電流密度値の結果、並び
にめつき外観の状態を第１表に示す
また比較のため、撹拌を羽根板の振動によら
ず、強い空気撹拌、ポンプによる液撹拌を行つた
場合の結果を第１表に併記する。
The present invention relates to a high-speed electroplating method, and particularly to a plating method suitably employed for through-hole plating of printed circuit boards. Conventionally, in order to improve the productivity of electroplating, especially through-hole plating of printed circuit boards, it has been desired to shorten the plating time. In order to shorten the plating time, it is necessary to increase the current density, but in order to perform plating at a high current density, it is important to increase the agitation of the plating solution on the surface of the printed circuit board. Moreover, in this case, in order to obtain a normal plated film, it is necessary not only to increase the liquid agitation but also to provide uniform liquid agitation.If the agitation is uneven, the area around the through hole will become unplated. Alternatively, step plating (skip plating), which is a thin plating state, occurs, and the plating on the surface of the printed circuit board becomes uneven, such as a so-called "eyeball" or "tears" phenomenon. Conventionally, methods of increasing the agitation of the plating liquid on the surface of the printed circuit board have been proposed, such as spraying the plating liquid onto the surface of the printed circuit board with a pump or making the plating liquid flow, but in both cases, The agitation state of the liquid varies depending on the width and depth of the soaking tank, making it difficult to uniformly agitate the liquid on the surface of the printed circuit board. As a result, the unevenness of the liquid agitation causes uneven plating on the surface of the printed circuit board, and the plating liquid flows in the same direction on the surface of the printed circuit board, causing distorted plating around the through holes. have a problem The present invention improves the above-mentioned situation, and improves the agitation of the plating liquid without causing it to flow in the same direction due to non-uniform agitation of the liquid on the surface of a plate-like plated object such as a printed circuit board. It is an object of the present invention to provide a plating method that enables high-speed plating, particularly through-hole plating of printed circuit boards at high current density. Hereinafter, one embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an example of an apparatus used to carry out the method of the present invention. In FIG. 1, 1 is a plating tank containing a plating solution 2 such as a copper pyrophosphate plating solution; 5 is a plate-like plated object (for example, a printed circuit board) suspended from the cathode busbar 6 via a hanger 7; 4
By applying a predetermined voltage between the anode busbar 6 and the cathode bus bar 6, a current flows between the anodes 3, 3 and the plated object 5 at a predetermined current density. Although not shown, the plating tank 1 may include necessary devices, such as a plating liquid heating device,
A plating liquid filtration device, etc. is attached. Reference numeral 8 denotes a vibrating stirring member, and as shown in detail in FIG. Attachment and both supports 9,9
It has a configuration in which the upper end portions are connected by a connecting plate 11, and as shown in FIG. The vibrating stirring member 8 is arranged so as to be disposed along the direction perpendicular to both surfaces (the surface to be fitted) of the object 5 to be fitted. and,
In this stirring member 8, the tip of a piston rod 13 which can move vertically in FIG. It is configured to be able to move (vibrate). Next, a method of plating using the apparatus configured as described above will be explained.
In this invention, when performing such electroplating, By moving the piston rod 13 up and down, the vibrating stirring member 8 is moved vertically, that is, in a direction perpendicular to each surface 10a of the blade plate 10 (parallel to the surface of the object to be plated) and to the object 5. The plating liquid 2 is stirred by vibrating while maintaining a constant distance from the plating liquid 2. In this case, the vibrating stirring member 8 and therefore the blade plate 10
The frequency of vibration is 1 to 20 cycles/second, preferably 5 to 10 cycles/second, and within this range the cathode current density (D k ) is reliably 5A/second.
Plating can be performed at a high current density of dcm or higher. The amplitude varies depending on the size of the plated object 5, the size and depth of the plating tank 1, etc.
The distance is preferably in the range of 200 mm, particularly preferably in the range of 20 to 100 mm, and good results are obtained by making it the same as the spacing between the blades 10. In other words, it is best to make the interval between each blade plate 10 the same as the amplitude of the vibrating stirring member 8 (vane plate 10),
Even if the vane plate 10 is placed near the plated object 5, a good plated film can be provided without disturbing the current distribution on the surface of the plated object. Note that the distance between the tip of each feather board 10 and the mating object 5 is 10 to 200 mm. Further, when attaching the slats 10 to the two slat supports 9, 9, the slats 10 of one support 9 and the slats 10 of the other support 9 are symmetrical with respect to the plated object 5. It is better to change the phase than to make them face each other (facing each other), and this improves the flow of the plating liquid into the through-holes when plating through-holes on printed circuit boards, making it more effective. be. By plating the blade plate 10 while vibrating it under the conditions described above, plating can be performed at a high current density. For example, when plating through-holes on printed circuit boards using a copper pyrophosphate plating solution or a copper sulfate plating solution, the current density is usually about 2 to 4 A/dm2 with a standard bath composition, but as mentioned above, 5 to 25 A/d by applying vibration at a frequency of 1 to 20 cycles/second and plating.
