JPH02153100A - Barrel plating device - Google Patents

Abstract

PURPOSE:To eliminate the discontinuous supply of a current to a material to be plated in a barrel body, to increase and uniformize the current density, and to improve productivity by arranging an anode and a cathode in the perforated barrel body. CONSTITUTION:The perforated barrel body 1 made of resin, etc., is dipped in the plating soln. in a tank 2. The anode 3 and the cathode 4 formed by a conductive net, etc., are arranged in the barrel body 1. A material 5 to be plated is placed in the barrel body 1, the barrel body 1 is rotated or oscillated, and a current is applied between the anode 3 and the cathode 4 to carry out plating. Since the current flows directly to the cathode 4 from the anode 3, a barrel trace is not formed, and the current is easily sent even to the center of the material 5. The cathode current density of the material 5 is uniformized, and a nice-looking plated product having uniform plating film thickness and alloy composition is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a barrel plating apparatus used for electroplating.

[Conventional technology]

Commonly used barrel plating equipment has a perforated barrel body made of resin with many small holes in the wall to improve the flow of the plating solution, and is equipped with a contact that serves as a cathode inside the perforated barrel body. A device that supplies current to the object to be plated that is housed in the chamber and comes into contact with the contact from an anode installed in the plating solution outside the perforated barrel body, and performs plating while rotating or swinging the perforated barrel body. It is.

[Problem to be solved by the invention]

However, in the conventional barrel plating equipment, the current is interrupted in the object to be plated that is away from the cathode contact in the perforated barrel body, and a part of the object to be plated is oxidized and dissolved due to bipolar phenomenon, and plating continues. This causes poor adhesion, and alloy plating often causes segregation in the alloy composition.

In addition, since the current flows through the small holes drilled in the perforated barrel body, the current concentrates on the objects to be plated that are in contact with the holes, causing plating burns called barrel marks, and further damaging the objects to be plated. Since it is difficult for the current to reach the center, there is a problem in that extremely large differences occur in the current density at the cathode of the object to be plated, resulting in unevenness in the plating film thickness and alloy composition.

The present invention solves the problems of the conventional barrel plating apparatus, eliminates the interruption of current to the object to be plated within the perforated barrel body, and makes the current density high and uniform.
The object of the present invention is to provide a highly productive barrel plating device that can produce extremely high-quality plated products.

[Means to solve the problem]

The present invention is a barrel plating apparatus characterized in that an anode and a cathode are provided in a perforated barrel body, and further, the cathode is a conductive net-like body, and the net-like body is arranged along the inner wall of the perforated barrel body. It is also characterized by the fact that it has been deployed.

[For production]

In the present invention, since both the anode and the cathode are provided in the perforated barrel body, the current does not pass through the small hole in the wall of the perforated barrel body (as it flows directly from the anode to the cathode). Barrel marks that are commonly seen in the past do not occur, the current can easily reach the center of the object to be plated, and the current density flowing to the object to be plated is uniform, making it possible to achieve even plating products such as plating film thickness of 1 alloy composition. Furthermore, since the distance between the anode and cathode is short, the bath voltage is low and the loss of electrical energy is also reduced.

In addition, if the cathode is made of a conductive net and is placed along the inner wall of the perforated barrel body, the area of the cathode becomes wider and the contact with the object to be plated becomes better, resulting in a higher cathode current density than the conventional one. This allows current to flow through the entire group of objects to be plated, eliminating intermittent current flow to the objects to be plated.
Bipolar phenomenon does not occur in the plated object.

〔Example〕

An embodiment of the present invention will be described with reference to the drawings. 1 is immersed in a plating solution filled in a tank 2 and rotated (first
It is a perforated barrel body made of resin similar to the conventional art which can be rotated (see figure) or reversely oscillated (see figure 2), and has many small holes in the wall surface to improve the circulation of the plating solution. Both an anode 3 and a cathode are arranged in the perforated barrel body l, and the cathode can be similar to a conventional cathode contact, but as shown in the example, a conductive wire 4, e.g. , stainless steel, TI4, or the like is used as a cathode, and the rope 4 serving as the cathode can be attached along the inner wall of the perforated barrel body 1 .

In the figure, 5 indicates an object to be plated inside the perforated barrel body 1.

Thus, the object to be plated 5 housed in the perforated barrel body 1 is rotated (FIG. 1) or 180° by the perforated barrel body 1.
Plating is performed by inverting and rocking (Fig. 2) to improve the flow of the plating solution, and by passing current between the anode 3 and the cathode. At this time, the current flows directly from the anode 3 to the cathode, and the conventional barrel mark does not occur, the current easily reaches the object to be plated 5 in the center, and the cathode current density of the object to be plated 5 is also uniform. Therefore, it is possible to obtain a plated product with a good appearance and no unevenness such as a plating film thickness of 5 alloy composition, and because the distance between the anode 3 and the cathode is short, the bath voltage is low and there is little loss of electrical energy. .

Furthermore, the cathode is conductive! When attached along the inner wall of the perforated barrel body 1 as 144, the area of the cathode becomes larger, and the contact between the net 4 serving as the cathode and the object to be plated 5 is improved, and a high cathode current density can be achieved. , the current flows throughout the object to be plated 5, there is no intermittent current, no bipolar phenomenon occurs, and the object to be plated 5 and 5li1
4, the object to be plated is well agitated, further reducing variations in the thickness of the plated film.

〔Effect of the invention〕

As described above, according to the present invention, extremely beneficial effects as listed below are produced.

■ Current flows directly from the anode to the cathode inside the perforated barrel body, so even if the current is high, there are no barrel marks like in the past (
Does not occur.

■ Current flows easily in the center of the group of objects to be plated, and there is little variation in the current density of the objects to be plated, so there is little variation in alloy composition, and it is possible to obtain plated products with uniform plating film thickness and both alloy compositions. .

■ Because the distance between the anode and cathode is short, the bath voltage is low and there is little electrical loss.

■ When the cathode is arranged in the form of a mesh on the inner wall of the perforated barrel body, the cathode area is wide (and the contact with the object to be plated is good, the cathode current density can be increased, and the object to be plated is Current flows throughout, eliminating bipolar conditions and increasing productivity.

[Brief explanation of the drawing]

FIGS. 1 and 2 are cutaway views showing an embodiment of the present invention. l... Perforated barrel body, 2... Tank, 3... Anode,
4... Net, 5... Item to be plated. 1st

Claims (2)

[Claims] (1) A barrel plating device characterized by having an anode and a cathode arranged inside a perforated barrel body. (2) The barrel plating apparatus according to claim 1, wherein the cathode is a conductive net-like body, and the net-like body is arranged along the inner wall of the perforated barrel body.