JPS5767192A - High-speed plating method - Google Patents
High-speed plating methodInfo
- Publication number
- JPS5767192A JPS5767192A JP14219080A JP14219080A JPS5767192A JP S5767192 A JPS5767192 A JP S5767192A JP 14219080 A JP14219080 A JP 14219080A JP 14219080 A JP14219080 A JP 14219080A JP S5767192 A JPS5767192 A JP S5767192A
- Authority
- JP
- Japan
- Prior art keywords
- vanes
- plating
- cathode
- electrodes
- current density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
PURPOSE: To increase the current density by setting vibratile vanes between a cathode and an anode and carrying out electroplating while agitating a soln. under prescribed conditions.
CONSTITUTION: A plating tank 1 is filled with a plating soln. 2, and an anode plate 3 and a material 5 to be plated as a cathode are suspended. A vibration agitating member 8 provided with vanes 10 in the horizontal direction is then set between both the electrodes 3, 5. While vibrating the member 8 in the vertical direction at amplitude almost equal to the space between the vanes and 1W20 cycle/sec vibration frequency, a voltage is applied between the electrodes 3, 5. By this method plating is enabled at high current density, and even, homogeneous and high-speed palting can be attained.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14219080A JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14219080A JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5767192A true JPS5767192A (en) | 1982-04-23 |
JPS6146559B2 JPS6146559B2 (en) | 1986-10-15 |
Family
ID=15309474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14219080A Granted JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5767192A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290591A (en) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | Processing method of inside of hole |
JPH06220697A (en) * | 1992-12-28 | 1994-08-09 | Nippon Techno Kk | Plating method |
JPH07126896A (en) * | 1993-11-02 | 1995-05-16 | Nippon Techno Kk | Surface treating method and surface treating device used therefor |
JP2008266670A (en) * | 2007-04-16 | 2008-11-06 | Sumitomo Electric Ind Ltd | Electroplating apparatus |
JP2009155726A (en) * | 2007-12-04 | 2009-07-16 | Ebara Corp | Plating apparatus and plating method |
JP2010529293A (en) * | 2007-06-06 | 2010-08-26 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus and method for wet chemical treatment of a product and method for mounting a flow member in the apparatus |
US8486234B2 (en) | 2007-12-04 | 2013-07-16 | Ebara Corporation | Plating apparatus and plating method |
-
1980
- 1980-10-11 JP JP14219080A patent/JPS5767192A/en active Granted
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290591A (en) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | Processing method of inside of hole |
JPH06220697A (en) * | 1992-12-28 | 1994-08-09 | Nippon Techno Kk | Plating method |
JPH07126896A (en) * | 1993-11-02 | 1995-05-16 | Nippon Techno Kk | Surface treating method and surface treating device used therefor |
JP2008266670A (en) * | 2007-04-16 | 2008-11-06 | Sumitomo Electric Ind Ltd | Electroplating apparatus |
JP2010529293A (en) * | 2007-06-06 | 2010-08-26 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus and method for wet chemical treatment of a product and method for mounting a flow member in the apparatus |
JP2013174016A (en) * | 2007-06-06 | 2013-09-05 | Atotech Deutschland Gmbh | Apparatus and method for wet chemical treatment of plate-like product and method for mounting flow rate member in the apparatus |
KR101526022B1 (en) * | 2007-06-06 | 2015-06-04 | 아토테크더치랜드게엠베하 | Apparatus and method for the wet chemical treatment of a product and method for installing a flow member into the apparatus |
JP2009155726A (en) * | 2007-12-04 | 2009-07-16 | Ebara Corp | Plating apparatus and plating method |
US8486234B2 (en) | 2007-12-04 | 2013-07-16 | Ebara Corporation | Plating apparatus and plating method |
KR101486441B1 (en) * | 2007-12-04 | 2015-01-28 | 가부시키가이샤 에바라 세이사꾸쇼 | Plating apparatus and plating method |
KR101493380B1 (en) * | 2007-12-04 | 2015-02-23 | 가부시키가이샤 에바라 세이사꾸쇼 | Plating apparatus and plating method |
USRE45687E1 (en) | 2007-12-04 | 2015-09-29 | Ebara Corporation | Plating apparatus and plating method |
Also Published As
Publication number | Publication date |
---|---|
JPS6146559B2 (en) | 1986-10-15 |
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