JPS54159341A - Plating method - Google Patents
Plating methodInfo
- Publication number
- JPS54159341A JPS54159341A JP6830678A JP6830678A JPS54159341A JP S54159341 A JPS54159341 A JP S54159341A JP 6830678 A JP6830678 A JP 6830678A JP 6830678 A JP6830678 A JP 6830678A JP S54159341 A JPS54159341 A JP S54159341A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- parts
- plating
- jig
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To enable a type face, etc. to be plated with a layer of a uniform thickness and superior durability by setting auxiliary electrodes around the body to be plated and plating thickness regulating pieces behind the body in close vicinity to it prior to electrolysis.
CONSTITUTION: For example, in plating of a type face, etc. used for a motor controlling printer, anode 2 is set in an electrolytic soln. in plating vessel 1, and plastic type body 4 is fixed with jig 3 on the opposite side and used as a cathode. Auxiliary electrodes 7 are set around jig 3 so that electrodes 7 enclose type parts 6, and plating thickness regulating pieces 8 are arranged behind parts 6 on jig 3 in close vicinity to parts 6. Electrodes 7 prevent the tendency of a current to concentrate on the outermost part of body 4, resulting in a uniform plated layer. By means of pieces 8 the back sides of parts 6 are not excessively plated. The type body plated by this method is able to endure above 5000000 times of uses.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6830678A JPS54159341A (en) | 1978-06-08 | 1978-06-08 | Plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6830678A JPS54159341A (en) | 1978-06-08 | 1978-06-08 | Plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54159341A true JPS54159341A (en) | 1979-12-17 |
Family
ID=13369968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6830678A Pending JPS54159341A (en) | 1978-06-08 | 1978-06-08 | Plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54159341A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6141792A (en) * | 1984-08-06 | 1986-02-28 | Nippon Kagaku Sangyo Kk | Method for uniformly electrodepositing copper on cylinder by plating under rotation |
| JPH04235298A (en) * | 1991-01-10 | 1992-08-24 | Fujitsu Ltd | Copper plating device for printed wiring board |
| JP2008169403A (en) * | 2007-01-05 | 2008-07-24 | Toyoda Gosei Co Ltd | Method for manufacturing plated resin product, and resin-molded article to be plated with the method |
| JP2017179550A (en) * | 2016-03-31 | 2017-10-05 | Ｄｏｗａメタルテック株式会社 | Nickel plating material, and production method thereof |
-
1978
- 1978-06-08 JP JP6830678A patent/JPS54159341A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6141792A (en) * | 1984-08-06 | 1986-02-28 | Nippon Kagaku Sangyo Kk | Method for uniformly electrodepositing copper on cylinder by plating under rotation |
| JPH04235298A (en) * | 1991-01-10 | 1992-08-24 | Fujitsu Ltd | Copper plating device for printed wiring board |
| JP2008169403A (en) * | 2007-01-05 | 2008-07-24 | Toyoda Gosei Co Ltd | Method for manufacturing plated resin product, and resin-molded article to be plated with the method |
| US8900689B2 (en) | 2007-01-05 | 2014-12-02 | Toyoda Gosei Co., Ltd. | Method for producing resin plated product and resin molded product to be plated used therefor |
| JP2017179550A (en) * | 2016-03-31 | 2017-10-05 | Ｄｏｗａメタルテック株式会社 | Nickel plating material, and production method thereof |
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