m 2 , particularly a current density of 8 A/dm 2 or more, making it possible to perform plating at a speed 2 to 10 times the normal speed, thereby achieving high-speed plating. Moreover,
According to the above-mentioned vibration stirring method, the printed circuit board surface is uniformly agitated, and the plating liquid does not flow in the same direction, so that uniform plating can be achieved overall without uneven plating. At the same time, the inside of the through hole is also well plated, and no stepped plating occurs near the through hole, resulting in distorted plating. There is no particular restriction on the plating solution to which the method of the present invention can be applied, and in addition to the above-mentioned copper pyrophosphate plating solution and copper sulfate plating solution, nickel plating, tin plating, solder plating, gold plating, etc. It can be used in various plating solutions. Further, the type of plate-like plated material is not limited, but it can be particularly suitably used for printed circuit boards. Although the vibrating stirring member 8 shown in FIGS. 1 and 2 has each blade plate 10 arranged along the horizontal direction so as to vibrate in the vertical direction, the present invention is not limited to this. As shown in Figure 3, each blade plate is arranged along the vertical direction, and is made to vibrate horizontally (in a direction perpendicular to the blade surface, that is, in the direction of the arrow in Figure 3). Good too. Furthermore, the method of vibrating the vibrating stirring member 8 (blade plate 10) is not limited to the method using a hydraulic cylinder, and various modifications are possible, such as adopting a cam mechanism, for example. Furthermore, in the present invention, it is also possible to use a conventional stirring method, such as air stirring or a cathode rocker, if necessary. EXAMPLES Next, the present invention will be explained in more detail with reference to Examples. [Example 1] Vibration stirring as shown in Fig. 2, in which blade plates each having a width of 20 mm and a length of 450 mm were arranged along the horizontal direction (a predetermined number of blade plates were arranged on each blade support body). Manufactured the parts. Next, this was equipped as shown in FIG. 1, and through-hole plating of a 400 x 400 mm printed circuit board was performed using a copper pyrophosphate plating solution having the following composition under the following conditions. Plating solution composition Copper pyrophosphate (Cu 2 P 2 O 7・3H 2 O 95g / Potassium pyrophosphate 360 〃 Ammonia 2.5cc / Light selection agent 1 〃 PH 8.6 Plating conditions Plating temperature 55℃ Anode Copper Stirring Vane plate Vibration Table 1 shows the results of the critical cathode current density values and the condition of the plating appearance when the frequency of the vibrating stirring member, the amplitude of vibration, and the spacing between the blade plates were changed. Table 1 also shows the results when strong air agitation and liquid agitation using a pump were performed without using vibration.
【表】
＊：スルーホール付近に“涙”現象発生
〔実施例 ２〕
下記組成の硫酸銅めつき液を使用し、実施例１
と同様の実験を行い、第２表に示す結果を得た。
硫酸銅（CuSO4・5H2O） 100ｇ／
硫酸 200 〃
Cl- 50ppm
添加剤 ６c.c.／
めつき温度 25℃
陽極 銅
撹拌 羽根板による撹拌[Table] *: "Tear" phenomenon occurs near the through hole [Example 2] Using a copper sulfate plating solution with the following composition, Example 1
An experiment similar to that was conducted and the results shown in Table 2 were obtained. Copper sulfate (CuSO 4・5H 2 O) 100g/ Sulfuric acid 200〃 Cl - 50ppm Additive 6 c.c./ Plating temperature 25℃ Anode Copper Stirring Stirring with a blade plate
【表】
以上説明したように、本発明によれば電気めつ
き液が収容された電気めつき槽内に陽極と板状の
被めつき物を吊下し、陽極と被めつき物との間に
所用の電圧を印加して被めつき物の被めつき面を
電気めつきするに際し、複数枚の羽根板を互に10
〜200mmの間隔でかつ被めつき物の被めつき面と
10〜200mm離間させて陽極と被めつき物との間に
羽根板面が水平又は垂直になるようにかつ被めつ
き物の被めつき面に対し直角方向に沿つて配置
し、これら羽根板を前記被めつき物の被めつき面
に平行にしかも被めつき物の被めつき面との前記
離間距離を維持した状態において、１〜20サイク
ル／秒の速度でかつ互に隣り合う羽根板間の間隔
と同じ距離の振幅で往復動させて、羽根板配置位
置付近のめつき液を羽根板の往復動方向に沿つて
流動撹拌させながら電気めつきを行うようにした
ことにより、被めつき物表面の液撹拌が不均一に
なつたりめつき液が同一方向に流動したりするこ
となくめつき液の撹拌を高めることができ、従つ
て高電流密度でめつきすることができると共に、
めつきのムラ付きを防止して全体的に均質な電着
物を得ることができる。[Table] As explained above, according to the present invention, an anode and a plate-shaped object to be plated are suspended in an electroplating tank containing an electroplating solution, and the anode and the object to be plated are connected to each other. When electroplating the plated surface of a plated object by applying the required voltage between them, multiple blade plates are
~200mm apart and from the overlapping surface of the overlapping object.
