JPS5767192A - High-speed plating method - Google Patents

High-speed plating method

Info

Publication number
JPS5767192A
JPS5767192A JP14219080A JP14219080A JPS5767192A JP S5767192 A JPS5767192 A JP S5767192A JP 14219080 A JP14219080 A JP 14219080A JP 14219080 A JP14219080 A JP 14219080A JP S5767192 A JPS5767192 A JP S5767192A
Authority
JP
Japan
Prior art keywords
vanes
plating
cathode
electrodes
current density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14219080A
Other languages
Japanese (ja)
Other versions
JPS6146559B2 (en
Inventor
Yasuo Uchikoshiki
Fujio Asa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP14219080A priority Critical patent/JPS5767192A/en
Publication of JPS5767192A publication Critical patent/JPS5767192A/en
Publication of JPS6146559B2 publication Critical patent/JPS6146559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE: To increase the current density by setting vibratile vanes between a cathode and an anode and carrying out electroplating while agitating a soln. under prescribed conditions.
CONSTITUTION: A plating tank 1 is filled with a plating soln. 2, and an anode plate 3 and a material 5 to be plated as a cathode are suspended. A vibration agitating member 8 provided with vanes 10 in the horizontal direction is then set between both the electrodes 3, 5. While vibrating the member 8 in the vertical direction at amplitude almost equal to the space between the vanes and 1W20 cycle/sec vibration frequency, a voltage is applied between the electrodes 3, 5. By this method plating is enabled at high current density, and even, homogeneous and high-speed palting can be attained.
COPYRIGHT: (C)1982,JPO&Japio
JP14219080A 1980-10-11 1980-10-11 High-speed plating method Granted JPS5767192A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14219080A JPS5767192A (en) 1980-10-11 1980-10-11 High-speed plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14219080A JPS5767192A (en) 1980-10-11 1980-10-11 High-speed plating method

Publications (2)

Publication Number Publication Date
JPS5767192A true JPS5767192A (en) 1982-04-23
JPS6146559B2 JPS6146559B2 (en) 1986-10-15

Family

ID=15309474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14219080A Granted JPS5767192A (en) 1980-10-11 1980-10-11 High-speed plating method

Country Status (1)

Country Link
JP (1) JPS5767192A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0290591A (en) * 1988-09-28 1990-03-30 Hitachi Ltd Processing method of inside of hole
JPH06220697A (en) * 1992-12-28 1994-08-09 Nippon Techno Kk Plating method
JPH07126896A (en) * 1993-11-02 1995-05-16 Nippon Techno Kk Surface treating method and surface treating device used therefor
JP2008266670A (en) * 2007-04-16 2008-11-06 Sumitomo Electric Ind Ltd Electroplating apparatus
JP2009155726A (en) * 2007-12-04 2009-07-16 Ebara Corp Plating apparatus and plating method
JP2010529293A (en) * 2007-06-06 2010-08-26 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Apparatus and method for wet chemical treatment of a product and method for mounting a flow member in the apparatus
US8486234B2 (en) 2007-12-04 2013-07-16 Ebara Corporation Plating apparatus and plating method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0290591A (en) * 1988-09-28 1990-03-30 Hitachi Ltd Processing method of inside of hole
JPH06220697A (en) * 1992-12-28 1994-08-09 Nippon Techno Kk Plating method
JPH07126896A (en) * 1993-11-02 1995-05-16 Nippon Techno Kk Surface treating method and surface treating device used therefor
JP2008266670A (en) * 2007-04-16 2008-11-06 Sumitomo Electric Ind Ltd Electroplating apparatus
JP2010529293A (en) * 2007-06-06 2010-08-26 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Apparatus and method for wet chemical treatment of a product and method for mounting a flow member in the apparatus
JP2013174016A (en) * 2007-06-06 2013-09-05 Atotech Deutschland Gmbh Apparatus and method for wet chemical treatment of plate-like product and method for mounting flow rate member in the apparatus
KR101526022B1 (en) * 2007-06-06 2015-06-04 아토테크더치랜드게엠베하 Apparatus and method for the wet chemical treatment of a product and method for installing a flow member into the apparatus
JP2009155726A (en) * 2007-12-04 2009-07-16 Ebara Corp Plating apparatus and plating method
US8486234B2 (en) 2007-12-04 2013-07-16 Ebara Corporation Plating apparatus and plating method
KR101486441B1 (en) * 2007-12-04 2015-01-28 가부시키가이샤 에바라 세이사꾸쇼 Plating apparatus and plating method
KR101493380B1 (en) * 2007-12-04 2015-02-23 가부시키가이샤 에바라 세이사꾸쇼 Plating apparatus and plating method
USRE45687E1 (en) 2007-12-04 2015-09-29 Ebara Corporation Plating apparatus and plating method

Also Published As

Publication number Publication date
JPS6146559B2 (en) 1986-10-15

Similar Documents

Publication Publication Date Title
JPS526374A (en) Anode structure for electrolysis
JPS5767192A (en) High-speed plating method
DE3278119D1 (en) Process of electroforming screen material, material as obtained and apparatus for executing said process
JPS5751290A (en) Electrolytic treatment of beltlike metallic plate
JPS5767184A (en) Stabilizing method for metallic bed of aluminum in electrolytic cell for aluminum
JPS55134187A (en) Stabilizing method for aluminum metal layer in aluminum electrolytic cell
JPS5662998A (en) Surface processing method dependent upon high-speed vibration
JPS55152200A (en) Electroplating
ES513436A0 (en) "IMPROVEMENTS INTRODUCED IN AN ELECTROLYTIC REDUCTION CELL".
JPS56119792A (en) Electroplating method
JPS56156793A (en) Manufacture of composite powder by electroplating
JPS5245720A (en) Electrical anticorrosion of external surface of bottom plate of surface tank
JPS5792191A (en) Partial plating method
GB779906A (en) Improvements in or relating to electro-plating process and apparatus
JPS5380161A (en) Electrode formation of semiconductor
JPS55141590A (en) Electrodeposition apparatus for uranium
JPS54159341A (en) Plating method
JPS5623297A (en) Partial plating method
JPS55161096A (en) Continuous electroplating method
JPS5635793A (en) Electrolytic formation of verdigris on surface of copper or copper alloy
JPS6423542A (en) Wiring structure
JPS55158297A (en) Control method of electric current density in electroplating
JPS52148419A (en) Electrolytic refining method of lead
SU1790255A1 (en) Electrolyzer with powder electrode
JPS55158291A (en) Edge part structure of anode lead plate