The blade plates are arranged at a distance of 10 to 200 mm between the anode and the object to be plated, so that the surface of the blade plate is horizontal or vertical, and along the direction perpendicular to the surface of the object to be plated. the blades adjacent to each other at a speed of 1 to 20 cycles/sec while parallel to the surface of the object to be plated and maintaining the distance from the surface of the object to be covered. Electroplating is performed by reciprocating the blades with the same amplitude as the spacing between the plates, and causing the plating liquid near the vane plate arrangement position to flow and stir along the direction of the reciprocating movement of the vane plates. It is possible to improve the agitation of the plating solution without causing uneven agitation of the solution on the surface of the plating object and the plating solution flowing in the same direction, and therefore, it is possible to perform plating with a high current density. ,
It is possible to prevent uneven plating and obtain a uniform electrodeposit as a whole.
第１図は本発明の実施に使用するめつき装置の
一例を示す概略断面図、第２図は同装置の振動撹
拌部材の拡大斜視図、第３図は振動撹拌部材の他
の例を示す横断面図である。
１…めつき槽、２…めつき液、３…陽極、５…
被めつき物、８…振動撹拌部材、１０…羽根板、
１０ａ…羽根板面、１３…ピストン棒。
Fig. 1 is a schematic cross-sectional view showing an example of a plating device used in carrying out the present invention, Fig. 2 is an enlarged perspective view of a vibratory stirring member of the same device, and Fig. 3 is a cross-sectional view showing another example of a vibratory stirring member. It is a front view. 1...Plating tank, 2...Plating liquid, 3...Anode, 5...
Covered object, 8... Vibrating stirring member, 10... Feather plate,
10a...Blade plate surface, 13...Piston rod.
Claims (1)
陽極と板状の被めつき物を吊下し、陽極と被めつ
き物との間に所用の電圧を印加して被めつき物の
被めつき面を電気めつきするに際し、複数枚の羽
根板を互に10〜200mmの間隔でかつ被めつき物の
被めつき面と10〜200mm離間させて陽極と被めつ
き物との間に羽根板面が水平又は垂直になるよう
にかつ被めつき物の被めつき面に対し直角方向に
沿つて配置し、これら羽根板を前記被めつき物の
被めつき面と平行にしかも被めつき物の被めつき
面との前記離間距離を維持した状態において、１
〜20サイクル／秒の速度でかつ互に隣り合う羽根
板間の間隔と同じ距離の振幅で往復振動させて、
羽根板配置位置付近のめつき液を羽根板の往復動
方向にそつて流動撹拌させながら電気めつきを行
うようにしたことを特徴とする高速めつき方法。1. An anode and a plate-shaped object to be plated are suspended in an electroplating tank containing an electroplating solution, and a required voltage is applied between the anode and the object to be plated. When electroplating the surface to be plated, the anode and the surface of the object to be plated are separated by placing multiple blade plates at a distance of 10 to 200 mm from each other and from the surface to be plated by 10 to 200 mm. The slats are arranged so that the surface of the slats is horizontal or vertical and perpendicular to the surface of the slatted object, and these slats are parallel to the surface of the slatted object. Moreover, in a state where the above-mentioned separation distance from the covered surface of the covered object is maintained, 1
Vibrate back and forth at a speed of ~20 cycles/second and with an amplitude equal to the distance between adjacent vanes,
A high-speed plating method characterized in that electroplating is performed while the plating liquid near the vane plate arrangement position is flowed and stirred along the reciprocating direction of the vane plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14219080A JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14219080A JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5767192A JPS5767192A (en) | 1982-04-23 |
| JPS6146559B2 true JPS6146559B2 (en) | 1986-10-15 |
Family
ID=15309474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14219080A Granted JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5767192A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2644848B2 (en) * | 1988-09-28 | 1997-08-25 | 株式会社日立製作所 | Hole processing jig |
| JP2707530B2 (en) * | 1992-12-28 | 1998-01-28 | 日本テクノ株式会社 | Plating method |
| JP2911350B2 (en) * | 1993-11-02 | 1999-06-23 | 日本テクノ株式会社 | Surface treatment method and surface treatment device used therefor |
| JP2008266670A (en) * | 2007-04-16 | 2008-11-06 | Sumitomo Electric Ind Ltd | Electroplating apparatus |
| DE102007026635B4 (en) * | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Apparatus for wet-chemical treatment of goods, use of a flow organ, method for installing a flow organ in the device and method for producing a wet-chemical treated goods |
| JP5184308B2 (en) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | Plating apparatus and plating method |
| US8177944B2 (en) | 2007-12-04 | 2012-05-15 | Ebara Corporation | Plating apparatus and plating method |
-
1980
- 1980-10-11 JP JP14219080A patent/JPS5767192A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5767192A (en) | 1982-04-23 |
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